Heat treatment chamber and heat treatment equipment

By adopting vertically staggered heating sources and multiple dispersed airflow design in the rapid heat treatment equipment, combined with the design of cooling components, the problem of low temperature and airflow uniformity in the equipment is solved, extending the equipment life and meeting the rapid heat treatment Requirements for process.

CN118866775BActive Publication Date: 2025-02-18ADVANCED MATERIALS TECH & ENG INC +1
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Patent Information

Application Number
CN202411336572.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-25
Publication Date
2025-02-18
Estimated Expiration
2044-09-25

AI Technical Summary

Technical Problem

The existing rapid heat treatment equipment has low temperature uniformity, low air flow uniformity, and easy overtemperature of cavity walls and lamps, resulting in a short service life of the equipment and cannot meet the strict requirements of rapid heat treatment processes.

Method used

A heat treatment chamber is designed, using a heating source arranged vertically in space, combined with a process airflow design with multiple dispersions, and adding cooling components to ensure cooling of the cavity wall and heating parts, ensuring temperature and uniformity of air flow.

Benefits of technology

It improves the temperature uniformity and airflow uniformity of the equipment, avoids overtemperature of the cavity wall and lamp tubes, extends the service life of the equipment, and meets the strict requirements of the rapid heat treatment process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a heat treatment chamber and heat treatment equipment, which relate to the field of semiconductor processing technology. The heat treatment chamber includes: a shell assembly, which is provided with a process chamber; a heating assembly, which includes a plurality of heaters located on one side of the process chamber and arranged along a first direction and a plurality of heaters located on the other side of the process chamber and arranged along a second direction, wherein the first direction and the second direction are in a spatial vertical relationship; a first cooling assembly, which includes a cooling water channel, which is arranged in the shell assembly and surrounds the process chamber; and a second cooling assembly, which includes a cooling air duct, a part of which is located at the heater. The heat treatment chamber and the heat treatment equipment have high temperature uniformity and high airflow uniformity, which can avoid equipment damage caused by overheating of the cavity wall and overheating of the lamp tube, increase the service life of the equipment and production safety, and can simultaneously meet the strict requirements of the rapid heat treatment process.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a heat treatment chamber and heat treatment equipment. Background Art

[0002] Rapid Thermal Processing (RTP) is a process that processes materials at high temperatures in a short period of time, aiming to quickly change the structure and properties of materials through rapid heating and cooling. In order to obtain semiconductor wafer materials with better performance, semiconductor wafers need to be rapidly thermally processed. Therefore, rapid thermal processing equipment has also become one of the key equipment in the production of semiconductor devices.

[0003] However, the rapid thermal processing equipment in the prior art has the following problems: most of the thermal processing equipment heats unevenly, resulting in low temperature uniformity, and the direction of the process airflow is disordered, resulting in low airflow uniformity, affecting product performance, and there is no reproducible pattern; moreover, the cavity wall of most of the thermal processing equipment is not cooled sufficiently, resulting in the cavity wall being easily overheated, and the cavity wall material is prone to softening or even melting; the lamp tube is not cooled sufficiently, resulting in the lamp tube being easily overheated and frequently damaged, and the equipment has a short service life, and cannot simultaneously meet the strict requirements of the rapid thermal processing process.

[0004] With respect to the above-mentioned problems in the prior art, no effective solution has been proposed yet. Summary of the invention

[0005] The purpose of the present invention is to provide a heat treatment chamber and heat treatment equipment to solve the problems of low temperature uniformity, low airflow uniformity, easy over-temperature of the cavity wall and the lamp tube, which are easy to cause equipment damage, short equipment service life, and inability to simultaneously meet the strict requirements of the rapid heat treatment process.

[0006] In one aspect, the present invention provides a thermal processing chamber, comprising:

[0007] A shell assembly is provided with a process chamber;

[0008] A heating assembly, comprising a plurality of heaters located at one side of the process chamber and arranged along a first direction and a plurality of heaters located at the other side of the process chamber and arranged along a second direction, wherein the first direction and the second direction are in a spatially vertical relationship;

[0009] A first cooling assembly, comprising a cooling water channel, wherein the cooling water channel is disposed in the shell assembly and surrounds the process chamber;

[0010] The second cooling assembly includes a cooling air duct, a portion of which is located at the heater.

[0011] In one embodiment of the present invention, the shell assembly includes a middle cavity, and a first cavity cover and a second cavity cover respectively connected to the middle cavity, and the first cavity cover, the middle cavity and the second cavity cover enclose the process cavity.

[0012] In one embodiment of the present invention, the second cavity cover is provided with a plurality of support columns.

[0013] In one embodiment of the present invention, the cavity wall on one side of the middle cavity is provided with a plurality of dispersion holes penetrating the cavity wall, and the cavity wall on the other side is provided with an outlet channel connected to the outlet port, and the side wall of the outlet channel along the length direction thereof is provided with a plurality of holes, and the outlet channel is connected to the process cavity through the holes; a plurality of the dispersion holes are connected to an air intake pipe assembly, and the air intake pipe assembly includes an air intake main pipe and a plurality of dispersion pipes connected thereto, and a plurality of the dispersion pipes are connected to the process cavity through a plurality of the dispersion holes.

[0014] In one embodiment of the present invention, the middle cavity is provided with an air-distributing plate near the dispersion holes, and the air-distributing plate is provided with a plurality of through holes.

[0015] In one embodiment of the present invention, there are at least two gas uniformizing plates, and when the gas uniformizing plates are arranged adjacent to each other in sequence, the through holes on the adjacent gas uniformizing plates are arranged in a staggered manner.

[0016] In one embodiment of the present invention, the numbers of the dispersion pipe, the dispersion holes and the through holes on the gas uniforming plate increase in sequence.

[0017] In one embodiment of the present invention, the first cooling assembly also includes a water inlet pipe and a water outlet pipe installed on the shell assembly and connected to the cooling water channel; the cooling water channel includes a first cooling water channel arranged on the first cavity cover and / or the second cavity cover, and a second cooling water channel arranged on the middle cavity; the first cooling water channel is arranged vertically and horizontally, and the second cooling water channel is arranged in a square shape.

[0018] In one embodiment of the present invention, the heater comprises a sleeve and a heating element, wherein the sleeve is sleeved on the outer peripheral side of the heating element so that the heating element is located in the inner cavity of the sleeve;

[0019] The second cooling component is arranged on the first cavity cover and / or the second cavity cover; the second cooling component also includes an air inlet and an air outlet; the cooling air duct includes a first air cavity and a second air cavity, the first air cavity is located at one end of the heater and is close to the air inlet, the second air cavity is located at the other end of the heater and is close to the air outlet, and the two ends of the sleeve are respectively connected to the first air cavity and the second air cavity, so that the inner cavity becomes a part of the cooling air duct.

[0020] In one embodiment of the present invention, the air inlet portion includes an air inlet grille, and the air inlet grille is provided with a wind speed sensor for detecting the wind speed of the incoming air; the air outlet portion includes an air outlet cover, and the air outlet cover is provided with a third temperature sensor.

[0021] In one embodiment of the present invention, the first cavity cover, the second cavity cover, and the middle cavity are all equipped with sensors for detecting the temperature of the cavity walls.

[0022] In one embodiment of the present invention, the first cavity cover is connected to a first driving mechanism, and the second cavity cover is connected to a second driving mechanism. The first cavity cover rotates relative to the middle cavity through the first driving mechanism, and the second cavity cover rotates relative to the middle cavity through the second driving mechanism and opens and closes with the middle cavity respectively.

[0023] On the other hand, the present invention provides a heat treatment device, comprising the heat treatment chamber, and further comprising a frame, wherein the heat treatment chamber is mounted on the frame.

[0024] Beneficial effects of the present invention:

[0025] The heat treatment chamber and heat treatment equipment provided by the present invention have a heater of the first chamber cover that can form a grid-shaped heating source with the heater of the second chamber cover that is vertically staggered in space, so that the thermal field is more uniform, which can improve the uniformity of heating the heating element and the temperature uniformity of the equipment; the design of the process gas flow channel of the shell assembly can disperse the process gas multiple times, which is conducive to uniformly dispersing the airflow, improving the dispersion effect and airflow uniformity, reducing the airflow impact, allowing the process gas to flow through the workpiece evenly and orderly, avoiding the occurrence of airflow direction disorder, improving the airflow uniformity, and further improving the temperature uniformity of the heat treatment process. Uniformity, thereby improving product performance, and has a reproducible pattern; its first cooling component can ensure the heat dissipation effect of the shell component, avoid the softening or even melting of the cavity wall material due to overheating, prevent the heat treatment chamber from being damaged by overheating, ensure the safety of the equipment, extend the service life of the equipment, and improve the process temperature stability of the process chamber; its second cooling component can cool the heating element in the heater, avoid insufficient cooling of the heating element and easy overheating, prevent it from being overheated and burned and frequently damaged, increase the service life of the equipment and production safety, and can meet the strict requirements of the rapid heat treatment process at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the three-dimensional structure of a heat treatment chamber in a closed state provided by an embodiment of the present invention.

[0027] Figure 2 This is a schematic diagram of the three-dimensional structure of the heat treatment chamber in an open state provided by an embodiment of the present invention.

[0028] Figure 3 A top view of a heat treatment chamber provided in an embodiment of the present invention.

[0029] Figure 4 for Figure 3 BB section view in.

[0030] Figure 5 for Figure 3 CC section view in.

[0031] Figure 6 for Figure 3 DD section view in.

[0032] Figure 7 A cross-sectional view of a receiving assembly provided in an embodiment of the present invention.

[0033] Figure 8 This is a schematic structural diagram of a first cooling water channel provided in an embodiment of the present invention.

[0034] Fig. 9 A cross-sectional view from a first perspective of a heat treatment chamber provided by an embodiment of the present invention.

[0035] Fig.10 A cross-sectional view from a second perspective of a heat treatment chamber provided by an embodiment of the present invention.

[0036] Fig.11 This is a schematic structural diagram of a second cooling water channel provided in an embodiment of the present invention.

[0037] Fig.12 This is an exploded view of the middle cavity provided in an embodiment of the present invention.

[0038] Fig.13 This is a schematic diagram of the structure of some through holes on the gas uniforming plate provided in an embodiment of the present invention.

[0039] Fig.14 A three-dimensional diagram of a heat treatment chamber with a drive mechanism provided by an embodiment of the present invention.

[0040] Fig.15 A three-dimensional view of a heat treatment chamber provided in an embodiment of the present invention with a housing assembly of a driving mechanism opened.

[0041] In the figure: 1. Shell assembly; 11. First cavity cover; 12. Second cavity cover; 121. Support column; 13. Middle cavity; 131. Inlet pipe assembly; 1311. Inlet main pipe; 1312. Dispersion pipe; 132. Dispersion hole; 133. Channel; 134. Air outlet channel; 135. Air outlet; 14. Process chamber; 15. Air uniformity plate; 151. Through hole; 16. Cover plate; 17. First drive mechanism; 18. Second drive mechanism; 2. Accommodation assembly; 21. First substrate; 22. Second substrate; 23. Accommodation space; 3. Heating assembly; 30. Heater; 31. Sleeve; 32. Heating element; 33. First temperature sensor ; 34. Second temperature sensor; 35. Inner cavity; 4. First cooling component; 40. Cooling water channel; 401. First cooling water channel; 402. Branch channel; 403. First water inlet pipe; 404. First water outlet pipe; 411. Second cooling water channel; 412. Second water inlet pipe; 413. Second water outlet pipe; 43. Blockage; 5. Second cooling component; 51. Air inlet; 511. Air inlet grille; 52. Air outlet; 521. Air outlet cover; 522. Third temperature sensor; 53. Cooling air duct; 531. First air cavity; 532. Second air cavity; 6. Wafer; L1. Process gas flow path; L2. Cooling gas flow path. DETAILED DESCRIPTION

[0042] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] The embodiments of the present application provide a heat treatment chamber and heat treatment equipment, which are intended to at least to some extent solve the problems existing in the rapid heat treatment equipment in the prior art, such as low temperature uniformity, low airflow uniformity, easy over-temperature of the cavity wall, easy over-temperature of the lamp tube, easy damage to the equipment, short service life of the equipment, and inability to simultaneously meet the strict requirements of the rapid heat treatment process.

[0046] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Fig.12 An embodiment of the present application provides a heat treatment chamber, including a shell component 1, a heating component 3, a first cooling component 4, and a second cooling component 5. The shell component 1 is provided with a process cavity 14.

[0047] In some embodiments, the housing assembly 1 includes a middle cavity 13, and a first cavity cover 11 and a second cavity cover 12 respectively connected to the middle cavity 13. The first cavity cover 11, the middle cavity 13 and the second cavity cover 12 enclose a process cavity 14; the first cavity cover 11 and the second cavity cover 12 are designed to be openable or closable, so as to facilitate opening or closing the process cavity 14 and facilitate operation and maintenance. Specifically, in this embodiment, Figure 1 As shown, in the closed state, the first cavity cover 11 covers the upper part of the middle cavity 13 and is the upper cover of the middle cavity 13 ; the second cavity cover 12 covers the lower part of the middle cavity 13 and is the lower cover of the middle cavity 13 .

[0048] The second chamber cover 12 is provided with a plurality of support columns 121 facing the first chamber cover 11. The support columns 121 can be used to support the workpiece placed in the process chamber 14, for example, to support a wafer, or to support the receiving assembly 2 with a wafer. Preferably, the support columns 121 are made of quartz.

[0049] Furthermore, the cavity wall on one side of the middle cavity 13 is provided with a plurality of dispersion holes 132 penetrating the cavity wall, and the cavity wall on the other side is provided with an outlet channel 134 connected to the outlet port 135, and the side wall of the outlet channel 134 along the length direction thereof is provided with a plurality of channels 133, and the outlet channel 134 is connected with the process cavity 14 through the channels 133; the plurality of dispersion holes 132 are connected with the air inlet pipe assembly 131, and the air inlet pipe assembly 131 includes an air inlet main pipe 1311 and a plurality of dispersion pipes 1312 connected thereto, and the plurality of dispersion pipes 1312 are connected with the process cavity 14 through the plurality of dispersion holes 132.

[0050] Specifically, near the dispersion holes 132, the middle cavity 13 is provided with a gas-distributing plate 15, and the gas-distributing plate 15 is provided with a plurality of through holes 151. Preferably, the gas-distributing plate 15 is made of quartz glass.

[0051] Furthermore, there are at least two air-leveling plates 15 , and when the air-leveling plates 15 are arranged adjacent to each other in sequence, the through holes 151 on the adjacent air-leveling plates 15 are arranged in a staggered manner.

[0052] like Fig.12 As shown, the embodiment of the present application provides two uniform gas plates 15, which are installed in the middle cavity 13 through the cover plate 16 and are located on the side close to the dispersion hole 132. The two uniform gas plates 15 are arranged adjacent to each other in parallel, and the through holes 151 on the two adjacent uniform gas plates 15 are arranged in a staggered manner, so that the through holes 151 on the two adjacent uniform gas plates 15 are arranged in a mesh-like manner when they are superimposed, as shown in FIG. Fig.13 As shown, the impact of airflow can be alleviated and the uniformity of airflow distribution can be further improved.

[0053] Optionally, the number of the dispersion tubes 1312, the dispersion holes 132, and the through holes 151 on the gas homogenizing plate 15 increases in sequence. Optionally, the number of the dispersion holes 132 may be twice the number of the dispersion tubes 1312. For example, in this embodiment, the number of the dispersion tubes 1312 is four, the number of the dispersion holes 132 is eight, and the number of the through holes 151 on a single gas homogenizing plate 15 is several, which may be an integer greater than eight.

[0054] Alternatively, if Figure 4 and Figure 5 As shown, the channel 133 is inclined, one end of the channel 133 is a small hole opened on the wall of the middle cavity 13, and the other end is connected to the gas outlet channel 134 set in the wall of the middle cavity 13, so that a plurality of channels 133 are arranged in a row along the rectangular strip of the gas outlet channel 134 in the wall of the middle cavity 13, so as to realize the connection between the gas outlet channel 134 of the process gas and the process chamber 14, and uniform exhaust. Limited by the overall size of the structure, by developing and designing the structure of such channels 133 and gas outlet channels 134, uniform exhaust can be achieved while saving structural space.

[0055] Specifically, Figure 4 and Fig.12 As shown, the process gas first enters the dispersion pipe 1312 through the air intake manifold 1311, and the dispersion pipe 1312 disperses the process gas for the first time. The cavity wall of the middle cavity 13 is provided with a dispersion hole 132 that penetrates the cavity wall. The process gas that has been dispersed once by the dispersion pipe 1312 enters the process cavity 14 in the middle cavity 13 from the dispersion hole 132. The number of dispersion holes 132 is greater than the number of dispersion pipes 1312, and the dispersion hole 132 disperses the process gas for the second time. Then, near the dispersion hole 132, the middle cavity 13 is provided with an air-distributing plate 15. Several through holes 151 on the air-distributing plate 15 allow the process gas that has been dispersed twice by the dispersion hole 132 to pass evenly, and the air-distributing plate 15 disperses the process gas for the third time. The through holes 151 on the two air-distributing plates 15 are arranged in a staggered manner, so that the through holes 151 on the two air-distributing plates 15 are arranged in a mesh-like manner when superimposed, so as to reduce the impact of the airflow and make the airflow evenly distributed.

[0056] Therefore, the heat treatment chamber provided by the present application can achieve three-fold dispersion of the process gas, which is conducive to uniform dispersion of the airflow, so that the process gas enters the process chamber 14 in a uniform and dispersed manner, improves the dispersion effect and airflow uniformity, and reduces the airflow impact. The dispersed airflow passes through the workpiece evenly, flows in parallel from one side of the middle cavity 13 to the other side, flows through the entire process chamber 14 and the workpiece, further improves the temperature uniformity of the heat treatment process, and finally enters from a number of parallel channels 133 on the cavity wall on the other side of the middle cavity 13 into the gas outlet channel 134 set in the cavity wall of the middle cavity 13, such as Figure 4 The process gas flow path L1 and Figure 1 , Figure 2 As shown, the gas then converges from the gas outlet channel 134 to the gas outlet 135, and is finally discharged from the gas outlet pipe connected to the gas outlet 135. Therefore, the design of the process gas flow channel provided by the present application can make the process gas flow evenly and orderly, avoid the disorder of the gas flow direction, improve the gas flow uniformity, further improve the temperature uniformity of the heat treatment process, thereby improving the product performance, and has a reproducible regularity.

[0057] Furthermore, if Figure 4 and Fig.12 As shown, the middle cavity 13 is provided with a cover plate 16 for limiting the direction of the process gas flow, and the gas leveling plate 15 is clamped on the cover plate 16, and the cover plate 16 is overlapped on the middle cavity 13, and the gas leveling plate 15 is located in the process chamber 14. The cover plate 16 is used to limit the direction of the process gas flow so that it flows as parallel as possible. Preferably, the cover plate 16 is made of quartz glass.

[0058] Please refer to Figure 7In some embodiments, the heat treatment chamber may further include a containing assembly 2. When the heat treatment process is performed, the containing assembly 2 is located between the cover plate 16 and the support column 121. The support column 121 supports the containing assembly 2 carrying the wafer 6. The containing assembly 2 includes a first substrate 21 and a second substrate 22 that are butt-jointed with each other. A containing space 23 for containing the wafer 6 is formed between the first substrate 21 and the second substrate 22. The first substrate 21 and the second substrate 22 can be used to assist in heating the wafer 6.

[0059] Among them, the first substrate 21 and the second substrate 22 are used to assist in heating the wafer 6, which means that the first substrate 21 and the second substrate 22 absorb the heat of the heating component 3 and transfer it to the wafer 6. The first substrate 21 and the second substrate 22 are arranged relatively to each other and cover the wafer 6, so that the front and back sides of the wafer 6 are heated more evenly. Compared with the single-sided heating method of the existing heat treatment equipment for the wafer, due to the poor thermal radiation absorption performance of materials such as silicon carbide and sapphire, the single-sided heating method causes its heating speed to be slow, and it is impossible to achieve a rapid heat treatment process. By adopting the technical solution of the above-mentioned embodiment of the present application, the first substrate 21 and the second substrate 22 can evenly heat the front and back sides of the wafer 6, so that the accommodating space 23 forms a relatively closed high-temperature environment, which is conducive to its rapid heating and can achieve a rapid heat treatment process.

[0060] Furthermore, the first substrate 21 and the second substrate 22 are made of heat-conducting material.

[0061] Optionally, the first substrate 21 and the second substrate 22 of the present embodiment can be made of non-transparent materials that can assist in heat conduction, and can absorb the heat energy of the heating component 3, and conduct heat to the wafer 6 in the accommodating space 23, that is, conduct heat to the front and back sides of the wafer 6 at the same time, ensuring the uniformity of heating on the front and back sides of the wafer 6, which is conducive to its rapid temperature rise. Further, the thermal conductive material is graphite. Graphite material has the advantage of high temperature resistance, and as a non-transparent material, it has a good auxiliary heat conduction effect.

[0062] In some embodiments, the heating assembly 3 includes a plurality of heaters 30 respectively installed on the first chamber cover 11 and the second chamber cover 12. The heaters 30 of the first chamber cover 11 are arranged along the first direction, and the heaters 30 of the second chamber cover 12 are arranged along the second direction. The first direction and the second direction are in a spatial vertical relationship. When the heat treatment chamber is in a closed state, the heaters 30 on the first chamber cover 11 and the second chamber cover 12 are both located in the process chamber 14, and are arranged relatively up and down.

[0063] In the embodiment of the present application, the heater 30 is arranged in the effective heating area of ​​the process chamber 14, providing the main heat source for heating the workpiece to be processed. The first direction and the second direction are in a spatially vertical relationship. Specifically, the first direction can be the lateral direction of the shell assembly 1, and the second direction can be the longitudinal direction of the shell assembly 1. The heater 30 of the first chamber cover 11 can form a heating source vertically staggered in space with the heater 30 of the second chamber cover 12, forming a grid shape, and the thermal field is more uniform, so as to improve the uniformity of heating the heating element and improve the temperature uniformity of the equipment.

[0064] Furthermore, the heater 30 includes a sleeve 31 and a heating element 32 . The sleeve 31 is sleeved on the outer circumference of the heating element 32 , so that the heating element 32 is located in the inner cavity 35 of the sleeve 31 .

[0065] Exemplarily, the sleeve 31 can be made of a quartz tube, and the heating element 32 can be made of a halogen lamp tube. The halogen lamp tube provides a heating source. The halogen lamp tube is placed in the quartz tube. The quartz tube has a high transmittance, which allows more radiant heat energy from the halogen lamp tube to pass through and irradiate the containing component 2 to heat the wafer, and the two ends of the quartz tube can be sealed by O-rings to isolate the atmospheric environment inside the quartz tube from the vacuum environment outside the quartz tube, that is, the process chamber 14. In addition, when the heat treatment chamber is in a closed state for heat treatment, the heating element 32 provided in this embodiment is arranged at the upper and lower ends of the process chamber 14, and is closer to the containing component 2 placed on the support column 121 and carrying the wafer 6, forming a grid-shaped heating source arranged vertically in space, with more uniform illumination, which can effectively increase the wafer heating rate, and can quickly and stably increase the temperature of the process chamber 14, thereby increasing the operating temperature of the equipment.

[0066] Optionally, the first cavity cover 11 and the second cavity cover 12 are equipped with a plurality of first temperature sensors 33 for detecting the temperature of the cavity wall, and the middle cavity body 13 is equipped with a second temperature sensor 34 for detecting the temperature of the cavity wall. The temperature of the cavity wall is monitored in real time by a plurality of first temperature sensors 33 and second temperature sensors 34, so as to avoid the cavity wall temperature being too high and softening or even melting the cavity wall material, and meet the strict temperature requirements of the rapid thermal processing process.

[0067] In some embodiments, the first cooling assembly 4 includes a cooling water channel 40 , which is disposed in the housing assembly 1 and surrounds the process chamber 14 .

[0068] Specifically, the first cooling assembly 4 further includes a water inlet pipe and a water outlet pipe installed on the shell assembly 1 and connected to the cooling water channel 40; the cooling water channel 40 includes a first cooling water channel 401 arranged on the first cavity cover 11 and / or the second cavity cover 12, and a second cooling water channel 411 arranged in the middle cavity 13; the first cooling water channel 401 is arranged vertically and horizontally, and the second cooling water channel 411 is arranged in a square shape. Exemplarily, the first cooling assembly 4 can use cooling water as the cooling medium.

[0069] Furthermore, the first cooling water channel 401 disposed in the first cavity cover 11 has the same structure as the first cooling water channel 401 disposed in the second cavity cover 12, but the two first cooling water channels 401 are arranged in a spatial vertical relationship. For example, if the first cooling water channel 401 disposed in the first cavity cover 11 is as follows: Figure 8 and Fig. 9 In the direction shown, the first cooling water channel 401 arranged on the second cavity cover 12 is rotated 90° clockwise or counterclockwise horizontally, so that the two first cooling components 4 including the first water inlet pipe 403, the first water outlet pipe 404 and the first cooling water channel 401 are respectively independent cooling structures, which facilitates the processing and sealing of the heat treatment chamber, ensures the heat dissipation effect of the shell component, and prevents the heat treatment chamber from being damaged due to overheating.

[0070] The following takes the first cooling assembly 4 disposed on the first cavity cover 11 as an example. Figure 8 , Fig. 9 and Fig.10 The first cooling assembly 4 includes first cooling water channels 401 arranged in a vertical and horizontal manner and disposed on the first cavity cover 11 , and a first water inlet pipe 403 and a first water outlet pipe 404 installed on the first cavity cover 11 and connected to the first cooling water channels 401 .

[0071] In this embodiment, the first cooling water channel 401 is cross-linked in the first chamber cover 11 to form a plurality of branch channels 402, which can increase the cooling area. The cooling water is injected into the first cooling water channel 401 through the first water inlet pipe 403 connected to the first cooling water channel 401. The cooling water flows through the plurality of branch channels 402 in the first cooling water channel 401, and then flows out through the first water outlet pipe 404 connected to the first cooling water channel 401, which can quickly dissipate heat, reduce the temperature of the first chamber cover 11, the second chamber cover 12, and the heater 30, ensure the safety of the equipment, extend the service life of the equipment, and improve the process temperature stability of the process chamber 14. In addition, the first cooling water channel 401 of this structure cools more evenly, and can also make the equipment structure more compact, which is convenient for arranging the remaining structures.

[0072] For further information, please refer to Fig.11The second cooling water channel 411 in the middle cavity 13 is arranged in two layers, and the water flow directions of the second cooling water channels 411 in the upper and lower layers are opposite, which can make the heat exchange more uniform, improve the heat dissipation and cooling effect on the cavity wall of the middle cavity 13, and further improve the process temperature stability of the process cavity 14. The middle cavity 13 is provided with a second water inlet pipe 412 and a second water outlet pipe 413 connected to the second cooling water channel 411.

[0073] In this embodiment, the second cooling water channel 411 is arranged around the middle cavity 13, and is two water channels in the upper and lower layers, and each second cooling water channel 411 is arranged in a U-shaped shape. Cooling water is injected into the second cooling water channel 411 through a second water inlet pipe 412 connected to the second cooling water channel 411. The cooling water flows in a circular shape in the second cooling water channel 411, and then is discharged from the second water outlet pipe 413 connected to the second cooling water channel 411. In this process, heat can be dissipated quickly, the temperature of the cavity wall of the middle cavity 13 can be reduced, and the process temperature stability of the process cavity 14 can be further improved, and the first cooling water channel 401 can be assisted to cool the equipment, thereby further improving the cooling rate.

[0074] Preferably, since the first cooling water channel 401 and the second cooling water channel 411 are both deep hole structures and are arranged in the first cavity cover 11, the second cavity cover 12 or the middle cavity 13, the ends of the first cooling water channel 401 and the second cooling water channel 411 are through structures and can be formed by drilling, which is convenient to process and can also avoid the problem of weld leakage caused by the welded structure. Plugs 43 are installed at the ends of the first cooling water channel 401 and the second cooling water channel 411 to seal the cooling water inside the water channel, which is convenient for maintenance and replacement.

[0075] In some embodiments, the second cooling assembly 5 disposed on the first cavity cover 11 has the same structure as the second cooling assembly 5 disposed on the second cavity cover 12, and the two second cooling assemblies 5 are arranged in a spatial vertical relationship, that is, if the second cooling assembly 5 disposed on the first cavity cover 11 is as follows Figure 1 and Figure 4 As shown in the direction, the second cooling assembly 5 arranged on the second chamber cover 12 is rotated 90° clockwise or counterclockwise horizontally. The two second cooling assemblies 5 are also independent structures to facilitate the processing and sealing of the heat treatment chamber. The second cooling assembly 5 is mainly used to cool the heating element 32 in the heater 30 to prevent it from overheating and burning.

[0076] The following takes the second cooling assembly 5 disposed on the first cavity cover 11 as an example. Figure 1 , Figure 4 , Figure 5 , Fig. 9 and Fig.10Specifically, the second cooling assembly 5 includes a cooling air duct 53, an air inlet 51 and an air outlet 52, and a portion of the cooling air duct 53 is located in the heater 30. The cooling air duct 53 includes a first air cavity 531 and a second air cavity 532. The first air cavity 531 is located at one end of the heater 30 and is close to the air inlet 51. The second air cavity 532 is located at the other end of the heater 30 and is close to the air outlet 52. Both ends of the sleeve 31 are respectively connected to the first air cavity 531 and the second air cavity 532, so that the inner cavity 35 becomes a part of the cooling air duct 53.

[0077] The air inlet 51 is disposed on the first cavity cover 11 for air intake; the air outlet 52 is disposed on the first cavity cover 11 for air discharge; and the cooling air duct 53 is disposed on the first cavity cover 11 and connects the air inlet 51 and the air outlet 52 .

[0078] In this embodiment, the heating element 32 is placed in the sleeve 31, and the sleeve 31 allows cooling gas to pass through to cool the heating element 32. Figure 4 and Figure 5 As shown in the cooling gas flow path L2, the cooling gas enters the cooling air duct 53 through the air inlet 51, and then flows out from the air outlet 52. A part of the cooling air duct 53 is located in the inner cavity 35 of the sleeve 31. In this process, the cooling gas flows through the entire sleeve 31 and surrounds the heating element 32, so that the heating element 32 can be cooled, the temperature of the heating element 32 is reduced, and the service life of the heating element 32 is extended; at the same time, the temperature of the sleeve 31 and the temperature of the sealing rings set at both ends when the sleeve 31 is installed on the first cavity cover 11 can also be reduced, thereby extending the service life of the sleeve and the sealing ring, and the cooling effect is good, the cooling rate is high, and the sleeve 31 and the heating element 32 can be quickly cooled. The sealing ring (not shown in the figure) can prevent the heat of the heating element 32 from overflowing and dissipating.

[0079] Therefore, the present application can realize rapid cooling of the sleeve 31 and the heating element 32 of the heater 30 through the second cooling assembly 5, thereby increasing the cooling rate, avoiding damage caused by overheating of the heating element 32, and greatly increasing the service life of the equipment and production safety. For example, natural wind can be selected as the cooling gas.

[0080] Furthermore, if Figure 2 and Figure 4 , Figure 5 As shown, when the first cavity cover 11 is covered with the middle cavity body 13, a first air cavity 531 connected to the air inlet 51 and a second air cavity 532 connected to the air outlet 52 are formed at both ends, and the first air cavity 531 is connected to one end of the plurality of heaters 30, and the second air cavity 532 is connected to the other end of the plurality of heaters 30 respectively.

[0081] In this embodiment, the first cavity cover 11 and the middle cavity body 13 are covered to form a relatively closed first air cavity 531 and a second air cavity 532, which are respectively located at two ends of the heater 30 and are both connected to the inner cavity 35 of the sleeve 31. Figure 4 As shown in the cooling gas flow path L2, the cooling gas enters the first air cavity 531 at one end of the heater 30 through the air inlet 51, then flows through the inner cavity 35 of the sleeve 31, enters the second air cavity 532 at the other end of the heater 30, and finally flows out from the air outlet 52.

[0082] Optionally, the air inlet 51 includes an air inlet grille 511, and the air inlet grille 511 is provided with a wind speed sensor for detecting the wind speed of the air inlet; the air outlet 52 includes an air outlet cover 521, and the air outlet cover 521 is provided with a third temperature sensor 522 for detecting the internal temperature thereof, and the air outlet cover 521 can be connected to an exhaust fan to drive the cooling gas to flow. In this embodiment, the flow rate of the cooling gas can be adjusted by the wind speed sensor and the third temperature sensor 522, thereby improving the cooling effect.

[0083] Please refer to Fig.14 and Fig.15 In some embodiments, the first cavity cover 11 is connected to a first driving mechanism 17, and the second cavity cover 12 is connected to a second driving mechanism 18. The first cavity cover 11 rotates relative to the middle cavity 13 through the first driving mechanism 17, and the second cavity cover 12 rotates relative to the middle cavity 13 through the second driving mechanism 18, and respectively opens and closes with the middle cavity 13. The first cavity cover 11 and the second cavity cover 12 can rotate around the middle cavity 13 by a certain angle under the drive of the first driving mechanism 17 and the second driving mechanism 18, respectively, to open or close the process cavity 14. Exemplarily, the first driving mechanism 17 and the second driving mechanism 18 include, but are not limited to, a linear motor, an electric push rod, or a cylinder.

[0084] In addition, the embodiment of the present application further provides a heat treatment device, which includes the above-mentioned heat treatment chamber, and also includes a frame, and the heat treatment chamber is installed on the frame. Exemplarily, the frame can be a rectangular parallelepiped, a cube, a prism, etc.

[0085] In summary, the heat treatment chamber and heat treatment equipment provided by the present application have high temperature uniformity and high airflow uniformity, which can avoid equipment damage caused by overheating of the cavity wall and overheating of the lamp tube, increase the service life of the equipment and production safety, and can simultaneously meet the strict requirements of the rapid heat treatment process.

[0086] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A heat treatment chamber, characterized in that: include: A housing assembly (1) is provided with a process chamber (14); A heating assembly (3) comprising a plurality of heaters (30) located on one side of the process chamber (14) and arranged along a first direction, and a plurality of heaters (30) located on the other side of the process chamber (14) and arranged along a second direction, the first direction and the second direction being in a spatially vertical relationship; A first cooling component (4) comprising a cooling water channel (40), wherein the cooling water channel (40) is arranged on the shell component (1) and surrounds the process chamber (14); A second cooling assembly (5) comprising a cooling air duct (53), a portion of the cooling air duct (53) being located on the heater (30); The housing assembly (1) comprises a middle cavity (13), and a first cavity cover (11) and a second cavity cover (12) respectively connected to the middle cavity (13); the first cavity cover (11), the middle cavity (13) and the second cavity cover (12) enclose the process cavity (14); The heater (30) comprises a sleeve (31) and a heating element (32), wherein the sleeve (31) is sleeved on the outer circumference of the heating element (32), so that the heating element (32) is located in the inner cavity (35) of the sleeve (31); The second cooling component (5) is arranged on the first cavity cover (11) and / or the second cavity cover (12); the second cooling component (5) also includes an air inlet (51) and an air outlet (52); the cooling air duct (53) includes a first air cavity (531) and a second air cavity (532), the first air cavity (531) is located at one end of the heater (30) and is close to the air inlet (51), the second air cavity (532) is located at the other end of the heater (30) and is close to the air outlet (52), and the two ends of the sleeve (31) are respectively connected to the first air cavity (531) and the second air cavity (532), so that the inner cavity (35) becomes a part of the cooling air duct (53).

2. A heat treatment chamber according to claim 1, characterized in that: The second cavity cover (12) is provided with a plurality of support columns (121).

3. A heat treatment chamber according to claim 1, characterized in that: The cavity wall on one side of the middle cavity (13) is provided with a plurality of dispersion holes (132) penetrating the cavity wall, and the cavity wall on the other side is provided with an air outlet channel (134) connected to an air outlet (135), and the side wall of the air outlet channel (134) is provided with a plurality of holes (133) along the length direction of the strip, and the air outlet channel (134) is connected to the process cavity (14) through the holes (133); the plurality of dispersion holes (132) are connected to an air intake pipe assembly (131), and the air intake pipe assembly (131) includes an air intake main pipe (1311) and a plurality of dispersion pipes (1312) connected thereto, and the plurality of dispersion pipes (1312) are connected to the process cavity (14) through the plurality of dispersion holes (132).

4. A heat treatment chamber according to claim 3, characterized in that: The middle cavity (13) is provided with an air-distributing plate (15) near the dispersion hole (132), and the air-distributing plate (15) is provided with a plurality of through holes (151).

5. A heat treatment chamber according to claim 4, characterized in that: There are at least two of the air-distributing plates (15), and when the air-distributing plates (15) are arranged adjacent to each other in sequence, the through holes (151) on the adjacent air-distributing plates (15) are arranged in a staggered manner.

6. A heat treatment chamber according to claim 4, characterized in that: The numbers of the dispersion tube (1312), the dispersion holes (132), and the through holes (151) on the gas uniforming plate (15) increase in sequence.

7. A heat treatment chamber according to claim 1, characterized in that: The first cooling assembly (4) further comprises a water inlet pipe and a water outlet pipe mounted on the shell assembly (1) and connected to the cooling water channel (40); the cooling water channel (40) comprises a first cooling water channel (401) arranged on the first cavity cover (11) and / or the second cavity cover (12), and a second cooling water channel (411) arranged on the middle cavity (13); the first cooling water channel (401) is arranged in a vertical and horizontal manner, and the second cooling water channel (411) is arranged in a square shape.

8. A heat treatment chamber according to claim 1, characterized in that: The air inlet portion (51) comprises an air inlet grille (511), and the air inlet grille (511) is provided with a wind speed sensor for detecting the wind speed of the incoming air; the air outlet portion (52) comprises an air outlet cover (521), and the air outlet cover (521) is provided with a third temperature sensor (522).

9. A heat treatment chamber according to claim 1, characterized in that: The first cavity cover (11), the second cavity cover (12) and the middle cavity body (13) are all equipped with sensors for detecting the temperature of the cavity walls.

10. A heat treatment chamber according to claim 1, characterized in that: The first cavity cover (11) is connected to a first driving mechanism (17), and the second cavity cover (12) is connected to a second driving mechanism (18); the first cavity cover (11) rotates relative to the middle cavity body (13) through the first driving mechanism (17), and the second cavity cover (12) rotates relative to the middle cavity body (13) through the second driving mechanism (18), and respectively opens and closes with the middle cavity body (13).

11. A heat treatment device, characterized in that: The heat treatment chamber comprises the heat treatment chamber according to any one of claims 1 to 10, further comprising a frame, and the heat treatment chamber is mounted on the frame.

Citation Information

Patent Citations

  • Heat treatment module, process treatment apparatus, and semiconductor device

    CN118431120A