Molding method and molding equipment of computer backboard

Abstract

The invention relates to the technical field of material molding, in particular to a molding method and molding equipment of a computer backboard. The molding method of the computer backboard providedby the invention comprises the following steps: heating a carbon fiber plate to a softened state, and enabling a matrix in a molten state and the carbon fiber plate in a softened state to be integrated through injection molding, wherein relatively good fusion of the carbon fiber plate and the matrix can be realized, and the obtained computer backboard has high strength and good heat dissipation performance. The molding equipment of the computer backboard provided by the invention comprises a heating device, a molding device and a transferring device, wherein the heating device is used for heating the carbon fiber plate, the molding device is used for generating the matrix in the molten state, the matrix in the molten state and the carbon fiber plate in the softened state are integrated through injection molding, and the transferring device is used for transferring the carbon fiber plate and the computer backboard between the heating device and the molding device. The computer backboard obtained through the molding equipment comprises the carbon fiber plate and the matrix which are fused relatively well, and the obtained computer backboard has high strength and good heat dissipation performance.

Description

technical field [0001] The invention relates to the technical field of material molding, in particular to a computer backplane molding method and molding equipment. Background technique [0002] Compared with desktop computers, notebook computers are smaller, lighter, and more convenient to move. They are suitable for meeting records, social occasions, and daily life. With the widespread use of notebook computers, light weight, high strength, and good heat dissipation have become new demands of consumers, and the backplane of notebook computers has become an important part that affects user experience. [0003] The computer backplane is generally installed on the back of the computer motherboard, and is used to install and fix the central processing unit, connectors, radiators, etc. of the computer. At present, the conventional computer backplane molding method is plastic injection molding, and the backplane adopting plastic injection molding has insufficient strength and p...

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