A hermetic packaging component structure with integrated lens

Abstract

The present invention discloses an airtight packaging component structure of an integrated lens, including a component housing, a cover plate, a lens, a primary aperture, a secondary aperture, a filter, a chip module, and an electrode plate. A two-stage aperture is arranged in the component, wherein the secondary aperture is close to the chip surface and is used to fix the filter. The lens also serves as a component window, which is fixed to the cover plate by welding or epoxy glue, and the chip module and the lens are aligned by optical alignment equipment. After all parts are assembled, the component is filled with inert gas for protection, and airtight welding is completed. This type of component can be used at room temperature or low temperature. The lens serves as a component window, which can not only meet the requirements of airtight packaging, but also ensure the requirements of high-precision optical alignment. At the same time, the multi-stage aperture is integrated in the component, which can effectively reduce the influence of background radiation and stray light in the chip field of view.

Description

Technical Field

[0001] The invention relates to a packaging structure of a photoelectric detector, in particular to a component structure of a detector airtight packaging with an integrated optical lens, which is suitable for packaging detectors working at low temperatures or near room temperature. Background Art

[0002] The purpose of packaging infrared detectors is to realize the optical, mechanical, electrical and thermal interfaces of the detectors and provide protection for the detectors, thereby improving the reliability of the detectors. In order to obtain a high signal-to-noise ratio, infrared detectors generally work at low temperatures. According to the packaging atmosphere, there are vacuum packaging and inert gas protection packaging, which can ensure that the detectors are not affected by water vapor condensation when working at low temperatures. Both packaging methods have high requirements for the leakage rate of the components, but in comparison, the inert gas protection packaging components do not need to integrate degassing agents, which can save exhaust process time and have low packaging costs. It is very suitable for applications where cooling is provided by thermoelectric coolers or space radiation cooling. In addition, optoelectronic detection systems based on aerospace applications have strict requirements on the volume, weight and reliability of infrared detector components. Integrating the lens near the surface of the infrared detector can simplify the optical system, especially when the F# number of the optical system is small, which can greatly reduce the system volume. Zeng Zhijiang et al. reported a multi-lens deep-cryogenic infrared detector shell structure encapsulated in a dewar, application number: 201210431030.9. The shell is used in the dewar as a supporting component of the lens. The precise mechanical alignment of the chip and the lens group is achieved through structural design and positioning assembly. There is no need to achieve sealing when aligning the chip and the lens. Summary of the invention

[0003] The present invention aims to provide a component structure and packaging method for an integrated lens airtight package, which can realize the function of the lens as a sealed package window while ensuring the alignment of the chip and the lens. It is suitable for packaging detectors working at room temperature, and is also suitable for applications where cooling is provided by a thermoelectric cooler or space radiation cooling.

[0004] An airtight packaging component structure of an integrated lens, comprising a component housing 1, a cover plate 2, a lens 3, a primary aperture 4, a secondary aperture 8, a filter 7, a chip module 6, an electrode plate 5, and an aperture support 9; characterized in that: the chip module 6 and the electrode plate 5 are fixed to the bottom surface of the component housing 1 by epoxy glue, the electrode plate 5 is located on both sides of the chip module 6, the electrical signal of the chip module 6 is led out to the electrode plate 5 by gold wire or aluminum wire bonding, and then led out to the pin of the component housing 1 by gold wire or aluminum wire bonding; the aperture support 9 is fixed to the upper surface of the chip module 6 by epoxy glue, and the filter After the sheet 7 and the secondary aperture 8 are bonded together, they are fixed as a whole on the upper surface of the aperture support 9, and the primary aperture 4 is fixed on the step of the component housing 1 by epoxy glue; the lens 3 is fixed on the cover plate 2 by welding or epoxy glue, and before sealing welding, the cover plate 2 of the integrated lens 3 and the chip module 6 are optically aligned with high precision, and the alignment deviation between the lens center and the chip center is less than 0.05mm. After alignment, the cover plate 2 and the component housing 1 are fixed by spot welding or clamps; before sealing, the entire component is first evacuated and then filled with inert gas, and finally sealed by laser welding or parallel seam welding.

[0005] The component housing 1, cover plate 2, primary aperture 4 and secondary aperture 8 are all made of low expansion coefficient alloy material.

[0006] The outer surfaces of the primary aperture 4 and the secondary aperture 8 are treated with blackening with low reflectivity.

[0007] The airtight packaging component structure of an integrated lens of the present invention has the following three characteristics: first, it adopts a tube shell packaging form, and the optical elements such as filters, apertures, lenses, etc. are integrated in the component, with high integration and simple structure; second, the structure omits the traditional flat optical window as a sealing window and replaces it with a lens, which can make the lens closer to the chip surface, and the design flexibility of the optical system is greater, which is also conducive to improving the system transmittance; third, the component can achieve air-filled sealing, which can be nitrogen or other inert gases, to ensure a low water vapor atmosphere for the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 Schematic diagram of component cross section.

[0009] Figure 2 Top view of the component after packaging is completed.

[0010] 1 housing, 2 cover plate, 3 lens, 4 primary aperture, 5 electrode plate, 6 chip module, 7 filter, 8 secondary aperture, 9 aperture support DETAILED DESCRIPTION

[0011] The present invention provides an airtight packaging component structure of an integrated lens, such as Figure 1, including component housing 1, cover plate 2, lens 3, primary aperture 4, secondary aperture 8, filter 7, chip module 6, electrode plate 5, aperture support 9. Component housing 1, cover plate 2, primary aperture 4, secondary aperture 8 are made of kovar material, the bottom surface of component housing 1 is sintered with glass bead lead pins, and the outer surface of primary aperture 4, secondary aperture 8 is blackened with black nickel. The chip module 6 and the electrode plate 5 are fixed to the bottom surface of the component housing 1 by epoxy glue, and the electrode plate 5 is located on both sides of the chip module 6; the electrical signal of the chip module 6 is led out to the electrode plate 5 by gold wire ball welding, and then led out to the pins of the component housing 1 by gold wire ball welding; the aperture support 9 is fixed to the upper surface of the chip module 6 by epoxy glue, and the filter 7 and the secondary aperture 8 are fixed to the upper surface of the aperture support 9 as a whole after being bonded with epoxy glue, and the centering deviation with the chip module 1 is better than 0.05mm; the primary aperture 4 is fixed to the step of the component housing 1 by epoxy glue; the lens 3 is fixed to the cover plate 2 by eutectic welding, and the chip module 1 and the lens 3 are aligned on the center deviation instrument, and the center deviation is better than 0.02mm; after alignment, the cover plate 2 and the component housing 1 are fixed by spot welding. The component is vacuumed and filled with nitrogen in the parallel sealing equipment, and the operation is repeated 3 times. Finally, the cover plate 2 and the component housing 1 are fixed by parallel sealing. The top view after packaging is completed is as follows Figure 2 .

Claims

1. An airtight package component structure of an integrated lens, comprising a component housing (1), a cover plate (2), a lens (3), a primary aperture (4), a secondary aperture (8), a filter (7), a chip module (6), an electrode plate (5), and an aperture support (9); characterized in that: The chip module (6) and the electrode plate (5) are fixed to the bottom surface of the component housing (1) by epoxy glue, the electrode plate (5) is located on both sides of the chip module (6), and the electrical signal of the chip module (6) is led out to the electrode plate (5) by gold wire or aluminum wire bonding, and then led out to the pins of the component housing (1) by gold wire or aluminum wire bonding; the aperture support (9) is fixed to the upper surface of the chip module (6) by epoxy glue, the filter (7) and the secondary aperture (8) are fixed to the upper surface of the aperture support (9) as a whole after being bonded, and the primary aperture (4) is fixed to the step of the component housing (1) by epoxy glue; the lens (3) is fixed to the cover plate (2) by welding or epoxy glue, and the alignment deviation between the center of the lens (3) and the center of the chip is less than 0.05 mm, the cover plate (2) and the component housing (1) are sealed by laser welding or parallel seam welding, and the entire component is filled with inert gas.

2. The airtight packaging component structure of an integrated lens according to claim 1, characterized in that: The component housing (1), the cover plate (2), the primary aperture (4) and the secondary aperture (8) are all made of a low expansion coefficient alloy material.

3. The airtight packaging component structure of an integrated lens according to claim 1, characterized in that: The outer surfaces of the primary aperture (4) and the secondary aperture (8) are treated with blackening with low reflectivity.

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