Mass wafer detection equipment and method

Abstract

The invention discloses wafer mass detection equipment and method.The wafer mass detection equipment comprises an equipment front-end module, a detection platform, a photoluminescence detection module and a control module, and a plurality of wafer carrier boxes of different sizes are arranged in a stepped mode in the equipment front-end module and used for containing wafers of different sizes; the test positions of different sizes in the detection platform are used for placing wafers on the wafer carrier box, the first detection module is used for detecting the placement positions of the wafers at the test positions, and the control module controls the equipment front-end module to place the wafers at the corresponding test positions according to the sizes of the wafers by obtaining the wafers of different sizes in the wafer carrier box. According to the invention, the detection platform is provided with the photoluminescence detection module, the placement position of the wafer at the test position is obtained, the wafer on the detection platform is controlled to focus with the photoluminescence detection module, and the photoluminescence detection module is controlled to detect the wafer based on the preset imaging detection parameters of the wafer, so that the detection requirements of LED wafers of different specifications are met, and the LED wafer detection efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, and in particular to a wafer mass detection device and method. Background Art

[0002] Wafer mass inspection is a crucial part of semiconductor manufacturing. Wafers are prone to various defects such as breakage, cracks, and scratches during the production process. In particular, defects such as pits, protrusions, and cracks are very difficult to detect. These defects can affect the function and performance of the chip and even cause the chip to fail. Therefore, it is very necessary to effectively detect and analyze wafer defects.

[0003] However, with the continuous development of LED light-emitting chip manufacturing technology, the chip size has been reduced, and microchip LED wafers such as MiniLED and Micro LED have appeared. At the same time, in order to accommodate as many microchip particles as possible on the surface of a wafer, the wafer size is also constantly increasing, and the shape is no longer limited to round. Nowadays, LED microchip wafers of various sizes have been formed. Traditional detection systems can only detect wafers of one size. For other sizes, they can only be detected by replacing the wafer box, which seriously slows down the detection efficiency. Summary of the invention

[0004] Based on this, it is necessary to provide a semiconductor wafer mass detection equipment and a detection method thereof to address the above-mentioned technical problems, so as to meet the needs of multi-size LED wafer detection, thereby improving the efficiency of LED wafer detection.

[0005] A first aspect of an embodiment of the present application provides a wafer mass detection device, the wafer mass detection device comprising a device front-end module, a detection platform, a photoluminescence detection module and a control module; The equipment front-end module has a plurality of wafer carrier boxes of different sizes arranged in a stepped manner, and the wafer carrier boxes of different sizes are used to place the wafers of different sizes; The detection platform comprises a plurality of test positions of different sizes and a first detection module, wherein the test positions of different sizes are used to place the wafer on the wafer carrier box, and the first detection module is used to detect the placement position of the wafer at the test positions; A control module is used to obtain the size of the wafer, control the front-end module of the device to place the wafer at the corresponding test position according to the size of the wafer, and obtain the placement position of the wafer at the test position, control the focus of the wafer on the detection platform and the photoluminescence detection module, and control the photoluminescence detection module to detect the wafer based on the preset imaging detection parameters of the wafer.

[0006] Optionally, the front-end module of the equipment also includes a wafer loading device, a robotic arm, a wafer alignment device, an edge-finding device and a wafer transporting device. The wafer loading device is provided with a second detection module, and the second detection module is used to detect the placement information of the wafer carrier box. The robotic arm is used to grab the wafer. The wafer alignment device is used to calibrate the wafer. The wafer alignment device is provided with a third detection module, and the third detection module is used to detect the status information of the wafer. The edge-finding device is used to find the edge of the wafer, and the wafer transporting device is used to transfer the wafer after edge-finding to the detection platform.

[0007] Optionally, the robot arm is provided with a vacuum adsorption device, and the vacuum adsorption device is used to adsorb the wafer on the wafer carrier box.

[0008] Optionally, the detection platform is provided with an adsorption module, and the adsorption module is used to adsorb the wafer on the test position.

[0009] Optionally, the photoluminescence detection module includes a light source, a monochromator, an optical lens system, a detector and an image processing unit, the light source is used to provide illumination for the surface of the wafer, the monochromator and the optical lens system are used to irradiate the light source on the surface of the wafer so that the wafer absorbs the excitation light energy emitted by the light source and emits an emission light signal, the detector is used to scan and image the surface of the wafer according to the emission light signal to obtain a wafer image, the image processing unit is used to divide the wafer image into multiple wafer areas, and use a deep learning algorithm to detect each of the wafer areas to obtain defect information of chip microunits in the multiple wafer areas, and stitch the multiple wafer areas through an image stitching algorithm to generate a wafer defect detection result.

[0010] Optionally, the wafer mass detection device further includes a display module, and the display module is used to display the detection results.

[0011] A second aspect of an embodiment of the present application provides a wafer mass detection method, the wafer mass detection method comprising: Obtaining a size of a wafer, wherein the size of the wafer is obtained based on a plurality of wafer carrier boxes of different sizes arranged in a stepped manner; Based on the size of the wafer, determining the test position information of the wafer on the detection platform, wherein the detection platform has a plurality of test positions of different sizes; According to the test position information, controlling the wafer on the detection platform to focus on a photoluminescence detection module; Based on the preset imaging detection parameters of the wafer, a photoluminescence detection module is controlled to detect the wafer.

[0012] Optionally, controlling the wafer on the detection platform to focus with a photoluminescence detection module includes: Obtaining a placement position of the wafer at the test position; Based on the placement position, the actual position information of the wafer on the detection platform is adjusted to complete the focusing of the wafer and the photoluminescence detection module.

[0013] Optionally, before obtaining the size of the wafer, the method includes: Detect whether the placement information of the wafer carrier box meets the preset position; If the preset position is met, obtaining identification information of the wafer carrier box, wherein the identification information includes a barcode or label information; According to the identification information of the wafer carrier box, identity recognition and data verification are performed on the wafer carrier box to determine whether the carrier information of the wafer carrier box meets a preset value, wherein the carrier information of the wafer carrier box includes at least one of the following: the type of the wafer carrier box, the batch of the wafer carrier box, and the number of wafers in the wafer carrier box; If the preset value is met, then monitor whether the environmental parameters of the front-end module of the equipment meet the preset requirements, wherein the environmental parameters include at least one of the following: cleanliness, humidity and temperature; If the preset requirements are met, the robot arm is controlled to grab the wafer from the wafer carrier box and determine the size of the wafer.

[0014] Optionally, after obtaining the test result, the method further comprises: Based on the preset imaging detection parameters of the wafer, controlling the photoluminescence detection module to detect the wafer includes: Presetting imaging detection parameters of the wafer, and constructing different imaging detection modes according to the imaging detection parameters; Selecting an optimal imaging detection method from different imaging detection methods according to the characteristic information of the wafer; Based on the optimal imaging detection method, a light source is used to illuminate the surface of the wafer, and a monochromator and an optical lens system are used to irradiate the light source onto the surface of the wafer, so that the wafer absorbs the excitation light energy emitted by the light source and emits an emission light signal, and a detector is used to scan and image the surface of the wafer according to the emission light signal to obtain a wafer image; Using an image processing unit to divide the wafer image into a plurality of wafer regions, and using a deep learning algorithm to detect each of the wafer regions to obtain defect information of chip micro-units in the plurality of wafer regions; According to the defect information of the chip micro-units in the multiple wafer areas, the multiple wafer areas are spliced ​​using an image splicing algorithm to generate a wafer defect detection result.

[0015] In summary, the present invention provides a wafer mass detection device and method, the wafer mass detection device includes a device front-end module, a detection platform, a photoluminescence detection module and a control module, the device front-end module has a plurality of wafer carrier boxes of different sizes arranged in a stepped manner, for placing wafers of different sizes, the detection platform includes a plurality of test positions of different sizes and a first detection module, the test positions of different sizes are used to place wafers on the wafer carrier box, the first detection module is used to detect the placement position of the wafer at the test position, the control module is used to obtain the size of the wafer, control the device front-end module to place the wafer at the corresponding test position according to the size of the wafer, and obtain the placement position of the wafer at the test position, control the wafer on the detection platform to focus on the photoluminescence detection module, and control the photoluminescence detection module to detect the wafer based on preset imaging detection parameters of the wafer. It can be seen that the present application obtains wafers of different sizes in the wafer carrier box, and then controls the photoluminescence detection module to detect the wafers on the detection platform based on the preset imaging detection parameters of the wafers, thereby meeting the detection requirements of LED wafers of different specifications and improving the efficiency of LED wafer detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0017] Figure 1 It is a structural schematic diagram of a wafer mass detection device provided by an embodiment of the present invention; Figure 2 is another structural schematic diagram of a wafer mass detection device provided by an embodiment of the present invention; Figure 3 It is a structural schematic diagram of a wafer carrier box in a wafer mass detection device provided by an embodiment of the present invention; Figure 4 It is a flow chart of a wafer mass detection method provided by one embodiment of the present invention. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0020] It should also be understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0021] As used in the present specification and the appended claims, the term "if" can be interpreted as "when" or "uponce" or "in response to a determination" depending on the context. Similarly, the phrase "if it is determined" or "if matched to [described condition or event]" can be interpreted as meaning "uponce determined" or "in response to a determination" or "uponce matched to [described condition or event]" or "in response to matching to [described condition or event]" depending on the context.

[0022] In addition, in the description of the present specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0023] References to "one embodiment" or "some embodiments" etc. described in the present specification mean that one or more embodiments of the present invention include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0024] It should be understood that the order of execution of the steps in the following embodiments does not imply a precedence of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0025] In order to illustrate the technical solution of the present invention, specific embodiments are provided below for illustration.

[0026] See also Figure 1 , Figure 1 It is a structural schematic diagram of a wafer mass detection device provided by one embodiment of the present invention. The wafer mass detection device can solve the problem that traditional detection equipment is not compatible with multi-size LED wafers, thereby meeting the detection needs of LED wafers of different specifications.

[0027] See also Figure 2 , Figure 2 It is a structural schematic diagram of another wafer mass detection device provided by an embodiment of the present invention. The wafer mass detection device at least includes a device front-end module, a detection platform, a photoluminescence detection module, and a control module, which can be directly or indirectly connected by wired or wireless communication, and the present application does not make specific limitations here.

[0028] exist Figure 2 In the test, the wafer mass detection equipment includes the equipment front-end module, the detection platform, the photoluminescence detection module and the control module; The equipment front-end module has a plurality of wafer carrier boxes of different sizes arranged in a stepped manner, and the wafer carrier boxes of different sizes are used to place the wafers of different sizes; The detection platform comprises a plurality of test positions of different sizes and a first detection module, wherein the test positions of different sizes are used to place the wafer on the wafer carrier box, and the first detection module is used to detect the placement position of the wafer at the test positions; The control module is used to obtain the size of the wafer, control the front-end module of the equipment to place the wafer at the corresponding test position according to the size of the wafer, and obtain the placement position of the wafer at the test position, control the wafer on the detection platform to focus with the photoluminescence detection module, and control the photoluminescence detection module to detect the wafer based on the preset imaging detection parameters of the wafer.

[0029] In this embodiment, the equipment front end module (EFEM) belongs to semiconductor production equipment. After the system is started, it is initialized and set to check whether the status and functions of all components are normal. If normal, it enters the standby state. Since the equipment front end module has a plurality of wafer carrier boxes of different sizes arranged in a stepped manner, and the wafer carrier boxes of different sizes are used to place wafers of different sizes, the equipment front end module can obtain wafers of multiple different sizes and transfer the wafers of multiple different sizes to the detection platform, wherein the wafer carrier boxes of different sizes are arranged in a stepped manner, such as Figure 3As shown, the vertical space can be fully utilized so that more wafer carrier boxes can be accommodated in the same horizontal area, and thus a variety of LED wafers of different sizes can be compatible, thereby improving the overall utilization of storage and transportation space and meeting the subsequent inspection needs of LED wafers of different specifications.

[0030] Specifically, wafers of different sizes are manually placed in wafer carrier boxes of different sizes arranged in a stepped manner, that is, in the motor module of the wafer carrier box, the front-end module of the equipment is started, the motor module of the wafer carrier box is started at the same time, the wafer loading device is enabled, and the motor module of the wafer carrier box is transported to the material picking position. When the motor module of the wafer carrier box is in place, a sensor is used to give a signal to control the horizontal axis module to run automatically, first move to the storage position, and then the up and down movement module starts to run, and the Mapping operation is performed to reflect whether there is overlapping, slanted, missing, etc. according to the actual situation. Among them, the Mapping operation refers to the position mapping verification of specific elements, structures or performance parameters on the wafer. And real-time feedback to the control module, if there is a stacked oblique piece, the corresponding silo will automatically return, and the position of the wafer will be adjusted manually according to the situation, and restarted. When the silo is completely normal, the wafer transport device starts to take the wafer and put it on any edge-finding device to perform wafer edge-finding positioning. Because this machine is equipped with two edge-finding devices, after the wafer transport device places a piece, it will quickly return to the silo position to take another piece and put it on the edge-finding device on the other side, and so on, and then find the edge until the edge is found. After the edge search is completed, the wafer transport device takes the material and transfers the positioned wafer to the detection platform, and the detection platform also has multiple test positions of different sizes. The test positions of different sizes are used to place the wafers of different sizes on the wafer carrier box transmitted by the front-end module of the equipment, so that the detection platform can also be compatible with a variety of different sizes of LED wafers. The size of the wafer can be used to express the size of the wafer. Specifically, for example, the wafer size can include multiple different sizes such as 12 inches, 8 inches, 6 inches, and 4 inches. In this application, the specific size of the wafer is not specifically limited. Both the wafer carrier box and the test position can be specific locations for placing wafers. There can be multiple wafer carrier boxes and test positions, and the size of the test position can match the size of the wafer. Specifically, for example, a 4-inch wafer matches a 4-inch wafer carrier box and a 4-inch test position, respectively. It should be noted that the present application does not specifically limit the specific number, size, and material of the wafer carrier box and the test position. Then, PL detection is performed by controlling the light emitting detection module. During the detection, the wafer transport device returns to the silo and continues to take materials and place them on the edge finder. When the detection is completed, the wafer transport device takes the inspected wafers on the detection tooling and puts them back into the wafer carrier box motor module, and again transfers the wafers that have completed edge finding and positioning to the detection tooling, repeats the above movement, and the detection is completed.

[0031] It should be noted that the present application does not specifically limit the specific number, size, and material of the wafer carrier box and the test positions. And the test positions of different sizes can be arranged in a preset arrangement, thereby reducing the area of ​​the detection platform and reducing the cost of the detection platform, wherein the preset arrangement can be a concentric circle arrangement (for example, when the wafer size includes 12 inches, 8 inches, 6 inches, and 4 inches, the test positions are arranged in the order of 4-inch test positions, 6-inch test positions, 8-inch test positions, and 12-inch test positions, and the area where the large-size test positions are located can include the area occupied by the small-size test positions) or other forms of arrangement, which can be set according to actual conditions, and the present application does not make any restrictions on this.

[0032] Further, the control module is mainly responsible for the operation and control of the entire device. After obtaining the wafer size sent by the front-end module of the device, the front-end module of the device is controlled according to the wafer size to place the wafer in the corresponding test position. Since the detection platform is provided with a first detection module, the first detection module can send the placement position of the detection wafer in the test position to the control module, and then control the wafer on the detection platform to focus on the photoluminescence detection module according to the placement position of the wafer in the test position, wherein the photoluminescence detection module is an optical device that works on the principle of photoluminescence (PL for short), and then the imaging detection parameters of the wafer are pre-set through the control module, and then based on the preset imaging detection parameters of the wafer, the photoluminescence detection module is controlled to detect the wafer, thereby meeting the detection requirements of LED wafers of different specifications and improving the efficiency of LED wafer detection. For example, in the case of detecting the particle size of the wafer, the control module sets the test parameters of the light source and the optical component, and then obtains the reflection effect of the wafer. It should be noted that the first detection module can be a sensor or other device, and this application does not make any limitation on this.

[0033] Specifically, when the wafer on the detection platform is not aligned with the photoluminescence detection module and is not focused, after the control module receives the placement position of the wafer at the test position, it adjusts the actual position information of the wafer on the detection platform according to the placement position of the wafer at the test position, that is, adjusts the Z-axis height, T-axis angle and XY-axis position of the wafer on the detection platform, so that the detection platform moves to a preset height and preset position, thereby ensuring that the wafer is aligned and focused with the photoluminescence detection module, so that the subsequent photoluminescence detection module can obtain high-quality detection results, thereby improving the accuracy and reliability of subsequent detection. It should be noted that the preset height and preset position can be set according to actual conditions, and this application does not make any limitation on this.

[0034] In summary, the present invention provides a wafer mass detection device and method, the wafer mass detection device includes a device front-end module, a detection platform, a photoluminescence detection module and a control module, the device front-end module has a plurality of wafer carrier boxes of different sizes arranged in a stepped manner, for placing wafers of different sizes, the detection platform includes a plurality of test positions of different sizes and a first detection module, the test positions of different sizes are used to place wafers on the wafer carrier box, the first detection module is used to detect the placement position of the wafer at the test position, the control module is used to obtain the size of the wafer, control the device front-end module to place the wafer at the corresponding test position according to the size of the wafer, and obtain the placement position of the wafer at the test position, control the wafer on the detection platform to focus on the photoluminescence detection module, and control the photoluminescence detection module to detect the wafer based on preset imaging detection parameters of the wafer. It can be seen that the present application obtains wafers of different sizes in the wafer carrier box, and then controls the photoluminescence detection module to detect the wafers on the detection platform based on the preset imaging detection parameters of the wafers, thereby meeting the detection requirements of LED wafers of different specifications and improving the efficiency of LED wafer detection.

[0035] In some embodiments, the front-end module of the equipment also includes a wafer loading device, a robotic arm, a wafer alignment device, an edge-finding device and a wafer transporting device. The wafer loading device is provided with a second detection module, and the second detection module is used to detect the placement information of the wafer carrier box. The robotic arm is used to grab the wafer. The wafer alignment device is used to calibrate the wafer. The wafer alignment device is provided with a third detection module, and the third detection module is used to detect the status information of the wafer. The edge-finding device is used to find the edge of the wafer, and the wafer transporting device is used to transfer the wafer after edge-finding to the detection platform.

[0036] Specifically, the design of the front-end module of the equipment is to ensure that the wafer remains in a highly clean state during the transmission process to meet the strict purity requirements of semiconductor manufacturing. Since the front-end module of the equipment includes a wafer loading device, a robotic arm, a wafer alignment device, an edge-finding device and a wafer transport device, when the front-end module of the equipment is started, it is initialized and set to check whether the status and functions of all components are normal. If normal, it enters the standby state and manually places wafers of different sizes in the wafer carrier box in the wafer loading device. The wafer loading device is provided with a second detection module so that the second detection module detects the placement information of the wafer carrier box and transmits the placement information of the wafer carrier box to the control module. The control module determines the placement of the wafer carrier box. The wafer carrier box is checked to see whether the placement information satisfies the preset position. If the preset position has been placed, the identification information of the wafer carrier box is obtained, wherein the identification information includes barcode or label information. The barcode of the wafer carrier box may contain the unique serial number, production date, batch number, manufacturer information, etc. of the carrier box; the label information of the wafer carrier box may include the identity information of the wafer carrier box (such as serial number, manufacturer, production date, etc.), relevant information of the wafer (such as the number of wafers, batch number, production process steps, etc.), and possible security verification information, etc., and then the wafer carrier box is identified and data verified according to the identification information of the wafer carrier box to ensure the accuracy and compliance of the wafer carrier box, thereby ensuring production efficiency and product quality.

[0037] Furthermore, after the wafer carrier box is identified and the data is verified, it is determined whether the carrier information of the wafer carrier box meets the preset value, that is, whether the type of the wafer carrier box meets the preset type, whether the batches of the wafer carrier box belong to the same batch, whether the number of wafers to be inspected meets the preset value, etc. The present application does not impose any restrictions on this. If the preset value is met, the control module controls the front-end module of the equipment to start the access control mechanism, and then monitors whether the environmental parameters of the front-end module of the equipment meet the preset requirements, that is, monitors whether the cleanliness, humidity and temperature of the front-end module of the equipment are maintained within the optimal range required for the wafer process. If the preset requirements are met, the robot arm is controlled to grab the wafer from the wafer carrier box. Since the wafer alignment device is provided with a third detection module, the third detection module is used to detect the status information of the wafer. The status information of the wafer is whether there are possible overlaps, tilted wafers, missing wafers, etc. when the wafer is placed in the wafer carrier box, or whether the wafer direction, wafer position and wafer marking are correct. Among them, the status information of the wafer includes the wafer direction, wafer position and wafer marking. The wafer direction refers to the specific orientation or crystal direction of the wafer on the plane. The wafer position refers to the specific position of the wafer on the carrier box, processing equipment or test bench. Wafer marking is a means for identifying information such as the identity, batch, direction or position of the wafer. Wafer marking can be achieved in a variety of ways, such as notch marking, flat marking, color marking, QR code or barcode, etc., mainly to improve the traceability and management efficiency of the wafer. The control module will receive the status information of the wafer fed back by the third detection module, control the wafer alignment device to adjust the wafer position, and after calibrating the wafer, control the edge finding device to find the edge of the wafer, rotate the wafer to the set orientation, and then find the edge of the wafer, wherein the setting orientation refers to the notch or identification mark in the wafer facing the fixed direction, and the specific fixed direction can be determined according to actual needs or subsequent processes, and this application does not limit this. Since the size of the wafer carrier box matches the size of the wafer, the size of the wafer can be quickly and accurately determined according to the size of the wafer carrier box, so as to improve the accuracy and reliability of the detection later. And the front-end module of the device exchanges data with the detection platform through the interface, so as to control the wafer transport device through the control module to transfer the edge-finding wafer to the detection platform to ensure the correct transfer of the wafer. It should be noted that the second detection module and the third detection module can be sensors or other devices, and this application does not limit this.

[0038] In some embodiments, the robot arm is provided with a vacuum adsorption device, and the vacuum adsorption device is used to adsorb wafers in a wafer carrier box loaded with multiple wafers to be inspected according to the size of the wafers.

[0039] Specifically, the robot arm may include not only a grasping part, but also a moving part, and the moving part may lead the grasping part to move to grasp the wafer. The moving part may be composed of multiple groups of connected moving part components. Similarly, the grasping part may also include multiple grasping part components. Specifically, the grasping part may include two grasping part components that are rotatably connected. Of course, the grasping part may also have only one component. This application does not limit the number and specific shape of the moving part and the grasping part. The vacuum adsorption device is used to adsorb the wafer. Since the surface of the wafer is easily scratched, which affects the subsequent process, a vacuum adsorption device is set on the grasping part of the robot arm. By adsorption according to the size of the wafer, the wafer is grasped in the wafer carrier box loaded with wafers of different sizes, which can reduce the damage to the wafer surface during the grasping process and improve the accuracy of grasping the wafer. It should be noted that the number of vacuum adsorption devices can be one or more, and this application does not make any restrictions on this.

[0040] In some embodiments, the detection platform is provided with an adsorption module, and the adsorption module is used to adsorb the wafer on the test position.

[0041] Specifically, an adsorption module is arranged on the detection platform, so that the adsorption module can adsorb the wafer on the detection platform, so that the wafer does not move during detection as much as possible, thereby reducing the error caused by the movement of the wafer during detection.

[0042] In some embodiments, the photoluminescence detection module includes a light source, a monochromator, an optical lens system, a detector, and an image processing unit. The light source is used to provide illumination for the surface of the wafer. The monochromator and the optical lens system are used to irradiate the light source onto the surface of the wafer so that the wafer absorbs the excitation light energy emitted by the light source and emits an emission light signal. The detector is used to scan and image the surface of the wafer according to the emission light signal to obtain a wafer image. The image processing unit is used to divide the wafer image into multiple wafer areas, and use a deep learning algorithm to detect each of the wafer areas to obtain defect information of chip microunits in the multiple wafer areas, and stitch the multiple wafer areas through an image stitching algorithm to generate a wafer defect detection result.

[0043] Specifically, the photoluminescence detection module includes a light source, a monochromator, an optical lens system, a detector and an image processing unit. The light source refers to an object that can emit electromagnetic waves in a certain wavelength range (including visible light and invisible light such as ultraviolet rays, infrared rays and X-rays), which is used to provide illumination for the surface of the wafer. The monochromator is a device that separates the light emitted by the light source into the required monochromatic light, and is responsible for decomposing the composite light into monochromatic light. The optical lens system is a system of optical elements made of transparent materials (such as glass, crystal, etc.) whose surface is part of a spherical surface. The monochromator and the optical lens system are mainly used to irradiate the light source on the surface of the wafer to The wafer absorbs the excitation light energy emitted by the light source and emits an emission light signal. The detector is used to scan and image the surface of the wafer according to the emission light signal to obtain a wafer image. The image processing unit is used to divide the wafer image into multiple wafer areas, and use a deep learning algorithm to detect each wafer area to obtain defect information of chip micro units in multiple wafer areas. Then, according to the defect information of the chip micro units in the multiple wafer areas, the multiple wafer areas are spliced ​​through an image stitching algorithm to generate a wafer defect detection result, thereby improving the accuracy and reliability of detection and reducing the difficulty and error rate of manual operation.

[0044] In some embodiments, the wafer mass inspection device further includes a display module, and the display module is used to display the inspection results.

[0045] Specifically, the wafer mass detection equipment also includes a display module, which is used to display the detection results. After the control module controls the photoluminescence detection module to detect the wafer, the detection result is obtained, and the detection result includes at least one of the following: luminous intensity, spectral distribution and defect information, that is, luminous intensity is referred to as light intensity, which is a photometric used to indicate the intensity of light emitted by a light source in one direction; spectral distribution refers to the spectral distribution of photometric (such as luminous flux, light intensity, etc.) or radiation measurement (such as radiation power, radiation intensity, etc.); defect information refers to the difference between the actual performance of the wafer and the explicit or implicit needs of the user, and then the detection results are automatically analyzed and judged, and a detailed detection report is generated, thereby providing strong support for the quality assessment of LED wafers. Then the display module is controlled to visualize the detection report and display it to the user in the form of charts, images, etc. It should be noted that the way in which the wafer is detected in this application can be set according to actual conditions, and this application does not limit this.

[0046] Understandably, Figure 1The system architecture shown is only an example. The structural diagram of the wafer mass detection equipment described in the embodiment of the present application is for more clearly illustrating the technical solution of the embodiment of the present application, and does not constitute a limitation on the technical solution provided in the embodiment of the present application. A person of ordinary skill in the art can know that with the evolution of the system structure and the emergence of new business scenarios, the technical solution provided in the embodiment of the present application is also applicable to similar technical problems.

[0047] See also Figure 4 , is a flow chart of a wafer mass detection method provided by an embodiment of the present invention. The wafer mass detection method can be applied to Figure 2 Wafer mass inspection equipment in Figure 4 As shown, the wafer mass detection method can be implemented by the following steps.

[0048] S401: Acquire the size of a wafer, wherein the size of the wafer is obtained based on a plurality of wafer carrier boxes of different sizes arranged in a stepped manner; S402: Determine test bit information of the wafer on a testing platform based on the size of the wafer, wherein the testing platform has a plurality of test bits of different sizes; S403: Controlling the wafer on the inspection platform to focus with a photoluminescence inspection module according to the test position information; S404: Based on preset imaging detection parameters of the wafer, control a photoluminescence detection module to detect the wafer.

[0049] In this embodiment, since the front-end module of the device has a plurality of wafer carrier boxes of different sizes arranged in a stepped manner, and the wafer carrier boxes of different sizes are arranged in a stepped manner, the vertical space can be fully utilized, so that more wafer carrier boxes can be accommodated in the same horizontal area, and then it can be compatible with a variety of LED wafers of different sizes, thereby improving the overall utilization rate of the storage and transportation space, and meeting the subsequent detection requirements of LED wafers of different specifications, so the control module can determine the size of the wafer according to the wafer carrier boxes of different sizes, and the detection platform also has a plurality of test positions of different sizes, and then according to the size of the wafer, the front-end module of the device is controlled to place the wafer in the corresponding test position to determine the test position information of the wafer on the detection platform, wherein the test position information can be the position information of the test position on the detection platform corresponding to the size of the wafer. Then, according to the test position information, the detection platform is controlled to move to a preset height and a preset position, so as to ensure that the wafer on the detection platform is focused with the photoluminescence detection module, and before the test, the detection parameters such as the wavelength, power, and irradiation time of the light source are pre-set by the control device. At the same time, according to the characteristics and requirements of the LED wafer, appropriate test standards and requirements are selected to reduce the difficulty and error rate of manual operation, and then based on the preset imaging detection parameters of the wafer, the photoluminescence detection module is controlled to detect the wafer to obtain the wafer defect detection result, improve the accuracy and efficiency of the detection, and reduce the difficulty and error rate of manual operation. It should be noted when necessary that the wafer defect detection result can be luminous intensity, spectral distribution, and defect information, etc. This application does not impose any restrictions on the detection results. It can be seen that this application greatly improves the efficiency and accuracy of wafer detection by combining the equipment front-end module, detection platform, control module and photoluminescence detection module, effectively reduces production costs, and can be compatible with a variety of LED wafers of different sizes, thereby meeting the detection needs of LED wafers of different specifications.

[0050] In some embodiments, controlling the wafer on the inspection platform to focus with a photoluminescence inspection module includes: Obtaining a placement position of the wafer at the test position; Based on the placement position, the actual position information of the wafer on the detection platform is adjusted to complete the focusing of the wafer and the photoluminescence detection module.

[0051] Specifically, when the wafer on the detection platform is not aligned with the photoluminescence detection module and is not focused, after the control module receives the placement position of the wafer at the test position, it adjusts the actual position information of the wafer on the detection platform according to the placement position of the wafer at the test position, that is, adjusts the Z-axis height, T-axis angle and XY-axis position of the wafer on the detection platform, so that the detection platform moves to a preset height and preset position, thereby ensuring that the wafer is aligned and focused with the photoluminescence detection module, so that the subsequent photoluminescence detection module can obtain high-quality detection results, thereby improving the accuracy and reliability of subsequent detection. It should be noted that the preset height and preset position can be set according to actual conditions, and this application does not make any limitation on this.

[0052] Optionally, before obtaining the size of the wafer, the following steps are included: Detect whether the placement information of the wafer carrier box meets the preset position; If the preset position is met, obtaining identification information of the wafer carrier box, wherein the identification information includes a barcode or label information; According to the identification information of the wafer carrier box, identity recognition and data verification are performed on the wafer carrier box to determine whether the carrier information of the wafer carrier box meets a preset value, wherein the carrier information of the wafer carrier box includes at least one of the following: the type of the wafer carrier box, the batch of the wafer carrier box, and the number of wafers in the wafer carrier box; If the preset value is met, then monitor whether the environmental parameters of the front-end module of the equipment meet the preset requirements, wherein the environmental parameters include at least one of the following: cleanliness, humidity and temperature; If the preset requirements are met, the robot arm is controlled to grab the wafer from the wafer carrier box and determine the size of the wafer.

[0053] Specifically, before obtaining the size of the wafer, since the front-end module of the equipment is designed to ensure that the wafer remains in a high clean state during the transmission process to meet the strict purity requirements of semiconductor manufacturing, when the front-end module of the equipment is started, it is initialized and set to check whether the status and functions of all components are normal. If normal, it enters the standby state, and then wafers of different sizes are manually placed in the wafer loading device through the wafer carrier box. Since the wafer loading device is provided with a second detection module, the second detection module detects the placement information of the wafer carrier box, and transmits the placement information of the wafer carrier box to the control module, and the control module determines whether the placement information of the wafer carrier box meets the preset position. If it has been placed in the preset position, the identification information of the wafer carrier box is obtained, wherein the identification information includes a barcode or label information. The barcode of the wafer carrier box may contain the unique serial number, production date, batch number, manufacturer information, etc. of the carrier box; the label information of the wafer carrier box may include the identity information of the wafer carrier box (such as serial number, manufacturer, production date, etc.), relevant information of the wafer (such as the number of wafers, batch number, production process steps, etc.), and possible security verification information, etc., and then, according to the identification information of the wafer carrier box, the wafer carrier box is identified and the data is verified to ensure the accuracy and compliance of the wafer carrier box, thereby ensuring production efficiency and product quality.

[0054] Furthermore, after the wafer carrier box is identified and the data is verified, it is determined whether the carrier information of the wafer carrier box meets the preset value, that is, whether the type of the wafer carrier box meets the preset type, whether the batches of the wafer carrier box belong to the same batch, whether the number of wafers to be inspected meets the preset value, etc. The present application does not impose any restrictions on this. If the preset value is met, the control module controls the front-end module of the equipment to start the access control mechanism, and then monitors whether the environmental parameters of the front-end module of the equipment meet the preset requirements, that is, monitors whether the cleanliness, humidity and temperature of the front-end module of the equipment are maintained within the optimal range required for the wafer process. If the preset requirements are met, the robot arm is controlled to grab the wafer from the wafer carrier box. Since the wafer alignment device is provided with a third detection module, the third detection module is used to detect the status information of the wafer. The status information of the wafer is whether there are possible overlaps, tilted wafers, missing wafers, etc. when the wafer is placed in the wafer carrier box, or whether the wafer direction, wafer position and wafer marking are correct. Among them, the status information of the wafer includes the wafer direction, wafer position and wafer marking. The wafer direction refers to the specific orientation or crystal direction of the wafer on the plane. The wafer position refers to the specific position of the wafer on the carrier box, processing equipment or test bench. Wafer marking is a means for identifying information such as the identity, batch, direction or position of the wafer. Wafer marking can be achieved in a variety of ways, such as notch marking, flat marking, color marking, QR code or barcode, etc., mainly to improve the traceability and management efficiency of the wafer. The control module will receive the status information of the wafer fed back by the third detection module, control the wafer alignment device to adjust the wafer position, and after calibrating the wafer, control the edge-finding device to find the edge of the wafer, and rotate the wafer to the set orientation, thereby finding the edge of the wafer. The setting orientation refers to the notch or identification mark in the wafer facing a fixed direction. The specific fixed direction can be determined according to actual needs or subsequent processes, and this application does not limit this. Since the size of the wafer carrier box matches the size of the wafer, the size of the wafer can be quickly and accurately determined based on the size of the wafer carrier box, so as to improve the accuracy and reliability of the subsequent detection.

[0055] Optionally, based on preset imaging detection parameters of the wafer, controlling a photoluminescence detection module to detect the wafer includes: Presetting imaging detection parameters of the wafer, and constructing different imaging detection modes according to the imaging detection parameters; Selecting an optimal imaging detection method from different imaging detection methods according to the characteristic information of the wafer; Based on the optimal imaging detection method, a light source is used to illuminate the surface of the wafer, and a monochromator and an optical lens system are used to irradiate the light source onto the surface of the wafer, so that the wafer absorbs the excitation light energy emitted by the light source and emits an emission light signal, and a detector is used to scan and image the surface of the wafer according to the emission light signal to obtain a wafer image; Using an image processing unit to divide the wafer image into a plurality of wafer regions, and using a deep learning algorithm to detect each of the wafer regions to obtain defect information of chip micro-units in the plurality of wafer regions; According to the defect information of the chip micro-units in the multiple wafer areas, the multiple wafer areas are spliced ​​using an image splicing algorithm to generate a wafer defect detection result.

[0056] Specifically, the control module is mainly responsible for the operation and control of the entire equipment. After the wafer on the control detection platform is focused with the photoluminescence detection module, the control device pre-sets the detection parameters, such as the wavelength, power, and irradiation time of the light source. Different imaging detection methods are constructed according to the imaging detection parameters, and then the wafer is analyzed to clarify the characteristic information of the wafer, including but not limited to: size: diameter and thickness of the wafer; surface state: whether there are scratches, dirt or other defects; material type: in the semiconductor field, common ones are silicon (Si), gallium arsenide (GaAs), etc.; pattern features: whether there are circuit patterns, coupling features, photolithography patterns, etc. on the wafer. According to the characteristic information of the wafer, the best imaging detection method with high detection rate and low error rate is selected from different imaging detection methods, and then based on the best imaging detection method, a light source is used to provide illumination for the surface of the wafer, and a monochromator and an optical lens system are used to irradiate the light source on the surface of the wafer, so that the wafer absorbs the excitation light energy emitted by the light source and emits an emission light signal, and a detector is used to scan and image the surface of the wafer according to the emission light signal to obtain a wafer image, and an image processing unit is used to divide the wafer image into multiple wafer areas, and a deep learning algorithm is used to detect each wafer area to obtain defect information of chip micro units in multiple wafer areas, and an image stitching algorithm is used to stitch multiple wafer areas according to the defect information of chip micro units in multiple wafer areas to generate a wafer defect detection result. Wherein, the surface of the wafer includes a central partition and an edge partition, and the wafer surface is partitioned manually or automatically according to the test needs, for example, the wafer surface is divided into one or more fan-shaped areas, one or more annular areas or one or more irregular areas, and further, the areas of the N partitions of the wafer surface can be equal or unequal.

[0057] By detecting each wafer area in the wafer image and then stitching it together, the wafer defect detection results can be obtained more accurately, thereby improving the yield and reliability of wafer detection. This will facilitate subsequent analysis of the wafer defect detection results, and then, based on the analysis results of the detection results, the wafer can be more accurately processed or improved, thereby providing strong support for the quality assessment of LED wafers.

[0058] In this embodiment, wafers of different sizes are obtained by using a plurality of wafer carrier boxes of different sizes arranged in a stepped manner, and then the front-end module of the device is controlled to place the wafer at the corresponding test position according to the size of the wafer, and the placement position of the wafer at the test position is obtained, and the focus of the wafer on the detection platform and the photoluminescence detection module is controlled. Based on the preset imaging detection parameters of the wafer, the photoluminescence detection module is controlled to detect the wafer, thereby meeting the detection requirements of LED wafers of different specifications, greatly improving the detection efficiency and detection accuracy, and effectively reducing the production cost.

[0059] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0060] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the system is divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of the present invention. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the above-mentioned method embodiment, which will not be repeated here. If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium.

[0061] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A wafer mass detection device, characterized in that: The wafer mass detection equipment includes an equipment front-end module, a detection platform, a photoluminescence detection module and a control module; The equipment front-end module has a plurality of wafer carrier boxes of different sizes arranged in a stepped manner, and the wafer carrier boxes of different sizes are used to place the wafers of different sizes; The detection platform comprises a plurality of test positions of different sizes and a first detection module, wherein the test positions of different sizes are used to place the wafer on the wafer carrier box, and the first detection module is used to detect the placement position of the wafer at the test positions; A control module is used to obtain the size of the wafer, control the front-end module of the device to place the wafer at the corresponding test position according to the size of the wafer, and obtain the placement position of the wafer at the test position, control the focus of the wafer on the detection platform and the photoluminescence detection module, and control the photoluminescence detection module to detect the wafer based on the preset imaging detection parameters of the wafer.

2. The wafer mass detection device according to claim 1, characterized in that: The front-end module of the equipment also includes a wafer loading device, a robotic arm, a wafer alignment device, an edge-finding device and a wafer transporting device. The wafer loading device is provided with a second detection module, and the second detection module is used to detect the placement information of the wafer carrier box. The robotic arm is used to grab the wafer. The wafer alignment device is used to calibrate the wafer. The wafer alignment device is provided with a third detection module, and the third detection module is used to detect the status information of the wafer. The edge-finding device is used to find the edge of the wafer. The wafer transporting device is used to transfer the wafer after edge-finding to the detection platform.

3. The wafer mass detection device according to claim 2, characterized in that: The robot arm is provided with a vacuum adsorption device, and the vacuum adsorption device is used to adsorb the wafer on the wafer carrier box.

4. The wafer mass detection device according to claim 1, characterized in that: The detection platform is provided with an adsorption module, and the adsorption module is used for adsorbing the wafer on the test position.

5. The wafer mass detection device according to claim 1, characterized in that: The photoluminescence detection module includes a light source, a monochromator, an optical lens system, a detector and an image processing unit. The light source is used to provide illumination for the surface of the wafer. The monochromator and the optical lens system are used to irradiate the light source on the surface of the wafer so that the wafer absorbs the excitation light energy emitted by the light source and emits an emission light signal. The detector is used to scan and image the surface of the wafer according to the emission light signal to obtain a wafer image. The image processing unit is used to divide the wafer image into multiple wafer areas, and use a deep learning algorithm to detect each of the wafer areas to obtain defect information of chip microunits in the multiple wafer areas, and splice the multiple wafer areas through an image splicing algorithm to generate a wafer defect detection result.

6. The wafer mass detection device according to claim 1, characterized in that: The wafer mass detection device also includes a display module, and the display module is used to display the detection report.

7. A wafer mass detection method, characterized in that: include: Obtaining a size of a wafer, wherein the size of the wafer is obtained based on a plurality of wafer carrier boxes of different sizes arranged in a stepped manner; Based on the size of the wafer, determining the test position information of the wafer on the detection platform, wherein the detection platform has a plurality of test positions of different sizes; According to the test position information, controlling the wafer on the detection platform to focus on a photoluminescence detection module; Based on the preset imaging detection parameters of the wafer, a photoluminescence detection module is controlled to detect the wafer.

8. The wafer mass detection method according to claim 7, characterized in that: The step of controlling the wafer on the detection platform to focus on the photoluminescence detection module comprises: Obtaining a placement position of the wafer at the test position; Based on the placement position, the actual position information of the wafer on the detection platform is adjusted to complete the focusing of the wafer and the photoluminescence detection module.

9. The wafer mass detection method according to claim 7, characterized in that: Before obtaining the size of the wafer, the method includes: Detect whether the placement information of the wafer carrier box meets the preset position; If the preset position is met, obtaining identification information of the wafer carrier box, wherein the identification information includes a barcode or label information; According to the identification information of the wafer carrier box, identity recognition and data verification are performed on the wafer carrier box to determine whether the carrier information of the wafer carrier box meets a preset value, wherein the carrier information of the wafer carrier box includes at least one of the following: the type of the wafer carrier box, the batch of the wafer carrier box, and the number of wafers in the wafer carrier box; If the preset value is met, then monitor whether the environmental parameters of the front-end module of the equipment meet the preset requirements, wherein the environmental parameters include at least one of the following: cleanliness, humidity and temperature; If the preset requirements are met, the robot arm is controlled to grab the wafer from the wafer carrier box and determine the size of the wafer.

10. The wafer mass detection method according to claim 7, characterized in that: The controlling the photoluminescence detection module to detect the wafer based on the preset imaging detection parameters of the wafer includes: Presetting imaging detection parameters of the wafer, and constructing different imaging detection modes according to the imaging detection parameters; Selecting an optimal imaging detection method from different imaging detection methods according to the characteristic information of the wafer; Based on the optimal imaging detection method, a light source is used to illuminate the surface of the wafer, and a monochromator and an optical lens system are used to irradiate the light source onto the surface of the wafer, so that the wafer absorbs the excitation light energy emitted by the light source and emits an emission light signal, and a detector is used to scan and image the surface of the wafer according to the emission light signal to obtain a wafer image; Using an image processing unit to divide the wafer image into a plurality of wafer regions, and using a deep learning algorithm to detect each of the wafer regions to obtain defect information of chip micro-units in the plurality of wafer regions; According to the defect information of the chip micro-units in the multiple wafer areas, the multiple wafer areas are spliced ​​using an image splicing algorithm to generate a wafer defect detection result.

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