Water-soluble diamond grinding paste for high-hardness materials as well as preparation method and application of water-soluble diamond grinding paste

Abstract

The invention discloses a water-soluble diamond grinding paste for a high-hardness material as well as a preparation method and application of the water-soluble diamond grinding paste. The water-soluble diamond grinding paste for the high-hardness material comprises the following components in parts by mass: 10-80 parts of stearic acid; 1 to 20 parts of vinyl ether; 1 to 10 parts of vaseline; 0.1 to 10 parts of wax; and 2-200 parts of artificial diamond micro powder. The preparation method of the water-soluble diamond grinding paste for the high-hardness material comprises the following steps: putting 10-80 parts of stearic acid, 1-20 parts of vinyl ether, 1-10 parts of vaseline, 0.1-10 parts of wax and 2-200 parts of artificial diamond micro powder into a heating device, and adding anhydrous sodium acetate and triethylamine as catalysts; the heating device is placed in an autoclave to be pressurized and heated, the heated abrasive paste is obtained, the heating temperature ranges from 100 DEG C to 150 DEG C, the pressure ranges from 1 MPa to 200 MPa, and the heating time ranges from 2 h to 4 h; and cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

Description

Technical Field

[0001] The invention relates to the technical field of material processing, and in particular to a water-soluble diamond grinding paste for high-hardness materials and a preparation method and application thereof. Background Art

[0002] Diamond grinding paste is a soft abrasive made of diamond micro-powder abrasive and paste binder, also known as loose abrasive. It is used to grind hard and brittle materials to obtain high surface finish. The characteristic of grinding is that the abrasive keeps rolling during the grinding process, producing two effects of extrusion and cutting, making the convex and concave surface gradually flat and smooth. The binder of grinding paste is divided into oily and water-soluble. For example, in the PCB circuit board industry, during the metallographic process, the sample is ground and a certain fineness of grinding paste (0.3um) is added to make the cross section of the sample for observation after inlaying clearer under the microscope and meet the test standard.

[0003] Most of the diamond grinding pastes in the prior art are used for grinding and polishing tungsten steel molds, optical molds, injection molds, etc., but are difficult to be used for high-hardness materials, or the grinding effect of high-hardness materials is very poor and the grinding efficiency is low.

[0004] The above contents are only used to assist in understanding the technical solution of the present invention and do not constitute an admission that the above contents are prior art. Summary of the invention

[0005] The main purpose of the present invention is to provide a water-soluble diamond grinding paste for high hardness materials and its preparation method and application, aiming to solve the problem that the diamond grinding paste in the prior art is difficult to use for high hardness materials, or the grinding effect for high hardness materials is very poor and the grinding efficiency is low.

[0006] In order to achieve the above object, the present invention provides a water-soluble diamond grinding paste for high hardness materials, wherein the water-soluble diamond grinding paste for high hardness materials comprises, in parts by mass:

[0007] Stearic acid: 10-80 parts;

[0008] Vinyl ether: 1-20 parts;

[0009] Vaseline: 1-10 parts;

[0010] Wax: 0.1-10 parts;

[0011] Artificial diamond powder: 2-200 parts.

[0012] Preferably, in the water-soluble diamond grinding paste for high-hardness materials, the water-soluble diamond grinding paste is prepared using anhydrous sodium acetate and triethylamine as catalysts.

[0013] Preferably, in the water-soluble diamond grinding paste for high-hardness materials, the particle size of the artificial diamond micropowder is 0.05-60 μm.

[0014] In order to achieve the above object, the present invention also provides a method for preparing a water-soluble diamond grinding paste for high hardness materials, the preparation method comprising:

[0015] 10-80 parts of stearic acid, 1-20 parts of vinyl ether, 1-10 parts of vaseline, 0.1-10 parts of wax, and 2-200 parts of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0016] The heating device is placed in an autoclave for pressurized heating to obtain a heated grinding paste, wherein the heating temperature is 100-150° C., the pressure is 1-200 MPa, and the heating time is 2-4 hours;

[0017] The heated grinding paste is cooled to room temperature to obtain the water-soluble diamond grinding paste.

[0018] Preferably, in the method for preparing the water-soluble diamond abrasive paste for high-hardness materials, after the step of cooling the heated abrasive paste to room temperature to obtain the water-soluble diamond abrasive paste, the method further comprises:

[0019] The obtained water-soluble diamond grinding paste is color-adjusted and filled.

[0020] Preferably, in the method for preparing the water-soluble diamond abrasive paste for high-hardness materials, the coloring and filling of the obtained water-soluble diamond abrasive paste comprises:

[0021] Adding 1-50 parts of carbon black and 5-100 parts of purple powder into the water-soluble diamond grinding paste for coloring to obtain a colored water-soluble diamond grinding paste;

[0022] The water-soluble diamond grinding paste is heated and evenly filled into the container to be filled in batches.

[0023] Preferably, in the method for preparing the water-soluble diamond grinding paste for high-hardness materials, the step of cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste comprises:

[0024] The heated grinding paste is cooled to room temperature for 2-4 hours to obtain the water-soluble diamond grinding paste.

[0025] Preferably, in the method for preparing the water-soluble diamond grinding paste for high-hardness materials, the particle size of the artificial diamond micropowder is 0.05-60 μm.

[0026] In order to achieve the above object, the present invention also provides a water-soluble diamond grinding paste for high hardness materials. The water-soluble diamond grinding paste for high hardness materials is prepared by the above preparation method.

[0027] In order to achieve the above-mentioned purpose, the present invention also provides an application of the above-mentioned water-soluble diamond abrasive paste for high hardness materials, wherein the water-soluble diamond abrasive paste for high hardness materials is applied to the grinding and polishing of high hardness materials, and the hardness of the high hardness materials is greater than Mohs hardness 9.5.

[0028] The present invention has at least the following beneficial effects:

[0029] The water-soluble diamond grinding paste for high-hardness materials provided by the present invention comprises 10-80 parts of stearic acid and 2-200 parts of artificial diamond micropowder. The water-soluble diamond grinding paste obtained in this way can be applied to the grinding and polishing of high-hardness materials, is easy to clean, has excellent lubrication and cooling effects, and can effectively improve the grinding efficiency.

[0030] Furthermore, the water-soluble diamond polishing paste provided by the present invention is used to polish high-hardness tungsten carbide material. The polishing result shows that the surface roughness Ra of the tungsten carbide material is 0.055 μm, which is significantly lower than the roughness before polishing. The material surface is clean, has few scratches, and is easy to clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A flow chart of a method for preparing a water-soluble diamond grinding paste for high-hardness materials provided by the present invention;

[0032] Figure 2 The status of the old carrier that was removed for abnormality;

[0033] Figure 3 for Figure 2 The state of the new carrier after the middle carrier is polished for 1 minute with the water-soluble diamond polishing paste provided by the present invention;

[0034] Figure 4 for Figure 2 and Figure 3 Comparison of test values ​​of heating current of new and old platforms;

[0035] Figure 5 for Figure 2 and Figure 3 Comparison of test values ​​of power factor between the new and old platforms;

[0036] Figure 6 for Figure 2 and Figure 3 Comparison of test values ​​of series resistance between the new and old carriers.

[0037] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0038] In the embodiments of the present invention, the term "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent three situations: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0040] In the embodiments of the present invention, the term "plurality" refers to two or more than two, and other quantifiers are similar.

[0041] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, it can be understood by those skilled in the art that in the embodiments of the present invention, many technical details are proposed in order to enable the reader to better understand the present invention. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present invention can also be implemented. The division of the following embodiments is for the convenience of description and should not constitute any limitation on the specific implementation of the present invention. The various embodiments can be combined and referenced with each other under the premise of no contradiction.

[0042] The present invention provides a water-soluble diamond grinding paste for high-hardness materials, and the water-soluble diamond grinding paste for high-hardness materials comprises, in parts by mass:

[0043] Stearic acid: 10-80 parts;

[0044] Vinyl ether: 1-20 parts;

[0045] Vaseline: 1-10 parts;

[0046] Wax: 0.1-10 parts;

[0047] Artificial diamond powder: 2-200 parts.

[0048] In other embodiments, the mass fraction of stearic acid can also be 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, or 70 parts; the mass fraction of vinyl ether can also be 5 parts, 10 parts, or 15 parts; the mass fraction of vaseline can also be 2 parts, 4 parts, 6 parts, or 8 parts; the mass fraction of wax can also be 2 parts, 4 parts, 6 parts, or 8 parts; the mass fraction of artificial diamond micropowder can also be 20 parts, 50 parts, 100 parts, or 150 parts.

[0049] Wherein, in the preparation of the water-soluble diamond grinding paste for high-hardness materials, the water-soluble diamond grinding paste is prepared by using anhydrous sodium acetate and triethylamine as catalysts.

[0050] The particle size of the artificial diamond powder is 0.05-60 μm. In other embodiments, the particle size of the artificial diamond powder can also be 0.1 μm, 1 μm, 10 μm, or 30 μm.

[0051] The present invention also provides a method for preparing a water-soluble diamond grinding paste for high hardness materials, such as Figure 1 As shown, the preparation method comprises:

[0052] Step S100, 10-80 parts of stearic acid, 1-20 parts of vinyl ether, 1-10 parts of vaseline, 0.1-10 parts of wax, and 2-200 parts of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0053] The particle size of the artificial diamond powder is 0.05-60 μm. In other embodiments, the particle size of the artificial diamond powder can also be 0.1 μm, 1 μm, 10 μm, or 30 μm.

[0054] In other embodiments, the mass fraction of stearic acid can also be 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, or 70 parts; the mass fraction of vinyl ether can also be 5 parts, 10 parts, or 15 parts; the mass fraction of vaseline can also be 2 parts, 4 parts, 6 parts, or 8 parts; the mass fraction of wax can also be 2 parts, 4 parts, 6 parts, or 8 parts; the mass fraction of artificial diamond micropowder can also be 20 parts, 50 parts, 100 parts, or 150 parts.

[0055] Step S200, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 100-150° C., the pressure is 1-200 MPa, and the heating time is 2-4 hours;

[0056] Step S300, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0057] In the specific implementation, the heated grinding paste is cooled to room temperature for 2-4 hours to obtain the water-soluble diamond grinding paste.

[0058] Step S300 also includes step S400.

[0059] Step S400, coloring and filling the obtained water-soluble diamond grinding paste.

[0060] Specifically, step S400 includes step S410 and step S420.

[0061] Step S410, adding 1-50 parts of carbon black and 5-100 parts of purple powder into the water-soluble diamond grinding paste for color adjustment to obtain a colored water-soluble diamond grinding paste;

[0062] Step S420, heating the water-soluble diamond grinding paste and evenly filling it into the container to be filled in batches.

[0063] In a specific implementation, the water-soluble diamond grinding paste obtained by heating can be evenly filled into a disposable syringe in batches.

[0064] The present invention also provides a water-soluble diamond grinding paste for high-hardness materials. The water-soluble diamond grinding paste for high-hardness materials is prepared by the above-mentioned preparation method.

[0065] The present invention also provides an application of the above-mentioned water-soluble diamond abrasive paste for high-hardness materials, wherein the water-soluble diamond abrasive paste for high-hardness materials is applied to grinding and polishing high-hardness materials, wherein the hardness of the high-hardness materials is greater than Mohs hardness 9.5.

[0066] Among them, high hardness materials include super hard ceramics, tungsten carbide, silicon carbide, super hard crystals, diamond and other high hardness materials.

[0067] The water-soluble diamond grinding paste for high-hardness materials provided by the present invention comprises 10-80 parts of stearic acid and 2-200 parts of artificial diamond micropowder. The water-soluble diamond grinding paste obtained in this way can be applied to the grinding and polishing of high-hardness materials, is easy to clean, has excellent lubrication and cooling effects, and can effectively improve the grinding efficiency.

[0068] Furthermore, the water-soluble diamond polishing paste provided by the present invention is used to polish high-hardness tungsten carbide material. The polishing result shows that the surface roughness Ra of the tungsten carbide material is 0.055 μm, which is significantly lower than the roughness before polishing. The material surface is clean, has few scratches, and is easy to clean.

[0069] Example Water-soluble diamond grinding paste for high hardness materials

[0070] The water-soluble diamond grinding paste for high-hardness materials comprises, by weight: 10-80 parts of stearic acid; 1-20 parts of vinyl ether; 1-10 parts of vaseline; 0.1-10 parts of wax; and 2-200 parts of artificial diamond micropowder.

[0071] Example Preparation method of water-soluble diamond grinding paste for high hardness materials

[0072] S1, placing 10-80 parts of stearic acid, 1-20 parts of vinyl ether, 1-10 parts of vaseline, 0.1-10 parts of wax, and 2-200 parts of artificial diamond powder in a heating device, and adding anhydrous sodium acetate and triethylamine as catalysts;

[0073] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 100-150° C., the pressure is 1-200 MPa, and the heating time is 2-4 hours;

[0074] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0075] Example 1

[0076] S1, 30 parts of stearic acid, 10 parts of vinyl ether, 5 parts of vaseline, 7 parts of wax, and 100 parts of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0077] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 150° C., the pressure is 200 MPa, and the heating time is 4 hours;

[0078] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0079] Example 2

[0080] S1, 40 parts of stearic acid, 10 parts of vinyl ether, 10 parts of vaseline, 10 parts of wax, and 150 parts of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0081] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 150° C., the pressure is 200 MPa, and the heating time is 4 hours;

[0082] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0083] Example 3

[0084] S1, 50g of stearic acid, 10g of vinyl ether, 10 parts of vaseline, 10 parts of wax, and 200 parts of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0085] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 150° C., the pressure is 200 MPa, and the heating time is 4 hours;

[0086] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0087] Example 4

[0088] S1, 60g of stearic acid, 10g of vinyl ether, 10g of vaseline, 10g of wax, and 200g of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0089] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 150° C., the pressure is 200 MPa, and the heating time is 4 hours;

[0090] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0091] Example 5

[0092] S1, 70g of stearic acid, 10g of vinyl ether, 10g of vaseline, 10g of wax, and 200g of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0093] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 150° C., the pressure is 200 MPa, and the heating time is 4 hours;

[0094] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0095] Comparative Example 1

[0096] S1, 5g of stearic acid, 20g of vinyl ether, 10g of vaseline, 10g of wax, and 300g of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0097] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 150° C., the pressure is 200 MPa, and the heating time is 4 hours;

[0098] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0099] Comparative Example 2

[0100] S1, 90g of stearic acid, 20g of vinyl ether, 10g of vaseline, 10g of wax, and 200g of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts;

[0101] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 150° C., the pressure is 200 MPa, and the heating time is 4 hours;

[0102] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0103] Comparative Example 3

[0104] S1, take 90g of stearic acid, 20g of vinyl ether, 10g of vaseline, 10g of wax, and 200g of artificial diamond powder and place them in a heating device;

[0105] S2, placing the heating device in an autoclave and heating under pressure to obtain a heated abrasive paste, wherein the heating temperature is 150° C., the pressure is 200 MPa, and the heating time is 4 hours;

[0106] S3, cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste.

[0107] Comparative Example 4

[0108] 10g of diamond micropowder, 15g of rapeseed oil and 25g of nonylphenol polyoxyethylene ether were mixed uniformly under ultrasonic stirring to obtain diamond slurry. The ultrasonic frequency was 20kHz, the stirring rate was 800rad / min, and the mixing time was 30min. The particle size of the diamond micropowder was 1μm.

[0109] 10g of alkyl alcohol amide polyoxyethylene ether and 40g of lithium-based lubricant were mixed uniformly, and the stirring rate during mixing was 600rad / min, and the mixing time was 15min. Wherein, the lithium-based lubricant was prepared from 6g of animal and plant fats and oils, 12g of lithium hydroxide, 16g of fatty acid and 6g of base oil. The mixture of the above-mentioned surfactant and lithium-based lubricant was added to the above-mentioned diamond slurry and mixed uniformly to obtain a diamond polishing paste, and the stirring rate during mixing was 600rad / min, and the mixing time was 15min.

[0110] Table 1

[0111]

[0112] In order to verify the beneficial effects of the present invention, the performance of the water-soluble diamond grinding paste provided in the embodiment and the comparative example was tested, and the water-soluble diamond grinding paste provided in the embodiment and the comparative example was used to grind the superhard ceramics. The scratches, roughness, and removal rate of the ceramic surface of the superhard ceramics after grinding were statistically analyzed. The water-soluble diamond grinding paste used in the embodiment of the present invention was used to grind the high-hardness tungsten carbide material. The grinding result showed that the surface roughness Ra of the tungsten carbide material was 0.055 μm, which was significantly reduced compared to the roughness before grinding. The material surface was clean, had few scratches, and was easy to clean. However, the grinding paste provided in the comparative example did not significantly reduce the roughness of the high-hardness tungsten carbide material, and there were many scratches on the material surface.

[0113] Comparison Figure 2 and Figure 3 It can be clearly seen that after grinding with the water-soluble diamond grinding paste provided by the present invention for 1 minute, there is a significant improvement effect and the pores are not blocked.

[0114] Figures 4 to 6 It can be seen that the test mean value of the heating current (Ith) of the polished carrier is: 18.18mA, the test mean value of the normal test carrier is: 18.66mA, the difference between the polished carrier and the normal test carrier is: 0.48mA, and the fluctuation percentage is: 2.75%, which is within the process control range; the test mean value of the power factor (Pf) of the polished carrier is: 6.553mW, the test mean value of the normal test carrier is: 6.523mW, the difference is: 0.03mW, the difference percentage is: 0.45%, and the fluctuation is within the process control range; the test mean value of the series resistance (Rs) of the polished carrier is: 6.805Ω, the test mean value of the normal test carrier is: 6.886Ω, the difference is 0.081Ω, and the difference percentage is 8.1%. The contact between the chip and the carrier improves after polishing, and Rs improves by 8.1%. After polishing with the water-soluble diamond abrasive paste provided by the present invention, the roughness of the carrier surface becomes smaller and the contact with the chip is more complete, the series resistance (Rs) is significantly improved, and the other parameters also fluctuate within the process control range; further, the use of the water-soluble diamond abrasive paste polishing product provided by the present invention can extend the service life of the carrier.

[0115] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, ordinary technicians in this field can make other different forms of changes or modifications without creative work, which should fall within the scope of protection of the present invention.

Claims

1. A water-soluble diamond grinding paste for high hardness materials, characterized in that: The water-soluble diamond grinding paste for high hardness materials comprises, by weight: Stearic acid: 10-80 parts; Vinyl ether: 1-20 parts; Vaseline: 1-10 parts; Wax: 0.1-10 parts; Artificial diamond powder: 2-200 parts.

2. The water-soluble diamond grinding paste for high hardness materials according to claim 1, characterized in that: The water-soluble diamond grinding paste is prepared by using anhydrous sodium acetate and triethylamine as catalysts.

3. The water-soluble diamond grinding paste for high hardness materials according to claim 1, characterized in that: The particle size of the artificial diamond powder is 0.05-60 μm.

4. A method for preparing a water-soluble diamond grinding paste for high hardness materials, characterized in that: The preparation method comprises: 10-80 parts of stearic acid, 1-20 parts of vinyl ether, 1-10 parts of vaseline, 0.1-10 parts of wax, and 2-200 parts of artificial diamond powder are placed in a heating device, and anhydrous sodium acetate and triethylamine are added as catalysts; The heating device is placed in an autoclave for pressurized heating to obtain a heated grinding paste, wherein the heating temperature is 100-150° C., the pressure is 1-200 MPa, and the heating time is 2-4 hours; The heated grinding paste is cooled to room temperature to obtain the water-soluble diamond grinding paste.

5. The method for preparing a water-soluble diamond grinding paste for high hardness materials as claimed in claim 4, characterized in that: After the step of cooling the heated abrasive paste to room temperature to obtain the water-soluble diamond abrasive paste, the preparation method further comprises: The obtained water-soluble diamond grinding paste is color-adjusted and filled.

6. The method for preparing a water-soluble diamond grinding paste for high hardness materials according to claim 5, characterized in that: The step of coloring and filling the obtained water-soluble diamond grinding paste comprises: Adding 1-50 parts of carbon black and 5-100 parts of purple powder into the water-soluble diamond grinding paste for coloring to obtain a colored water-soluble diamond grinding paste; The water-soluble diamond grinding paste is heated and evenly filled into the container to be filled in batches.

7. The method for preparing a water-soluble diamond grinding paste for high hardness materials as claimed in claim 4, characterized in that: The step of cooling the heated grinding paste to room temperature to obtain the water-soluble diamond grinding paste comprises: The heated grinding paste is cooled to room temperature for 2-4 hours to obtain the water-soluble diamond grinding paste.

8. The method for preparing a water-soluble diamond grinding paste for high hardness materials as claimed in claim 4, characterized in that: The particle size of the artificial diamond powder is 0.05-60 μm.

9. A water-soluble diamond grinding paste for high hardness materials, characterized in that: The water-soluble diamond grinding paste for high-hardness materials is prepared by the preparation method described in any one of claims 4 to 8.

10. An application of the water-soluble diamond grinding paste for high hardness materials according to any one of claims 1 to 3 and 9, characterized in that: The water-soluble diamond grinding paste for high-hardness materials is used for grinding and polishing high-hardness materials, and the hardness of the high-hardness materials is greater than Mohs hardness 9.5.

Images