Liquid cooling server cluster and data center liquid cooling system

Abstract

The present invention provides a liquid cooling server cluster and a data center liquid cooling system, which relates to the field of data center cooling technology. The liquid cooling server cluster includes a cabinet and multiple servers; the cabinet includes a first cavity, a first plate is provided in the first cavity, and multiple first through holes are provided on the first plate; along the vertical direction, the first cavity is divided into a buffer cavity and an immersion cavity that are independent of each other by the first plate, and the immersion cavity is located above the buffer cavity; multiple servers are arranged in the immersion cavity; the server includes a shell, a second through hole is provided on the bottom surface of the shell, and the bottom surfaces of multiple shells are arranged one by one with the multiple first through holes; a second plate is provided in the immersion cavity, the shell passes through the second plate, and the shell is sealed and connected to the second plate; along the vertical direction, the immersion cavities on both sides of the second plate are divided into independent chambers by the second plate. Each server can more fully exchange heat with the cooling liquid, thereby improving the overall cooling performance of the liquid cooling server cluster.

Description

Technical Field

[0001] The present invention relates to the technical field of data center cooling, and in particular to a liquid cooling server cluster and a data center liquid cooling system. Background Art

[0002] With the rapid development of information technology, the increase in chip integration has led to higher and higher heat flux density in data centers. Traditional air cooling technology can no longer meet the cooling requirements of data centers. Therefore, the cooling technology of data centers has gradually developed towards the field of liquid cooling.

[0003] In an immersion liquid-cooled server cluster, the server is directly immersed in insulating coolant, using the coolant's higher specific heat to absorb heat from high heat flux density components. The cooling system then cools the coolant to achieve heat transfer.

[0004] In the prior art, a liquid-cooled server cluster includes a cabinet and a server. The server is placed in the cabinet, and a liquid inlet pipe is arranged on the cabinet, through which the coolant flows into the cabinet. However, the coolant flowing in from the liquid inlet pipe has a certain flow rate. After the coolant flows into the cabinet, it will impact in a certain direction, resulting in uneven distribution of the coolant in the cabinet, which will cause the amount of coolant contacted by servers at different positions to be different, so that the servers at some positions cannot fully exchange heat with the coolant, resulting in poor cooling effect of the servers at some positions, and thus reducing the overall cooling performance of the liquid-cooled server cluster. Summary of the invention

[0005] The object of the present invention is to provide a liquid-cooled server cluster to solve the technical problem of poor cooling performance of the liquid-cooled server cluster in the prior art.

[0006] The liquid cooling server cluster provided by the present invention comprises a cabinet and a plurality of servers;

[0007] The cabinet comprises a first cavity, a first plate is arranged in the first cavity, and a plurality of first through holes are arranged on the first plate; along the vertical direction, the first cavity is divided into a buffer cavity and an immersion cavity which are independent of each other by the first plate, and the immersion cavity is located above the buffer cavity;

[0008] The plurality of servers are all arranged in the immersion chamber; the server comprises a shell, a bottom surface of the shell is provided with a second through hole, and the bottom surfaces of the plurality of shells are arranged in a one-to-one correspondence with the plurality of the first through holes;

[0009] A second plate is provided in the immersion chamber, the shell passes through the second plate, and the shell is sealed and connected to the second plate; along the vertical direction, the immersion chambers on both sides of the second plate are divided into independent chambers by the second plate.

[0010] Furthermore, there are a plurality of the second plate bodies, and the plurality of the second plate bodies are arranged at intervals along the vertical direction.

[0011] Further, the top surface of the immersion chamber has a first opening, the edge of the first opening is provided with a third plate body, the bottom of the shell extends into the first opening, and the top of the shell is detachably connected to the third plate body;

[0012] The bottom of the shell passes through the second plate, and the shell is clamped with the second plate.

[0013] Furthermore, the server further comprises a chip;

[0014] The chip is arranged in the shell, and the shell includes a first side wall, and a third through hole is provided on the first side wall; along the vertical direction, the second through hole and the third through hole are respectively located on both sides of the second plate body, and the third through hole is located above the chip.

[0015] Furthermore, the server further includes a heat sink; the heat sink is disposed in the housing, and the heat sink is attached to the chip.

[0016] Further, along the horizontal direction, the projection of the heat sink on the first side wall is a first projection; the first projection and the third through hole are arranged at intervals along the vertical direction.

[0017] Furthermore, the cabinet also includes a shell and a second cavity;

[0018] The first cavity and the second cavity are both disposed in the housing;

[0019] In the horizontal direction, the first cavity and the second cavity are arranged in sequence; in the vertical direction, the second cavity is arranged above the buffer cavity;

[0020] The outer wall of the first cavity and the outer wall of the second cavity are respectively tightly fitted with the inner wall of the shell;

[0021] The top of the second cavity has a second opening, and the top of the shell has a third opening; the first opening and the second opening are both located below the third opening, and the second opening is located above the first opening.

[0022] Furthermore, a liquid discharge pipe is provided on the second cavity, and the liquid discharge pipe is communicated with the second cavity; and a liquid inlet pipe is provided on the buffer cavity, and the liquid inlet pipe is communicated with the buffer cavity.

[0023] Furthermore, the cabinet is an insulating cabinet.

[0024] The present invention also aims to provide a data center liquid cooling system, including the liquid cooling server cluster provided by the present invention.

[0025] The liquid cooling server cluster provided by the present invention comprises a cabinet and a plurality of servers; the cabinet comprises a first cavity, a first plate is arranged in the first cavity, and a plurality of first through holes are arranged on the first plate; along the vertical direction, the first cavity is divided into a buffer cavity and an immersion cavity which are independent of each other by the first plate, and the immersion cavity is located above the buffer cavity; a plurality of the servers are arranged in the immersion cavity; the server comprises a shell, a second through hole is arranged on the bottom surface of the shell, and the bottom surfaces of the plurality of the shells are arranged in a one-to-one correspondence with the plurality of the first through holes; a second plate is arranged in the immersion cavity, the shell passes through the second plate, and the shell is sealed and connected to the second plate; along the vertical direction, the immersion cavities located on both sides of the second plate are divided into independent chambers by the second plate. After the cooling liquid enters the buffer cavity, it flows from the buffer cavity into the immersion cavity, and then cools the servers in the immersion cavity. Since the buffer chamber and the immersion chamber are independent of each other, after the coolant with a certain flow rate flows into the buffer chamber, it can be buffered in the buffer chamber, and the buffered coolant flows to the immersion chamber through the first through holes respectively, so that the coolant in the immersion chamber is distributed more evenly, and the multiple first through holes are arranged in a one-to-one correspondence with the bottom surfaces of the multiple shells, so that the second through holes on the bottom surface of each shell can correspond to a first through hole, so that the multiple servers can obtain the coolant more evenly, and each server can more fully exchange heat with the coolant, thereby improving the overall cooling performance of the liquid-cooled server cluster. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a schematic diagram of the structure of a liquid cooling server cluster provided by an embodiment of the present invention;

[0028] Figure 2 This is a front view of a liquid cooling server cluster provided by an embodiment of the present invention;

[0029] Figure 3 It is a schematic diagram of the structure of a server of a liquid cooling server cluster provided by an embodiment of the present invention;

[0030] Figure 4 It is a schematic diagram of the structure of a radiator of a liquid-cooled server cluster provided in an embodiment of the present invention;

[0031] Figure 5 It is a schematic diagram of the structure of the buffer chamber of the liquid cooling server cluster provided in an embodiment of the present invention.

[0032] Icons: 1-housing; 2-drain pipe; 3-immersion chamber; 4-second chamber; 5-liquid inlet pipe; 6-first plate; 7-second plate; 8-shell; 9-third through hole; 10-third plate; 11-chip; 12-second through hole; 13-heat sink; 14-buffer chamber. DETAILED DESCRIPTION

[0033] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] The present invention provides a liquid cooling server cluster and system. A plurality of embodiments are given below to describe in detail the liquid cooling server cluster and system provided by the present invention.

[0035] Example 1

[0036] The liquid cooling server cluster provided in this embodiment is as follows: Figures 1 to 5 As shown, it includes a cabinet and multiple servers; the cabinet includes a first cavity, a first plate 6 is arranged in the first cavity, and a plurality of first through holes are arranged on the first plate 6; along the vertical direction, the first cavity is divided into a buffer cavity 14 and an immersion cavity 3 which are independent of each other by the first plate 6, and the immersion cavity 3 is located above the buffer cavity 14; multiple servers are arranged in the immersion cavity 3; the server includes a shell 8, a second through hole 12 is arranged on the bottom surface of the shell 8, and the bottom surfaces of the multiple shells 8 are arranged one by one corresponding to the multiple first through holes; a second plate 7 is arranged in the immersion cavity 3, the shell 8 passes through the second plate 7, and the shell 8 is sealed and connected to the second plate 7; along the vertical direction, the immersion cavities 3 located on both sides of the second plate 7 are divided into independent chambers by the second plate 7.

[0037] Since the buffer chamber 14 and the immersion chamber 3 are independent of each other, after the coolant with a certain flow rate flows into the buffer chamber 14, the coolant can be buffered in the buffer chamber 14, and the buffered coolant flows to the immersion chamber 3 through the first through holes, so that the coolant in the immersion chamber 3 is distributed more evenly, and the multiple first through holes are arranged in a one-to-one correspondence with the bottom surfaces of the multiple shells 8, so that the second through holes 12 on the bottom surface of each shell 8 can correspond to a first through hole, so that the multiple servers can obtain the coolant more evenly, and each server can more fully exchange heat with the coolant, thereby improving the overall cooling performance of the liquid-cooled server cluster.

[0038] In addition, since the coolant flows into the immersion chamber 3 through the first through hole, the first through hole can be set to a smaller cross-sectional area (the cross-sectional area of ​​the first through hole is smaller than the cross-sectional area of ​​the liquid inlet pipe 5). Such a setting accelerates the flow rate of the coolant flowing into the immersion chamber 3 and also plays a role in enhancing heat exchange.

[0039] Furthermore, the liquid-cooled server cluster can cool different types of servers, as long as the servers are placed in the immersion chamber 3, and has high versatility.

[0040] In this embodiment, the coolant is an insulating liquid.

[0041] Among them, the first plate body 6 is fixedly connected to the inner wall of the first cavity, and the connection method can be any suitable method such as bonding, welding or integral molding. A buffer cavity 14 is formed under the first plate body 6, and an immersion cavity 3 is formed above the first plate body 6, and the buffer cavity 14 and the immersion cavity 3 are independent of each other.

[0042] The first plate 6 is provided with a plurality of first through holes, which can be evenly spaced along the first direction to make the coolant in the immersion chamber 3 more evenly distributed, or can be unevenly spaced. The positions of the plurality of first through holes are related to the positions of the plurality of servers in the immersion chamber 3, and the plurality of first through holes need to be arranged one-to-one correspondingly to the bottom surfaces of the plurality of shells 8.

[0043] It should be noted that the first direction is Figure 2 and Figure 5 As shown by the arrows in the direction of ab.

[0044] A second through hole 12 is provided on the bottom surface of each shell 8, and the second through hole 12 may be one or more. In this embodiment, a plurality of second through holes 12 are provided on the bottom surface of the shell 8, so that the bottom surface of the shell 8 forms a hollow structure, so that the bottom surface of the shell 8 can be more evenly filled with liquid.

[0045] The second plate 7 is fixedly connected to the inner wall of the immersion chamber 3 by any suitable method such as bonding, welding or integral molding, so that the second plate 7 can separate the immersion chamber 3, and the upper and lower sides of the second plate 7 form independent chambers respectively.

[0046] The shell 8 is sealed and connected to the second plate 7. Specifically, a hole is set on the second plate 7, and the shell 8 passes through the hole, and the shell 8 fits tightly with the hole. Any suitable structure such as a sealing gasket or a sealing ring can also be set between the shell 8 and the hole of the second plate 7 for sealing.

[0047] By setting the second plate body 7, in the process of liquid flowing out of the first through hole flowing into the second through hole 12, part of the liquid directly flows into the second through hole 12, and part of the liquid flows into the cavity formed between the second plate body 7 and the first plate body 6, and does not flow to the cavity above the second plate body 7, so that the cooling liquid is collected in the cavity below the second plate body 7 (the cavity formed between the second plate body 7 and the first plate body 6) and then gradually flows into the second through hole 12, so that most of the cooling liquid flows into the shell 8, thereby improving the cooling effect.

[0048] There may be one or more second plates 7. The plurality of second plates 7 may be arranged at uniform intervals along the vertical direction or at non-uniform intervals.

[0049] In this embodiment, there are multiple second plates 7, and the multiple second plates 7 are arranged at intervals along the vertical direction.

[0050] A plurality of second plates 7 are arranged. When the separation performance of the second plate 7 at the bottom layer fails, the second plate 7 located above the second plate 7 at the bottom layer can still separate the immersion chamber 3, so that the immersion chamber 3 on both sides of the second plate 7 located above the second plate 7 at the bottom layer is separated into independent chambers, thereby making the reliability of the second plate 7 separating the immersion chamber 3 higher.

[0051] Furthermore, the plurality of second plates 7 can cooperate with the fixed housing 8 to make the server more stable.

[0052] The shell 8 can be placed in the immersion chamber 3 , or can be snap-fitted with the second plate 7 to be fixed in the immersion chamber 3 .

[0053] Furthermore, the top surface of the immersion chamber 3 has a first opening, and a third plate body 10 is provided at the edge of the first opening. The bottom of the shell 8 extends into the first opening, and the top of the shell 8 is detachably connected to the third plate body 10; the bottom of the shell 8 passes through the second plate body 7, and the shell 8 is clamped with the second plate body 7.

[0054] The connection between the top of the shell 8 and the third plate 10 may be a snap connection or a threaded connection or any other suitable form.

[0055] In this embodiment, a slot is provided on the third plate body 10 , and a buckle is provided on the top of the shell 8 , and the buckle is engaged with the slot.

[0056] The third plate body 10 and the second plate body 7 are respectively connected to the shell 8 , so that the shell 8 can be fixed in the immersion chamber 3 more stably.

[0057] Furthermore, the server also includes a chip 11; the chip 11 is arranged in a shell 8, the shell 8 includes a first side wall, and a third through hole 9 is provided on the first side wall; along the vertical direction, the second through hole 12 and the third through hole 9 are respectively located on both sides of the second plate body 7, and the third through hole 9 is located above the chip 11.

[0058] After the coolant flows into the shell 8 from the second through hole 12 on the bottom surface of the shell 8, the coolant in the shell 8 continues to increase, causing the liquid level in the shell 8 to continue to increase. The coolant contacts the chip 11 for heat exchange. When the liquid level is higher than the third through hole 9, the coolant will flow out from the third through hole 9.

[0059] Since the second through hole 12 and the third through hole 9 are respectively located on both sides of the second plate body 7 along the vertical direction, the second through hole 12 and the third through hole 9 are respectively located in two independent chambers, so that the coolant after heat exchange flowing out of the shell 8 and the coolant before heat exchange flowing into the second through hole 12 are separated from each other, preventing coolants with different temperatures from interfering with each other.

[0060] Furthermore, the server further includes a heat sink 13 ; the heat sink 13 is disposed in the housing 8 , and the heat sink 13 is attached to the chip 11 .

[0061] Chips can be bonded or connected by fasteners.

[0062] The heat sink 13 can dissipate heat for the chip 11 , and the coolant takes away the heat on the heat sink 13 after contacting the heat sink 13 .

[0063] Further, along the horizontal direction, the projection of the heat sink 13 on the first side wall is a first projection; the first projection and the third through hole 9 are arranged at intervals along the vertical direction.

[0064] Specifically, the first projection is located directly above the third through hole 9. Since the coolant needs to flow out of the shell 8 from the third through hole 9, such a setting can guide the coolant to flow to the third through hole 9, which can also force the coolant to flow directly above the chip 11, so that the coolant is forced to flow through the chip 11 and the radiator 13 before flowing out of the shell 8, so that more coolant passes through the radiator, enhancing the heat exchange effect. In this embodiment, the radiator 13 is a fin-column radiator 13, made of brass, and tightly fixed on the chip 11. The radiator 13 can increase the heat exchange area between the chip 11 and the coolant.

[0065] Furthermore, one chip 11 or multiple chips 11, for example, 2, 3, 4 or 5 chips, may be arranged in the server.

[0066] Furthermore, the cabinet also includes an outer shell 1 and a second cavity 4; the first cavity 4 and the second cavity 4 are both arranged in the outer shell 1; along the horizontal direction, the first cavity and the second cavity 4 are arranged in sequence; along the vertical direction, the second cavity 4 is arranged above the buffer cavity 14; the top of the second cavity 4 has a second opening, and the top of the outer shell 1 has a third opening; the outer wall of the first cavity and the outer wall of the second cavity 4 are respectively tightly fitted with the inner wall of the outer shell 1; the first opening and the second opening are both located below the third opening, and the second opening is located above the first opening.

[0067] Among them, along the horizontal direction, the first cavity and the second cavity 4 are arranged in sequence, the first cavity and the second cavity 4 are arranged adjacent to each other, and one side wall of the first cavity is tightly fitted with one side wall of the second cavity 4 .

[0068] The outer wall of the first cavity and the outer wall of the second cavity 4 are respectively tightly fitted with the inner wall of the shell 1. After the coolant in the first cavity overflows from the first opening, the liquid will flow into the shell 1 above the first opening.

[0069] In this embodiment, the first cavity is L-shaped, that is, along the first direction, the length c of the buffer cavity 14 is greater than the length d of the immersion cavity. This arrangement allows a portion of the top surface of the buffer cavity 14 to protrude from the immersion cavity, and the second cavity 4 can be arranged on the top surface of the buffer cavity 14 protruding from the immersion cavity, so that the first cavity and the second cavity are highly integrated and the overall volume of the cabinet is reduced.

[0070] It should be noted that the first direction is Figure 2 and Figure 5 As shown by the arrows in the direction of ab.

[0071] After the coolant overflows the shell 8 from the third through hole 9, it flows into the chamber above the second plate 7 located at the top of the immersion chamber 3. When the liquid level in the immersion chamber 3 is higher than the first opening, the coolant flows into the shell 1 above the first opening. As the liquid level in the shell 1 above the first opening rises, when it rises to a level higher than the second opening, the coolant flows into the second cavity 4. The second cavity 4 is separated from the immersion chamber 3 to avoid mixing of cold and hot fluids. In addition, the second cavity 4 can also play a role in maintaining a constant liquid level in the immersion chamber 3. The second opening is located above the first opening, so that the coolant can flow into the second opening only after it is higher than the first opening. This arrangement allows the coolant to overflow the server, so that the devices at various positions in the server can all be in contact with the coolant, thereby improving the cooling effect.

[0072] Furthermore, a liquid discharge pipe 2 is provided on the second cavity 4, and the liquid discharge pipe 2 is communicated with the second cavity 4. A liquid inlet pipe 5 is provided on the buffer cavity 14, and the liquid inlet pipe 5 is communicated with the buffer cavity 14.

[0073] The cooling liquid after heat exchange flows out of the cabinet through the drain pipe 2, and the cooling liquid before heat exchange flows into the buffer chamber 14 through the inlet pipe 5. In the vertical direction, the drain pipe 2 is located below the second opening.

[0074] The number of the liquid inlet pipes 5 can be one or more, and the number of the liquid discharge pipes 2 can be one or more.

[0075] Furthermore, the cabinet is an insulating cabinet. The cabinet can be made of insulating materials such as rubber or silicone, which also have low thermal conductivity, thereby reducing the thermal conductivity of the cabinet.

[0076] The liquid-cooled server cluster provided in the present embodiment has the buffer chamber 14 and the immersion chamber 3 independent of each other. After the coolant with a certain flow rate flows into the buffer chamber 14, it can be buffered in the buffer chamber 14. The buffered coolant flows to the immersion chamber 3 through the first through holes, so that the coolant in the immersion chamber 3 is distributed more evenly. In addition, the multiple first through holes are arranged in a one-to-one correspondence with the bottom surfaces of the multiple shells 8, so that the second through holes 12 on the bottom surface of each shell 8 can correspond to a first through hole, so that the multiple servers can obtain the coolant more evenly, and each server can more fully exchange heat with the coolant, thereby improving the overall cooling performance of the liquid-cooled server cluster.

[0077] Example 2

[0078] The data center liquid cooling system provided in this embodiment includes the liquid cooling server cluster provided in Embodiment 1. Since the buffer chamber 14 and the immersion chamber 3 are independent of each other, after the cooling liquid with a certain flow rate flows into the buffer chamber 14, it can be buffered in the buffer chamber 14, and the buffered cooling liquid flows to the immersion chamber 3 through the first through holes, so that the cooling liquid in the immersion chamber 3 is distributed more evenly, and the multiple first through holes are arranged in a one-to-one correspondence with the bottom surfaces of the multiple shells 8, so that the second through holes 12 on the bottom surface of each shell 8 can correspond to a first through hole, so that the multiple servers can obtain the cooling liquid more evenly, so that each server can more fully exchange heat with the cooling liquid, thereby improving the overall cooling performance of the liquid cooling server cluster.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid-cooled server cluster, characterized in that: Includes cabinet and multiple servers; The cabinet comprises a first cavity, a first plate is arranged in the first cavity, and a plurality of first through holes are arranged on the first plate; along the vertical direction, the first cavity is divided into a buffer cavity and an immersion cavity which are independent of each other by the first plate, and the immersion cavity is located above the buffer cavity; The plurality of servers are all arranged in the immersion chamber; the server comprises a shell, the bottom surface of the shell is provided with a second through hole, and the bottom surfaces of the plurality of shells are arranged in a one-to-one correspondence with the plurality of the first through holes; A second plate is provided in the immersion chamber, the shell passes through the second plate, and the shell is sealed and connected to the second plate; along the vertical direction, the immersion chambers located on both sides of the second plate are divided into independent chambers by the second plate; The top surface of the immersion chamber has a first opening; The cabinet also includes a shell and a second cavity; The first cavity and the second cavity are both disposed in the housing; Along the horizontal direction, the first cavity and the second cavity are arranged in sequence; In the vertical direction, the second cavity is arranged above the buffer cavity; The outer wall of the first cavity and the outer wall of the second cavity are respectively tightly fitted with the inner wall of the shell; The top of the second cavity has a second opening, and the top of the housing has a third opening; the first opening and the second opening are both located below the third opening, and the second opening is located above the first opening; The second cavity is provided with a liquid discharge pipe, which is communicated with the second cavity; the buffer cavity is provided with a liquid inlet pipe, which is communicated with the buffer cavity.

2. The liquid cooling server cluster according to claim 1, characterized in that: There are a plurality of the second plates, and the plurality of the second plates are spaced apart in the vertical direction.

3. The liquid cooling server cluster according to claim 1, characterized in that: A third plate is provided at the edge of the first opening, the bottom of the shell extends into the first opening, and the top of the shell is detachably connected to the third plate; The bottom of the shell passes through the second plate, and the shell is clamped with the second plate; The number of the liquid discharge pipe is one.

4. The liquid cooling server cluster according to claim 1, characterized in that: The server further includes a chip; The chip is arranged in the shell, and the shell includes a first side wall, and a third through hole is provided on the first side wall; along the vertical direction, the second through hole and the third through hole are respectively located on both sides of the second plate body, and the third through hole is located above the chip.

5. The liquid cooling server cluster according to claim 4, characterized in that: The server further includes a heat sink; the heat sink is arranged in the housing, and the heat sink is attached to the chip.

6. The liquid cooling server cluster according to claim 5, characterized in that: Along the horizontal direction, the projection of the heat sink on the first side wall is a first projection; the first projection and the third through hole are spaced apart in the vertical direction.

7. The liquid-cooled server cluster according to any one of claims 1 to 6, characterized in that: The cabinet is an insulating cabinet.

8. A data center liquid cooling system, characterized in that: A liquid-cooled server cluster comprising any one of claims 1-7.

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