Novel semiconductor IC integrated circuit support feeding structure

Abstract

A novel semiconductor IC integrated circuit support feeding structure relates to the technical field of semiconductor die bonding equipment, has a material stacking and feeding mode and a material box feeding mode, and comprises a base, a material stacking frame, a feeding tray, a suction cup material taking assembly, a material pushing box assembly and a material pushing assembly. The suction cup material taking assembly sequentially sucks the supports to be subjected to die bonding to the feeding track of the feeding tray, and the material pushing assembly pushes the supports to be subjected to die bonding on the feeding track into a feeding channel of the die bonder. When the material box feeding mode is used for feeding, the feeding track on the feeding tray is detached, the suction cup material taking assembly moves to the side, away from the material stacking frame, of the feeding tray, the material box pushing assembly pushes the material box to the feeding tray, and the material pushing assembly sequentially pushes the supports to be subjected to die bonding in the material box into a feeding channel of the die bonder. By the adoption of the technical scheme, the stacking feeding mode and the material box feeding mode can be compatible, the production efficiency is improved, operation is easy and convenient, and market popularization is facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor die bonding equipment, and in particular to a novel semiconductor IC integrated circuit bracket feeding structure. Background Art

[0002] In the packaging process of semiconductor devices such as integrated circuits (ICs) and light-emitting diodes (LEDs), die bonding is an extremely important step. The process of die bonding is as follows: first, the loading system transports the die bonding bracket in the storage device to the feed channel, and then the die bonding bracket moves along the feed channel and stays at a certain position. At this time, the dispensing module on the rack automatically dispenses the adhesive material, that is, dispenses the adhesive material on the die bonding area of ​​the die bonding bracket, and then the automatic pick-and-place device takes the chip from the wafer disk and adheres the chip to the die bonding area of ​​the die bonding bracket, completing the die bonding.

[0003] There are generally two ways to load the existing die bonders: one is to put the die bonders into a material box for loading, and the other is to stack the die bonders for loading. The loading mechanisms of traditional die bonders need to be configured separately, and it is not possible to use both material box feeding and stacking feeding on the same mechanism. Therefore, only a single mode of loading can be achieved, which is not flexible enough, causing inconvenience to actual production, hindering the production process, and not conducive to large-scale industrial production. Summary of the invention

[0004] The purpose of the present invention is to address the phenomenon that the crystal bonding machine in the prior art is not compatible with the material box feeding method and the stacking feeding method, can only realize a single mode of feeding, lacks flexibility, hinders the production process, and is not conducive to large-scale industrial production. The present invention provides a new type of semiconductor IC integrated circuit bracket feeding structure.

[0005] The technical solution adopted by the present invention is: a new type of semiconductor IC integrated circuit bracket feeding structure, which has a stacking feeding mode and a box feeding mode, and the feeding structure includes:

[0006] Pedestal;

[0007] A material stacking rack, arranged above the base, for carrying a material box filled with supports to be bonded or a material tray on which supports to be bonded are stacked;

[0008] A feeding tray is arranged on one side of the stacking rack, can be vertically lifted and lowered relative to the stacking rack along the Z-axis direction, and a feeding track connected to the feeding channel of the crystal bonding machine can be detachably arranged on its top surface;

[0009] The suction cup material taking component is arranged above the stacking rack and the feeding tray, and can move relative to the stacking rack along the X-axis direction and the Z-axis direction. In the stacking material feeding mode, the suction cup material taking component is used to suck the to-be-bonded crystal supports stacked on the material tray onto the feeding track in sequence;

[0010] A material pushing box assembly is provided on the material stacking rack, and in the material box loading mode, the material pushing box assembly is used to push the material box filled with the support to be bonded to the feeding tray; and

[0011] The material pushing assembly is arranged on the side of the feeding tray away from the feeding channel of the crystal bonding machine, and is used to suck the suction cup material taking assembly onto the feeding track and push the crystal-to-be-bonded bracket into the feeding channel of the crystal bonding machine in the material stacking loading mode, or to push the material pushing box assembly from the material stacking rack to the crystal-to-be-bonded bracket in the material box on the feeding tray and push them into the feeding channel of the crystal bonding machine in sequence in the material box loading mode;

[0012] When the stacking loading mode is used for loading, the suction cup material taking component sucks the to-be-bonded crystal supports stacked on the material tray to the feeding track of the feeding tray in sequence, and the pushing component pushes the to-be-bonded crystal supports on the feeding track into the feeding channel of the crystal bonding machine to realize stacking loading;

[0013] When using the material box loading mode to load materials, the feeding track on the feeding tray is removed, the suction cup material picking assembly is moved to the side of the feeding tray away from the stacking rack, the material box pushing assembly pushes the material box on the stacking rack onto the feeding tray, and the material pushing assembly pushes the crystal bonding brackets to be bonded in the material box into the feeding channel of the crystal bonding machine one by one to realize material box loading.

[0014] Optionally, the suction cup material picking assembly includes a support plate arranged on a base, an X-axis movable seat slidably arranged on the support plate, a Z-axis fixed seat fixedly arranged on the X-axis movable seat, a Z-axis lifting frame slidably arranged on the Z-axis fixed seat, and a suction cup group arranged on the Z-axis lifting frame, the support plate is arranged along the X-axis direction, and the support plate is located above the stacking frame, the X-axis movable seat can move left and right along the length direction of the support plate, the Z-axis fixed seat is arranged along the Z-axis direction, and the Z-axis lifting frame can move up and down along the length direction of the Z-axis fixed seat, and the suction cup group is used to suck the stacked and placed on the material tray to be solidified.

[0015] Optionally, the suction cup material picking assembly also includes an X-axis driving component for driving the X-axis movable seat to move left and right along the length direction of the support plate, and a Z-axis driving component for driving the Z-axis lifting frame to move up and down along the length direction of the Z-axis fixed seat.

[0016] Optionally, the X-axis driving component includes an X-axis screw rod rotatably disposed on the support plate and arranged along the length direction of the support plate, an X-axis nut seat threadedly sleeved on the X-axis screw rod and fixedly connected to the X-axis moving seat, an X-axis guide rail arranged along the length direction of the support plate and slidingly matched with the X-axis moving seat, and an X-axis driving motor for driving the X-axis screw rod to rotate.

[0017] Optionally, the Z-axis driving component includes a Z-axis screw rod rotatably disposed on the Z-axis fixed seat and arranged along the length direction of the Z-axis fixed seat, a Z-axis nut seat threadedly sleeved on the Z-axis screw rod and fixedly connected to the Z-axis lifting seat, a Z-axis guide rail arranged along the length direction of the support plate and slidingly matched with the Z-axis lifting frame, and a Z-axis driving motor for driving the Z-axis screw rod to rotate.

[0018] Optionally, the pushing box assembly includes a pushing rack slidably arranged on the stacking rack, a pushing block arranged on the pushing rack, and a pushing box cylinder for driving the pushing rack to move toward or away from a feeding tray. The pushing rack can slide along the length direction of the stacking rack toward or away from the feeding tray, the pushing block protrudes from the stacking rack and abuts against a material box filled with the crystal bracket to be fixed, the pushing cylinder is arranged along the length direction of the stacking rack, and the piston rod of the pushing box cylinder is fixedly connected to the pushing rack.

[0019] Optionally, a support frame for supporting a feeding tray is vertically arranged on the base, the feeding tray is slidably arranged on the side wall of the support frame, and a lifting assembly is provided on the support frame for driving the feeding tray to vertically lift and lower relative to the base, so that in the material box loading mode, the pushing assembly can push the support to be bonded in the material box into the feeding channel of the bonding machine in sequence;

[0020] The lifting assembly includes a vertical slot vertically opened on the carrier frame, a lifting screw rod rotatably arranged in the vertical slot, a lifting seat threadedly connected to the lifting screw rod, and a lifting motor used to drive the lifting screw rod to rotate. A vertical guide rail that slides with the lifting seat is also provided in the vertical slot. The feeding tray is fixedly connected to the lifting seat, so that when the lifting motor drives the lifting screw rod to rotate, the lifting seat can drive the feeding tray to rise and fall vertically relative to the base.

[0021] Optionally, the carrier frame is provided with a clamping assembly for clamping the material box so that the material box can be stably located on the feeding tray;

[0022] The clamping assembly includes a sliding frame slidably arranged on the top surface of the supporting frame, an abutment plate arranged on the side of the sliding frame close to the feeding tray, a first limit bar and a second limit bar respectively arranged on the sliding frame and the abutment plate, and a clamping cylinder arranged on the second limit bar. The sliding frame can move relative to the supporting frame in a direction close to or away from the feeding tray, the abutment plate is used to abut against the material box, the first limit bar and the second limit bar cooperate to clamp the material box, and the clamping cylinder is used to abut one side of the material box so as to abut the other side of the material box against the first limit bar.

[0023] Optionally, the pushing assembly includes a mounting plate fixed on the supporting frame, a pushing cylinder arranged on the mounting plate, and a pushing rod arranged on the pushing cylinder. The pushing cylinder is located on the side of the feeding push plate away from the feeding channel of the crystal bonding machine, and the pushing rod is flush with the crystal bracket to be bonded in the material box.

[0024] Optionally, a material receiving rack for collecting empty material boxes is provided between the material stacking rack and the base, and a material receiving box assembly for pushing the empty material boxes from one end of the material receiving rack to the other end is provided on the base;

[0025] The material receiving box assembly includes a movable frame slidably arranged on a base and a material receiving cylinder for driving the movable frame to move toward or away from the material receiving frame. The movable frame is used to push the empty material box to move along the length direction of the material receiving frame so that the empty material box can be pushed from one end of the material receiving frame to the other end of the material receiving frame.

[0026] After adopting the above technical solution, the beneficial effects of the present invention are:

[0027] The material box is then pushed onto the feed tray and the material is fed to the feed channel of the bonding machine, thereby allowing the material box to be loaded and unloaded. The material box is fed to the feed tray and the feeding channel is then pushed to the feed channel of the bonding machine, thereby allowing the material box to be loaded and unloaded. The material box is then pushed onto the feed tray and the material is fed to the feed channel of the bonding machine, thereby allowing the material box to be loaded and unloaded. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 This is a display diagram of the embodiment when the stacking material loading mode is used for loading;

[0030] Figure 2 This is a display diagram of the material box loading mode used for loading in this embodiment;

[0031] Figure 3 is a display diagram of the suction cup material taking component in this embodiment;

[0032] Figure 4 It is a schematic diagram used to reflect the coordination relationship between the push box assembly and the stacking rack;

[0033] Figure 5 It is a schematic diagram for reflecting the coordination relationship between the tightening assembly, the material pushing box assembly and the material stacking rack;

[0034] Figure 6 This is a partial display diagram of the material box loading mode used in this embodiment for loading;

[0035] Figure 7 It is a schematic diagram used to reflect the coordination relationship between the carrier, lifting assembly and feeding tray;

[0036] Figure 8 It is a schematic diagram used to reflect the coordination relationship between the clamping assembly, the feeding tray and the carrier frame;

[0037] Fig. 9 2 is a display diagram of the pusher assembly in this embodiment;

[0038] Fig.10 It is a schematic diagram for reflecting the matching relationship between the receiving box assembly and the base;

[0039] Fig.11 It is a schematic diagram used to reflect the coordination relationship between the receiving rack, the moving rack and the receiving cylinder.

[0040] Description of reference numerals: 10, base; 11, carrier frame; 111, vertical slot; 112, lifting screw rod; 113, lifting seat; 114, lifting motor; 115, vertical guide rail; 116, transmission belt; 12, material receiving rack;

[0041] 20. Material stacking rack; 21. Material tray; 22. Material box; 23. Crystal support to be fixed; 24. Waste paper box;

[0042] 30. Feeding tray; 31. Feeding track;

[0043] 40. Suction cup material picking assembly; 41. Support plate; 42. X-axis moving seat; 43. Z-axis fixed seat; 44. Z-axis lifting frame; 45. Suction cup assembly; 46. X-axis driving member; 461. X-axis screw rod; 462. X-axis nut seat; 463. X-axis guide rail; 464. X-axis driving motor; 47. Z-axis driving member; 471. Z-axis screw rod; 472. Z-axis nut seat; 473. Z-axis guide rail; 474. Z-axis driving motor;

[0044] 50. Pushing box assembly; 51. Pushing rack; 52. Pushing block; 53. Pushing box cylinder;

[0045] 60. Pushing assembly; 61. Mounting plate; 611. First plate; 612. Second plate; 62. Pushing cylinder; 63. Push rod;

[0046] 70. Clamping assembly; 71. Sliding frame; 72. Abutment plate; 73. First limiting strip; 74. Second limiting strip; 75. Clamping cylinder; 76. Adjusting member;

[0047] 80. abutting assembly; 81. abutting cylinder; 82. abutting block;

[0048] 90. Material receiving box assembly; 91. Moving frame; 92. Material receiving cylinder. DETAILED DESCRIPTION

[0049] The following will be combined with the attached embodiment of the present invention Figure 1-11 , the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] It should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "back", "side", "circumferential" and the like in the present invention indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the words "first", "second" and the like are only used to distinguish multiple components or structures with the same or similar structures, and do not represent any special limitation on the arrangement order or connection relationship.

[0051] The present embodiment relates to a novel semiconductor IC integrated circuit bracket feeding structure, which is mainly configured at the feeding end of a die bonding machine to realize automatic feeding.

[0052] Reference Figure 1 and Figure 2 The feeding structure provided in this embodiment has a stacking feeding mode and a material box feeding mode. The stacking feeding mode stacks the crystal-bonding supports for feeding, while the material box 22 feeding mode stacks the crystal-bonding supports 23 in the material box 22.

[0053] The loading structure includes a base 10, a stacking rack 20, a feeding tray 30, a suction cup material taking assembly 40, a material pushing box assembly 50 and a material pushing assembly 60. The base 10 is generally arranged in a rectangular parallelepiped shape, and the stacking rack 20 is installed above the base 10, and is used to carry a material box 22 filled with a support 23 to be bonded or a material tray 21 on which a support 23 to be bonded is stacked. That is, when the stacking loading mode is used for loading, the material tray 21 is placed on the stacking rack 20, and a plurality of supports 23 to be bonded are stacked on the material tray 21. When the material box 22 loading mode is used for loading, the material box 22 is placed on the stacking rack 20, and a plurality of supports 23 to be bonded are stacked in the material box 22.

[0054] The feeding tray 30 is arranged on one side of the stacking rack 20, and can be vertically lifted and lowered along the Z-axis direction relative to the stacking rack 20, and a feeding track 31 connected to the feeding channel of the crystal bonding machine can be detachably arranged on its top surface. It should be noted that, in this embodiment, the length direction of the base 10 is the X-axis direction, the width direction of the base 10 is the Y-axis direction, and the height direction of the base 10 is the Z-axis direction.

[0055] The suction cup pick-up assembly 40 is arranged above the stacking rack 20 and the feeding tray 30, and it can move relative to the stacking rack 20 along the X-axis direction and the Z-axis direction, and in the stacking loading mode, the suction cup pick-up assembly 40 is used to suck the to-be-bonded crystal supports 23 stacked on the material tray 21 to the feeding track 31 in sequence. In addition, it should be noted that when the stacking loading mode is used, two adjacent to-be-bonded crystal supports 23 on the material tray 21 are separated by paper, so when the stacking loading mode is used for loading, a waste paper box 24 for placing paper is also provided on the stacking rack 20, and at the same time, after the suction cup pick-up assembly 40 sucks one to-be-bonded crystal support 23 to the feeding track 31 on the feeding tray 30, it is necessary to suck the paper on the next to-be-bonded crystal support 23 into the waste paper box 24 before the next loading can be carried out.

[0056] The material pushing box assembly 50 is disposed on the material stacking rack 20 . In the material box 22 loading mode, the material pushing box assembly 50 is used to push the material box 22 filled with the support 23 to be bonded onto the feeding tray 30 .

[0057] The pushing assembly 60 is arranged on the side of the feeding tray 30 away from the feeding channel of the crystal bonding machine. It is used to suck the suction cup material picking assembly 40 to the crystal bracket 23 to be bonded on the feeding track 31 and push it into the feeding channel of the crystal bonding machine in the stacking loading mode, thereby completing the stacking loading; or in the material box 22 loading mode, the pushing box assembly 50 is pushed from the stacking rack 20 to the material box 22 on the feeding tray 30, and the crystal bracket 23 to be bonded in the material box 22 is pushed into the feeding channel of the crystal bonding machine in turn, thereby completing the loading of the material box 22.

[0058] When using the stacking loading mode for loading, the suction cup material picking assembly 40 will suck the crystal bracket 23 to be bonded placed on the material tray 21 into the feeding track 31 of the feeding tray 30 in sequence. At this time, the pushing assembly 60 will push the crystal bracket 23 to be bonded on the feeding track 31 into the feeding channel of the crystal bonding machine, thereby realizing stacking loading.

[0059] When using the material box loading mode, first, the feeding track 31 on the feeding tray 30 needs to be removed, and then the suction cup material picking assembly 40 is moved to the side of the feeding tray 30 away from the stacking rack 20, that is, the suction cup material picking assembly 40 does not participate in the loading. At this time, the material box 22 located on the stacking rack 20 is pushed onto the feeding tray 30 through the material pushing box assembly 50, and the material pushing assembly 60 then pushes the crystal bracket 23 to be bonded in the material box 22 into the feeding channel of the crystal bonding machine in sequence, thereby realizing the loading of the material box 22. Here, it should be noted that since the feeding tray 30 can be raised and lowered vertically relative to the base 10, when the pushing component 60 pushes out the top layer of the to-be-bonded crystal bracket 23 in the material box 22, the feeding tray 30 descends to a certain position relative to the base 10, so that the pushing component 60 is aligned with the second layer of the to-be-bonded crystal bracket 23 on the material box 22, so that the pushing component 60 can push out the second layer of the to-be-bonded crystal bracket 23 in the material box 22, and this process is repeated until all the to-be-bonded crystal brackets 23 in the material box 22 are pushed out.

[0060] Further, refer to Figure 1 and Figure 3 The suction cup material picking assembly 40 includes a support plate 41 arranged on the base 10, an X-axis movable seat 42 arranged along the length direction of the support plate 41, a Z-axis fixed seat 43 fixedly arranged on the X-axis movable seat 42, a Z-axis lifting frame 44 slidably arranged on the Z-axis fixed seat 43, and a suction cup group 45 arranged on the Z-axis lifting frame 44, wherein the support plate 41 is arranged along the X-axis direction, the support plate 41 is located above the base 10, and the support plate 41 is connected to the substrate through a connecting plate, the X-axis movable seat 42 can slide along the length direction of the bracket (that is, the X-axis direction), the Z-axis fixed seat 43 is arranged along the Z-axis direction, the Z-axis lifting frame 44 can slide up and down along the length direction of the Z-axis fixed seat 43, the suction cup group 45 includes a plurality of suction cups evenly arranged on the bottom side of the Z-axis lifting frame 44, and the suction cup group 45 is used to suck the stacked and placed on the material tray 21 The to-be-bonded crystal bracket 23

[0061] Furthermore, the suction cup material picking assembly 40 also includes an X-axis driving component 46 for driving the X-axis movable seat 42 to move left and right along the length direction of the support plate 41 and a Z-axis driving component 47 for driving the Z-axis lifting frame 44 to move up and down along the length direction of the Z-axis fixed seat 43.

[0062] Specifically, the X-axis driving member 46 includes an X-axis screw rod 461 rotatably disposed on the support plate 41 and arranged along the length direction of the support plate 41, an X-axis nut seat 462 threadedly sleeved on the X-axis screw rod 461 and fixedly connected to the X-axis moving seat 42, an X-axis guide rail 463 arranged along the length direction of the support plate 41 and slidingly cooperating with the X-axis, and an X-axis driving motor 464 for driving the X-axis screw rod 461 to rotate.

[0063] The Z-axis driving component 47 includes a Z-axis screw rod 471 rotatably disposed on the Z-axis fixing seat 43 and arranged along the length direction of the Z-axis fixing seat 43, a Z-axis nut seat 472 threadedly sleeved on the Z-axis screw rod 471 and fixedly connected to the Z-axis lifting seat 113, a Z-axis guide rail 473 arranged along the length direction of the support plate 41 and slidingly matched with the Z-axis lifting frame 44, and a Z-axis driving motor 474 for driving the Z-axis screw rod 471 to rotate.

[0064] When the stacking loading mode is used for loading, the X-axis drive motor 464 drives the X-axis screw rod 461 to rotate, driving the X-axis nut seat 462 to move along the length direction of the X-axis screw rod 461 toward the stacking rack 20, driving the Z-axis fixed seat 43 and the suction cup group 45 to move along the X-axis direction toward the stacking rack 20. When the suction cup group 45 moves to the top of the material tray 21, the Z-axis drive motor 474 drives the Z-axis screw rod 471 to rotate, driving the Z-axis nut seat 472 to descend along the Z-axis direction, that is, driving the suction cup group 45 to rotate. 45 descends along the Z-axis direction and sucks up the crystal-bonding support 23 on the material tray 21, and then drives the Z-axis lead screw 471 to rotate in the opposite direction through the Z-axis drive motor 474, so that the suction cup group 45 and the crystal-bonding support 23 rise along the Z-axis direction. After rising to a certain height, the X-axis drive motor 464 drives the X-axis lead screw 461 to rotate in the opposite direction, driving the suction cup group 45 to move to the top of the feeding tray 30. At this time, the Z-axis drive motor 474 drives the lead screw to rotate forward, so that the crystal-bonding support can be placed on the feeding tray 30.

[0065] Further, refer to Figure 2 , Figure 4 and Figure 5 The pushing box assembly 50 includes a pushing rack 51 slidably arranged on the stacking rack 20, a pushing block 52 arranged on the pushing rack 51, and a pushing cylinder 62 for driving the pushing rack 51 to move toward or away from the feeding tray 30. The pushing rack 51 can move along the length direction of the stacking rack 20 toward or away from the feeding push plate, the pushing block 52 protrudes from the stacking rack 20 and abuts against the side of the material box 22 away from the feeding tray 30. The pushing cylinder 62 is arranged along the length direction of the stacking rack 20, and the piston rod of the pushing cylinder 62 is fixedly connected to the pushing rack 51.

[0066] When the material box loading mode is used, the pushing cylinder 62 drives the pushing rack 51 to move toward the feeding tray 30 , driving the pushing block 52 to move toward the feeding tray 30 , thereby pushing the material box 22 from the stacking rack 20 to the feeding tray 30 .

[0067] Further, refer to Figure 2 , Figure 6 and Figure 7 A carrier frame 11 for carrying a feeding tray 30 is vertically arranged on the base 10, and the feeding tray 30 is slidably arranged on the side wall of the carrier frame 11, that is, the feeding tray 30 can be vertically lifted and lowered relative to the carrier frame 11, and a lifting component for driving the feeding tray 30 to be vertically lifted and lowered relative to the base 10 is arranged on the carrier frame 11, so that in the loading mode of the material box 22, the pushing component 60 can push the crystal support 23 to be fixed in the material box 22 into the feeding channel one by one.

[0068] Specifically, the lifting assembly includes a vertical slot 111 vertically opened on the carrier frame 11, a lifting screw rod 112 rotatably arranged in the vertical slot 111, a lifting seat 113 threadedly connected to the lifting screw rod 112, and a lifting motor 114 for driving the lifting screw rod 112 to rotate, wherein the vertical slot 111 is opened along the length direction of the carrier frame 11, and the opening of the vertical slot 111 faces the feeding tray 30, the screw rod is arranged along the length direction of the vertical slot 111, and the two ends of the screw rod are rotatably connected to the upper and lower ends of the vertical slot 111 respectively, and a vertical guide rail 115 is provided in the vertical slot 111, which is slidably matched with the lifting seat 113, so that the lifting seat 113 can move up and down in the length direction of the vertical guide rail 115 when the screw rod rotates, and the feeding tray 30 is fixedly connected to the side of the lifting seat 113 away from the vertical slot 111.

[0069] In this embodiment, the output shaft of the lifting motor 114 is connected to the lifting screw 112 through a transmission belt 116, so that the lifting motor 114 can stably drive the lifting screw 112 to rotate, thereby driving the lifting seat 113 and the feeding tray 30 to rise and fall vertically relative to the base 10, and then the pushing assembly 60 can push the crystal bracket 23 to be fixed in the material box 22 out of the material box 22 one by one, thereby realizing loading.

[0070] Further, Figure 6 and Figure 8 In order to prevent the material box 22 from shifting after being pushed onto the feeding tray 30 and ensure the loading efficiency, a clamping assembly 70 for clamping the material box 22 is provided on the carrier frame 11 so that the material box 22 can be stably located on the feeding tray 30 .

[0071] Specifically, the clamping assembly 70 includes a sliding frame 71 slidably arranged on the top surface of the carrier 11, an abutment plate 72 arranged on the side of the sliding plate close to the feeding tray 30, a first limit bar 73 and a second limit bar 74 respectively arranged on the abutment plate 72 and the sliding frame 71, and a clamping cylinder 75 arranged on the second limit bar 74, wherein the sliding frame 71 is slidably connected to the carrier 11 through a slider and a slide rail structure, and the sliding frame 71 can move closer to or away from the carrier 11. The feed tray 30 moves in the direction, the abutment plate 72 is used to abut against the material box 22, the first limit bar 73 is fixedly installed on the side of the sliding frame 71 facing the feed tray 30, and the second limit bar 74 is installed on the abutment plate 72. The first limit bar 73 and the second limit bar 74 cooperate to clamp the material box 22. The clamping cylinder 75 is located on the second limit bar 74, and the clamping cylinder 75 is used to abut one side of the material box 22 so as to clamp the other side of the material box 22 against the first limit bar 73.

[0072] Going a step further, combining Figure 2 and Figure 5 The stacking rack 20 is also provided with a clamping assembly 80 for pressing the material box 22 against the abutting plate 72, so that the material box 22 is not easily displaced on the feeding tray 30 under the cooperation of the clamping assembly 70 and the clamping assembly 80, thereby ensuring the stability of the material box 22, thereby facilitating the pushing assembly 60 to push out the crystal bracket 23 to be fixed in the material box 22.

[0073] The clamping assembly 80 includes a clamping cylinder 81 arranged along the length direction of the stacking rack 20 and a clamping block 82 arranged on the clamping cylinder 81. The clamping block 82 is arranged on the piston rod of the clamping cylinder 81, and the clamping block 82 is used to clamp the side wall of the material box 22.

[0074] After the material box pushing assembly 50 pushes the material box 22 onto the feeding tray 30, the pressing block 82 can press the material box 22 against the abutment plate 72 by controlling the action of the pressing cylinder 81. At this time, the clamping cylinder 75 is controlled to press against the material box 22, thereby fixing the four side walls of the material box 22, ensuring the stability of the material box 22 and making it difficult for the material box 22 to shift, thereby achieving smooth loading.

[0075] In addition, refer to Figure 8 In order to adapt to material boxes 22 of different sizes, in this embodiment, the second limit strip 74 can slide relative to the abutment plate 72, and the abutment plate 72 is provided with an adjusting member 76 for adjusting the sliding distance of the second limit strip 74 relative to the abutment plate 72. By driving the limit strip to slide and fixing the second limit strip 74 through the adjusting member 76, the distance between the first limit strip 73 and the second limit strip 74 can be adjusted, so that material boxes 22 of different sizes can be adapted.

[0076] Furthermore, the pushing assembly 60 includes a mounting plate 61 fixed on the carrier frame 11, a pushing cylinder 62 arranged on the mounting plate 61, and a push rod 63 arranged on the pushing cylinder 62. The mounting plate 61 is arranged in an L shape. The mounting plate 61 includes a first plate 611 arranged along the X-axis direction and a second plate 612 arranged along the Y-axis direction. The first plate 611 and the second plate 612 can be integrally formed or fixedly connected by bolts. The first plate 611 is fixedly mounted on the carrier frame 11, and the second plate 612 extends to one side of the feed tray 30. The pushing cylinder 62 is installed on the second plate 612. The pushing cylinder 62 is located on the side of the feeding push plate away from the feeding channel of the crystal bonding machine, and the push rod 63 is flush with the crystal bracket 23 to be bonded in the material box 22.

[0077] Further, refer to Figure 2 , Fig.10 and Fig.11 When all the crystal-bonding supports 23 in the material box 22 are pushed out by the pushing assembly 60, the material box 22 is now an empty material box 22. A material receiving rack 12 for collecting the empty material boxes 22 is provided between the stacking rack 20 and the base 10. A material receiving box 22 assembly for pushing the empty material boxes 22 from one end of the material receiving rack 12 to the other end is provided on the base 10.

[0078] The empty material box 22 is then moved down to the receiving rack 12, and the receiving rack 12 is driven by the receiving cylinder 92 to slide along the length direction of the receiving rack 12, thereby driving the empty material box 22 to move from one end of the receiving rack 12 to the other end of the receiving rack 12, thereby completing the storage and sorting of the empty material box 22.

[0079] In addition, in order to improve the feeding efficiency and feeding accuracy of the entire feeding mechanism, the feeding mechanism provided in this embodiment also includes a control mechanism, which is electrically connected to the suction cup material picking assembly 40, the material pushing box assembly 50, the material pushing assembly 60, the lifting assembly, the clamping assembly 70, the tightening assembly 80, and the material receiving box 22 assembly, and the stacking rack 20, the feeding tray 30 and the first limit bar 73 (which can also be the second limit bar 74 and the abutment plate 72) of the clamping assembly 70 are all provided with material sensing, and the support plate 41 and the Z-axis fixed seat 43 of the suction cup material picking assembly 40 and the carrier frame 11 are all provided with motor origin photoelectrics, and at the same time, the material pushing box assembly 50, the clamping assembly 70, the tightening assembly 80 and the material receiving box 22 assembly all include cylinder origin photoelectrics and cylinder in-position photoelectrics, and the material sensing, motor origin photoelectrics, cylinder origin photoelectrics and cylinder in-position photoelectrics are all electrically connected to the control mechanism. It should be noted that material presence sensing, motor origin photoelectric, cylinder origin photoelectric and cylinder in-position photoelectric are all conventional technical means in this field. Technical personnel in this field can set them at the corresponding positions of the feeding mechanism provided in this embodiment according to actual conditions, and no further details will be given here.

[0080] The working principle of the present invention is roughly as follows: when using the stacking loading mode for loading, the suction cup material picking assembly 40 will suck the crystal bracket 23 to be bonded placed on the material tray 21 into the feeding track 31 of the feeding tray 30 in sequence. At this time, the pushing assembly 60 will act to push the crystal bracket 23 to be bonded on the feeding track 31 into the feeding channel of the crystal bonding machine, thereby realizing stacking loading.

[0081] When using the material box loading mode, first, the feeding track 31 on the feeding tray 30 needs to be removed, and then the suction cup material picking assembly 40 is moved to the side of the feeding tray 30 away from the stacking rack 20, that is, the suction cup material picking assembly 40 does not participate in the loading. At this time, the material box 22 located on the stacking rack 20 is pushed onto the feeding tray 30 by the material pushing box assembly 50, and the material pushing assembly 60 then pushes the crystal bracket 23 to be bonded in the material box 22 into the feeding channel of the crystal bonding machine in sequence, thereby realizing the loading of the material box 22.

[0082] The above is only used to illustrate the technical solution of the present invention rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A novel semiconductor IC integrated circuit bracket feeding structure, characterized in that: It has a stacking feeding mode and a box feeding mode, and the feeding structure includes: Base (10); A material stacking rack (20) is disposed above the base (10) and is used to carry a material box (22) filled with supports (23) to be bonded or a material tray (21) on which the supports (23) to be bonded are stacked; A feeding tray (30) is arranged on one side of the stacking rack (20), can be vertically lifted and lowered along the Z-axis direction relative to the stacking rack (20), and has a detachable feeding track (31) on its top surface that is connected to the feeding channel of the crystal bonding machine; A suction cup material taking component (40) is arranged above the material stacking frame (20) and the material feeding tray (30), and is movable relative to the material stacking frame (20) along the X-axis direction and the Z-axis direction. In the material stacking loading mode, the suction cup material taking component (40) is used to sequentially suck the to-be-bonded crystal supports (23) stacked on the material tray (21) onto the material feeding track (31); a material pushing box assembly (50) disposed on the material stacking rack (20); in a material box (22) loading mode, the material pushing box assembly (50) is used to push the material box (22) filled with the crystal support (23) to be bonded onto the feeding tray (30); and A material pushing assembly (60) is arranged on a side of the feeding tray (30) away from the feeding channel of the crystal bonding machine, and is used to, in the material stacking mode, suck the crystal holder (23) to be bonded on the feeding track (31) by the suction cup material taking assembly (40) and push it into the feeding channel of the crystal bonding machine; or, in the material box loading mode, push the material pushing box assembly (50) from the material stacking rack (20) to the crystal holder (23) in the material box (22) on the feeding tray (30), and push them into the feeding channel of the crystal bonding machine in sequence; When the stacking loading mode is used for loading, the suction cup material taking component (40) sequentially sucks the to-be-bonded crystal supports (23) stacked on the material tray (21) onto the feeding track (31) of the feeding tray (30), and the pushing component (60) pushes the to-be-bonded crystal supports (23) on the feeding track (31) into the feeding channel of the crystal bonding machine, thereby realizing stacking loading; When using the material box loading mode to load materials, the feeding track (31) on the feeding tray (30) is removed, the suction cup material picking assembly (40) is moved to the side of the feeding tray (30) away from the stacking rack (20), the material box pushing assembly (50) pushes the material box (22) located on the stacking rack (20) onto the feeding tray (30), and the material pushing assembly (60) pushes the crystal bracket (23) to be bonded in the material box (22) into the feeding channel of the crystal bonding machine in sequence, thereby realizing the loading of the material box (22).

2. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: The suction cup material taking component (40) comprises a support plate (41) arranged on the base (10), an X-axis movable seat (42) slidably arranged on the support plate (41), a Z-axis fixed seat (43) fixedly arranged on the X-axis movable seat (42), a Z-axis lifting frame (44) slidably arranged on the Z-axis fixed seat (43), and a suction cup group (45) arranged on the Z-axis lifting frame (44), wherein the support plate (41) is arranged along the X-axis direction, and the support plate (41) is located above the stacking frame (20), the X-axis movable seat (42) can move left and right along the length direction of the support plate (41), the Z-axis fixed seat (43) is arranged along the Z-axis direction, and the Z-axis lifting frame (44) can move up and down along the length direction of the Z-axis fixed seat (43), and the suction cup group (45) is used to suck the to-be-bonded crystal supports (23) stacked and placed on the material tray (21).

3. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 2 is characterized in that: The suction cup material picking assembly (40) also includes an X-axis driving member (46) for driving the X-axis movable seat (42) to move left and right along the length direction of the support plate (41), and a Z-axis driving member (47) for driving the Z-axis lifting frame (44) to move up and down along the length direction of the Z-axis fixed seat (43).

4. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 3 is characterized in that: The X-axis driving member (46) comprises an X-axis screw rod (461) rotatably arranged on the support plate (41) and arranged along the length direction of the support plate (41), an X-axis nut seat (462) threadedly sleeved on the X-axis screw rod (461) and fixedly connected to the X-axis moving seat (42), an X-axis guide rail (463) arranged along the length direction of the support plate (41) and slidingly matched with the X-axis moving seat (42), and an X-axis driving motor (464) for driving the X-axis screw rod (461) to rotate; The Z-axis driving member (47) comprises a Z-axis screw rod (471) rotatably arranged on the Z-axis fixing seat (43) and arranged along the length direction of the Z-axis fixing seat (43), a Z-axis nut seat (472) threadedly sleeved on the Z-axis screw rod (471) and fixedly connected to the Z-axis lifting seat (113), a Z-axis guide rail (473) arranged along the length direction of the support plate (41) and slidably matched with the Z-axis lifting frame (44), and a Z-axis driving motor (474) for driving the Z-axis screw rod (471) to rotate.

5. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: The pushing box assembly (50) includes a pushing frame (51) slidably arranged on the stacking frame (20), a pushing block (52) arranged on the pushing frame (51), and a pushing box cylinder (53) for driving the pushing frame (51) to move toward or away from the feeding tray (30). The pushing frame (51) can slide along the length direction of the stacking frame (20) toward or away from the feeding tray (30). The pushing block (52) protrudes from the stacking frame (20) and abuts against the material box (22) filled with the crystal support (23) to be fixed. The pushing box cylinder (53) is arranged along the length direction of the stacking frame (20), and the piston rod of the pushing box cylinder (53) is fixedly connected to the pushing frame (51).

6. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: A support frame (11) for supporting a feeding tray (30) is vertically arranged on the base (10); the feeding tray (30) is slidably arranged on the side wall of the support frame (11); a lifting component is provided on the support frame (11) for driving the feeding tray (30) to vertically lift and lower relative to the base (10), so that in the material box loading mode, the pushing component (60) can push the crystal support (23) to be bonded in the material box (22) into the feeding channel of the crystal bonding machine in sequence; The lifting assembly comprises a vertical slot (111) vertically opened on the carrier frame (11), a lifting screw rod (112) rotatably arranged in the vertical slot (111), a lifting seat (113) threadedly connected to the lifting screw rod (112), and a lifting motor (114) for driving the lifting screw rod (112) to rotate. A vertical guide rail (115) slidably matched with the lifting seat (113) is also arranged in the vertical slot (111). The feeding tray (30) is fixedly connected to the lifting seat (113), so that when the lifting motor (114) drives the lifting screw rod (112) to rotate, the lifting seat (113) can drive the feeding tray (30) to be vertically lifted relative to the base (10).

7. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 6 is characterized in that: The carrier frame (11) is provided with a clamping assembly (70) for clamping the material box (22) so that the material box (22) can be stably located on the feeding tray (30); The clamping assembly (70) comprises a sliding frame (71) slidably arranged on the top surface of the supporting frame (11), an abutting plate (72) arranged on the side of the sliding frame (71) close to the feeding tray (30), a first limiting strip (73) and a second limiting strip (74) respectively arranged on the sliding frame (71) and the abutting plate (72), and a clamping cylinder (75) arranged on the second limiting strip (74); the sliding frame (71) can move relative to the supporting frame (11) in a direction close to or away from the feeding tray (30); the abutting plate (72) is used to abut against the material box (22); the first limiting strip (73) and the second limiting strip (74) cooperate to clamp the material box (22); and the clamping cylinder (75) is used to abut one side of the material box (22) so as to abut the other side of the material box (22) against the first limiting strip (73).

8. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 6 is characterized in that: The stacking rack (20) is also provided with a clamping assembly (80) for clamping the material box (22) against the abutment plate (72). The clamping assembly (80) comprises a clamping cylinder (81) arranged along the length direction of the stacking rack (20) and a clamping block (82) arranged on the clamping cylinder (81). When the pushing assembly (60) pushes the material box (22) from the stacking rack (20) to the feeding tray (30), the clamping cylinder (81) is actuated to clamp the material box (22) against the abutment plate.

9. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: The pushing assembly (60) comprises a mounting plate (61) fixed on the carrier (11), a pushing cylinder (62) arranged on the mounting plate (61), and a pushing rod (63) arranged on the pushing cylinder (62); the pushing cylinder (62) is located on a side of the feeding push plate away from the feeding channel of the crystal bonding machine, and the pushing rod (63) is flush with the crystal bonding bracket (23) to be bonded in the material box (22).

10. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: A material receiving rack (12) for collecting empty material boxes (22) is provided between the material stacking rack (20) and the base (10); a material receiving box (22) assembly for pushing the empty material boxes (22) from one end of the material receiving rack (12) to the other end is provided on the base (10); The material receiving box (22) assembly comprises a movable frame (91) slidably arranged on a base (10) and a material receiving cylinder (92) for driving the movable frame (91) to move toward or away from the material receiving frame (12); the movable frame (91) is used to push the empty material box (22) to move along the length direction of the material receiving frame (12), so that the empty material box (22) can be pushed from one end of the material receiving frame (12) to the other end of the material receiving frame (12).

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