Vapor chamber and plate assembly

A technology of vapor chamber and components, applied in lighting and heating equipment, indirect heat exchangers, heat exchange equipment, etc., which can solve problems such as insufficient strength of the chamber and achieve the effect of avoiding deformation of the bottom side

Pending Publication Date: 2020-06-26
VAST GLORY ELECTRONICS &HARDWARE &PLASTIC HUI ZHOU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention is to provide a vapor chamber and plate assembly, so as to improve the problem of insufficient strength of the vapor chamber

Method used

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  • Vapor chamber and plate assembly
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  • Vapor chamber and plate assembly

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Experimental program
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Embodiment Construction

[0048] see Figure 1 to Figure 2 . figure 1 It is a three-dimensional schematic view of the temperature chamber according to the first embodiment of the present invention. figure 2 for figure 1 The decomposition diagram.

[0049] The vapor chamber 10 of this embodiment includes a first plate body 100 , a second plate body 200 , a capillary structure layer 300 , a first reinforcing plate body 400 and a second reinforcing plate body 500 .

[0050] The first plate body 100 is joined with the second plate body 200 so that the first plate body 100 and the second plate body 200 together surround a chamber S. The capillary structure layer 300 is located in the chamber S and stacked on the first board 100 . The first reinforcing board 400 is directly stacked on a part of the first board 100 .

[0051] see image 3 , image 3 for figure 2 Partial decomposition diagram of . The first plate body 100 is, for example, a metal plate, and the first plate body 100 includes a main b...

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Abstract

The invention relates to a vapor chamber and a plate assembly. The vapor chamber comprises a first plate body, a second plate body, a capillary structure layer and a first reinforcing plate body, wherein the second plate body is connected with the first plate body, so that the first plate body and the second plate body jointly define a cavity, the capillary structure layer is located in the cavityand overlapped on the first plate body, and the first reinforcing plate body is directly overlapped on a part of the first plate body. According to the provided vapor chamber and the plate assembly,the problem of insufficient strength of the vapor chamber is solved.

Description

technical field [0001] The invention relates to a uniform temperature plate and a plate assembly, in particular to a uniform temperature plate and a plate assembly with a reinforced plate body. Background technique [0002] The technical principle of the vapor chamber is similar to that of a heat pipe, but there are differences in the way of conduction. The heat pipe is one-dimensional linear heat conduction, while the heat in the vapor chamber is conducted on a two-dimensional surface, so the efficiency is higher. Specifically, the vapor chamber mainly includes a cavity and a capillary structure. There is a hollow chamber inside the cavity, and the hollow chamber is used for filling with a working fluid. Capillary tissue is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity where heat is dissipated is called the condensation zone. The working fluid absorbs heat in the evaporation area and vaporizes and r...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): F28D15/04F28F21/08
CPCF28D15/04F28F21/08
Inventor刘垒垒张小敏刘亚辛
OwnerVAST GLORY ELECTRONICS &HARDWARE &PLASTIC HUI ZHOU LTD