Multi-power nano rare earth electric heating structure and its manufacturing process

Abstract

The invention discloses a multi-power nano rare earth electrothermal structure and a manufacturing process thereof, comprising a substrate and a multi-power heating element attached to the substrate; the substrate is a conductive substrate or a non-conductive substrate; the multi-power heating element comprises a plurality of power circuit layers stacked in sequence; the multi-power nano rare earth electrothermal structure further comprises an electrode layer, the electrode layer is attached to the multi-power heating element, and the electrode layers are respectively electrically connected to each of the power circuit layers; the invention enables each power circuit layer to work on a different plane, avoids mutual interference between the power circuit layers and the occurrence of cross-current phenomena, and can realize more power combinations at the same time; and no substrate isolation is required between the power circuit layers, so that the overall structure is thinner, suitable for occasions with limited installation, and has the characteristics of faster heat transfer, light weight and strong practicality.

Description

Technical Field

[0001] The invention relates to a multi-power nano rare earth electric heating structure and a manufacturing process thereof. Background Art

[0002] At present, in order to meet the market demand, a multi-power heating plate is proposed, which arranges a plurality of heating circuits on the same plane or wraps a plurality of heating circuits between a plurality of substrates.

[0003] Although both structural methods can meet multi-power requirements, multiple heating circuits are arranged on the same plane, the creepage distance will be limited, and cross-current and mutual interference are likely to occur, seriously affecting the normal use of the multi-power heating plate. At the same time, more power combinations cannot be achieved within a given size; and multiple heating circuits are arranged between multiple substrates, which will make the entire multi-power heating plate thicker, which is not suitable for occasions with limited installation, and has poor thermal conductivity, heavy weight, and poor practicality. Summary of the invention

[0004] The purpose of the present invention is to overcome the above-mentioned disadvantages and provide a multi-power nano rare earth electric heating structure and its manufacturing process.

[0005] To achieve the above object, the specific scheme of the present invention is as follows:

[0006] A multi-power nano rare earth electrothermal structure comprises a substrate and a multi-power heating element attached to the substrate; the substrate is a conductive substrate or a non-conductive substrate; the multi-power heating element comprises a plurality of power circuit layers stacked in sequence; the multi-power nano rare earth electrothermal structure further comprises an electrode layer, the electrode layer is attached to the multi-power heating element, and the electrode layer is electrically connected to each of the power circuit layers respectively.

[0007] According to a further aspect of the present invention, the plurality of power circuit layers are formed on the substrate by printing and sintering nano rare earth materials; and the electrode layer is formed on the multi-power heating element by printing and sintering nano rare earth materials.

[0008] In a further aspect of the present invention, the substrate is a non-conductive substrate; the multi-power heating element is directly printed and sintered on the non-conductive substrate.

[0009] In a further aspect of the present invention, the substrate is a conductive substrate, an insulating layer is attached to the conductive substrate, and the multi-power heating element is printed and sintered on the insulating layer.

[0010] According to a further aspect of the present invention, the insulating layer is printed and sintered on the conductive substrate by nano rare earth material.

[0011] The present invention further comprises each power circuit layer comprising a resistive heating layer, a conductive layer and a covering layer which are printed and sintered in sequence, or a conductive layer, a resistive heating layer and a covering layer which are printed and sintered in sequence; wherein the conductive layer is electrically connected to the electrode layer.

[0012] In a further aspect of the present invention, the thickness of the covering layer is 35-150 μm.

[0013] The present invention also provides a process for manufacturing a multi-power nano rare earth electrothermal structure, comprising the following steps:

[0014] S1: Cleaning a conductive substrate or a non-conductive substrate;

[0015] S2: Printing a layer of resistor paste or a layer of conductive paste on the non-conductive substrate, and drying, sintering and cooling the printed layer of resistor paste or conductive paste in a tunnel furnace to form a resistive heating layer or a conductive layer;

[0016] Alternatively, a layer of insulating paste is printed on the conductive substrate, and the printed layer of insulating paste is dried, sintered and cooled in a tunnel furnace to form an insulating layer; then a layer of resistive paste or a layer of conductive paste is printed on the insulating layer, and the printed layer of resistive paste or conductive paste is dried, sintered and cooled in a tunnel furnace to form a resistive heating layer or a conductive layer;

[0017] S3: printing a layer of conductive paste or a layer of resistor paste on the resistive heating layer or the conductive layer, and drying, sintering and cooling the printed layer of conductive paste or resistor paste in a tunnel furnace to form a conductive layer or a resistive heating layer;

[0018] S4: printing a layer of covering slurry on the conductive layer or the resistive heating layer, and drying, sintering and cooling the printed covering slurry in a tunnel furnace to form a covering layer;

[0019] The resistance heating layer, the conductive layer and the covering layer are melted and connected to form a power circuit layer;

[0020] S5: printing a layer of resistor paste or a layer of conductive paste on the cover layer, and drying, sintering and cooling the printed layer of resistor paste or conductive paste in a tunnel furnace to form a resistive heating layer or a conductive layer, and then repeating steps S3 and S4;

[0021] S6: setting the number of times of repeating step S5 according to actual needs to form a plurality of power circuit layers stacked in sequence, and forming a multi-power heating element between the plurality of power circuit layers;

[0022] S7: printing a layer of electrode paste on the multi-power heating element, and drying, sintering and cooling the printed layer of electrode paste in a tunnel furnace to form an electrode layer, and the electrode layer is electrically connected to the conductive layers of each of the power circuit layers respectively;

[0023] Wherein, the insulating paste, the resistance paste, the conductive paste, the covering paste and the electrode paste are all made of nano rare earth materials.

[0024] In a further aspect of the present invention, the thickness of the covering layer is 35-150 μm.

[0025] The present invention further comprises that the drying time of the resistive heating layer, the conductive layer, the covering layer and the electrode layer are all 15 minutes and the drying temperature is 150-200°C; the sintering temperature of the resistive heating layer, the conductive layer, the covering layer and the electrode layer is 800-850°C.

[0026] The beneficial effects of the present invention are as follows: the present invention forms a multi-power heating element by stacking a plurality of power circuit layers in sequence, so that each power circuit layer works on a different plane, avoiding mutual interference between the power circuit layers and the occurrence of cross-current phenomena, and at the same time being able to achieve more power combinations; and no substrate isolation is required between the power circuit layers, so that the overall structure is thinner, suitable for occasions with limited installation, and has the characteristics of faster heat transfer, light weight, and strong practicality.

[0027] In addition, the present invention arranges the electrode layer on the top surface of the multi-power heating element, so that the wiring of each power circuit layer is more convenient, each electrode is on the same surface, and the process structure is more beautiful. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a three-dimensional diagram of a multi-power nano rare earth electrothermal structure provided by an embodiment of the present invention;

[0029] Figure 2 It is a decomposition schematic diagram of a multi-power nano rare earth electrothermal structure provided by an embodiment of the present invention;

[0030] Figure 3 is a schematic diagram of a multi-power nano rare earth electrothermal structure provided by another embodiment of the present invention;

[0031] Figure 4 It is a schematic diagram of a process for manufacturing a multi-power nano rare earth electrothermal structure provided by an embodiment of the present invention;

[0032] Explanation of the reference numerals: 1. substrate; 2. insulating layer; 3. multi-power heating element; 31. power circuit layer; 311. resistive heating layer; 312. conductive layer; 313. covering layer; 4. electrode layer. DETAILED DESCRIPTION

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the implementation scope of the present invention is not limited thereto.

[0034] like Figures 1 to 4 As shown, a multi-power nano rare earth electrothermal structure described in this embodiment includes a substrate 1 and a multi-power heating element 3 attached to the substrate 1; the substrate 1 is a conductive substrate or a non-conductive substrate; the multi-power heating element 3 includes a plurality of power circuit layers 31 stacked in sequence; the multi-power nano rare earth electrothermal structure also includes an electrode layer 4, the electrode layer 4 is attached to the multi-power heating element 3, and the electrode layer 4 is electrically connected to each of the power circuit layers 31. In this embodiment, the shape of the substrate 1 can be a flat plate, a tube or other shapes, and the substrate 1 of this embodiment adopts a flat plate shape.

[0035] In actual use, the external current flows into each power circuit layer 31 through the electrode layer 4. Each power circuit layer 31 converts electrical energy into thermal energy on a different plane, and conducts the heat to the substrate 1 in a timely manner. The substrate 1 then conducts the heat away to achieve the heating and heat supply functions.

[0036] In this embodiment, a plurality of power circuit layers 31 are stacked in sequence to form a multi-power heating element 3, so that each power circuit layer 31 works on a different plane, avoiding mutual interference and cross-current between the power circuit layers 31, and realizing more power combinations at the same time; and no substrate isolation is required between the power circuit layers 31, so that the overall structure is thinner, which is suitable for occasions with limited installation, and has the characteristics of faster heat transfer, light weight and strong practicality.

[0037] In addition, this embodiment sets the electrode layer 4 on the top surface of the multi-power heating element 3, so that the wiring of each power circuit layer 31 is more convenient, each electrode is on the same surface, and the process structure is more beautiful. For the existing method of using multiple substrates to cover the structure, the electrodes are not on the same surface, the overall structure has the problems of thick thickness, heavy weight, and poor thermal conductivity, which easily causes the heating circuit to burn out due to high temperature. The multi-power nano rare earth electric heating structure of this embodiment solves these technical problems.

[0038] In this embodiment, further, the multiple power circuit layers 31 are all formed on the substrate 1 by printing and sintering nano rare earth materials; the electrode layer 4 is printed and sintered on the multi-power heating element 3 by printing and sintering nano rare earth materials. In this way, the multi-power heating element 3 and the electrode layer 4 are integrated and firmly bonded to the substrate 1, thereby improving thermal stability and thermal conductivity and further reducing thickness.

[0039] In this embodiment, further, the substrate 1 adopts a non-conductive substrate, which can be a substrate 1 made of non-conductive materials such as microcrystalline glass plate, ceramics, etc.; the multi-power heating element 3 is directly printed and sintered on the non-conductive substrate.

[0040] Based on the above embodiment, further, each power circuit layer 31 includes a resistive heating layer 311, a conductive layer 312 and a covering layer 313 which are printed and sintered in sequence, or a conductive layer 312, a resistive heating layer 311 and a covering layer 313 which are printed and sintered in sequence; wherein the conductive layer 312 is electrically connected to the electrode layer 4. In actual use, the position between the conductive layer 312 and the resistive heating layer 311 can be flexibly set according to actual design requirements, and at the same time, according to actual requirements, each power circuit layer 31 is formed by different resistive heating layers 311, conductive layers 312 and covering layers 313, respectively, to meet more power combination requirements.

[0041] Based on the above embodiment, further, the thickness of the covering layer 313 is 35-150 μm. After repeated experiments and tests by the designers, and with creative efforts, the thickness of the covering layer 313 of each power circuit layer 31 is set within the range of 35-150 μm, which can avoid the mutual penetration and connection between the resistance heating layer 311 and the conductive layer 312 of each power circuit layer 31, and can transfer heat to the substrate 1 layer by layer, ensuring that each power circuit layer 31 can still maintain normal operation under high temperature conditions.

[0042] like Figure 2 and Figure 3 As shown, based on the above embodiment, further, the multi-power heating element 3 includes two power circuit layers 31, namely the first power circuit layer and the second power circuit layer. Of course, according to the actual power quantity requirements, the multi-power heating element 3 can be provided with three, four, five or more power circuit layers 31, and the overall thickness is thin and the weight is light.

[0043] like Figure 3 As shown, this embodiment also provides another implementation method, which is different from the above embodiment in that the substrate 1 is a conductive substrate, which can be a substrate 1 made of conductive materials such as a stainless steel substrate and an aluminum substrate. An insulating layer 2 is attached to the conductive substrate, and the multi-power heating element 3 is printed and sintered on the insulating layer 2. This arrangement achieves insulation between the power circuit layer 31 and the conductive substrate; the other structures of this embodiment are the same as the above embodiment and will not be repeated here. In this embodiment, the conductive substrate is preferably made of a stainless steel material, which is resistant to high temperatures and has high thermal conductivity. It can conduct the heat generated by each power circuit layer 31 in time to avoid excessive heat affecting the normal operation of each power circuit layer 31.

[0044] like Figures 1 to 4 As shown, this embodiment also provides a manufacturing process of a multi-power nano rare earth electrothermal structure, including the following steps:

[0045] Step S1: cleaning the conductive substrate or the non-conductive substrate; ensuring the cleanliness of the conductive substrate or the non-conductive substrate; the non-conductive substrate can be a substrate 1 made of non-conductive materials such as ceramics and microcrystalline glass plates; the conductive substrate can be a substrate 1 made of conductive materials such as stainless steel substrates and aluminum substrates;

[0046] Step S2: printing a layer of resistor paste or a layer of conductive paste on the non-conductive substrate by screen printing, and drying, sintering and cooling the printed layer of resistor paste or conductive paste in a tunnel furnace to form a resistive heating layer 311 or a conductive layer 312;

[0047] Or, a layer of insulating paste is printed on the conductive substrate by screen printing, and the printed layer of insulating paste is dried, sintered and cooled in a tunnel furnace to form an insulating layer 2; then, a layer of resistive paste or a layer of conductive paste is printed on the insulating layer 2 by screen printing, and the printed layer of resistive paste or conductive paste is dried, sintered and cooled in a tunnel furnace to form a resistive heating layer 311 or a conductive layer 312; this embodiment preferably uses a conductive substrate made of stainless steel material, which is resistant to high temperature and has good thermal conductivity, that is, a layer of insulating layer 2 is printed and sintered on the surface of the conductive substrate to achieve insulation between the multi-power heating element 3 and the conductive substrate;

[0048] Step S3: printing a layer of conductive paste or a layer of resistor paste on the resistive heating layer 311 or the conductive layer 312 by screen printing, and drying, sintering and cooling the printed layer of conductive paste or resistor paste in a tunnel furnace to form a conductive layer 312 or a resistive heating layer 311;

[0049] Step S4: printing a layer of covering slurry on the conductive layer 312 or the resistive heating layer 311 by screen printing, and drying, sintering and cooling the printed covering slurry in a tunnel furnace to form a covering layer 313; wherein the resistive heating layer 311, the conductive layer 312 and the covering layer 313 are melted and connected to form a power circuit layer 31;

[0050] Step S5: Print a layer of resistor paste or a layer of conductive paste on the cover layer 313 by screen printing, and dry, sinter and cool the printed layer of resistor paste or conductive paste in a tunnel furnace to form a layer of resistive heating layer 311 or a layer of conductive layer 312, and then repeat steps S3 and S4; at this time, two power circuit layers 31 are formed on the non-conductive substrate or two power circuit layers 31 are formed on the insulating layer 2;

[0051] Step S6: Then, the number of times step S5 is repeated is set according to actual needs to form a plurality of sequentially stacked power circuit layers 31, and a multi-power heating element 3 is formed between the plurality of power circuit layers 31; at this time, two power circuit layers 31 are formed on the non-conductive substrate or two power circuit layers 31 are formed on the insulating layer 2; if the number of times step S5 is repeated is 0 times, 1 times, 2 times, two, three, or four sequentially stacked power circuit layers 31 are formed;

[0052] Step S7: Print a layer of electrode paste on the multi-power heating element 3 by screen printing, and form an electrode layer 4 after drying, sintering and cooling the printed electrode paste in a tunnel furnace, and the electrode layer 4 is electrically connected to the conductive layer 312 of each power circuit layer 31; wherein the insulating paste, the resistor paste, the conductive paste, the covering paste, and the electrode paste are all made of nano rare earth materials. During production, each power circuit layer 31 is pre-reserved with avoidance holes so that the electrode layer 4 is electrically connected to each power circuit layer 31, so that the electrode layer 4 is electrically connected to each power circuit layer 31 by printing and sintering, which can increase the thickness of the conductive pad and enhance the strength of conductivity and welding performance.

[0053] In this embodiment, the resistive heating layer 311 is printed and sintered first, and then the conductive layer 312 is printed, so that the resistive heating layer 311 is closer to the substrate 1 to facilitate heat conduction.

[0054] The multi-power nano-rare earth electrothermal structure obtained by the manufacturing process of this embodiment enables each power circuit layer 31 to work on different planes, avoiding mutual interference and cross-current between the power circuit layers 31, and at the same time being able to achieve more power combinations; and no substrate isolation is required between the power circuit layers 31, so that the overall structure is thinner and suitable for occasions with limited installation. It has the characteristics of faster heat transfer, light weight, and strong practicality.

[0055] In addition, this embodiment sets the electrode layer 4 on the top surface of the multi-power heating element 3, so that the wiring of each power circuit layer 31 is more convenient, each electrode is on the same surface, and the process structure is more beautiful. For the existing structure using multiple substrates, the electrodes are not on the same surface, the overall structure has the problems of thick thickness, heavy weight, and poor thermal conductivity, which easily causes the heating circuit to burn out due to high temperature. The multi-power nano rare earth electric heating structure produced in this embodiment solves these technical problems.

[0056] Based on the above embodiment, further, the thickness of the covering layer 313 is 35-150 μm. After repeated experiments and tests by the designers, and with creative efforts, the thickness of the covering layer 313 of each power circuit layer 31 is set within the range of 35-150 μm, which can avoid the mutual penetration and connection between the resistance heating layer 311 and the conductive layer 312 of each power circuit layer 31, and can transfer heat to the substrate 1 layer by layer, ensuring that each power circuit layer 31 can still maintain normal operation under high temperature conditions.

[0057] Based on the above embodiment, further, the drying time of the resistive heating layer 311, the conductive layer 312, the covering layer 313, and the electrode layer 4 are all 15 minutes, and the drying temperature is 150-200°C; the sintering temperature of the resistive heating layer 311, the conductive layer 312, the covering layer 313, and the electrode layer 4 is 800-850°C. Such a setting ensures that the resistive heating layer 311, the conductive layer 312, and the covering layer 313 are integrated into one, forming a whole that is firmly bonded to the substrate 1 to avoid cracking, and ensures the thermal stability and thermal conductivity between each power circuit layer 31, while making the entire manufacturing process easier to operate; at the same time, the electrode layer 4 is firmly combined with the multi-power heating element 3 to ensure the strength of electrical conduction and welding performance.

[0058] In this embodiment, the above drying temperature range and sintering temperature are obtained by designers based on technical problems existing in existing multi-power heating plates, after repeated experiments and tests, and through creative labor, and are not obtained by chance.

[0059] In this embodiment, when the power circuit layer 31 is electrically connected to an external DC power source, the electrode layer 4 includes at least one positive contact and one negative contact; if two power circuit layers 31 are powered by different DC power sources, two positive contacts and one negative contact are set on the electrode layer 4 to meet the wiring requirements of the two power circuit layers 31; when the power circuit layer 31 is electrically connected to an external AC power source, the electrode layer 4 includes at least one live contact and at least one neutral contact; if two power circuit layers 31 are powered by different AC power sources, two live contacts and two neutral contacts are set on the electrode layer 4. Such a configuration can meet the contact requirements when there are both DC power sources and AC power sources.

[0060] The above is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the protection scope of the patent application of the present invention.

Claims

1. A process for manufacturing a multi-power nano rare earth electrothermal structure, characterized in that: The multi-power nano rare earth electrothermal structure comprises a substrate (1) and a multi-power heating element (3) attached to the substrate (1); the substrate (1) is a conductive substrate or a non-conductive substrate; the multi-power heating element (3) comprises a plurality of power circuit layers (31) stacked in sequence; the multi-power nano rare earth electrothermal structure further comprises an electrode layer (4), the electrode layer (4) is attached to the multi-power heating element (3), and the electrode layer (4) is electrically connected to each of the power circuit layers (31) respectively; The production process includes the following steps: S1: Cleaning a conductive substrate or a non-conductive substrate; S2: printing a layer of resistor paste or a layer of conductive paste on the non-conductive substrate, and drying, sintering and cooling the printed layer of resistor paste or conductive paste in a tunnel furnace to form a resistive heating layer (311) or a conductive layer (312); Alternatively, a layer of insulating paste is printed on the conductive substrate, and the printed layer of insulating paste is dried, sintered and cooled in a tunnel furnace to form an insulating layer (2); Then, a layer of resistance paste or a layer of conductive paste is printed on the insulating layer (2), and the printed layer of resistance paste or conductive paste is dried, sintered and cooled in a tunnel furnace to form a resistance heating layer (311) or a conductive layer (312); S3: printing a layer of conductive paste or a layer of resistor paste on the resistive heating layer (311) or the conductive layer (312), and drying, sintering and cooling the printed layer of conductive paste or resistor paste in a tunnel furnace to form a conductive layer (312) or a resistive heating layer (311); S4: printing a layer of covering slurry on the conductive layer (312) or the resistive heating layer (311), and drying, sintering and cooling the printed covering slurry in a tunnel furnace to form a covering layer (313); The resistive heating layer (311), the conductive layer (312), and the covering layer (313) are fused and connected to form a power circuit layer (31); S5: printing a layer of resistor paste or a layer of conductive paste on the cover layer (313), and drying, sintering and cooling the printed layer of resistor paste or conductive paste in a tunnel furnace to form a resistive heating layer (311) or a conductive layer (312), and then repeating steps S3 and S4; S6: setting the number of times to repeat step S5 according to actual needs, forming a plurality of power circuit layers (31) stacked in sequence, and forming a multi-power heating element (3) between the plurality of power circuit layers (31); S7: printing a layer of electrode paste on the multi-power heating element (3), and drying, sintering and cooling the printed layer of electrode paste in a tunnel furnace to form an electrode layer (4), and the electrode layer (4) is electrically connected to the conductive layer (312) of each power circuit layer (31) respectively; Wherein, the insulating paste, the resistance paste, the conductive paste, the covering paste and the electrode paste are all made of nano rare earth materials.

2. The manufacturing process of the multi-power nano rare earth electrothermal structure according to claim 1 is characterized in that: The thickness of the covering layer (313) is 35-150 μm.

3. The manufacturing process of the multi-power nano rare earth electric heating structure according to claim 1 is characterized in that: The drying time of the resistive heating layer (311), the conductive layer (312), the covering layer (313), and the electrode layer (4) is 15 minutes, and the drying temperature is 150-200° C.; the sintering temperature of the resistive heating layer (311), the conductive layer (312), the covering layer (313), and the electrode layer (4) is 800-850° C.

Images