A capacitor packaging structure
By using metal materials in the capacitor packaging structure and introducing insulating parts, the airtightness and volume problems of the capacitor packaging structure in the prior art are solved, and a miniaturized and high-reliability capacitor packaging is achieved.
Patent Information
- Application Number
- CN202110966095.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-08-23
- Publication Date
- 2024-12-10
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing capacitor packaging structures have reduced airtightness and reliability due to the use of plastic materials, and there are limitations in terms of volume and cost of solid-state stacked polymer capacitors.
The metal material is used as the encapsulation shell, and the contact between the capacitor unit and the metal base and the pin is isolated through insulating parts, including an insulating sleeve and an insulating gasket, to achieve insulation to improve airtightness and shock resistance.
The volume reduction and airtightness of the capacitor packaging structure are achieved, while avoiding defects in metal conductivity and improving the shock resistance and reliability of the capacitor.
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Figure CN113555213B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to electronic components, and in particular to a capacitor packaging structure. Background Art
[0002] Traditional capacitors use a winding method to wind the positive electrode, negative electrode and electrolytic paper together to form a cylinder, and then add electrolyte to form a winding capacitor. This method results in a large limitation in the size of the capacitor element formed. In industrial production, the existing production process is close to the limit. Therefore, solid-state laminated polymer capacitors came into being.
[0003] Solid-state multilayer polymer capacitors, also known as chip-type conductive polymer multilayer capacitors (Multilayer polymer capacitors, MLPC), are a widely used capacitor component. It is a solid aluminum capacitor formed by clicking and welding multiple capacitors with conductive polymer deposits together, and finally encapsulating them with resin and carbon paste silver paste.
[0004] After the capacitors are stacked, they need to be packaged. The most commonly used method is to stack the capacitor sheets on the lead frame, where the positive electrode is laser welded to penetrate the alumina of the positive electrode to achieve conduction and fixation of the positive electrode, while the negative electrode is conducted and fixed to the lead frame by silver paste, and finally the whole is packaged with insulating plastic. However, the plastic material itself is not water-resistant, and its airtightness and reliability are reduced after oxidation. Summary of the invention
[0005] The technical problem to be solved by the present invention lies in the existing capacitor packaging structure. Aiming at the deficiencies of the existing technology, a capacitor packaging structure is provided.
[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is as follows:
[0007] A capacitor packaging structure, comprising:
[0008] A capacitor unit, a metal upper cover, a metal base fixedly connected to the metal upper cover, and an insulating member for isolating the capacitor unit from the metal base;
[0009] The metal base and the metal upper cover form a cavity for accommodating the capacitor unit;
[0010] The capacitor unit comprises a capacitor body, a pin electrically connected to the capacitor body, and the pin passes through the metal base and is connected to other electronic components;
[0011] The insulating member is arranged between the metal base and the pin.
[0012] The capacitor packaging structure, wherein the insulating member comprises an insulating sleeve;
[0013] The insulating sleeve is sleeved between the pin and the metal base.
[0014] The capacitor packaging structure, wherein the insulating sleeve is made of glass.
[0015] The capacitor packaging structure, wherein the pin comprises a supporting portion connected to the capacitor unit, a middle portion sleeved on the insulating sleeve, and an extending portion connected to other electronic components;
[0016] The cross section of the support portion is larger than the cross section of the middle portion and smaller than the cross section of the insulating sleeve. The top of the support portion is electrically connected to the capacitor body, and the bottom of the support portion abuts against the insulating sleeve.
[0017] The capacitor packaging structure, wherein the length of the middle portion is greater than the height of the metal base;
[0018] There is a gap between the extension portion and the bottom of the metal base.
[0019] The capacitor packaging structure, wherein the insulating member includes an insulating gasket, and the metal base and the extending portion of the pin abut against the insulating gasket.
[0020] The capacitor packaging structure, wherein the bottom of the insulating gasket is provided with a polarity mark of the pin.
[0021] The capacitor packaging structure, wherein the four corners of the upper cover body are rounded.
[0022] The capacitor packaging structure, wherein the insulating gasket wraps around four corners of the metal base.
[0023] The capacitor packaging structure, wherein the metal upper cover comprises an upper cover body and an extension cover formed by horizontally extending the edge of the upper cover body outward;
[0024] The metal base is provided with a groove which cooperates with the extension cover.
[0025] Beneficial effect: Compared with the prior art, the present invention provides a capacitor packaging structure, which uses metal material as a packaging shell. The existing process for metal material can make the metal very light and thin, so even if the capacitor sheet is large, the entire capacitor packaging structure can maintain a very small volume. However, the important defect of metal material is that metal material is conductive, so an insulating member is provided between the capacitor unit and the packaging shell to achieve insulation between the capacitor unit and the packaging shell. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 An exploded view of the capacitor packaging structure provided by the present invention.
[0027] Figure 2 This is a cross-sectional view of the capacitor packaging structure provided by the present invention.
[0028] Figure 3 This is a first stereoscopic view of the capacitor packaging structure provided by the present invention.
[0029] Figure 4 This is a second stereoscopic view of the capacitor packaging structure provided by the present invention.
[0030] Figure 5 This is a three-dimensional view of the capacitor packaging structure provided by the present invention when there is no metal upper cover in the capacitor packaging structure.
[0031] The meanings of the markings in the figure are:
[0032] 100, packaging shell; 110, metal upper cover; 110a, upper cover body; 110b, extension cover; 120, metal base; 200, capacitor unit; 210, capacitor body; 211, isolation glue; 212, positive side; 213, negative side; 214, conductive glue; 215, capacitor sheet; 220, pin; 220a, support part; 220b, middle part; 220c, extension part; 221, first pin; 222, second pin; 230, clamping assembly; 230a, spring piece; 230b, clamping part; 231, first horizontal part; 232, angle part; 233, second horizontal part; 234, grabbing section; 235, through hole; 300, insulating part; 310, insulating sleeve; 320, insulating gasket; 321, polarity mark. DETAILED DESCRIPTION
[0033] The present invention provides a capacitor packaging structure. To make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0034] It will be understood by those skilled in the art that, unless expressly stated, the singular forms "one", "said", and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that when we refer to an element as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.
[0035] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as generally understood by those skilled in the art in the art to which the present invention belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as herein.
[0036] The invention is further described below by describing embodiments in conjunction with the accompanying drawings.
[0037] Although the hermetic package can also use ceramics to construct a cavity to place the capacitor, the larger the capacitor sheet is, the deeper the cavity needs to be, and the thickness of the ceramic is thicker. Therefore, when the capacitor sheet is large, the volume of the entire capacitor packaging structure is very large, which is not conducive to size reduction and also causes cost increase.
[0038] The existing process for metal materials can make metal very light and thin, so even if the capacitor sheet is large, the entire capacitor packaging structure can maintain a very small volume. However, the important disadvantage of metal materials is that metal materials are conductive. Therefore, in order to use metal materials as the shell of the capacitor structure, the existing packaging structure needs to be improved.
[0039] This solution provides a capacitor packaging structure. The capacitor packaging structure is mainly used to fix and install MLPC, but can also be applied to other capacitor installations.
[0040] like Figure 1As shown, the capacitor packaging structure is mainly divided into two parts, one is the packaging shell 100, and the other is the capacitor unit 200. The capacitor unit 200 mainly includes a capacitor body 210 and a pin 220 led out from the capacitor body 210. In this embodiment, the capacitor body 210 mainly refers to MLPC, and the pin 220 passes through the metal base 120 and is connected to other electronic components. Since the positive and negative poles connected to the pin 220 are different, the pin 220 is divided into a first pin 221 connected to the positive pole, and a second pin 222 connected to the negative pole. The number of the first pin 221 and the second pin 222 can be multiple, such as Figure 1 As shown, the number of the first pin 221 and the second pin 222 is two.
[0041] The package shell 100 has a chamber inside, and the capacitor unit 200 is disposed in the chamber inside the package shell 100 .
[0042] In order to achieve high airtight packaging of the capacitor unit 200, the main material of the shell in this solution is metal material, including a metal cover 110 and a metal base 120 fixedly connected to the metal cover 110. A cavity for accommodating the capacitor unit 200 is formed between the metal cover 110 and the metal base 120.
[0043] Since metal is conductive, an insulating member 300 is provided between the capacitor unit 200 and the package shell 100 . The metal cover 110 is generally not directly connected to the capacitor unit 200 , so the insulating member 300 is mainly used to isolate the capacitor unit 200 from the metal base 120 .
[0044] There are three places where the metal base 120 and the capacitor unit 200 may be in direct contact. The first place is the bottom of the capacitor body 210 and the upper surface of the metal base 120. The second place is between the pin 220 and the metal base 120 when the pin 220 passes through the metal base 120. The third place is the lower surface of the metal base 120 and the extension part c of the pin 220. The extension part c refers to the part where the pin 220 extends from the middle part 220b and is connected to other electronic components.
[0045] like Figure 1 and Figure 2As shown, in order to avoid the above-mentioned possible direct contact, the insulating member 300 includes an insulating sleeve 310. The insulating sleeve 310 refers to a set structure that can achieve insulation. The material of the insulating sleeve 310 can be insulating plastic, such as polyvinyl chloride and polypropylene. In this embodiment, the insulating sleeve 310 is equivalent to being embedded in the interior of the packaging shell 100. Therefore, if there is a problem inside the insulating sleeve 310, it is difficult to see from the outside and difficult to replace. Therefore, in this embodiment, the material of the insulating sleeve 310 is insulating glass. On the one hand, due to the transparency of the glass, cracks or damage can be found through appearance inspection. On the other hand, the insulating glass has high mechanical strength, is not easy to crack, and is difficult to age and has strong stability.
[0046] In order to avoid the other two direct contact modes, the pin 220 is divided into a support portion 220a directly connected to the capacitor unit 200, a middle portion 220b sleeved on the insulating sleeve 310, and an extension portion c. In the first implementation mode, the insulating sleeve 310 also sleeves the support portion 220a and the extension portion c, supporting the capacitor unit 200 together to ensure that the capacitor unit 200 is insulated from the metal base 120. However, this method is inconvenient to connect the pin 220 to the capacitor unit 200 and extend the pin 220.
[0047] In the second implementation, the cross-section of the support portion 220a is larger than the cross-section of the middle portion 220b and smaller than the cross-section of the insulating sleeve 310. The support portion 220a and the insulating sleeve 310 are in contact with each other. Due to the existence of the support portion 220a, there is a gap between the metal base 120 and the capacitor unit 200, and the two are no longer in direct contact. Moreover, since the length of the middle portion 220b is greater than the thickness of the metal base 120, the extension portion c is not in direct contact with the bottom of the metal base 120, thereby achieving insulation between the metal base 120 and the capacitor unit 200.
[0048] Although the extension part c can also be insulated in a similar manner, or the length of the middle part 220b of the pin 220 is greater than the height of the metal base, there is also a gap between the extension part c and the metal base to achieve insulation between the two.
[0049] However, when the above method is applied to the extension c and the metal base 120, the lead is relatively fragile when the capacitor packaging structure is installed on the component carrier. Therefore, in the third implementation method of this embodiment, the insulating member 300 includes an insulating gasket 320, and the insulating gasket 320 is installed between the metal base 120 and the extension c of the pin 220. The insulating gasket 320 is elastic and can provide more elasticity for the airtight packaging of the capacitor after installation, and completely insulates the metal base 120 from the extension c of the pin 220. Since the insulating gasket 320 is arranged between the metal base 120 and the pin 220, it may be convenient to replace it if it is damaged.
[0050] In order to facilitate identification of the first pin 221 and the second pin 222 of the pin 220, a polarity mark 321 of the pin 220 is provided at the bottom of the insulating spacer 320. Figure 3 As shown, the polarity mark 321 corresponding to the first pin 221 is "-", indicating the positive pole of the subsequent connected electronic component, and the polarity mark 321 corresponding to the second pin 222 is "+", representing the negative pole of the subsequent connected electronic component.
[0051] The metal upper cover 110 includes an upper cover body 110a and an extension cover 110b formed by horizontally extending the edge of the upper cover body 110a. At the same time, the metal base 120 is provided with a groove that cooperates with the extension cover 110b. When the metal upper cover 110 and the upper cover body 110a are closed, the extension cover 110b and the groove of the metal base 120 cooperate with each other. In order to achieve a fixed connection between the metal upper cover 110 and the metal base 120, the extension cover 110b and the groove are connected by welding, dispensing, etc., so as to improve the airtightness of the entire capacitor packaging structure.
[0052] In order to reduce the cost of the metal base 120, in this embodiment, the groove of the metal base 120 is a notch at the edge of the metal base 120. If the metal base 120 is impacted, the metal cover 110 may also be affected, and the areas of the metal base 120 that are most susceptible to impact are the four corners of the metal base 120. Therefore, in this embodiment, the insulating gasket 320 includes at least the four corners of the metal base 120.
[0053] Furthermore, if Figure 4 As shown, in order to improve the pressure resistance of the upper cover, the four corners of the upper cover body 110a are set to be rounded. When facing impact, the rounded corners can disperse the pressure through the arc surface of the rounded corners.
[0054] When the required capacitance value is larger, the number of capacitor sheets 215, the size and thickness of the capacitor body 210 formed will also become larger. The increase in thickness and size also brings challenges to the anti-vibration capability of the capacitor packaging structure.
[0055] In this embodiment, the capacitor unit 200 is improved. On the basis of the original capacitor body 210 and the pin 220, a clamping component 230 for clamping the capacitor body is added. The pin 220 is no longer directly connected to the capacitor body 210, but is connected to the clamping component 230. The clamping component 230 itself is conductive, so the capacitor body 210 can be connected to the pin 220 through the clamping component 230. At the same time, the clamping component 230 includes a clamping portion 230b for clamping the capacitor body, and also includes a spring 230a connected to the pin 220.
[0056] The clamping assembly 230 having the spring piece 230a can, on the one hand, clamp the capacitor body 210 to fix the capacitor body 210, and on the other hand, the spring piece 230a is elastic. When there is external impact or vibration, the elasticity of the spring piece 230a can play a buffering role, thereby improving the shock resistance.
[0057] Furthermore, if Figure 1 and Figure 5 As shown, if the capacitor is MLPC, the capacitor body 210 is composed of several capacitor sheets 215. The positive electrode of MLPC is aluminum foil, which is not conductive. Therefore, the positive electrode of the capacitor sheet 215 must be pierced with a laser point in advance to expose the aluminum, and then electrically connected to other capacitor sheets 215 through a conductive glue 214. The conductive glue 214 may include gold conductive glue 214, silver conductive glue 214, etc. In order to balance the positive and negative electrodes, the positive side 212 and the negative side 213 are electrically connected to other capacitor sheets 215 through conductive glue 214. On the capacitor sheet 215, in order to separate the positive electrode from the negative electrode, there is still an isolation glue 211 in the middle of the conductive sheet.
[0058] In addition, the side wall of the capacitor body 210 and the clamping portion 230b of the clamping component 230 are connected by a conductive adhesive 214, which not only improves the conductivity between the clamping component 230 and the capacitor body 210, but also improves the stability between the clamping component 230 and the capacitor body 210.
[0059] The spring piece 230a includes a first horizontal portion 231, a second horizontal portion 233, and an angled portion 232 connecting the first horizontal portion 231 and the second horizontal portion 233. The bottom of the first horizontal portion 231 is electrically connected to the pin 220, and the second horizontal portion 233 is connected to the clamping portion 230b. Since the clamping component 230 itself is conductive, the clamping portion 230b is electrically connected to the side wall of the capacitor body 210, and can be transmitted to the pin 220 through the second horizontal portion 233, the angled portion 232, and the first horizontal portion 231.
[0060] In order to improve the electrical conduction capability, in this embodiment, a conductive member for electrically connecting to the bottom of the capacitor body 210 is disposed on the upper surface of the second horizontal portion 233 , and a preferred conductive member is the conductive glue 214 .
[0061] The clamping portion 230b includes a gripping section 234, which is a section for gripping. In this embodiment, a through hole 235 is provided in the gripping section 234 to facilitate installation of the capacitor body 210 in the clamping assembly 230 and dispensing of glue.
[0062] When the capacitor packaging structure is used to package the capacitor, the unprocessed capacitor sheet 215 is first placed on the clamping assembly 230, and then the spring sheet 230a of the clamping assembly 230 is folded to fasten the capacitor.
[0063] The capacitor sheet 215 is turned on, and the aluminum foil is pierced during the conduction process to expose the aluminum. The positive electrode of the capacitor sheet 215 is connected with silver glue, and the negative electrode of the capacitor sheet 215 is connected with silver glue to form the capacitor body 210. Then the capacitor body 210 and the pin 220 are connected, and the pin 220 passes through the metal base 120 with the insulating sleeve 310. An insulating gasket 320 is attached to the bottom of the metal base 120 in advance, and the pin 220 passes through the insulating gasket 320 and extends outward to form an extension c. Finally, the metal upper cover 110 and the metal base 120 are covered and fixed by welding or other methods to obtain the packaging structure encapsulated with the capacitor in this embodiment.
Claims
1. A capacitor packaging structure, characterized in that: include: A capacitor unit, a metal upper cover, a metal base fixedly connected to the metal upper cover, and an insulating member for isolating the capacitor unit from the metal base; The capacitor unit is an MLPC capacitor, the metal base and the metal upper cover form a cavity for accommodating the capacitor unit, and the metal upper cover and the metal base together form an airtight package for the capacitor unit; The capacitor unit includes a capacitor body, a pin electrically connected to the capacitor body, the pin passes through the metal base and is connected to other electronic components; the pin includes a supporting portion connected to the capacitor unit, a middle portion passing through the metal base, and an extending portion bent parallel to the bottom surface of the metal base; The insulating member includes an insulating sleeve and an insulating gasket, wherein the insulating sleeve is arranged between the middle portion and the metal base; and the insulating gasket is arranged between the extending portion and the bottom of the metal base; The capacitor packaging structure also includes a clamping assembly for clamping the capacitor body, the clamping assembly includes a clamping portion for clamping the capacitor body, and a spring connected to the pin; the clamping portion includes a grabbing section, a through hole is provided in the grabbing section, and the clamping portion is electrically connected to the side wall of the capacitor body through a conductive adhesive; The spring sheet includes a first horizontal portion, a second horizontal portion, and an angle portion connecting the first horizontal portion and the second horizontal portion; the bottom of the first horizontal portion is electrically connected to the pin; the second horizontal portion is connected to the clamping portion, and the upper surface of the second horizontal portion is provided with a conductive glue for electrically connecting to the bottom of the capacitor body.
2. The capacitor packaging structure according to claim 1, characterized in that: The insulating sleeve is made of glass.
3. The capacitor packaging structure according to claim 1, characterized in that: The cross section of the support portion is larger than the cross section of the middle portion and smaller than the cross section of the insulating sleeve. The top of the support portion is electrically connected to the capacitor body, and the bottom of the support portion abuts against the insulating sleeve.
4. The capacitor packaging structure according to claim 3, characterized in that: The length of the middle portion is greater than the height of the metal base; There is a gap between the extension portion and the bottom of the metal base.
5. The capacitor packaging structure according to claim 1, characterized in that: The bottom of the insulating gasket is provided with a polarity mark of the pin.
6. The capacitor packaging structure according to claim 1, characterized in that: The four corners of the upper cover body are rounded.
7. The capacitor packaging structure according to claim 1, characterized in that: The insulating gasket wraps the four corners of the metal base.
8. The capacitor packaging structure according to any one of claims 1 to 7, characterized in that: The metal upper cover comprises an upper cover body and an extension cover formed by horizontally extending the edge of the upper cover body outward; The metal base is provided with a groove which cooperates with the extension cover.
