Sensor and electronic device

A technology of electronic equipment and sensors, which is applied in the field of sensors and can solve problems such as sensor sensitivity reduction
CN114650486APending Publication Date: 2022-06-21GOERTEK MICROELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
GOERTEK MICROELECTRONICS CO LTD
Publication Date
2022-06-21

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Abstract

The invention provides a sensor and electronic equipment, the sensor comprises a substrate layer, a vibrating diaphragm, a back electrode and a connecting column, and the substrate layer is provided with a first pin and a second pin; the vibrating diaphragm and the substrate layer are arranged at an interval, and the vibrating diaphragm is electrically connected with the first pin; a back electrode conducting layer is arranged in the back electrode and is connected with the second pin; one end of the connecting column is connected with the central position of the diaphragm, and the other end of the connecting column is connected with the back electrode. The vibrating diaphragm and the substrate layer are arranged at an interval, that is, the substrate layer is not directly connected with the vibrating diaphragm, and the central position of the vibrating diaphragm and the back electrode are connected through the connecting column to support the vibrating diaphragm. In the sensor, the vibrating diaphragm is connected with the back electrode only through the connecting column, the stress is small, the deformation of the sensor can be reduced, and the sensitivity of the product is not influenced.
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Description

technical field

[0001] The present invention relates to the field of sensors, in particular to a sensor and an electronic device. Background technique

[0002] In the prior art, the sensor includes a base layer, the outer edge of the diaphragm is connected to the base layer or the isolation layer above the base layer, and then connected to the pins through the conductive layer disposed in the isolation layer. After the sensor is packaged into a microphone, there is a large stress. When the product shell or circuit board is subjected to external pressure, the sensor will be deformed, thereby affecting the sensitivity of the product.

[0003] In view of this, it is necessary to provide a new type of sensor and electronic device to solve or at least alleviate the above-mentioned technical defects. SUMMARY OF THE INVENTION

[0004] The main purpose of the present invention is to provide a sensor and an electronic device, which aims to solve the technical problem that the sen...

Claims

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