Bus duct connection structure with intensive cooling fins

Abstract

The invention discloses a bus duct connection structure with intensive cooling fins. The bus duct connection structure comprises a duct body and a connection assembly used for cooling a bus board and installing the bus board in the duct body. The connecting assembly comprises a plurality of first heat-conducting rubber plates fixed at the bottom in the wire groove body, placement grooves are formed in the first heat-conducting rubber plates in a penetrating mode, arc-shaped grooves are formed in the bottom of the second heat-conducting rubber plates, and the arc-shaped grooves abut against the upper ends of the bus plates; a heat dissipation assembly; the heat dissipation assembly comprises a circulating water tank installed at the bottom in the wire groove body, and the circulating water tank is provided with a pumping mechanism used for pumping clear water to the multiple first heat conduction rubber plates and conducting heat exchange on the bus plate. According to the heat dissipation assembly, work of the water pump and the refrigeration part can be controlled by utilizing temperature evaporation as power through the evaporation liquid, heat dissipation can be reasonably and effectively conducted on the bus board so that it can be guaranteed that the bus board is in a safe and stable environment, when the temperature in the wire groove body is reduced, power failure of the water pump and the refrigeration part can be achieved, and energy consumption of the heat dissipation assembly can be reduced.

Description

Technical Field

[0001] The invention relates to the technical field of intensive bus ducts, and in particular to a heat sink intensive bus duct connection structure. Background Art

[0002] Bus duct is a closed metal device composed of copper and aluminum busbars, which is used to distribute high power to various components of the distributed system. It has increasingly replaced wires and cables in indoor low-voltage power transmission trunk line projects.

[0003] The prior art publication number is CN216355885U, which is a dense bus duct with heat sinks, including a sealing cover, a duct body and adjustment legs. The sealing cover is clamped on the top of the duct body, and multiple adjustment legs are installed on the left and right sides of the duct body. The bottom of the duct body is installed with multiple heat sinks extending into the interior thereof, a first spherical shell is provided on the top of the heat sink, an air inlet is provided at the bottom of the heat sink, a ventilation groove is provided in the heat sink, and a heat dissipation mechanism is provided on the sealing cover. The heat dissipation mechanism includes: a liquid storage tube, a second spherical shell and a heat dissipation ring. The liquid storage tube is installed on the lower side of the sealing cover, and the liquid storage tube is welded by multiple U-shaped tubes. Multiple second spherical shells connected to the liquid storage tube are provided on the lower side of the liquid storage tube, and multiple heat dissipation rings extending to the top of the sealing cover are provided on the upper side of the liquid storage tube.

[0004] The deficiency of the above-mentioned prior art is that heat is absorbed by the water in the liquid storage tube and the second spherical shell, and the water after absorbing heat transfers the heat to the heat dissipation ring, and the heat dissipation ring dissipates the heat into the air, thereby reducing the temperature in the main body of the cable duct. The heat transfer and heat dissipation effect through air as the medium is not good, and a large amount of heat accumulates in the main body of the cable duct, posing certain safety hazards. For this reason, the present application proposes a heat sink-intensive bus duct connection structure. Summary of the invention

[0005] The purpose of the present invention is to solve the above technical problems and to propose a heat sink intensive bus duct connection structure.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A heat sink-intensive bus duct connection structure, comprising a duct body, an upper cover is installed on the upper end of the duct body, a plurality of heat dissipation fins are fixed on the upper end of the upper cover, a plurality of first connecting plates and a plurality of second connecting plates are installed at both ends of the duct body, and a plurality of bus plates connected to the first connecting plates and the second connecting plates are installed in the duct body;

[0008] A connection component for dissipating heat from the busbar and installing it in the line slot body; the connection component comprises a plurality of first heat-conducting rubber plates fixed to the bottom of the line slot body, a placement groove is provided on the first heat-conducting rubber plate, the first heat-conducting rubber plate is hollow inside, the busbar is installed in the placement groove, a plurality of second heat-conducting rubber plates are fixed to the bottom of the upper cover, an arc groove is provided on the bottom of the second heat-conducting rubber plate, and the arc groove abuts against the upper end of the busbar;

[0009] Heat dissipation component; the heat dissipation component includes a circulating water tank installed at the bottom of the line slot body, and the circulating water tank is equipped with a pumping mechanism for pumping clean water to multiple first heat-conducting rubber plates to exchange heat for the busbar.

[0010] Preferably, the upper cover is provided with a plurality of through holes, the upper end of the wire trough body is provided with a plurality of bolt holes, bolts are passed through the through holes, and the bolts are threadedly engaged with the bolt holes to fasten the upper cover to the wire trough body.

[0011] Preferably, the pumping mechanism includes a water pump installed on a circulating water tank, the water inlet end of the water pump is connected to the circulating water tank through a short tube, the water outlet end of the water pump is installed with an outlet pipe, the other end of the outlet pipe is connected with a first shunt pipe, a plurality of first short tubes are fixed on the first shunt pipe, the first short tube is communicated with a first heat-conducting rubber plate, a return pipe is installed on the circulating water tank, a second shunt pipe is fixed on the return pipe, a plurality of second short tubes are fixed on the second shunt pipe, the second short tubes are connected with the first heat-conducting rubber plate, and the first shunt pipe and the second shunt pipe are arranged at both ends of the first heat-conducting rubber plate.

[0012] Preferably, it also includes a refrigeration mechanism, which includes a refrigeration component installed through the circulating water tank, the refrigeration component is a semiconductor refrigeration plate, the refrigeration end of the semiconductor refrigeration plate is located inside the circulating water tank, and the heating end of the semiconductor refrigeration plate is installed with a radiator.

[0013] Preferably, it also includes a dispersion mechanism, which includes a sleeve installed in the circulating water tank and connected to the return pipe, a support block is fixedly connected in the sleeve, a shaft rod is passed through the support block and is rotatably connected to the support block, a plurality of stirring rods are fixedly connected to the shaft rod located outside the sleeve, a mounting block is fixed to the other end of the shaft rod, and a plurality of spiral blades are fixed to the mounting block.

[0014] Preferably, it also includes a sealing mechanism for sealing between the upper cover and the wire trough body, the sealing mechanism includes a support frame fixed to the inner wall of the wire trough body, a hollow rubber frame is fixed to the upper end of the support frame, and an extrusion frame is fixed to the bottom of the upper cover, and the extrusion frame is arranged to abut against the hollow rubber frame.

[0015] Preferably, it also includes a control mechanism that can use the temperature in the wire slot body to control the operation of the water pump and the refrigeration component, the control mechanism includes a positioning block fixed to the bottom of the wire slot body, a piston cylinder is fixed on the positioning block, a movable piston is slidably connected in the piston cylinder, a driving rod is fixed on the movable piston, a sliding block that slides at the bottom of the wire slot body is fixed on the driving rod, an installation groove is provided on the sliding block, and a first switch and a second switch that respectively control the power supply operation of the water pump and the refrigeration component are installed on the inner wall of the installation groove and the inner wall of the wire slot body.

[0016] Preferably, the piston cylinder is connected to the hollow rubber frame through a connecting pipe, and both the piston cylinder and the hollow rubber frame are filled with evaporative liquid.

[0017] Preferably, the first switch includes a first brush insulated and installed on the inner wall of the installation slot, a first electric contact is fixed to the inner wall of the wire slot body, the first brush is matched with the first electric contact, and the first brush and the first electric contact are electrically connected to the water pump.

[0018] Preferably, the second switch includes a second brush insulated and mounted on the inner wall of the mounting slot, a second electric contact is fixed to the inner wall of the wire slot body, the second brush is matched with the second electric contact, and the second brush and the second electric contact are electrically connected to the refrigeration component.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The heat dissipation fins cannot meet the heat dissipation requirements of the busbar, which will cause the heat between the wire trough body and the upper cover to increase. The heat increase will cause the evaporative liquid in the piston cylinder and the hollow rubber frame to evaporate, thus causing the internal pressure of the hollow rubber frame to increase and expand, further increasing the pressure between the extrusion frame and ensuring the sealing between the upper cover and the wire trough body.

[0021] 2. The evaporative liquid evaporates into gas, which increases the pressure in the piston cylinder, thereby driving the movable piston to move. The movement of the movable piston drives the drive rod and the slider to move. The movement of the slider drives the first brush and the second brush to move. As the slider moves, the first brush first contacts the first electrical contact, so that the water pump is energized without the need for additional power equipment.

[0022] 3. When the water pump is powered on, the water in the circulating water tank can be transported to the first shunt pipe through the outlet pipe, and then transported to the first thermally conductive rubber plate through multiple first short pipes. After the first thermally conductive rubber plate is filled with clean water, it flows into the second shunt pipe through the second short pipe, and finally flows into the circulating water tank through the return pipe to realize water circulation. In this way, the busbar can be water-cooled and the heat dissipation can be combined with the heat dissipation fins to further improve the heat dissipation effect of the busbar.

[0023] 4. If the heat dissipation of the busbar is still not enough, the evaporation amount of the evaporative liquid increases, and the movable piston continues to be driven to move, so that the second brush and the second electric contact are offset. At this time, the first brush and the first electric contact are still in contact. At this time, the refrigeration component is powered on to cool the water in the circulating water tank, so that the temperature of the water flowing into the first heat-conducting rubber plate is reduced, and the heat dissipation of the busbar can be more efficient to ensure that the busbar is in a safe and stable environment.

[0024] 5. As the temperature of the busbar and the temperature inside the wire trough decrease, the evaporating liquid liquefies into liquid, causing the pressure inside the piston cylinder to decrease and the movable piston to reset. In this way, the first brush and the first electric contact are separated, the second brush and the second electric contact are separated, and the water pump and the refrigeration component are powered off, thereby reducing the energy consumption of the heat dissipation component.

[0025] To sum up, the present invention can control the operation of the water pump and the refrigeration components by utilizing the temperature evaporation of the evaporative liquid as the power, and can reasonably and effectively dissipate the heat of the busbar to ensure that it is in a safe and stable environment. When the temperature inside the cable tray body drops, the water pump and the refrigeration components can be powered off, thereby reducing the energy consumption of the heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic structural diagram of a heat sink-intensive bus duct connection structure proposed by the present invention;

[0027] Figure 2 A bottom view of a heat sink-intensive bus duct connection structure proposed by the present invention;

[0028] Figure 3 A schematic diagram of the structure of a pumping mechanism in a heat sink-intensive bus duct connection structure proposed by the present invention;

[0029] Figure 4 A schematic diagram of the structure of a heat sink in a heat sink-intensive bus duct connection structure proposed by the present invention;

[0030] Figure 5 A schematic diagram of the structure of the bushing in a heat sink-intensive bus duct connection structure proposed by the present invention;

[0031] Figure 6 This is a disassembled diagram of the bushing in a heat sink-intensive bus duct connection structure proposed by the present invention;

[0032] Figure 7 A schematic diagram of the structure inside a bus duct body of a heat sink-intensive bus duct connection structure proposed by the present invention;

[0033] Figure 8 A schematic diagram of the structure of a busbar in a heat sink-intensive busbar duct connection structure proposed by the present invention;

[0034] Fig. 9 This is a schematic structural diagram of a sealing mechanism located in a bus duct body in a heat sink-intensive bus duct connection structure proposed by the present invention;

[0035] Fig.10 A schematic structural diagram of a sealing mechanism in a heat sink-intensive bus duct connection structure proposed by the present invention;

[0036] Fig.11 This is a schematic structural diagram of a piston cylinder in a heat sink-intensive bus duct connection structure proposed by the present invention;

[0037] Fig.12 This is a disassembled diagram of the piston cylinder in a heat sink-intensive bus duct connection structure proposed by the present invention.

[0038] In the figure: 1 line trough body, 2 upper cover, 3 first connecting plate, 4 second connecting plate, 5 heat dissipation fin, 6 circulating water tank, 7 refrigeration component, 8 water outlet pipe, 9 return pipe, 10 water pump, 11 first shunt pipe, 12 first short pipe, 13 second shunt pipe, 14 second short pipe, 15 radiator, 16 sleeve, 17 shaft rod, 18 stirring rod, 19 support block, 20 mounting block, 21 spiral blade, 22 busbar, 23 first heat-conducting rubber plate, 24 second heat-conducting rubber plate, 25 placement groove, 26 arc groove, 27 support frame, 28 piston cylinder, 29 hollow rubber frame, 30 extrusion frame, 31 connecting pipe, 32 positioning block, 33 driving rod, 34 slider, 35 mounting groove, 36 first brush, 37 second brush, 38 first electric contact sheet, 39 second electric contact sheet, 40 moving piston. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0040] Reference Figure 1-Figure 12 A heat sink-intensive bus duct connection structure includes a duct body 1, an upper cover 2 is installed on the upper end of the duct body 1, a plurality of through holes are penetrated on the upper cover 2, a plurality of bolt holes are provided on the upper end of the duct body 1, bolts are penetrated in the through holes, and the bolts are threadedly engaged with the bolt holes to fasten the upper cover 2 to the duct body 1.

[0041] In order to ensure the sealing between the upper cover 2 and the wire trough body 1, a sealing mechanism for sealing between the upper cover 2 and the wire trough body 1 is also included. The sealing mechanism includes a support frame 27 fixed to the inner wall of the wire trough body 1, and a hollow rubber frame 29 is fixed to the upper end of the support frame 27. An extrusion frame 30 is fixed to the bottom of the upper cover 2, and the extrusion frame 30 is set against the hollow rubber frame 29.

[0042] A plurality of heat dissipating fins 5 are fixed to the upper end of the upper cover 2, a plurality of first connecting plates 3 and a plurality of second connecting plates 4 are respectively installed at both ends of the wire trough body 1, a plurality of busbars 22 connected to the first connecting plates 3 and the second connecting plates 4 are installed in the wire trough body 1, and the heat generated by the busbars 22 can be dissipated through the heat dissipating fins 5.

[0043] A connection component for dissipating heat from the busbar 22 and installing it in the line slot body 1; the connection component includes a plurality of first heat-conducting rubber plates 23 fixed to the bottom of the line slot body 1, a placement groove 25 is penetrated through the first heat-conducting rubber plates 23, the interior of the first heat-conducting rubber plates 23 is hollow, the busbar 22 is installed in the placement groove 25, a plurality of second heat-conducting rubber plates 24 are fixed to the bottom of the upper cover 2, an arc groove 26 is provided at the bottom of the second heat-conducting rubber plates 24, the arc groove 26 is against the upper end of the busbar 22, the second heat-conducting rubber plates 24 can transfer heat to the upper cover 2, and then transfer the heat to the plurality of heat dissipating fins 5 through the upper cover 2, so that the busbar 22 can be efficiently dissipated.

[0044] Heat dissipation assembly; The heat dissipation assembly includes a circulating water tank 6 installed at the bottom of the line slot body 1, and a pumping mechanism for pumping clean water to multiple first heat-conducting rubber plates 23 to exchange heat with the busbar 22 is installed on the circulating water tank 6. The pumping mechanism includes a water pump 10 installed on the circulating water tank 6, and the water inlet end of the water pump 10 is connected to the circulating water tank 6 through a short pipe. The water outlet end of the water pump 10 is installed with a water outlet pipe 8, and the other end of the water outlet pipe 8 is connected to a first shunt pipe 11, and multiple first short pipes 12 are fixed on the first shunt pipe 11. The first The short tube 12 is connected to the first heat-conducting rubber plate 23, a return pipe 9 is installed on the circulating water tank 6, a second shunt pipe 13 is fixed on the return pipe 9, a plurality of second short tubes 14 are fixed on the second shunt pipe 13, the second short tube 14 is connected to the first heat-conducting rubber plate 23, the first shunt pipe 11 and the second shunt pipe 13 are arranged at both ends of the first heat-conducting rubber plate 23, so that clean water can be transported to the first heat-conducting rubber plate 23 for water-cooling and heat dissipation of the busbar 22, and finally refluxed to the circulating water tank 6.

[0045] As the busbar 22 is exchanged with heat, the temperature of the clean water increases. If the clean water is not treated, the water cooling effect will be greatly reduced. For this reason, a refrigeration mechanism is also included. The refrigeration mechanism includes a refrigeration component 7 installed through the circulating water tank 6. The refrigeration component 7 is a semiconductor refrigeration plate. The refrigeration end of the semiconductor refrigeration plate is located inside the circulating water tank 6 and is used to cool and cool the circulating clean water. A radiator 15 is installed at the heating end of the semiconductor refrigeration plate. The radiator 15 can dissipate heat to the refrigeration component 7 to ensure its stable operation.

[0046] When the circulated clean water flows back into the circulating water tank 6, in order to ensure that the water after heat exchange is evenly dispersed in the circulating water tank 6, a dispersion mechanism is also included. The dispersion mechanism includes a sleeve 16 installed in the circulating water tank 6 and connected to the return pipe 9. A support block 19 is fixedly connected to the sleeve 16. A shaft rod 17 rotatably connected to the support block 19 is penetrated by the support block 19. A plurality of stirring rods 18 are fixedly connected to the shaft rod 17 located outside the sleeve 16. A mounting block 20 is fixed to the other end of the shaft rod 17, and a plurality of spiral blades 21 are fixed to the mounting block 20.

[0047] When there is no need to dissipate heat for the busbar 22, that is, the heat dissipation fins 5 can meet the heat dissipation requirements, the water pump 10 and the refrigeration component 7 are no longer needed. Therefore, a control mechanism is also included that can use the temperature in the line slot body 1 to control the operation of the water pump 10 and the refrigeration component 7. The control mechanism includes a positioning block 32 fixed to the bottom of the line slot body 1, and a piston cylinder 28 is fixed on the mounting block 32. The piston cylinder 28 is connected to the hollow rubber frame 29 through a connecting pipe 31, and the piston cylinder 28 and the hollow rubber frame 29 are both filled with evaporative liquid, and the evaporative liquid can be diaminomethane (boiling point is 39.75°C).

[0048] A movable piston 40 is slidably connected in the piston cylinder 28, a driving rod 33 is fixed on the movable piston 40, a slider 34 sliding on the bottom of the line slot body 1 is fixed on the driving rod 33, a mounting groove 35 is provided on the slider 34, and a first switch and a second switch for respectively controlling the power supply of the water pump 10 and the refrigeration component 7 are installed on the inner wall of the mounting groove 35 and the inner wall of the line slot body 1, the first switch includes a first brush 36 insulated and installed on the inner wall of the mounting groove 35, a first electric contact 38 is fixed on the inner wall of the line slot body 1, the first brush 36 is matched with the first electric contact 38, and the first brush 36 and the first electric contact 38 are electrically connected to the water pump 10, the second switch includes a second brush 37 insulated and installed on the inner wall of the mounting groove 35, a second electric contact 39 is fixed on the inner wall of the line slot body 1, the second brush 37 is matched with the second electric contact 39, and the second brush 37 and the second electric contact 39 are electrically connected to the refrigeration component 7.

[0049] When the present invention is used, the wire trough body 1 and the upper cover 2 are installed as described above, and the extrusion frame 30 is now against the hollow rubber frame 29, so that the sealing between the upper cover 2 and the wire trough body 1 can be ensured, and the evaporation liquid in the hollow rubber frame 29 is transported to the piston cylinder 28 through the connecting pipe 31;

[0050] As the busbar 22 is used, the busbar 22 generates heat, which can be transferred to the upper cover 2 through the second heat-conducting rubber sheet 24, and then transferred to the plurality of heat dissipation fins 5 through the upper cover 2, so that the busbar 22 can be cooled;

[0051] If the heat dissipation fins 5 cannot meet the requirements of the heat dissipation of the busbar 22, the heat between the wire trough body 1 and the upper cover 2 will increase, and the heat increase will cause the evaporation liquid in the piston cylinder 28 and the hollow rubber frame 29 to evaporate, thus causing the internal pressure of the hollow rubber frame 29 to increase and expand, further increasing the pressure between the extrusion frame 30, thereby ensuring the sealing between the upper cover 2 and the wire trough body 1;

[0052] The evaporation liquid evaporates and becomes gas, which increases the pressure in the piston cylinder 28, thereby driving the movable piston 40 to move. The movement of the movable piston 40 drives the drive rod 33 and the slider 34 to move. The movement of the slider 34 drives the first brush 36 and the second brush 37 to move. As the slider 34 moves, the first brush 36 at this time first abuts against the first electrical contact 38, so that the water pump 10 is energized. When the water pump 10 is energized, the water in the circulating water tank 6 can be transported to the first shunt pipe 11 through the water outlet pipe 8, and then transported to the first heat-conducting rubber plate 23 through multiple first short pipes 12. After the clean water fills the first heat-conducting rubber plate 23, it flows to the second shunt pipe 13 through the second short pipe 14, and finally flows to the circulating water tank 6 through the return pipe 9, realizing water circulation. In this way, the busbar 22 can be water-cooled and the heat dissipation is comprehensively performed with the heat dissipation fins 5, further improving the heat dissipation effect of the busbar 22;

[0053] If the heat dissipation of the busbar 22 is still not satisfied, the evaporation amount of the evaporative liquid increases, and the movable piston 40 is continuously driven to move, so that the second brush 37 is against the second electric contact piece 39, and the first brush 36 is still in contact with the first electric contact piece 38 at this time. At this time, the refrigeration element 7 is powered on to work, and the water in the circulating water tank 6 can be cooled, so that the temperature of the water flowing into the first heat-conducting rubber plate 23 is reduced, and the heat dissipation of the busbar 22 can be more efficiently performed to ensure that the busbar 22 is in a safe and stable environment;

[0054] As the temperature of the busbar 22 and the temperature inside the wire slot body 1 decrease, the evaporative liquid liquefies into liquid, causing the pressure inside the piston cylinder 28 to decrease and the movable piston 40 to reset. In this way, the first brush 36 and the first electrical contact 38 are separated, the second brush 37 and the second electrical contact 39 are separated, and the water pump 10 and the refrigeration component 7 are powered off, thereby reducing the energy consumption of the heat dissipation component.

[0055] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A heat sink-intensive bus duct connection structure, comprising a bus duct body (1), characterized in that: An upper cover (2) is installed at the upper end of the wire trough body (1), a plurality of heat dissipation fins (5) are fixed to the upper end of the upper cover (2), a plurality of first connecting plates (3) and a plurality of second connecting plates (4) are installed at both ends of the wire trough body (1), and a plurality of busbars (22) connected to the first connecting plates (3) and the second connecting plates (4) are installed inside the wire trough body (1); A connection assembly for dissipating heat from a busbar (22) and installing it in a line trough body (1); the connection assembly comprises a plurality of first heat-conducting rubber plates (23) fixed to the bottom of the line trough body (1); a placement groove (25) is provided through the first heat-conducting rubber plates (23); the first heat-conducting rubber plates (23) are hollow inside; the busbar (22) is installed in the placement groove (25); a plurality of second heat-conducting rubber plates (24) are fixed to the bottom of the upper cover (2); an arc groove (26) is provided at the bottom of the second heat-conducting rubber plates (24); the arc groove (26) abuts against the upper end of the busbar (22); A heat dissipation component; the heat dissipation component comprises a circulating water tank (6) installed at the bottom of the line trough body (1), and the circulating water tank (6) is equipped with a pumping mechanism for pumping clean water to a plurality of first heat-conducting rubber plates (23) to exchange heat with the busbar (22).

2. The heat sink-intensive bus duct connection structure according to claim 1, characterized in that: The upper cover (2) is provided with a plurality of through holes, the upper end of the wire trough body (1) is provided with a plurality of bolt holes, bolts are provided through the through holes, and the bolts are threadedly engaged with the bolt holes to fasten the upper cover (2) to the wire trough body (1).

3. The heat sink-intensive bus duct connection structure according to claim 1, characterized in that: The pumping mechanism comprises a water pump (10) mounted on a circulating water tank (6); a water inlet end of the water pump (10) is connected to the circulating water tank (6) via a short pipe; a water outlet end of the water pump (10) is mounted with a water outlet pipe (8); the other end of the water outlet pipe (8) is connected with a first shunt pipe (11); a plurality of first short pipes (12) are fixed on the first shunt pipe (11); the first short pipe (12) is connected with a first heat-conducting rubber plate (23); a return pipe (9) is mounted on the circulating water tank (6); a second shunt pipe (13) is fixed on the return pipe (9); a plurality of second short pipes (14) are fixed on the second shunt pipe (13); the second short pipes (14) are connected with the first heat-conducting rubber plate (23); the first shunt pipe (11) and the second shunt pipe (13) are arranged at both ends of the first heat-conducting rubber plate (23).

4. The heat sink-intensive bus duct connection structure according to claim 3, characterized in that: It also includes a refrigeration mechanism, which includes a refrigeration component (7) installed through the circulating water tank (6), the refrigeration component (7) is a semiconductor refrigeration plate, the refrigeration end of the semiconductor refrigeration plate is located inside the circulating water tank (6), and the heating end of the semiconductor refrigeration plate is installed with a radiator (15).

5. The heat sink-intensive bus duct connection structure according to claim 3, characterized in that: The invention also comprises a dispersion mechanism, the dispersion mechanism comprising a sleeve (16) installed in the circulating water tank (6) and connected to the return pipe (9), a support block (19) fixedly connected inside the sleeve (16), a shaft (17) rotatably connected to the support block (19) passing through the support block (19), a plurality of stirring rods (18) fixedly connected to the shaft (17) located outside the sleeve (16), a mounting block (20) fixedly connected to the other end of the shaft (17), a plurality of spiral blades (21) fixedly connected to the mounting block (20).

6. The heat sink-intensive bus duct connection structure according to claim 4, characterized in that: It also includes a sealing mechanism for sealing between the upper cover (2) and the wire trough body (1), the sealing mechanism including a support frame (27) fixed to the inner wall of the wire trough body (1), a hollow rubber frame (29) fixed to the upper end of the support frame (27), an extrusion frame (30) fixed to the bottom of the upper cover (2), and the extrusion frame (30) and the hollow rubber frame (29) are arranged to abut against each other.

7. The heat sink-intensive bus duct connection structure according to claim 6, characterized in that: The invention also comprises a control mechanism capable of controlling the operation of a water pump (10) and a refrigeration component (7) by utilizing the temperature in the wire trough body (1), wherein the control mechanism comprises a positioning block (32) fixed to the bottom of the wire trough body (1), a piston cylinder (28) fixed to the positioning block (32), a movable piston (40) slidably connected to the piston cylinder (28), a driving rod (33) fixed to the movable piston (40), a sliding block (34) slidably connected to the bottom of the wire trough body (1) fixed to the driving rod (33), a mounting groove (35) provided on the sliding block (34), and a first switch and a second switch respectively controlling the operation of the water pump (10) and the refrigeration component (7) by powering on the inner wall of the mounting groove (35) and the inner wall of the wire trough body (1) being installed.

8. The heat sink-intensive bus duct connection structure according to claim 7, characterized in that: The piston cylinder (28) is connected to the hollow rubber frame (29) via a connecting pipe (31), and both the piston cylinder (28) and the hollow rubber frame (29) are filled with evaporative liquid.

9. The heat sink-intensive bus duct connection structure according to claim 7, characterized in that: The first switch comprises a first brush (36) insulated and mounted on the inner wall of the mounting groove (35); a first electric contact (38) is fixed to the inner wall of the wire groove body (1); the first brush (36) and the first electric contact (38) are arranged in coordination with each other, and the first brush (36) and the first electric contact (38) are electrically connected to the water pump (10).

10. The heat sink-intensive bus duct connection structure according to claim 7, characterized in that: The second switch comprises a second brush (37) insulated and mounted on the inner wall of the mounting groove (35); a second electric contact piece (39) is fixed to the inner wall of the wire groove body (1); the second brush (37) and the second electric contact piece (39) are arranged in coordination with each other, and the second brush (37) and the second electric contact piece (39) are electrically connected to the refrigeration component (7).

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