Temporary fixing resin composition and substrate transport support belt

Abstract

A resin composition for temporary fixing used for temporarily fixing a substrate transport support to an organic substrate, comprising a thermoplastic resin, a thermosetting resin and an inorganic filler. When formed into a film, the elastic modulus of the film after heating at 130°C for 30 minutes and at 170°C for 2 hours is 350 to 550 MPa at 25°C.

Description

Technical Field

[0001] The present invention relates to a temporary fixing resin composition, a substrate conveying support belt and a method for producing an electronic equipment device. Background Art

[0002] As electronic devices such as smartphones and tablet PCs become more multifunctional, stacked MCP (Multi Chip Package) with high capacity by stacking semiconductor elements in multiple stages has become popular. Film adhesives are widely used as adhesives for die bonding when installing semiconductor elements. However, when using the existing wire bonding method for connecting semiconductor elements, the data processing speed is limited, so the operation of electronic devices tends to slow down. In addition, there is an increasing demand for maintaining low power consumption and being able to use for longer periods of time without charging, so power saving is also required. From this point of view, in recent years, with the purpose of further increasing speed and further saving power, new electronic device devices with new structures that use through electrodes instead of wire bonding to connect semiconductor elements have been developed one after another.

[0003] Despite the development of new electronic devices, there is still a demand for higher capacity, and the development of technology that can stack semiconductor elements in more stages regardless of the packaging structure is being promoted. However, in order to stack more semiconductor elements in a limited space, it is essential to steadily reduce the thickness of semiconductor elements.

[0004] For example, a semiconductor wafer is ground from the back side to make it thinner. In the grinding process at this time, it is mainstream to implement the grinding process in a state where a tape called a so-called BG tape (back grinding tape) is adhered to the semiconductor wafer to support the semiconductor wafer. However, the semiconductor wafer used in the grinding process has a circuit formed on the surface side, and when it is thinned by grinding, it is easily affected and warps. BG tape is a tape material that is easily deformed, so it cannot fully support the thinned semiconductor wafer, and it is easy to cause the semiconductor wafer to warp. Therefore, a method of fixing the wafer to a support body via a pressure-sensitive adhesive for back grinding and transportation has also been proposed (for example, refer to the following patent documents 1 and patent document 2).

[0005] Previous technical literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent No. 4565804

[0008] Patent Document 2: Japanese Patent No. 4936667 Summary of the invention

[0009] Technical issues to be solved by the invention

[0010] In order to achieve thinner semiconductor elements, the use of thin organic substrates as substrates is being considered. Specifically, the development of coreless substrates that do not use a core layer in which a thermosetting resin is impregnated in glass cloth is being actively pursued. Since coreless substrates do not have a core layer, the thickness of the substrate can be reduced. However, since they do not have a highly elastic core layer, it is difficult to ensure the rigidity of the substrate itself, and operability in the manufacturing process of semiconductor elements becomes a problem.

[0011] Based on this background, the inventors of the present invention have considered the following method: by attaching the support body to the substrate as a stacked body via a temporary fixing material, the rigidity is ensured and the operability in the manufacturing process of the semiconductor element is improved. However, in the above-mentioned manufacturing process, since the reflow process is performed in the state of the above-mentioned stacked body, there is the following problem: during the reflow, it is easy to cause peeling between the support body and the substrate (between the support body and the temporary fixing material or between the temporary fixing material and the substrate) or foaming that becomes the starting point of peeling. In addition, there is the following problem: when the temporary fixing material and the support body are peeled off from the substrate at room temperature after the reflow process, peeling occurs between the temporary fixing material and the support body, and the temporary fixing material is easy to remain on the substrate side.

[0012] The present invention is based on the above circumstances and aims to provide a temporary fixing resin composition, a substrate transport support tape and a method for manufacturing an electronic device that can achieve both suppression of peeling between a support and a substrate during reflow and peelability from the substrate after reflow.

[0013] Means for solving technical problems

[0014] In order to achieve the above-mentioned object, the present invention provides a temporary fixing resin composition for temporarily fixing a substrate transport support body to an organic substrate, which contains a thermoplastic resin, a thermosetting resin and an inorganic filler. When formed into a film, the elastic modulus after heating at 130°C for 30 minutes and at 170°C for 2 hours is 350 to 550 MPa at 25°C.

[0015] According to the above-mentioned temporary fixing resin composition, when an organic substrate is temporarily fixed to a substrate conveying support via a temporary fixing material formed by the temporary fixing resin composition, it is possible to achieve both suppression of peeling between the support and the organic substrate during reflow and peeling property when the temporary fixing material is peeled off from the organic substrate after reflow. It is believed that this is because the temporary fixing resin composition contains a thermoplastic resin, a thermosetting resin and an inorganic filler, and the elastic modulus after the above-mentioned heating when formed into a film is 350 to 550 MPa at 25°C, so that a temporary fixing material having excellent heat resistance and appropriate bonding force to the support and the organic substrate can be formed, and peeling or foaming that becomes the starting point of peeling between the support and the temporary fixing material and between the temporary fixing material and the organic substrate during reflow can be suppressed, and at the same time, the temporary fixing material is suppressed from remaining on the organic substrate at room temperature after reflow.

[0016] Furthermore, by adhering the support to the organic substrate as a laminate through the temporary fixing material formed of the temporary fixing resin composition, the following problem can be improved: when the organic substrate is transported during the manufacture of the semiconductor element, the handling property is reduced due to the bending. Furthermore, in the manufacturing process of the semiconductor element, even if the reflow process is performed in the state of the laminate, by using the temporary fixing resin composition, it is possible to achieve both the suppression of the peeling between the support and the substrate during the reflow and the peeling property when peeling from the substrate after the reflow.

[0017] The temporary fixing resin composition may further contain a curing accelerator. Also, the temporary fixing resin composition may further contain a silicone compound.

[0018] When the temporary fixing resin composition is made into a film, the 90° peel strength at 25°C between the substrate having the surface of the solder resist AUS308 after heating at 130°C for 30 minutes and at 170°C for 2 hours can be 30 to 150 N / m. By making the 90° peel strength measured under the above conditions within the above range, it is possible to achieve both suppression of peeling between the support and the organic substrate during reflow and peelability when the temporary fixing material is peeled off from the organic substrate after reflow at a higher level.

[0019] When the temporary fixing resin composition is made into a film, the 90° peel strength at 25°C between the polyimide film after heating at 130°C for 30 minutes and at 170°C for 2 hours can be 80 to 400 N / m. By making the 90° peel strength measured under the above conditions within the above range, it is possible to achieve both suppression of peeling between the support and the organic substrate during reflow and peelability when the temporary fixing material is peeled off from the organic substrate after reflow at a higher level.

[0020] In the above-mentioned temporary fixing resin composition, the above-mentioned inorganic filler can be an inorganic filler having an organic group on the surface. In addition, the above-mentioned organic group can include a vinyl group or an epoxy group. By using an inorganic filler having an organic group on the surface, the dispersibility in the temporary fixing resin composition can be improved, and the adhesion and heat resistance of the obtained temporary fixing material relative to the support and the organic substrate can be improved. In addition, in the case where the organic group includes a vinyl group or an epoxy group, the above-mentioned effect can be further exerted, and the adhesion of the obtained temporary fixing material relative to the support can be particularly improved.

[0021] The content of the inorganic filler in the temporary fixing resin composition may be 20 to 100 parts by mass relative to 100 parts by mass of the thermoplastic resin. By making the content of the inorganic filler within the above range, it is possible to achieve both the suppression of peeling between the support and the substrate during reflow and the peeling property when the temporary fixing material is peeled off from the substrate after reflow at a higher level.

[0022] The present invention also provides a substrate conveying support tape, which comprises: a support film for conveying an organic substrate; and a temporary fixing material layer, which is provided on the support film and is used to temporarily fix the organic substrate and the support film, wherein the temporary fixing material layer is a layer formed using the temporary fixing resin composition of the present invention. The substrate conveying support tape can improve the operability of the organic substrate, and can take into account both the suppression of peeling between the support body and the organic substrate during reflow and the peeling property when the temporary fixing material is peeled off from the organic substrate after reflow.

[0023] In the supporting belt for conveying a substrate, the supporting film may be a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.

[0024] In the substrate conveying support tape, the 90° peel strength at 25°C between the support film and the temporary fixing material layer after heating at 130°C for 30 minutes and at 170°C for 2 hours may be 80 to 400 N / m. By making the 90° peel strength measured under the above conditions within the above range, it is possible to achieve both suppression of peeling between the support body and the organic substrate during reflow and peelability when the temporary fixing material is peeled off from the organic substrate after reflow at a higher level.

[0025] The present invention also provides a method for manufacturing an electronic device, which includes: a first step of bonding a support body to an organic substrate via a temporary fixing material to obtain a laminate; a second step of heating the temporary fixing material of the laminate; a third step of mounting a semiconductor chip on the organic substrate of the laminate after the second step; a fourth step of sealing the semiconductor chip mounted on the organic substrate using a sealing material; and a fifth step of peeling off the support body and the temporary fixing material from the organic substrate of the laminate after the fourth step, wherein the temporary fixing material is a material formed using the temporary fixing resin composition of the present invention.

[0026] According to the manufacturing method of the electronic device, an electronic device having a semiconductor element thinned using an organic substrate can be manufactured with high productivity. That is, by making the temporary fixing material a material formed using the temporary fixing resin composition of the present invention, the manufacturing method can achieve the following effects: (i) the organic substrate and the support can be bonded in the first step, thereby improving the operability of the thin organic substrate (for example, the thin organic substrate can be easily transported); (ii) the temporary fixing material after the second step can fully fix the organic substrate and the support in the third and fourth steps, and the semiconductor chip can be efficiently installed and sealed; and (iii) in the fifth step, it can be easily peeled off from the organic substrate without contaminating the substrate surface; etc.

[0027] In the manufacturing method, the thickness of the organic substrate may be less than 200 μm. Furthermore, the organic substrate may be a coreless substrate.

[0028] In the above production method, the support may be a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film, or a polyimide film.

[0029] In the first step, the support may be continuously supplied in a belt-like shape. In this case, a thin organic substrate can be continuously conveyed, and productivity can be improved without expensive equipment investment.

[0030] In the first step, the laminate may be obtained by using a supporting tape including a supporting film as the supporting body and a temporary fixing material layer formed of the temporary fixing material and provided on the supporting film.

[0031] Compared with the case where a temporary fixing material layer is formed by coating a liquid temporary fixing material on an organic substrate or a support, the method using such a support tape can further reduce the unevenness of the temporary fixing material, making it easy to make the semiconductor element obtained after processing uniform. In addition, it is easy to use the temporary fixing material without waste.

[0032] In the laminate after the second step, the 90° peel strength between the organic substrate and the temporary fixing material at 25° C. may be 30 to 150 N / m. By setting the 90° peel strength within the above range, it is possible to achieve both suppression of peeling between the support and the organic substrate during reflow and peelability when the temporary fixing material is peeled off from the organic substrate after reflow at a higher level.

[0033] In the laminate after the second step, the 90° peel strength between the support and the temporary fixing material at 25° C. may be 80 to 400 N / m. By setting the 90° peel strength within the above range, both the suppression of peeling between the support and the organic substrate during reflow and the peelability when the temporary fixing material is peeled off from the organic substrate after reflow can be achieved at a higher level.

[0034] Effects of the Invention

[0035] According to the present invention, a temporary fixing resin composition, a substrate transporting support tape, and a method for producing an electronic device can be provided that can achieve both suppression of peeling between a support and a substrate during reflow and peelability from the substrate after reflow.

[0036] The temporary fixing resin composition of the present invention can fully fix the organic substrate and the support for transport, and the support can be easily peeled off from the organic substrate without contaminating the substrate surface. The substrate transport support tape of the present invention can improve the operability of the organic substrate, and can be easily peeled off from the organic substrate without contaminating the substrate surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 1 is a diagram showing an embodiment of a support belt for substrate transport. Figure 1 (A) is a top view. Figure 1 (B) is along Figure 1 (A) Schematic cross-sectional view of line II cutting.

[0038] Figure 2 2 is a diagram showing another embodiment of a substrate transport support belt. Figure 2 (A) is a top view. Figure 2 (B) is along Figure 2 (A) Schematic cross-sectional view of line II-II cutting.

[0039] Figure 3 middle, Figure 3 (a)~ Figure 3 (c) is a schematic cross-sectional view for explaining one embodiment of a method for manufacturing an electronic device.

[0040] Figure 4 middle, Figure 4 (d)~ Figure 4 (e) is a schematic cross-sectional view for explaining one embodiment of a method for manufacturing an electronic device.

[0041] Figure 5 middle, Figure 5 (f)~ Figure 5 (h) is a schematic cross-sectional view for explaining one embodiment of a method for manufacturing an electronic device. DETAILED DESCRIPTION

[0042] Hereinafter, the mode for implementing the present invention will be described in detail with reference to the accompanying drawings as appropriate. However, the present invention is not limited to the following embodiments. Furthermore, in this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, and "(meth)acrylate" means acrylate or its corresponding methacrylate. "A or B" only needs to include any one of A and B, and may include both at the same time.

[0043] Furthermore, in this specification, the term "layer" includes a structure formed on a part of a surface in addition to a structure formed on the entire surface when viewed as a plan view. Furthermore, in this specification, the term "process" includes not only independent processes, but also processes that cannot be clearly distinguished from other processes as long as the desired effect of the process can be achieved. Furthermore, a numerical range represented by "to" represents a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively.

[0044] In addition, in this specification, when there are multiple substances corresponding to each component in the composition, unless otherwise specified, the content of each component in the composition means the total amount of the multiple substances present in the composition. Furthermore, unless otherwise specified, the exemplified materials may be used alone or in combination of two or more.

[0045] Furthermore, in the numerical ranges described in stages in this specification, the upper limit or lower limit of the numerical range in a certain stage can be replaced by the upper limit or lower limit of the numerical range in other stages. Furthermore, in the numerical ranges described in this specification, the upper limit or lower limit of the numerical range can be replaced by the value shown in the embodiments.

[0046] [Resin composition for temporary fixing]

[0047] The temporary fixing resin composition of the present embodiment contains a thermoplastic resin, a thermosetting resin and an inorganic filler. In addition to the above components, the temporary fixing resin composition may further contain a curing agent, a curing accelerator or other components.

[0048] The temporary fixing resin composition of the present embodiment can be used as a temporary fixing material for temporarily fixing a substrate transport support body to an organic substrate.

[0049] <Thermoplastic resin>

[0050] As the thermoplastic resin, any resin having thermoplasticity before laminating the organic substrate and the support can be used without particular limitation. In the present embodiment, the thermoplastic resin can be a resin that forms a crosslinked structure by heating, etc. As such a resin, a polymer having a crosslinkable functional group can be cited.

[0051] Examples of the polymer having a crosslinkable functional group include thermoplastic polyimide resins, (meth) acrylic copolymers having a crosslinkable functional group, polyurethane resins, polyphenylene ether resins, polyetherimide resins, phenoxy resins, modified polyphenylene ether resins, etc. Among them, (meth) acrylic copolymers having a crosslinkable functional group are preferred.

[0052] The (meth) acrylic copolymer with crosslinking functional groups can use copolymers obtained by polymerization methods such as bead polymerization and solution polymerization, or commercial products can be used. The polymer with crosslinking functional groups can have crosslinking functional groups in the polymer chain or at the end of the polymer chain. As specific examples of crosslinking functional groups, epoxy, alcoholic hydroxyl, phenolic hydroxyl, carboxyl, etc. can be cited. Among the crosslinking functional groups, carboxyl is preferred. Carboxyl can be introduced into the polymer chain by using acrylic acid.

[0053] The glass transition temperature (hereinafter sometimes referred to as "Tg") of the thermoplastic resin is preferably -50°C to 50°C, more preferably -40°C to 20°C. When Tg is within these ranges, deterioration of workability (caused by excessively high adhesive force) can be suppressed, while more sufficient fluidity can be obtained, and the elastic modulus after curing can be further reduced, thereby further suppressing excessively high peel strength.

[0054] Tg is a midpoint glass transition temperature value when a thermoplastic resin is measured using differential scanning calorimetry (DSC, for example, "Thermo Plus 2" manufactured by Rigaku Corporation). Specifically, the above Tg is a midpoint glass transition temperature calculated by a method based on JIS K 7121:1987 by measuring heat change under the conditions of a heating rate of 10°C / min and a measuring temperature of -80 to 80°C.

[0055] The weight average molecular weight of the thermoplastic resin is not particularly limited, but is preferably 100,000 to 1.2 million, and more preferably 200,000 to 1 million. As long as the weight average molecular weight of the thermoplastic resin is within these ranges, film-forming properties and fluidity can be easily ensured. The weight average molecular weight is a polystyrene conversion value using a calibration curve based on standard polystyrene in gel permeation chromatography (GPC).

[0056] The thermoplastic resin may be used alone or in combination of two or more.

[0057] The content of the thermoplastic resin in the temporary fixing resin composition of the present embodiment can be 35 to 80 parts by mass relative to 100 parts by mass of the total composition. From the viewpoint of embedding properties, releasability from a substrate, and adhesiveness to a support, it is preferably 40 to 70 parts by mass, and more preferably 40 to 60 parts by mass.

[0058] <Thermosetting resin>

[0059] Examples of the thermosetting resin include epoxy resins, acrylic resins, silicone resins, phenolic resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins.

[0060] The epoxy resin is not particularly limited as long as it is a resin that is cured and has a heat-resistant effect. The epoxy resin can use bifunctional epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, phenol novolac epoxy resin, cresol novolac type epoxy resin and other novolac epoxy resins. In addition, the epoxy resin can apply known resins such as multifunctional epoxy resins, glycidylamine type epoxy resins, heterocyclic epoxy resins, and alicyclic epoxy resins.

[0061] Examples of the bisphenol A type epoxy resin include jER (registered trademark) series manufactured by Mitsubishi Chemical Corporation (Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, Epikote 1007, Epikote 1009, “Epikote” is a registered trademark), DER-330, DER-301, and DER-361 manufactured by The Dow Chemical Company, and YD8125 and YDF8170 manufactured by NIPPON STEEL Chemical & Material Co., Ltd.

[0062] Examples of the phenol novolac epoxy resin include Epikote 152 and Epikote 154 manufactured by JER Corporation, EPPN-201 manufactured by Nippon Kayaku Co., Ltd., and DEN-438 manufactured by The Dow Chemical Company.

[0063] Examples of the o-cresol novolac epoxy resin include EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, and EOCN-1027 ("EOCN" is a registered trademark) manufactured by Nippon Kayaku Co., Ltd., and YDCN701, YDCN702, YDCN703, and YDCN704 manufactured by NIPPON STEEL Chemical & Material Co., Ltd.

[0064] Examples of the polyfunctional epoxy resin include Epon 1031S manufactured by JER, ARALDITE 0163 manufactured by Huntsman Japan, and Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-421, EX-411, and EX-321 manufactured by Nagase ChemteX Corporation (“ARALDITE” and “Denacol” are registered trademarks).

[0065] Examples of the amine type epoxy resin include Epikote 604 manufactured by JER, YH-434 manufactured by NIPPON STEEL Chemical & Material Co., Ltd., TETRAD-X and TETRAD-C ("TETRAD" is a registered trademark) manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC., and ELM-120 manufactured by Sumitomo Chemical Co., Ltd.

[0066] Examples of the heterocyclic ring-containing epoxy resin include ARALDITE PT810 manufactured by Ciba Specialty Chemicals, and ERL4234, ERL4299, ERL4221, and ERL4206 manufactured by UCC.

[0067] The above epoxy resins may be used alone or in combination of two or more.

[0068] When an epoxy resin is used as the thermosetting resin, it is preferred to use an epoxy resin curing agent together.

[0069] The epoxy resin curing agent may be a commonly used known curing agent. Examples of the epoxy resin curing agent include: amines; polyamides; acid anhydrides; polysulfides; boron trifluoride; bisphenols having two or more phenolic hydroxyl groups in one molecule, such as bisphenol A, bisphenol F, and bisphenol S; phenolic resins such as novolac resins, bisphenol A novolac resins, and cresol novolac resins; etc. In particular, from the viewpoint of excellent electrical corrosion resistance during moisture absorption, the epoxy resin curing agent is preferably a phenolic resin such as novolac resins, bisphenol A novolac resins, and cresol novolac resins.

[0070] Preferred resins among the phenolic resins (as the above-mentioned epoxy resin curing agent) include, for example, PHENOLITE LF2882, PHENOLITE LF2822, PHENOLITE TD-2090, PHENOLITE TD-2149, PHENOLITE VH-4150, PHENOLITE VH4170 manufactured by DIC CORPORATION, H-1 manufactured by MEIWA PLASTIC INDUSTRIES, LTD., jER CURE MP402FPY, EPICURE YL6065, EPICURE YLH129B65 manufactured by JER, and MILEX XL, MILEX XLC, MILEX RN, MILEX RS, MILEX VR manufactured by Mitsui Chemicals, Inc. ("PHENOLITE", "EPICURE", and "MILEX" are registered trademarks).

[0071] The thermosetting resin and the curing agent may be used alone or in combination of two or more.

[0072] The content of the thermosetting resin in the temporary fixing resin composition of the present embodiment is preferably 10 to 500 parts by mass relative to 100 parts by mass of thermoplastic resin, more preferably 15 to 300 parts by mass, and further preferably 20 to 100 parts by mass. If the content of the thermosetting resin is within the above range, the temporary fixing material is easy to have sufficient low-temperature adhesion, heat resistance, curability and peelability. As long as the content of the thermosetting resin is more than 10 parts by mass, the adhesion and heat resistance are improved, and the retention of the organic substrate during the manufacture of the electronic device is also improved, and the components (for example, semiconductor chips, etc.) constituting the electronic device tend to be difficult to damage. On the other hand, as long as the content of the thermosetting resin is less than 500 parts by mass, the viscosity before curing is not easy to become too low, and it can be cured in a shorter time, and it tends to be easy to take into account the retention of the organic substrate and the support and the peelability of the organic substrate and the support.

[0073] <Inorganic fillers>

[0074] Examples of the inorganic filler include silicon dioxide, aluminum oxide, boron nitride, titanium dioxide, glass, iron oxide, and ceramics. The inorganic filler may be added for the purpose of imparting low thermal expansion and low hygroscopicity to the temporary fixing resin composition and the film-like temporary fixing material. The inorganic filler may be used alone or in combination of two or more.

[0075] The inorganic filler is preferably an inorganic filler having an organic group on the surface. By modifying the surface of the inorganic filler with an organic group, it is easy to improve the dispersibility of the temporary fixing resin composition in an organic solvent when preparing a coating liquid for forming a film-like temporary fixing material, and the adhesion and heat resistance of the formed film-like temporary fixing material.

[0076] The inorganic filler having an organic group on the surface can be obtained, for example, by mixing a silane coupling agent represented by the following general formula (B-1) and an inorganic filler, and stirring at a temperature of 30° C. or higher. Whether the surface of the inorganic filler is modified by an organic group can be confirmed by UV (ultraviolet) measurement, IR (infrared) measurement, XPS (X-ray photoelectron spectroscopy) measurement, etc.

[0077]

[0078] [In formula (B-1), X represents an organic group selected from the group consisting of phenyl, glycidoxy, acryloyl, methacryloyl, mercapto, amine, vinyl, isocyanate and methacryloyloxy, s represents an integer of 0 or 1 to 10, and R 11 , R 12 and R 13 Each independently represents an alkyl group having 1 to 10 carbon atoms.

[0079] Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, isopropyl, and isobutyl. From the viewpoint of easy availability, the alkyl group having 1 to 10 carbon atoms is preferably methyl, ethyl, and pentyl.

[0080] From the viewpoint of heat resistance, X is preferably an amino group, a glycidoxy group, a mercapto group, and an isocyanate group, and more preferably a glycidoxy group and a mercapto group.

[0081] From the viewpoint of suppressing the fluidity of the temporary fixing material at high temperature and improving the heat resistance, s in the formula (B-1) is preferably 0 to 5, more preferably 0 to 4.

[0082] Preferred silane coupling agents include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, Silane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanopropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-(1,3-dimethylbutylene)-3-(triethoxysilyl)-1-propylamine, N,N'-bis(3-(trimethoxysilyl)propyl)ethylenediamine, polyoxyethylenepropyltrialkoxysilane, polyethoxydimethylsiloxane, etc. Among them, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanopropyltriethoxysilane and 3-mercaptopropyltrimethoxysilane are preferred, and trimethoxyphenylsilane, 3-glycidoxypropyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane are more preferred.

[0083] The silane coupling agents may be used alone or in combination of two or more.

[0084] From the viewpoint of achieving a balance between the effect of improving heat resistance and storage stability, the amount of the coupling agent used is preferably 0.01 to 50 parts by mass, more preferably 0.05 to 20 parts by mass, relative to 100 parts by mass of the inorganic filler. From the viewpoint of improving heat resistance, it is further preferably 0.5 to 10 parts by mass.

[0085] From the viewpoint of achieving a higher level of both coating and embedding properties when the temporary fixing resin composition is made into a film and peeling properties when the temporary fixing material is peeled off from the substrate after reflow, the average particle size of the inorganic filler is preferably 1 to 1000 nm, more preferably 5 to 750 nm, and further preferably 10 to 500 nm. The average particle size of the inorganic filler can be measured, for example, using a nanoparticle size distribution measuring device (manufactured by SHIMADZU CORPORATION, trade name: SALD-7500nano).

[0086] From the viewpoint of improving the operability of the film-like temporary fixing material in the B stage state and improving the low thermal expansion, the content of the inorganic filler in the temporary fixing resin composition of the present embodiment is preferably 300 parts by mass or less relative to 100 parts by mass of the thermoplastic resin, more preferably 200 parts by mass or less, and further preferably 100 parts by mass or less. In addition, from the viewpoint of taking into account the suppression of the peeling between the support body and the substrate during reflow and the peeling property when the temporary fixing material is peeled off from the substrate after reflow at a higher level, the content of the inorganic filler is preferably 20 parts by mass or more relative to 100 parts by mass of the thermoplastic resin, more preferably 25 parts by mass or more, further preferably 30 parts by mass or more, and particularly preferably 35 parts by mass or more. By making the content of the inorganic filler within the above range, it tends to be able to fully ensure the adhesion to the organic substrate while giving the desired function to the temporary fixing material.

[0087] <Curing accelerator>

[0088] Examples of the curing accelerator include imidazoles, cyanoguanidine derivatives, dicarboxylic acid dihydrazides, triphenylphosphine, tetraphenylboric acid tetraphenylborate, 2-ethyl-4-methylimidazolium-tetraphenylborate, and 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylborate.

[0089] When the temporary fixing resin composition of the present embodiment contains a (meth) acrylic copolymer having an epoxy group as a thermoplastic resin, it is preferred to further contain a curing accelerator for accelerating the curing of the epoxy group of the copolymer. Examples of such curing accelerators include imidazoles and 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylborate.

[0090] The curing accelerator may be used alone or in combination of two or more.

[0091] The content of the curing accelerator in the temporary fixing resin composition of the present embodiment is preferably 0.01 to 5.0 parts by mass relative to 100 parts by mass of the thermoplastic resin. As long as the content of the curing accelerator is 0.01 parts by mass or more, it is easy to fully cure the temporary fixing resin composition according to the thermal history when manufacturing the semiconductor element, and the organic substrate and the support can be fixed more reliably. On the other hand, as long as the content of the curing accelerator is 5.0 parts by mass or less, the melt viscosity of the temporary fixing resin composition will not increase excessively, and it is easy to ensure storage stability.

[0092] <Other ingredients>

[0093] As components other than the above components, silicone compounds, organic fillers, silane coupling agents, etc. are mentioned.

[0094] As the silicone compound, any compound having a polysiloxane structure can be used without particular limitation, and examples thereof include silicone modified resins, linear silicone oils, non-reactive modified silicone oils, and reactive modified silicone oils.

[0095] When the temporary fixing resin composition contains a silicone compound, the temporary fixing material formed of the temporary fixing resin composition can be easily peeled off from the organic substrate subjected to a predetermined process even at a temperature as low as 100° C. or lower without using a solvent.

[0096] The silicone modified resin includes a silicone modified alkyd resin. When the temporary fixing resin composition contains a silicone modified alkyd resin, the temporary fixing material formed of the temporary fixing resin composition can be easily peeled off from the organic substrate that has been processed in a predetermined manner without using a solvent.

[0097] Examples of the modified silicone oil include polyether-modified silicone, alkyl-modified silicone, and epoxy-modified silicone.

[0098] Commercially available products of the silicone compound include SH3773M, L-7001, SH-550, and SH-710 manufactured by Dow Toray Co., Ltd., X-22-163, KF-105, X-22-163B, and X-22-163C manufactured by Shin-Etsu Chemical Co., Ltd., and BYK-UV3500 manufactured by BYK.

[0099] The silicone compounds can be used alone or in combination of two or more.

[0100] The content of the silicone compound in the temporary fixing resin composition is preferably 0 to 100 parts by mass, more preferably 0.01 to 80 parts by mass, relative to 100 parts by mass of the thermoplastic resin. As long as the content of the silicone compound is within the above range, both the adhesion to the organic substrate during processing and the releasability to the organic substrate after processing can be achieved at a higher level.

[0101] Furthermore, from the viewpoint of suppressing the contamination of the organic substrate, the temporary fixing resin composition of the present embodiment may not contain a silicone compound or the content of the silicone compound may be 10% by mass or less based on the total amount of the temporary fixing resin composition. According to the temporary fixing resin composition of the present embodiment, even if the content of the silicone compound is 10% by mass or less, the releasability when the temporary fixing material is peeled off from the organic substrate can be ensured, so that both the suppression of the contamination of the organic substrate and the releasability when the temporary fixing material is peeled off from the organic substrate can be taken into account.

[0102] Examples of the organic filler include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, and polyimide fine particles.

[0103] The content of the organic filler in the temporary fixing resin composition of the present embodiment is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and further preferably 100 parts by mass or less relative to 100 parts by mass of the thermoplastic resin. The lower limit of the content of the organic filler is not particularly limited, and can be 5 parts by mass or more relative to 100 parts by mass of the thermoplastic resin. By making the content of the organic filler within the above range, it tends to be able to fully ensure the adhesion to the organic substrate, while giving the desired function to the temporary fixing material.

[0104] When the temporary fixing resin composition of the present embodiment is formed into a film, the elastic modulus after heating at 130° C. for 30 minutes and at 170° C. for 2 hours is 350 to 550 MPa at 25° C.

[0105] The elastic modulus after heating is measured by the following procedure. First, a film with a thickness of 240 μm is prepared by laminating four films of a temporary fixing resin composition with a thickness of 60 μm at 80°C. After heating it under predetermined conditions (for example, heating it in an oven at 130°C for 30 minutes and further heating it at 170°C for 2 hours), it is cut into a width of 4 mm and a length of 33 mm in the thickness direction. The cut film is placed in a dynamic viscoelasticity device (trade name: Rheogel-E4000, manufactured by UMB), a tensile load is applied, and the measurement is performed at a frequency of 10 Hz and a heating rate of 5°C / min, and the measured value at 25°C is recorded.

[0106] From the viewpoint of achieving a higher level of both suppression of peeling between the support body and the substrate during reflow and peelability when the temporary fixing material is peeled off from the substrate after reflow, the elastic modulus at 25°C after the above-mentioned heating is preferably 360 to 520 MPa, more preferably 370 to 500 MPa, and further preferably 442 to 490 MPa.

[0107] The elastic modulus at 25° C. after the heating can be adjusted according to, for example, the type and blending amount of the inorganic filler, the type and blending amount of the thermoplastic resin, the type and blending amount of the thermosetting resin, and the like.

[0108] The temporary fixing resin composition of the present embodiment is made into a film and laminated on a substrate having a surface of solder resist AUS308, and the 90° peel strength at 25°C between the substrate and the substrate after heating at 130°C for 30 minutes and at 170°C for 2 hours can be 30 to 150 N / m, 40 to 100 N / m, or 40 to 80 N / m. If the 90° peel strength is within the above range, the organic substrate and the temporary fixing material are not easily peeled off, and it is further easy to mount and seal the semiconductor chip on the organic substrate reinforced by the support body, and it is possible to take into account the suppression of peeling between the support body and the organic substrate during reflow and the peelability when the temporary fixing material is peeled off from the organic substrate after reflow at a higher level.

[0109] The 90° peel strength is measured as follows. A substrate (material: glass epoxy substrate, substrate thickness: 1000μm) having a surface with a solder resist "PSR-4000AUS308" (manufactured by TAIYO INK MFG.CO., LTD., trade name) is placed on the stage of a roll laminator (manufactured by Taisei Laminator Co., LTD., First Laminator VA-400III), and a temporary fixing resin composition formed into a film with a thickness of 60μm is set to adhere it to the substrate. It is pasted under the conditions of a speed of 0.4m / min, a temperature of 80°C, and a pressure of 0.2MPa as a measurement sample. After heating the obtained measurement sample under predetermined heating conditions (for example, heating at 130°C for 30 minutes and heating at 170°C for 2 hours), it is cut into 10mm width. A peel test was performed at a rate of 300 mm / min using a peel tester set to a peel angle of 90°, and the peel strength at this time was defined as a 90° peel strength.

[0110] Furthermore, the temporary fixing resin composition of the present embodiment is formed into a film and laminated on a polyimide film (manufactured by DU PONT-TORAY CO., LTD., trade name: 100EN, thickness 25 μm) as a support, and the 90° peel strength at 25°C between the support and the support after heating at 130°C for 30 minutes and at 170°C for 2 hours can be 80 N / m or more, 100 N / m or more, or 120 N / m or more, and can be 500 N / m or less, 400 N / m or less, or 300 N / m or less. If the 90° peel strength is within the above range, it is possible to achieve both suppression of peeling between the support and the organic substrate during reflow and peelability when the temporary fixing material is peeled off from the organic substrate after reflow at a higher level.

[0111] The temporary fixing resin composition of the present embodiment is a temporary fixing material that can be formed into a film. At this time, it is easier to control the film thickness of the temporary fixing material, and the uneven thickness in the laminate of the organic substrate, the temporary fixing material and the support can be reduced. In addition, the film-like temporary fixing material can be attached to the organic substrate or the support by simple methods such as lamination, and the workability is also excellent.

[0112] The thickness of the film-like temporary fixing material is not particularly limited, and is preferably 10 to 350 μm from the viewpoint of fully fixing the organic substrate and the support for transport. As long as the thickness is 10 μm or more, the uneven thickness during coating is reduced, and the thickness is sufficient, so the strength of the temporary fixing material or the cured product of the temporary fixing material becomes good, and the organic substrate and the support for transport can be more fully fixed. As long as the thickness is 350 μm or less, the uneven thickness of the temporary fixing material is not easy to occur, and it is easy to reduce the amount of residual solvent in the temporary fixing material by sufficient drying, which can further reduce the foaming when the cured product of the temporary fixing material is heated.

[0113] [Support belt for substrate transport]

[0114] The substrate conveyance support belt of the present embodiment includes a support film for conveying an organic substrate and a temporary fixing material layer provided on the support film and for temporarily fixing the organic substrate and the support film.

[0115] The temporary fixing material layer may contain a thermoplastic resin, a thermosetting resin and an inorganic filler, and have an elastic modulus of 350 to 550 MPa at 25° C. after heating at 130° C. for 30 minutes and at 170° C. for 2 hours. Such a temporary fixing material layer may be formed from the temporary fixing resin composition of the present embodiment.

[0116] Figure 1 1 is a diagram showing an embodiment of a support belt for substrate transport. Figure 1 (A) is a top view. Figure 1 (B) is along Figure 1 (A) is a schematic cross-sectional view taken along line II. The substrate conveyance support belt 10 shown in these figures includes a support film 1, a temporary fixing material layer 2A formed of the temporary fixing resin composition of the present embodiment, and a protective film 3 in this order.

[0117] The supporting film 1 is not particularly limited as long as it is a film capable of conveying an organic substrate, and examples thereof include polyethylene terephthalate films, polybutylene terephthalate films, polyethylene naphthalate films, polyethylene films, polypropylene films, polyamide films, and polyimide films. Among them, polyethylene terephthalate films, polybutylene terephthalate films, polyethylene naphthalate films, polypropylene films, polyamide films, and polyimide films are preferred from the viewpoint of excellent flexibility and toughness, and polyimide films are more preferred from the viewpoint of heat resistance and strength.

[0118] The thickness of the supporting film 1 can be appropriately set according to the target strength and flexibility, and is preferably 3 to 350 μm. As long as the thickness is 3 μm or more, sufficient film strength tends to be obtained, and as long as the thickness is 350 μm or less, sufficient flexibility tends to be obtained. From this point of view, the thickness of the supporting film 1 is more preferably 5 to 200 μm, and further preferably 7 to 150 μm.

[0119] The protective film 3 is not particularly limited, and examples thereof include polyethylene terephthalate films, polybutylene terephthalate films, polyethylene naphthalate films, polyethylene films, and polypropylene films. From the viewpoint of flexibility and toughness, the protective film 3 is preferably a polyethylene terephthalate film, a polyethylene film, and a polypropylene film. Furthermore, from the viewpoint of improving the peelability from the temporary fixing material layer, a film subjected to a release treatment using a silicone compound, a fluorine compound, or the like is preferably used as the protective film 3.

[0120] The thickness of the protective film 3 can be appropriately set according to the target strength and flexibility, for example, preferably 10 to 350 μm. As long as the thickness is 10 μm or more, sufficient film strength tends to be obtained, and as long as the thickness is 350 μm or less, sufficient flexibility tends to be obtained. From this point of view, the thickness of the protective film 3 is more preferably 15 to 200 μm, and further preferably 20 to 150 μm.

[0121] The temporary fixing material layer 2A can be formed by mixing and kneading the components constituting the temporary fixing resin composition of the present embodiment in an organic solvent to prepare a varnish, and applying the prepared varnish on the supporting film 1 and drying it.

[0122] The organic solvent is not particularly limited and can be determined by considering the volatility during film formation according to the boiling point. Specifically, from the viewpoint of making it difficult to solidify the film during film formation, preferred solvents are methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, xylene, etc., which have a relatively low boiling point. In addition, for the purpose of improving film forming properties, for example, solvents with a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, cyclohexanone, etc. are preferably used. Such solvents can be used alone or in combination of two or more. The solid content concentration in the varnish is preferably 10 to 80% by mass.

[0123] Mixing and kneading are carried out using a common stirrer, a pounder, a three-roller, a ball mill or other disperser, which can be appropriately combined. Drying is not particularly limited as long as the organic solvent used can be fully volatilized, and can usually be carried out by heating at 60° C. to 200° C. for 0.1 to 90 minutes.

[0124] After the temporary fixing material layer 2A is formed on the supporting film 1 , the protective film 3 is bonded onto the temporary fixing material layer 2A, thereby obtaining the supporting tape 10 for substrate transport.

[0125] The substrate transport support tape 10 can be easily stored by being wound into a roll, for example. Alternatively, the substrate transport support tape 10 in a roll form can be stored in a state where the roll-shaped substrate transport support tape 10 is cut into an appropriate size.

[0126] Figure 2 2 is a diagram showing another embodiment of a substrate transport support belt. Figure 2 (A) is a top view. Figure 2 (B) is along Figure 2 (A) is a schematic cross-sectional view taken along line II-II. The substrate conveyance support belt 20 shown in these figures includes a support film 1a, a temporary fixing material layer 2B formed of a first resin layer 2a and a second resin layer 2b, and a support film 1b in this order.

[0127] The first resin layer 2a and the second resin layer 2b may be composed of the same composition or different compositions. When the first resin layer 2a and the second resin layer 2b are composed of different compositions, for example, if the second resin layer 2b is used as the side in contact with the organic substrate, the support film 1a can be used as a support film for transport. At this time, by forming the second resin layer 2b with the temporary fixing resin composition of the present embodiment, it is possible to take into account both sufficient fixing of the organic substrate and the support film for transport and easy peeling of the support film for transport from the organic substrate. The first resin layer 2a can be designed to be a resin layer having excellent adhesion to the support film for transport, i.e., the support film 1a.

[0128] The temporary fixing material layer 2B can be formed by laminating the following two laminates: a laminate prepared by mixing and kneading the above components in an organic solvent to prepare a varnish, applying the varnish on the support film 1a, and drying it; and a laminate prepared by applying the same or separately prepared varnish on the support film 1b and drying it. In the case where the first resin layer 2a and the second resin layer 2b are formed from the same varnish, there is an advantage that even if a thick temporary fixing material layer is formed, it is easy to sufficiently reduce the residual amount of the organic solvent. The first resin layer 2a and the second resin layer 2b can be integrated to form a single-layer structure, or a double-layer structure can be maintained with an interface between the two layers.

[0129] [Method for manufacturing electronic device]

[0130] The method for producing an electronic device using the temporary fixing resin composition of the present embodiment can be roughly divided into the following five steps.

[0131] (a) A first step of bonding a support to an organic substrate via a temporary fixing material to obtain a laminate.

[0132] (b) A second step of heating the temporary fixing material of the stacked body.

[0133] (c) A third step of mounting a semiconductor chip on the organic substrate of the laminated body after the second step.

[0134] (d) A fourth step of sealing the semiconductor chip mounted on the organic substrate with a sealing material.

[0135] (e) A fifth step of peeling the support and the temporary fixing material from the organic substrate of the laminate after the fourth step.

[0136] Figure 3 , Figure 4 and Figure 5 1 is a schematic cross-sectional view for explaining an embodiment of a method for manufacturing an electronic device. Figure 3 , Figure 4 and Figure 5 In the figure, the temporary fixing material (temporary fixing material layer) is shown as Figure 1 (B) shows the case of the temporary fixing material layer 2A of the substrate transport supporting belt 10, but the structure of the temporary fixing material is not limited to this.

[0137] <(a) First step>

[0138] In the first step, the support film 1 is bonded to the organic substrate 30 via the temporary fixing material layer 2A to obtain a laminated body 15 ( Figure 3 (a)).

[0139] As the organic substrate 30, for example, a substrate having a thickness of 10 to 1000 μm can be used. From the perspective of thinning semiconductor elements or electronic equipment, the thickness of the organic substrate 30 can be 200 μm or less, or 100 μm or less. From the perspective of maintaining the strength of the package and reducing warping, the thickness of the organic substrate 30 can be 30 μm or more, or 50 μm or more.

[0140] The organic substrate 30 may be a coreless substrate. Examples of the material of the coreless substrate include build-up materials such as epoxy resin compositions. The organic substrate 30 may have a composition containing an acrylate resin on its surface.

[0141] like Figure 3 As shown in (a), when the laminated body 15 is obtained by using the substrate conveying support belt 10, the organic substrate 30 and the support film 1 can be laminated via the temporary fixing material layer 2A using a roll laminator. When the substrate conveying support belt 10 has a protective film 3, the protective film 3 can be peeled off before lamination, or the temporary fixing material layer 2A and the support film 1 can be laminated while peeling off the protective film 3.

[0142] As a roll laminator, for example, there can be mentioned a roll laminator VA400III (trade name) manufactured by Taisei Laminator Co., LTD. When using this device, the organic substrate 30 and the support film 1 can be bonded via the temporary fixing material layer 2A under the conditions of a pressure of 0.1 MPa to 1.0 MPa, a temperature of 40° C. to 150° C., and a speed of 0.1 to 1.0 m / min.

[0143] In this embodiment, the belt-shaped substrate conveying support tape 10 can be continuously supplied. In this case, the organic substrate 30 reinforced by the belt-shaped support film 1 can be continuously conveyed, and the throughput can be improved, the manufacturing time can be shortened, and the like can be achieved.

[0144] A vacuum laminator may also be used instead of a roll laminator.

[0145] Examples of the vacuum laminator include NPC Incorporated's vacuum laminator LM-50×50-S (trade name) and Nichigo-Morton Co., Ltd.'s vacuum laminator V130 (trade name). The lamination conditions include an air pressure of 1 hPa or less, a pressure bonding temperature of 40° C. to 150° C. (preferably 60° C. to 120° C.), a lamination pressure of 0.01 to 0.5 MPa (preferably 0.1 to 0.5 MPa), and a holding time of 1 second to 600 seconds (preferably 30 seconds to 300 seconds), and the organic substrate 30 and the support film 1 can be bonded via the temporary fixing material layer 2A.

[0146] <(b) Second step>

[0147] In the second step, the temporary fixing material layer 2A of the laminate 15 is heated. Through this step, the organic substrate 30 and the support film 1 ( Figure 3 (b)) to improve the operability of the organic substrate 30.

[0148] Heating can be performed, for example, using an explosion-proof dryer. The heating conditions are preferably 100 to 200°C for curing for 10 to 300 minutes (more preferably 20 to 210 minutes). As long as the temperature is above 100°C, the temporary fixing material can be fully cured without causing problems in subsequent processes. As long as it is below 200°C, degassing is not likely to occur when curing the temporary fixing material, and peeling of the temporary fixing material can be further suppressed. In addition, as long as the heating time is more than 10 minutes, problems are not likely to occur in subsequent processes. As long as it is below 300 minutes, the operating efficiency is not likely to deteriorate. Figure 3 The temporary fixing material layer 2C in (b) represents a cured product of the temporary fixing material layer 2A.

[0149] <(c) Step 3>

[0150] In the third step, the semiconductor chip is mounted on the organic substrate of the laminate after the second step. For example, the semiconductor chip 40 can be mounted on the organic substrate 30 using a flip chip bonder ( Figure 3 (c)) As an apparatus for mounting, for example, FC3000L (trade name) manufactured by TORAY ENGINEERING Co., Ltd. can be cited, and mounting conditions can be arbitrarily selected according to the desired organic substrate and semiconductor chip.

[0151] In the third step, the semiconductor chip can also be mounted on the organic substrate by performing a reflow process. The reflow process can be performed by heating the laminated body equipped with the semiconductor chip at a temperature that melts the solder. The heating temperature is adjusted according to the type of solder, for example, 190 to 280°C, preferably 220 to 270°C. By using the temporary fixing resin composition of the present embodiment, even when the reflow process is performed at the above temperature, the organic substrate 30 and the supporting film 1 bonded via the temporary fixing material layer 2A can be suppressed from peeling off during the reflow process, and after the reflow process, at room temperature, the temporary fixing material layer 2A can be suppressed from remaining on the organic substrate 30, and the supporting film 1 can be easily peeled off from the organic substrate 30.

[0152] <(d) Step 4>

[0153] In the fourth step, if Figure 4As shown in (d), the semiconductor chip 40 mounted on the organic substrate 30 is sealed with a sealing material 50. As a sealing device, for example, FFT1030G (trade name) manufactured by TOWA JAPAN can be cited, and the sealing conditions can be arbitrarily selected according to the desired organic substrate, semiconductor chip and sealing material. In addition, the curing conditions of the sealing material after sealing can be arbitrarily selected according to the type of sealing material.

[0154] <(e) Fifth step>

[0155] In the fifth step, if Figure 4 As shown in (e), the support film 1 and the temporary fixing material layer 2C are peeled off from the organic substrate 30 of the laminate after the fourth step. As the peeling method, the following methods can be cited: horizontally fixing one of the semiconductor chip mounting substrate or the support film on which the semiconductor chip is mounted and sealed on the organic substrate, and lifting the other at a certain angle from the horizontal direction; and sticking a protective film on the sealing surface of the semiconductor chip mounting substrate, and peeling the semiconductor chip mounting substrate and the protective film from the support film in a lifting manner; etc.

[0156] The peeling method is usually carried out at room temperature, but can also be carried out at a temperature of about 40 to 100°C.

[0157] In this embodiment, when the temporary fixing material partially remains on the semiconductor chip mounting substrate, a cleaning step for removing the temporary fixing material may be provided. The temporary fixing material may be removed by, for example, cleaning the semiconductor chip mounting substrate.

[0158] The cleaning liquid is not particularly limited as long as it can remove the temporary fixing material remaining locally. As such a cleaning liquid, for example, the above-mentioned organic solvent that can be used for diluting the temporary fixing resin composition can be cited. Such organic solvents can be used alone or in combination of two or more.

[0159] Furthermore, in the case where it is difficult to remove the remaining temporary fixing material, alkalis and acids may be added to the organic solvent. Examples of alkalis include amines such as ethanolamine, diethanolamine, triethanolamine, triethylamine, and ammonia; and ammonium salts such as tetramethylammonium hydroxide. As acids, organic acids such as acetic acid, oxalic acid, benzenesulfonic acid, and dodecylbenzenesulfonic acid may be used. The added amount is preferably 0.01 to 10% by mass in terms of concentration in the cleaning solution. Furthermore, in order to improve the removability of the residue, an existing surfactant may be added to the cleaning solution.

[0160] The cleaning method is not particularly limited, and examples thereof include a method of cleaning with the above cleaning solution under stirring, a method of cleaning by spraying with a sprayer, and a method of immersing in a cleaning solution tank. The suitable temperature is 10 to 80° C., preferably 15 to 65° C., and finally, water washing or alcohol washing is performed, and drying is performed to obtain a semiconductor chip mounting substrate.

[0161] Furthermore, as described above, according to the temporary fixing resin composition of the present embodiment, it is possible to favorably peel off from the organic substrate and to suppress the temporary fixing material from remaining on the organic substrate, so that the washing step can be omitted.

[0162] In this embodiment, the semiconductor chip mounting substrate 55 on which the semiconductor chip is mounted and sealed is further cut into individual semiconductor elements 60 ( Figure 5 (f) and Figure 5 (g)).

[0163] Figure 5 (h) is a cross-sectional view schematically showing the electronic device 100 manufactured through the above steps. The electronic device 100 includes a plurality of semiconductor elements 60 arranged on a circuit board 70 via solder balls 65 .

[0164] As mentioned above, although embodiment of this invention was described, this invention is not necessarily limited to the said embodiment, It can change suitably within the range which does not deviate from the meaning.

[0165] Example

[0166] Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.

[0167] [Synthesis of Acrylic Rubber K-1]

[0168] In a 500cc removable flask equipped with a stirrer, a thermometer, a nitrogen replacement device (nitrogen inflow tube) and a reflux cooler with a water receiving container, 200g of deionized water, 70g of butyl acrylate, 10g of methyl methacrylate, 10g of 2-hydroxyethyl methacrylate, 10g of glycidyl methacrylate, 1.8% polyvinyl alcohol aqueous solution 1.94g, 0.2g of lauroyl peroxide and 0.06g of n-octyl mercaptan were mixed. Then, N2 gas was blown into the flask for 60 minutes to remove the air in the system, and the temperature in the system was raised to 65°C and polymerization was carried out for 5 hours. Furthermore, the temperature in the system was raised to 90°C, and stirring was continued for 2 hours to complete the polymerization. The transparent beads obtained by the polymerization reaction were separated by filtration, washed with deionized water, and dried at 50°C in a vacuum dryer for 6 hours to obtain acrylic rubber K-1.

[0169] The weight average molecular weight of the acrylic rubber K-1 was measured by GPC, and the weight average molecular weight was 400,000 in terms of polystyrene. The Tg of the acrylic rubber K-1 was -28°C.

[0170] (Examples 1 to 4, Comparative Examples 1 to 3)

[0171] [Manufacturing of support belt for substrate transport]

[0172] Varnishes for forming a temporary fixing material layer were prepared with the compositions in parts by mass shown in Table 1. The prepared varnish was applied to a polyimide film (manufactured by DU PONT-TORAY CO., LTD., trade name: 100EN, thickness 25 μm) as a supporting film, and dried by heating at 90°C for 5 minutes and at 120°C for 5 minutes, thereby forming a temporary fixing material layer with a thickness of 60 μm. Then, a protective film was attached to the temporary fixing material layer to obtain a substrate conveying support belt having a structure of a supporting film, a temporary fixing material layer and a protective film.

[0173] [Table 1]

[0174]

[0175] The details of each component described in Table 1 are as follows.

[0176] (Thermoplastic resin)

[0177] Acrylic rubber K-1: Acrylic rubber synthesized as described above (weight average molecular weight measured by GPC: 400,000, glycidyl methacrylate: 10% by mass, Tg: -28°C)

[0178] (Thermosetting resin)

[0179] EXA-830CRP: Bisphenol F type epoxy resin (manufactured by DIC CORPORATION, trade name)

[0180] YDCN-700-10: Cresol novolac type multifunctional epoxy resin (manufactured by NIPPON STEEL Chemical & Material Co., Ltd., trade name)

[0181] (Curing agent)

[0182] HE100-30: Phenol aralkyl resin (manufactured by AIR WATER INC, trade name)

[0183] (Inorganic filler)

[0184] YA050C-HHG: Vinylsilane surface treated silica filler (manufactured by Admatechs Company Limited, trade name, average particle size 50 nm)

[0185] SC2050-HLG: Epoxysilane surface treated silica filler (manufactured by Admatechs Company Limited, trade name, average particle size 500 nm)

[0186] Y10SV-AH1: Vinylsilane surface treated silica filler (manufactured by Admatechs Company Limited, trade name, average particle size 10 nm)

[0187] YA050C-MJC: epoxy silane surface treated silica filler (manufactured by Admatechs Company Limited, trade name, average particle size 50 nm)

[0188] SC2050-HNK: Silica filler surface treated with aniline silane (manufactured by Admatechs Company Limited, trade name, average particle size 500 nm)

[0189] (Curing accelerator)

[0190] 2PZ-CN: Imidazole curing accelerator (manufactured by SHIKOKU CHEMICALS CORPORATION, trade name)

[0191] The substrate transport support tapes of the prepared examples and comparative examples were evaluated for elastic modulus after heating, 90° peel strength after heating, presence of peeling during reflow, and peelability after reflow by the following methods. The evaluation results are shown in Table 2.

[0192] [Measurement of elastic modulus after heating]

[0193] The elastic modulus is measured in the following order. First, four temporary fixing material layers with a thickness of 60 μm are laminated at 80°C to form a film with a thickness of 240 μm. It is heated in an oven at 130°C for 30 minutes, and further heated at 170°C for 2 hours, and then cut into 4 mm width and 33 mm length in the thickness direction. The cut film is placed in a dynamic viscoelasticity device (trade name: Rheogel-E4000, manufactured by UMB), a tensile load is applied, and the measurement is performed at a frequency of 10 Hz and a heating rate of 5°C / min, and the measured value at 25°C is recorded.

[0194] [Measurement of 90° peel strength after heating]

[0195] The 90° peel strength between the organic substrate and the temporary fixing material layer and between the support film and the temporary fixing material layer was evaluated by the following method. An organic substrate (material: glass epoxy substrate) with a thickness of 1000 μm and a surface having a solder resist AUS308 (manufactured by TAIYO INK MFG.CO., LTD., trade name: PSR-4000AUS308) was placed on the stage of a roll laminator (manufactured by Taisei Laminator Co., LTD., VA-400III) so that the temporary fixing material layer was adhered to the side of the organic substrate. The substrate conveying support tape from which the protective film had been peeled was laminated at a temperature of 100°C, a pressure of 0.4 MPa, and 0.15 m / min. The obtained sample was heated at 130°C for 30 minutes, then heated at 170°C for 2 hours, and then cut into 10 mm widths as a film for measurement. The film for measurement was subjected to a peel test at a speed of 300 mm / min using a peel tester set to a peel angle of 90°, and the peel strength at this time was referred to as the 90° peel strength. The peel strength was measured by measuring the strength when the temporary fixing material layer was peeled off from the organic substrate (organic substrate / temporary fixing material layer 90° peel strength) and the strength when the supporting film was peeled off from the temporary fixing material layer (supporting film / temporary fixing material layer 90° peel strength).

[0196] [Evaluation of peeling during reflow]

[0197] The same sample as the sample used for the measurement of 90° peel strength was prepared. After the sample was placed (moisture absorption treatment) at a temperature of 30°C and a humidity of 55%RH for 72 hours, it was placed on a heating plate heated to 260°C for 2 minutes in a manner such that the supporting film was in contact with the heating plate, and whether peeling (foaming) occurred between the organic substrate and the supporting film (i.e., between the organic substrate / temporary fixing material layer and / or between the supporting film / temporary fixing material layer) was confirmed with the naked eye. Then, the peeling state during reflow was evaluated according to the following evaluation criteria.

[0198] A: No peeling (foaming) occurred between the organic substrate / temporary fixing material layer and between the support film / temporary fixing material layer.

[0199] B: At least one of the organic substrate / temporary fixing material layer and the support film / temporary fixing material layer has slightly peeled off (foamed). The area of ​​the peeled (foamed) portion is 2% or less of the total area.

[0200] C: Delamination (foaming) occurs in at least one of the organic substrate / temporary fixing material layer and the support film / temporary fixing material layer. The area of ​​the delamination (foaming) portion exceeds 2% of the total area.

[0201] [Evaluation of peeling properties after reflow]

[0202] The same sample as the sample used for the 90° peel strength measurement was prepared. The sample was placed on a heating plate heated to 260°C for 2 minutes in such a way that the organic substrate was in contact with the heating plate. After the sample was cooled to room temperature (25°C), the support film was peeled off from the organic substrate, and it was confirmed with the naked eye whether the temporary fixing material layer adhered to the organic substrate and remained. Then, the peelability after reflow was evaluated according to the following evaluation criteria.

[0203] A: The temporary fixing material layer does not remain on the organic substrate.

[0204] B: A portion of the temporary fixing material layer remains on the organic substrate.

[0205] C: Peeling occurred between the support film and the temporary fixing material layer, and most of the temporary fixing material layer remained on the organic substrate.

[0206] [Table 2]

[0207]

[0208] The results shown in Table 2 clearly confirm that the support tape for substrate conveyance according to the embodiment having a temporary fixing material layer containing a thermoplastic resin, a thermosetting resin and an inorganic filler, and having an elastic modulus of 350 to 550 MPa at 25°C after heating at 130°C for 30 minutes and at 170°C for 2 hours, can suppress the peeling between the support film and the organic substrate during reflow, and can obtain excellent peeling properties when the temporary fixing material layer is peeled off from the organic substrate after reflow.

[0209] Explanation of symbols

[0210] 1, 1a, 1b-support film, 2A, 2B, 2C-temporary fixing material layer, 2a-first resin layer, 2b-second resin layer, 3-protective film, 10, 20-support tape, 15-laminated body, 30-organic substrate, 40-semiconductor chip, 50-sealing material, 55-semiconductor chip mounting substrate, 60-semiconductor element, 65-solder ball, 70-circuit substrate, 100-electronic device device.

Claims

1. A temporary fixing resin composition for temporarily fixing a substrate transport support to an organic substrate, The temporary fixing resin composition contains a thermoplastic resin, a thermosetting resin and an inorganic filler. When formed into a film, the elastic modulus after heating at 130°C for 30 minutes and at 170°C for 2 hours is 350 to 550 MPa at 25°C. The elastic modulus is measured by the following measurement method: a film with a thickness of 240 μm is prepared from a temporary fixing resin composition, heated at 130°C for 30 minutes and at 170°C for 2 hours, and then cut into a film with a width of 4 mm and a length of 33 mm in the thickness direction. The cut film is placed in a dynamic viscoelasticity device, a tensile load is applied, and the elastic modulus at 25°C is measured under the conditions of a frequency of 10 Hz and a heating rate of 5°C / min. 2 . The temporary fixing resin composition according to claim 1 , further comprising a curing accelerator. 3 . The temporary fixing resin composition according to claim 1 , further comprising a silicone compound.

4. The temporary fixing resin composition according to claim 1 or 2, when made into a film, has a 90° peel strength of 30 to 150 N / m at 25°C between the film and a substrate having a surface with a solder resist AUS308 after heating at 130°C for 30 minutes and at 170°C for 2 hours.

5. The temporary fixing resin composition according to claim 1 or 2, which, when formed into a film, has a 90° peel strength of 80 to 400 N / m at 25°C between the polyimide film and the film after heating at 130°C for 30 minutes and at 170°C for 2 hours.

6. The temporary fixing resin composition according to claim 1 or 2, wherein The inorganic filler is an inorganic filler having an organic group on the surface.

7. The temporary fixing resin composition according to claim 6, wherein The organic group includes a vinyl group or an epoxy group.

8. The temporary fixing resin composition according to claim 1 or 2, wherein The content of the inorganic filler is 20 to 100 parts by mass based on 100 parts by mass of the thermoplastic resin.

9. A substrate transport support belt comprising: A supporting film for transporting an organic substrate; and a temporary fixing material layer, which is disposed on the supporting film and is used to temporarily fix the organic substrate and the supporting film, The temporary fixing material layer is a layer formed using the temporary fixing resin composition according to any one of claims 1 to 8.

10. The substrate conveying support belt according to claim 9, wherein: The supporting film is a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film or a polyimide film.

11. The substrate conveying support belt according to claim 9 or 10, wherein: The 90° peel strength at 25° C. between the support film and the temporary fixing material layer after heating at 130° C. for 30 minutes and at 170° C. for 2 hours is 80 to 400 N / m.

12. A method for manufacturing an electronic device, comprising: In a first step, a support is bonded to an organic substrate via a temporary fixing material to obtain a laminate; The second step is to heat the temporary fixing material of the stacked body; A third step is to mount a semiconductor chip on the organic substrate of the laminate after the second step; A fourth step is to seal the semiconductor chip mounted on the organic substrate with a sealing material; and A fifth step is to peel off the support and the temporary fixing material from the organic substrate of the laminate after the fourth step. The temporary fixing material is a material formed using the temporary fixing resin composition according to any one of claims 1 to 8.

13. The method for manufacturing an electronic device according to claim 12, wherein: The thickness of the organic substrate is less than 200 μm.

14. The method for manufacturing an electronic device according to claim 12 or 13, wherein: The organic substrate is a coreless substrate.

15. The method for manufacturing an electronic device according to claim 12 or 13, wherein: The support is a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polypropylene film, a polyamide film or a polyimide film.

16. The method for manufacturing an electronic device according to claim 12 or 13, wherein: In the first step, the support is in a belt shape and is continuously supplied.

17. The method for manufacturing an electronic device according to claim 12 or 13, wherein: In the first step, the laminate is obtained using a supporting tape including a supporting film as the supporting body and a temporary fixing material layer formed of the temporary fixing material and provided on the supporting film.

18. The method for manufacturing an electronic device according to claim 12 or 13, wherein: In the laminate after the second step, a 90° peel strength at 25° C. between the organic substrate and the temporary fixing material is 30 to 150 N / m.

19. The method for manufacturing an electronic device according to claim 12 or 13, wherein: In the laminated body after the second step, a 90° peel strength at 25° C. between the support and the temporary fixing material is 80 to 400 N / m.

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