Supporting module and preparation method thereof, and preparation method of display device
A technology for supporting molds and supporting pads, which is applied to identification devices, instruments, etc., and can solve problems such as bonding and embossing of display modules
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0067] In order to make the purpose, technical solution and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below in conjunction with the accompanying drawings.
[0068] The terms used in the embodiment section of the present disclosure are only for explaining the present disclosure, and are not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. For example, "first", "second" and "third" and similar words used in the embodiments of the present disclosure and the claims do not indicate any order, quantity or importance, but are only used to distinguish different components part. Likewise, words like "a" or "one" do not denote a limitation in quantity, but indicate that there is at least on...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com