Cushion pad

A cushioning pad and fiber layer technology, applied in the field of cushioning pads, can solve the problems of limited heat resistance and high pressure resistance of kraft paper and silicone pads

Inactive Publication Date: 2020-08-18
东莞市协多电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, kraft paper and silicone pads have limited heat resistance and high pressure resistance

Method used

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Embodiment Construction

[0016] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0017] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly co...

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Abstract

The invention belongs to the technical field of circuit board printing, pressing and buffering, and discloses a cushion pad, which comprises a first antistatic high-temperature layer, a first bondinglayer, a high-temperature-resistant layer, a second bonding layer and a second antistatic high-temperature layer. The first bonding layer and the first antistatic high-temperature layer are sequentially arranged at one end of the high-temperature-resistant layer, and the second bonding layer and the second antistatic high-temperature layer are sequentially arranged at the other end of the high-temperature-resistant layer. The high-temperature-resistant layer comprises a fiber layer and a base cloth layer. The cushion pad is resistant to a high temperature and can be recycled.

Description

technical field [0001] The invention relates to the technical field of circuit board printing press-fit cushioning, in particular to a cushioning pad. Background technique [0002] In the traditional process of manufacturing printed circuit boards, kraft paper or silicone pads must be placed on the pressing surfaces of steel plates as cushioning materials during lamination. However, kraft paper and silicone mats have limited heat resistance and high pressure resistance. Contents of the invention [0003] The embodiment of the present invention provides a buffer pad, which has the advantages of being environmentally friendly, durable, high temperature resistant and recyclable. [0004] In order to achieve the above object, the present invention provides a cushion pad, comprising a first antistatic high temperature layer, a first adhesive layer, a high temperature resistant layer, a second adhesive layer and a second antistatic high temperature layer; one end of the high te...

Claims

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Application Information

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IPC IPC(8): B32B7/12B32B5/02B32B5/26B32B33/00H05K3/46
CPCB32B5/02B32B5/26B32B7/12B32B33/00B32B2307/21B32B2307/306H05K3/4611H05K2203/068
Inventor何丽虎阮传兵汪麒
Owner东莞市协多电子有限公司