High-frequency heating full-automatic plate bonding machine

Abstract

The invention provides a high-frequency heating full-automatic plate sticking machine which comprises a feeding mechanism, a high-frequency heating mechanism, a waste plate removing mechanism, a cooling mechanism, a gluing mechanism, a resin plate feeding mechanism and a curing warehouse which are sequentially arranged in the conveying direction of a material base and further comprises a conveying mechanism, and the conveying mechanism comprises a conveying line and a carrying mechanism. According to the invention, the processes of heating and separation of the material base and the waste resin plate, material base residual glue treatment, material base cooling, material base gluing, new resin plate bonding, curing, storage and the like are realized, manpower reduction and automation are realized, the production efficiency is improved, and the labor intensity and the production cost are reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of photovoltaics, and in particular relates to a high-frequency heating fully automatic board gluing machine. Background Art

[0002] Before processing silicon wafers, the silicon rod needs to be bonded to the material plate, and then the material plate is bonded to the material holder. After that, the material holder is clamped to the wire cutting machine for cutting. After the cutting is completed, the silicon wafer is first separated from the material plate, and finally the material plate and the material holder are separated. At present, the method for separating the material plate and the material holder is generally the water bath heating separation method. The principle is to heat the epoxy resin glue between the bonding material plate and the material holder to a certain temperature through the water bath heating method, so that it softens and loses its bonding ability, and finally the material plate and the material holder are separated. The main disadvantages of this method are: 1) The water bath heating process consumes a lot of energy, and it often takes 60-90 minutes to heat. The water temperature needs to be kept between 90-100°C. The heating time will be longer, the energy consumption will be greater, the heating will be uneven, and there will be higher requirements for labor protection of personnel; 2) It is necessary to set up multiple handling mechanisms and multiple manipulators to work simultaneously to complete the transmission of the material holder, which is complicated to operate and difficult to collaborate.

[0003] 3) The curing operation is set up on the production line, and the time requirement of the curing operation affects the overall production efficiency.

[0004] 4) After curing, the resin plate and the material holder need to be transferred several times before use, which affects the bonding quality of the resin plate and the material holder. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a high-frequency heating fully automatic board gluing machine, which has a fast heating process, uniform heating, and high safety; the linkage is precise, the response is rapid, the number of workers is reduced, and the production efficiency is improved.

[0006] The technical solution adopted by the present invention is: a high-frequency heating fully automatic board gluing machine, comprising a feeding mechanism, a high-frequency heating mechanism, a waste board removing mechanism, a cooling mechanism, a gluing mechanism, a resin board feeding mechanism and a curing warehouse which are sequentially arranged along the transmission direction of the material holder, wherein: The feeding mechanism is used to carry the material holder with the waste resin plate stuck on it; The high-frequency heating mechanism is used to perform high-frequency heating on the material holder with the waste resin plate adhered thereto to soften the adhesive; The curing warehouse is used to cure the new resin plate on the material holder and store the material holder bonded with the new resin plate; It also includes a transmission mechanism, which includes a transmission line and a conveying mechanism. The conveying mechanism is erected above the waste plate removal mechanism and the cooling mechanism. The transmission line is aligned with the conveying mechanism and connected to the feeding mechanism and the high-frequency heating mechanism, and the resin plate feeding mechanism and the curing warehouse, respectively.

[0007] Furthermore, the loading mechanism includes a storage rack storing a plurality of material holders with waste resin plates adhered thereto and a loading robot, the storage rack being adjacent to the automatic loading port of the transmission line, whereby the loading robot clamps the material holders with waste resin plates adhered thereto and places them in the automatic loading port.

[0008] Furthermore, the high-frequency heating mechanism includes a box, a high-frequency heating component, a transverse movement component, an exhaust mechanism, an exhaust gas treatment mechanism and a spray mechanism; wherein, The transmission line passes through the box; The high-frequency heating component includes an induction coil and a heating main unit, which is used to generate an induction magnetic field to heat the material holder bonded with the resin plate to soften the adhesive; The traverse assembly is connected to the induction coil and is used to move the induction coil along the length direction of the material holder to which the resin plate is bonded; The spray mechanism is connected to an external water source through a circulation pipeline and is used to spray liquid onto the material holder to which the resin plate is bonded to cool it down; The exhaust mechanism and the waste gas treatment mechanism are connected to the box body and are used to treat and discharge the irritating gas in the box body.

[0009] Furthermore, the waste plate removal mechanism includes a plate removing mechanism, a glue scraping mechanism and a polishing mechanism. By means of the lifting, clamping and moving actions of the conveying jaws of the conveying mechanism, the material holder with the waste resin plate adhered thereto that has been heated at high temperature is successively transported to the plate removing mechanism, the glue scraping mechanism and the polishing mechanism to remove the residual glue on the surface of the waste resin plate and the material holder.

[0010] Furthermore, the polishing mechanism includes a polishing lateral moving device, a polishing lifting device and a polishing device, the polishing lifting device is arranged on the polishing lateral moving device, and the polishing device is connected to the polishing lifting device to facilitate the lateral movement and lifting movement of the polishing device; the polishing device includes a rotary drive and a polishing head, the rotary drive drives the polishing head to rotate to remove the residual glue on the surface of the material seat.

[0011] Furthermore, the cooling mechanism includes a plurality of cold water tanks, air drying devices and circulation pipelines, wherein: The air-drying device comprises an air-drying tank, an upper air-blowing device, an air-blowing lateral moving device, an air-blowing lifting device and a bottom air-blowing device. The air-blowing lateral moving device is connected to the air-drying tank, and the air-blowing lifting device is connected to the air-blowing lateral moving device, so as to facilitate the lateral movement and lifting of the upper air-blowing device. The bottom air-blowing device is arranged at the bottom of the air-drying tank. The cold water tank and the air drying tank are both connected to the circulation pipeline.

[0012] Furthermore, the resin plate feeding mechanism includes a resin plate storage device, a resin plate transmission device, a resin plate adsorption device and a resin plate transfer device; wherein, The resin plate storage device is arranged on both sides of the resin plate transmission device, and the resin plate adsorption device is arranged across the resin plate storage device and the resin plate transmission device, whereby the resin plate adsorption device is moved so that the resin plate is placed on the resin plate transmission device; The resin plate transfer device is arranged across the transmission line; The resin plate transmission device is arranged at one side of the transmission line and is connected to the resin plate transfer device in an aligned manner. With the action of the resin plate transfer device, the resin plate is placed on the material holder.

[0013] Furthermore, the solidified library includes a cache library, a storage mechanism and a storage mechanism; wherein, The cache has a plurality of independently arranged storage layers, each of which is provided with a plurality of independent curing mechanisms for pressing the material holder bonded with the new resin plate to cure it; The storage entry mechanism and the storage exit mechanism are arranged relatively to the buffer library, and are both provided with a lifting component and a translation component; the translation component is connected to the lifting component and can be connected to the curing mechanism in an aligned manner.

[0014] Furthermore, it also includes a manual feeding mechanism arranged between the feeding mechanism and the high-frequency heating mechanism for manual feeding.

[0015] Furthermore, it also includes a control system, which is electrically connected to the feeding mechanism, the high-frequency heating mechanism, the waste plate removal mechanism, the cooling mechanism, the gluing mechanism, the resin plate feeding mechanism, and the curing warehouse, respectively, to control the actions of the feeding mechanism, the high-frequency heating mechanism, the waste plate removal mechanism, the cooling mechanism, the gluing mechanism, the resin plate feeding mechanism, and the curing warehouse.

[0016] The advantages and positive effects of the present invention are: (1) Due to the adoption of the above technical solution, the material holder and the waste resin plate are transferred between the feeding mechanism, the high-frequency heating mechanism, the waste plate removal mechanism, the cooling mechanism, the gluing mechanism, the resin plate feeding mechanism and the curing warehouse under the cooperation of the transmission line and the handling mechanism, which reduces the difficulty of collaborative operation, makes it more convenient to use, and the layout of each mechanism is reasonable and the structure is more compact; (2) A high-frequency heating device is used to generate eddy currents inside the material holder through the alternating electromagnetic field generated by the induction coil, causing the material holder to heat up. The heating process is fast and the heating is uniform. Through the automatic control of the control system, continuous operation is achieved and the heating efficiency is improved. It has strong applicability, high safety and is more environmentally friendly.

[0017] (3) The curing process is combined with storage to avoid material accumulation that affects the operation of the production line. At the same time, each storage layer can be equipped with multiple curing mechanisms, which has strong storage capacity and maximizes space utilization. Each curing mechanism operates independently, which improves the overall curing efficiency. Through the first alignment component and the second alignment component, the resin plate can be accurately aligned with the material seat, which improves the bonding accuracy between the material seat and the resin plate. By setting up the storage mechanism and the out-of-stock mechanism, the first cured material plate and resin plate are taken out of the cache first, ensuring the curing time of the material seat and the resin plate, and can quickly complete the curing and circulation of the material seat and the resin plate, with strong flexibility.

[0018] (4) The feeding mechanism, high-frequency heating mechanism, waste plate removal mechanism, cooling mechanism, gluing mechanism, resin plate feeding mechanism and curing warehouse are all automatically controlled by the control system, with precise linkage and rapid response, which reduces the number of workers, improves production efficiency and further saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a specific embodiment of the present invention; Figure 2 It is a structural schematic diagram of a feeding mechanism of a specific embodiment of the present invention; Figure 3 It is a structural schematic diagram of a high-frequency heating mechanism of a specific embodiment of the present invention; Figure 4 It is a schematic diagram of the internal structure of a box body according to a specific embodiment of the present invention; Figure 5 It is a schematic structural diagram of a waste plate removal mechanism according to a specific embodiment of the present invention; Figure 6 It is a schematic structural diagram of a scraper mechanism of a specific embodiment of the present invention; Figure 7 It is a structural schematic diagram of a glue removal mechanism according to a specific embodiment of the present invention; Figure 8It is a schematic diagram of the grinding mechanism structure of a specific embodiment of the present invention; Fig. 9 It is a schematic diagram of the cooling mechanism structure of a specific embodiment of the present invention; Fig.10 It is a schematic structural diagram of an air-drying device according to a specific embodiment of the present invention; Fig.11 It is a structural schematic diagram of a gluing mechanism of a specific embodiment of the present invention; Fig.12 It is a schematic structural diagram of a resin sheet feeding mechanism according to a specific embodiment of the present invention; Fig.13 is a structural schematic diagram of a resin plate storage device according to a specific embodiment of the present invention; Fig.14 It is a schematic diagram of the curing library structure of a specific embodiment of the present invention; Fig.15 It is a schematic diagram of using a solidification library according to a specific embodiment of the present invention.

[0020] In the figure: 10, feeding mechanism; 11, storage rack; 12, feeding manipulator; 20, transmission mechanism; 21, transmission line; 211, heating lifting mechanism; 22, handling mechanism; 30, high-frequency heating mechanism; 31, box; 32, high-frequency heating component; 321, induction coil; 322, heating host; 33, transverse movement component; 34, exhaust mechanism; 35, spray mechanism; 351, nozzle; 352, sink; 40, Waste board removal mechanism; 41, scraper mechanism; 411, positioning seat; 412, scraper assembly; 413, conveyor belt; 414, waste board box; 42, glue removal mechanism; 421, first scraper; 422, second scraper; 423, scraper lateral movement device; 43, grinding mechanism; 431, grinding lateral movement device; 432, grinding lifting device; 433, grinding device; 50, cooling mechanism; 51, cold water tank; 52, Air drying device; 521, air drying tank; 522, upper blowing device; 523, blowing horizontal moving device; 524, blowing lifting device; 525, bottom blowing device; 53, circulation pipeline; 60, glue coating mechanism; 61, glue coating horizontal moving device; 62, glue coating vertical moving device; 63, glue storage device; 64, glue coating device; 70, resin board feeding mechanism; 71, resin board storage device; 72, resin board transmission device; 73, resin board adsorption device; 731, adsorption device; 74, resin board transfer device; 80, curing warehouse; 81, cache warehouse; 82, curing mechanism; 821, fixed pallet; 822, pressing assembly; 823, positioning piece; 824, first alignment assembly; 825, second alignment assembly; 83, storage mechanism; 831, lifting assembly; 832, translation assembly; 84, storage mechanism; 90, manual feeding mechanism. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described below with reference to the accompanying drawings.

[0022] like Figure 1 As shown, the present invention proposes a high-frequency heating fully automatic plate bonding machine, which is used for separating the material holder bonded with the discarded resin plate from the discarded resin plate in the process of straight pulling single crystal, treating the residual glue on the surface of the material holder, and re-bonding a new resin plate on the surface of the material holder, so that the material holder after the single crystal silicon rod is cut can be recycled and reused, and the bonding of the new resin plate to the material holder is completed at the same time, realizing the automatic removal of the discarded resin plate and the automatic bonding of the new resin plate. It is controlled by a programmable control system, which improves the gluing efficiency of the resin plate, reduces labor intensity, has a high degree of automation, and improves work efficiency.

[0023] like Figure 1 The high-frequency heating fully automatic board gluing machine shown in the figure comprises a feeding mechanism 10, a high-frequency heating mechanism 30, a waste board removing mechanism 40, a cooling mechanism 50, a gluing mechanism 60, a resin board feeding mechanism 70 and a curing warehouse 80 which are sequentially arranged along the transmission direction of the material holder, wherein: The feeding mechanism 10 is used to store and transport the material holder with the waste resin plate adhered thereto, and transport the material holder with the waste resin plate adhered thereto to the transmission line 21 to realize automatic feeding; The high-frequency heating mechanism 30 is used to perform high-frequency heating on the material holder with the waste resin plate adhered thereto to soften the adhesive, so as to prepare for the subsequent removal of the waste resin plate and facilitate the subsequent removal of the waste resin plate and the residual adhesive on the surface of the material holder; The waste plate removing mechanism 40 is used to remove the waste resin plates and residual glue bonded to the material holder, so as to facilitate the subsequent gluing and bonding of new resin plates; The cooling mechanism 50 is used to cool the material holder from which the waste resin plate is removed, so as to reduce the temperature of the material holder, facilitate the subsequent application of glue on the surface of the material holder, and reduce the influence of temperature on the glue; The glue coating mechanism 60 is used to coat the cooled material base with glue, and to coat the glue on the surface of the material base according to certain rules, so as to facilitate the subsequent bonding of a new resin plate; The resin sheet feeding mechanism 70 is used to bond the new resin sheet to the material holder, so as to facilitate the subsequent curing of the new resin sheet and the material holder; The curing storehouse 80 is used to cure the new resin plate on the material holder so that the resin plate is firmly bonded to the material holder, and to store the material holder bonded with the new resin plate for subsequent use; It also includes a transmission mechanism 20, which includes a transmission line 21 and a conveying mechanism 22. The conveying mechanism 22 is erected above the waste plate removal mechanism and the cooling mechanism 50. The transmission line 21 is aligned with the conveying mechanism 22 and connected to the feeding mechanism 10 and the high-frequency heating mechanism 30, and the resin plate feeding mechanism 70 and the curing warehouse 80 respectively.

[0024] The above-mentioned feeding mechanism 10 puts the material holder with the waste resin plate adhered to the automatic feeding port of the transmission line 21, transmits it to the high-frequency heating mechanism 30 for high-frequency heating, softens the glue between the waste resin plate and the material holder, and then transmits it to the outside of the high-frequency heating mechanism 30; the conveying mechanism 22 conveys the softened material holder with the waste resin plate adhered to the waste plate to the waste plate removal mechanism 40, removes the waste resin plate, and removes the residual glue remaining on the material holder; the conveying mechanism 22 conveys the material holder with the waste resin plate removed to the cooling mechanism 50 to reduce the temperature of the material holder; then the conveying mechanism 22 continues to convey the material holder to the transmission line 21 behind the cooling mechanism 50, the transmission line 21 drives the material holder to enter the gluing mechanism 60 for gluing, and then enters the resin plate feeding mechanism 70, the resin plate feeding mechanism 70 bonds the new resin plate to the material holder, and then transmits it to the curing warehouse 80 through the transmission line 21, the curing warehouse 80 cures the new resin plate on the material holder, and after storing and standing for a period of time, it can be used for the subsequent sticking process.

[0025] like Figure 2 As shown, the loading mechanism 10 includes a storage rack 11 for storing a plurality of material holders with waste resin plates adhered thereto and a loading robot 12. The storage rack 11 is adjacent to the automatic loading port of the transmission line 21. The loading robot 12 clamps the material holders with waste resin plates adhered thereto and places them in the automatic loading port.

[0026] Specifically, the storage rack 11 is provided with a plurality of storage positions, each of which can store a material holder with waste resin plates adhered thereto, and the loading robot 12 can move within the range of the storage rack 11 to clamp the material holder with waste resin plates adhered thereto, and place the material holder at the automatic loading port of the transmission line 21; the loading robot 12 is controlled by a control system, moves according to an edited program, and automatically loads materials at set time intervals, thereby reducing the labor intensity and production costs of manual loading.

[0027] The loading robot 12 can be a robot of any structure and is not limited here.

[0028] In the present application, the above-mentioned operation processes are all automatically controlled by a control system; the control system is electrically connected to the feeding mechanism 10, the high-frequency heating mechanism 30, the waste plate removal mechanism 40, the cooling mechanism 50, the gluing mechanism 60, the resin plate feeding mechanism 70, the curing warehouse 80 and the transmission mechanism 20 respectively, and controls the feeding mechanism 10, the high-frequency heating mechanism 30, the waste plate removal mechanism, the cooling mechanism 50, the gluing mechanism 60, the resin plate feeding mechanism 70, the curing warehouse 80 and the transmission mechanism 20 to complete the set actions, automatically complete the removal of the waste resin plate on the material holder, and the bonding of the new resin plate, so as to realize integrated control; and can timely identify the effect of the above-mentioned mechanism completing the action according to the set program, so as to control the above-mentioned mechanism to stop running when a fault occurs.

[0029] The controller of this control system can be a PLC controller, or a CPU, or other programmable controller. It can be selected according to actual needs. No specific requirements are made here.

[0030] The loading robot 12 places the material holder with the waste resin plate adhered thereto on the transmission line 21 , and the transmission line 21 transports the material holder with the waste resin plate adhered thereto to the high-frequency heating mechanism 30 .

[0031] The above-mentioned transmission line 21 includes a support frame and a transmission chain. The distance between the two transmission chains is less than the length of the material seat, which can drive the material seat to move; a loading waiting station is provided on the transmission line 21 between the loading mechanism 10 and the high-frequency heating mechanism 30, and the loading waiting station includes several groups of positioning components. The positioning components are fixed to the support frame and are located on the inner side of the two transmission chains. They can be raised and lowered relative to the transmission chains. When they are raised, they can block the material seat with the waste resin board adhered to them to prevent them from being transmitted to the high-frequency heating mechanism 30. After the previous material seat with the waste resin board adhered to it is softened and leaves the high-frequency heating mechanism 30 under the action of the transmission line 21, the positioning component descends, so that the material seat with the waste resin board adhered to it located at the loading waiting station is transmitted to the high-frequency heating mechanism 30. Similarly, a gluing waiting station is set on the transmission line 21 before the gluing mechanism 60, a loading board waiting station is set between the gluing mechanism 60 and the resin plate loading mechanism 70, and a curing waiting station is set between the resin plate loading mechanism 70 and the curing warehouse 80. The action of the positioning components ensures that the gluing mechanism 60, the resin plate loading mechanism 70 and the curing warehouse 80 can operate smoothly.

[0032] The positioning assembly is preferably driven by a cylinder, but other transmission structures may also be used, which is not limited here.

[0033] The transmission line 21 also includes a plurality of alignment sensors, which identify the position of the material holder and transmit corresponding signals to the control system. The control system controls the lifting and lowering of the positioning component according to the signal to achieve coordination with the positioning component and ensure the smooth operation of the entire device.

[0034] like Figure 3 , Figure 4As shown, the high-frequency heating mechanism 30 includes a box 31, a high-frequency heating component 32, a transverse movement component 33, an exhaust mechanism 34, an exhaust gas treatment mechanism and a spray mechanism 35; wherein the high-frequency heating component 32 includes an induction coil 321 and a heating host 322, which are used to generate an induction magnetic field to heat the material holder bonded with the resin plate to soften the adhesive; the transverse movement component 33 is connected to the induction coil 321, and is used to move the induction coil 321 along the length direction of the material holder bonded with the resin plate. During the movement, the alternating electromagnetic field generated by the induction coil 321 generates eddy currents inside the material holder bonded with the resin plate, causing the material holder bonded with the resin plate to heat up, thereby softening the adhesive between the material holder and the resin plate. Softening is convenient for separating the material holder and the resin plate in the subsequent process; the induction coil 321 moves along the set speed so that all parts of the material holder with the resin plate bonded to it in the length direction are evenly heated to reach the set temperature; the spray mechanism 35 is connected to the external water source through the circulation pipeline 53, and when the temperature of the material holder with the resin plate bonded to it exceeds the set temperature, liquid is sprayed thereon, so that the material holder with the resin plate bonded to it is quickly cooled down, avoiding excessive heating of the upper end surface of the material holder with the resin plate bonded to it and causing carbonization, thereby reducing the risk of fire; the exhaust mechanism 34 and the exhaust gas treatment mechanism are connected to the box body 31, and are used to discharge and treat the irritating gas in the box body 31, and finally discharge the treated gas into the air.

[0035] The induction coil 321 is a plane spiral, and its radius is set to cover the entire width of the material holder with the resin plate bonded thereto; the heating host 322 generates an alternating current, so that the induction coil 321 forms an alternating electromagnetic field, thereby generating an alternating current, i.e., eddy current, inside the material holder with the resin plate bonded thereto below the induction coil 321. The eddy current causes the atoms inside the material holder to move irregularly at high speed, and the atoms collide and rub against each other to generate heat energy, thereby achieving the effect of heating the material holder. The material holder then transfers the heat to the adhesive covering the upper end surface of the material holder through heat conduction, so that it reaches the set temperature and softens, so as to facilitate the subsequent separation of the material holder from the resin plate.

[0036] The above-mentioned induction coil 321, transverse movement assembly 33 and spray mechanism 35 are all arranged on the inner side of the box body 31; the heating host 322, exhaust mechanism 34 and exhaust gas treatment mechanism are arranged on the outer side of the box body 31; the transmission line 21 runs through the box body 31 and is located below the induction coil 321, and is used to transmit the material holder bonded with the resin plate.

[0037] The transmission line 21 further comprises a heating lifting mechanism 211 , which is located inside the box 31 and comprises a heating platform and a lifting device. By the action of the lifting device, the heating platform lifts the material holder bonded with the resin plate to approach the induction coil 321 .

[0038] The transverse movement component 33 is arranged on one side above the heating lifting mechanism 211, so that the induction coil 321 extends to one side to above the heating platform; the transverse movement component 33 can adopt a cylinder or a pneumatic guide rail, or a gear rack transmission, or other transverse movement components 33, so that the induction coil 321 can move back and forth along the length direction of the material holder to which the resin plate is bonded, and its moving range can cover the entire length of the material holder to which the resin plate is bonded.

[0039] A temperature sensor is also provided in the box body 31, and the temperature sensor faces the upper end surface of the material holder to which the resin plate is bonded, so as to monitor the temperature of the upper end surface of the material holder to which the resin plate is bonded.

[0040] The spray mechanism 35 includes a plurality of spray heads 351 and a water tank 352. The spray heads 351 are arranged along the length direction of the material holder with the resin plate bonded thereto, and are disposed below the transverse movement assembly 33 and face the position when the material holder with the resin plate bonded thereto is lifted up; the water tank 352 is disposed below the heating lifting mechanism 211.

[0041] The transmission line 21 drives the softened material holder with the waste resin plate to leave the high-frequency heating mechanism 30 and arrive at the bottom of the conveying mechanism 22. The conveying mechanism 22 includes a truss, a longitudinal moving mechanism, a clamping and lifting mechanism, a clamping drive mechanism and a clamping device; wherein the truss is arranged above the waste plate removal mechanism, the cooling mechanism 50 and the gluing mechanism 60, the longitudinal moving mechanism is arranged on the truss, the clamping and lifting mechanism is connected to the longitudinal moving mechanism, the clamping drive mechanism is connected to the free end of the clamping and lifting mechanism, and the clamping device is arranged on the clamping drive mechanism. Through the above technical solution, the clamping device can be moved from one end of the truss to the other end, that is, from the waste plate removal mechanism to the cooling structure and the gluing mechanism 60 in sequence.

[0042] The longitudinal moving mechanism can be a pneumatic guide rail or a gear rack transmission, or other drive forms, which can be selected according to actual needs and is not required here; preferably, the longitudinal moving mechanism is a pneumatic guide rail, and the slider of the guide rail is connected to the clamping and lifting mechanism, so that the clamping and lifting mechanism can move back and forth on the longitudinal moving mechanism.

[0043] The clamping and lifting mechanism can also be a pneumatic guide rail or a gear rack drive, and the clamping drive mechanism is connected to the free end of the clamping and lifting mechanism so that it can rise or fall under the drive of the clamping and lifting mechanism; The clamping drive mechanism is connected to the clamping mechanism, driving the clamping mechanism to clamp the material holder with the waste resin plate bonded thereto. The clamping drive mechanism is preferably a cylinder, and the clamping mechanism is a clamping jaw. There are two groups of clamping jaws, which are symmetrically arranged. Each group of clamping jaws is connected to the piston of the cylinder of the clamping drive mechanism. Through the telescopic action of the piston of the cylinder, the two clamping jaws move toward or away from each other, thereby achieving clamping or separation of the clamping jaws.

[0044] When in use, the clamp moves to the top of the material to be clamped under the action of the longitudinal moving mechanism, aligns with the material, the piston of the cylinder extends, the clamp opens, and moves downward to clamp the material under the action of the clamping lifting mechanism. Then the clamp rises and moves under the action of the clamping lifting mechanism and the longitudinal moving mechanism, and then descends under the action of the clamping lifting mechanism to place the material in the set position to complete the material handling.

[0045] In the present application, the clamp moves to the top of the transmission line 21 under the action of the longitudinal moving mechanism, and is aligned with the softened material holder with the waste resin board bonded thereto. The piston of the cylinder extends, the clamp opens, and moves downward under the action of the clamping and lifting mechanism to clamp the softened material holder with the waste resin board bonded thereto. Then, the clamp rises and moves under the action of the clamping and lifting mechanism and the longitudinal moving mechanism, and reaches the top of the waste board removal mechanism 40. It descends under the action of the clamping and lifting mechanism, and places the softened material holder with the waste resin board bonded thereto on the waste board removal mechanism 40. The clamp driving mechanism releases the clamp to complete the transportation of the material holder with the waste resin board bonded thereto.

[0046] like Figure 5 As shown, the waste plate removal mechanism 40 includes a scraper mechanism 41, a glue removal mechanism 42 and a grinding mechanism 43, wherein the scraper mechanism 41 is used to remove the waste resin plate on the material seat, and the glue removal mechanism 42 is used to remove the residual glue remaining on the material seat; the grinding mechanism 43 further grinds the material seat to further clean the material seat and ensure that the residual glue is completely removed.

[0047] Specifically, Figure 6 As shown, the scraper mechanism 41 includes a positioning seat 411, a positioning mechanism, a scraper assembly 412, a conveyor belt 413 and a waste board box 414. The positioning seat 411, the positioning mechanism, the scraper assembly 412 and the conveyor belt 413 are all fixed on the support frame. The conveying mechanism 22 places the softened material seat with the waste resin board on the positioning seat 411. The positioning mechanism is used to position the material seat with the waste resin board. The positioning mechanism is a block and a telescopic device. The telescopic device is fixedly installed on both sides of the positioning seat 411, and the telescopic device is fixedly connected to the block. The block performs telescopic reciprocating motion under the action of the telescopic device to block and position the material seat with the waste resin board. The telescopic device is preferably a cylinder.

[0048] The scraper assembly 412 is arranged on the upper part of the positioning seat 411. The scraper assembly 412 is used to scrape the waste resin plate adhered to the material seat. The scraper assembly 412 is fixedly mounted on the support frame, so as to facilitate the scraping of the waste resin plate adhered to the material seat. The scraper assembly 412 includes a lateral moving device and a shovel plate assembly. The shovel plate is fixedly connected to the lateral moving device, so that the scraper assembly 412 can move under the action of the lateral moving device to scrape the waste resin plate; the lateral moving device is preferably a gear drive device, the gear driver is fixedly connected to the shovel plate assembly, the two output ends of the gear driver are connected to gears, and the support frame is fixedly mounted with a toothed belt meshing with the gear. The scraper assembly 412 includes a shovel plate, the height of which is flush with the upper surface of the material seat, and the waste resin plate is scraped under the action of the gear driver; One end of the positioning seat 411 is aligned with the entrance end of the conveyor belt 413, and the shovel drives the waste resin board to move to the conveyor belt 413. The conveyor belt 413 drives the waste resin board to leave the positioning seat 411 and fall into the waste board box 414 under the support frame.

[0049] Preferably, a plurality of waste plate removing mechanisms 40 are installed in parallel on the support frame, and they can be independently operated to remove waste resin plates, thereby improving the efficiency of plate removal.

[0050] The transport mechanism 22 transports the material holder with the waste resin plate removed from the scraper mechanism 41 to the glue removal mechanism 42. Figure 7 As shown, the glue removal mechanism 42 is used to scrape off the residual glue on the material seat. The glue removal mechanism 42 includes a first glue scraping device and a second glue scraping device. The first glue scraping device is used to scrape off the residual glue on the upper surface of the material seat. The second glue scraping device is arranged on both sides of the first glue scraping device and is used to scrape off the residual glue on the side of the material seat. The first glue scraping device. The first glue scraping device includes a glue scraping transverse movement device 423, a glue scraping contraction device and a first glue scraping member 421. The first glue scraping member 421 is connected to the glue scraping telescopic device, so that the first glue scraping member 421 is lifted and lowered under the action of the glue scraping telescopic device, so that the first glue scraping member 421 can contact the material seat, and the force acting on the surface of the material seat is large enough to scrape off the residual glue without damaging the material seat; the glue scraping contraction device is connected to the glue scraping transverse movement device 423, so that the glue scraping telescopic device can drive the first glue scraping member 421 to reciprocate in the horizontal direction to remove the residual glue on the upper surface of the material seat. The scraper extension and retraction device is preferably driven by a cylinder, and a first scraper member 421 is fixedly installed at the free end of the cylinder extension rod, and the first scraper member 421 is a scraper; the scraper transverse movement device 423 is preferably driven by a gear rack, and the rack is arranged on a support frame, and moves horizontally under the action of the gear driver, driving the first scraper member 421 to scrape the upper surface of the material seat, and clean the residual glue on the upper surface of the material seat. Since the residual glue has been softened by boiling in water, it is easy to remove it under the action of the first scraper member 421.

[0051] The second scraper device is arranged on both sides of the first scraper device, and is used to scrape the residual glue on the side of the material seat. The second scraper device is fixedly mounted on the scraper lateral movement device 423 to clean the residual glue on both sides of the material seat. The second scraper device includes a telescopic device and a second scraper member. The telescopic device is fixedly mounted on the scraper lateral movement device 423. The telescopic device is preferably a cylinder. The second scraper member 422 is fixedly mounted on the free end of the telescopic rod of the cylinder. The second scraper member is preferably a scraper. The scraper reciprocates under the action of the telescopic rod of the telescopic device, and the scraper is aligned with the side of the material seat to clean the residual glue on the side of the material seat.

[0052] The transport mechanism 22 transports the material base from which the residual glue has been initially scraped off from the glue removal mechanism 42 to the grinding mechanism 43 to further clean the material base and ensure that the residual glue is completely removed. Figure 8 As shown, the grinding mechanism 43 includes a grinding transverse moving device 431, a grinding lifting device 432 and a grinding device 433; the grinding transverse moving device 431 is arranged on a support frame, preferably with a gear rack transmission, and its specific structure can adopt the same structure as the scraping glue transverse moving device 423, which will not be described here; the grinding lifting device 432 is arranged on the grinding transverse moving device 431, preferably with a cylinder transmission, and the grinding device 433 is connected to the free end of the grinding lifting device 432, and can be lifted and moved under the action of the grinding lifting device 432, so that the grinding device 433 can fully contact with the surface of the material seat; the grinding device 433 includes a rotary drive and a grinding head, and the rotary drive drives the grinding head to rotate to further remove the residual glue on the surface of the material seat. Preferably, the grinding head is a steel brush, which can effectively clean the residual glue on the material seat to ensure the cleaning effect.

[0053] The material holder with the waste resin plate and residual glue removed is transported to the cooling mechanism 50 under the action of the transport mechanism 22. Fig. 9 As shown, the cooling mechanism 50 includes a plurality of cold water troughs 51, an air drying device 52 and a circulation pipeline 53, wherein the plurality of cold water troughs 51 are arranged in sequence along the conveying direction of the material seat, and the plurality of material seats can be cooled down at the same time to improve work efficiency. The plurality of cold water troughs 51 are arranged in parallel in sequence, and cold water is injected into the cold water troughs 51 to cool down the material seat.

[0054] The cooled material holder is transported to the air drying device 52 by the transport mechanism 22 to remove moisture from the surface of the material holder. Fig.10As shown, the air drying device 52 is arranged behind the cold water tank 51 along the conveying direction of the material holder. The air drying device 52 comprises an air drying tank 521, an upper blowing device 522, an air blowing transverse moving device 523, an air blowing lifting device 524 and a bottom air blowing device 525, wherein the air blowing transverse moving device 523 is connected to the air drying tank 521, the air blowing lifting device 524 is connected to the air blowing transverse moving device 523, and the bottom air blowing device 525 is connected to the air blowing lifting device 524, so as to facilitate the transverse movement and lifting of the bottom air blowing device 525, and to blow air to various parts of the lower surface of the material holder more effectively; the upper air blowing device 522 is arranged on the upper part of the air drying tank 521 through a bracket, and is used to blow air to the upper surface of the material holder; The cold water tank 51 and the air drying tank 521 are both connected to the circulation pipeline 53. Both are tank structures, and have a water inlet and a water outlet respectively. The water inlet and the water outlet are connected to the circulation pipeline 53 to realize the recycling of water resources. Each cold water tank 51 and each air drying tank 521 is equipped with a switch valve, which can control the water volume therein separately. A filter screen is provided at the bottom of the tank body, and a temperature controller is also provided in the tank to timely feedback the internal temperature of the tank body. The circulation pipeline 53 includes a water inlet pipe, a drain pipe, a filter and a water pump, which can complete water filling and drainage according to demand, ensuring that the water volume and water temperature in the cold water tank 51 meet the use requirements. Its specific structure is prior art and will not be described in detail here.

[0055] The air-dried material base is transported to the transmission line 21 by the transport mechanism 22, and is transmitted to the gluing mechanism 60 through the transmission line 21. The gluing mechanism 60 is used to apply glue on the surface of the material base according to a certain rule, so as to facilitate the subsequent bonding of a new resin plate; Fig.11 As shown, the glue coating mechanism 60 includes a glue coating transverse moving device 61, a glue coating longitudinal moving device 62, a glue storage device 63 and a glue coating device 64. The glue coating transverse moving device 61 is fixedly mounted on the support frame, the glue coating longitudinal moving device is arranged on the glue coating transverse moving device 61, and the glue coating device 64 is arranged on the glue coating longitudinal moving device 62, so as to facilitate the glue coating device 64 to move transversely and longitudinally for gluing. The glue storage device 63 is connected to the glue coating device 64 to supply glue to the glue coating device 64; the glue coating device 64 is a glue coating tube, and the glue storage device 63 is in the shape of a glue storage barrel; when the glue coating tube is coating glue, the glue can be coated in an L shape, or in an H shape, or in a parallel straight line, or in other shapes, which can be selected according to actual needs, and no specific requirements are made here. The glue coating mechanism 60 is a prior art and will not be described in detail here.

[0056] The material base after the glue coating is transmitted to the resin plate feeding mechanism 70 through the transmission line 21, and the resin plate feeding mechanism 70 bonds the new resin plate to the material base. Fig.12 , Fig.13As shown, the resin board loading mechanism 70 includes a resin board storage device 71, a resin board transmission device 72, a resin board adsorption device 73 and a resin board transfer device 74; wherein, the resin board storage device 71 is arranged on both sides of the resin board transmission device 72, and the resin board adsorption device 73 is arranged across the resin board storage device 71 and the resin board transmission device 72, whereby the resin board adsorption device 73 is operated, the resin board is placed on the resin board transmission device 72; the resin board transfer device 74 is arranged across the transmission line 21; the resin board transmission device 72 is arranged on one side of the transmission line 21, and is connected to the resin board transfer device 74 in a positional manner, whereby the resin board is placed on the material holder by the operation of the resin board transfer device 74.

[0057] The above-mentioned resin board storage device 71 includes a number of material frames arranged side by side, each of which is stacked with a number of new resin boards. The length direction of the resin boards is parallel to the resin board transmission device 72. The new resin boards are adsorbed one by one by the resin board adsorption device 73 and placed on the resin board transmission device 72; the resin board transmission device 72 is preferably a conveyor belt 413.

[0058] The resin plate adsorption device 73 includes an upper plate longitudinal moving device, an upper plate lifting device and an adsorption device 731. The upper plate longitudinal moving device is installed on the support frame, preferably a gear rack drive or a guide rail drive; the upper plate lifting device is installed on the upper plate longitudinal moving device, so that the upper plate lifting device moves horizontally under the action of the upper plate longitudinal moving device, and its moving direction is perpendicular to the resin plate transmission device 72, so that the new resin plate can be subsequently transported to the resin plate transmission device 72; the upper plate lifting device can be a chain drive, or a gear rack drive, or a cylinder, or other lifting devices, which can be selected according to actual needs, and no specific requirements are made here; in this embodiment, the upper plate lifting device is a cylinder drive, and the adsorption device 731 is installed at the free end of the upper plate lifting device, and performs a lifting movement under the action of the upper plate lifting device, so that the adsorption device 731 can contact the new vertical part in the material frame. The adsorption device 731 is a suction cup, which is connected to a vacuum pump and is used to adsorb a new resin plate and load a new resin plate.

[0059] The new resin board is transported to the bottom of the resin board transfer device 74 by the resin board transmission device 72, and is placed on the material seat through the resin board transfer device 74; the resin board transfer device 74 includes a transfer transverse shifting device, a transfer lifting device and a transfer suction cup; the transfer transverse shifting device is installed on the bracket, preferably a gear rack transmission, and the transfer lifting device is installed on the transfer transverse shifting device, so that the transfer lifting device can move horizontally along the direction of the vertical transmission line 21 under the action of the transfer transverse shifting device; the transfer suction cup is installed on the transfer lifting device, and the structure of the transfer suction cup is the same as that of the adsorption device 731. It rises or falls under the action of the transfer lifting device to adsorb the new resin board. The new resin board is moved to the top of the material seat under the adsorption of the transfer suction cup through the action of the transfer lifting device and the transfer transverse shifting device, and is placed on the upper surface of the material seat to complete the loading of the new resin board.

[0060] The material holder with the new resin plate bonded thereto is transported to the curing warehouse 80 via the transmission line 21. The curing warehouse 80 is used to cure the new resin plate on the material holder and store the material holder. Fig.14 , Fig.15 As shown, the curing warehouse 80 includes a cache warehouse 81, a curing mechanism 82, a storage mechanism 83 and a storage mechanism 84: the cache warehouse 81 has a plurality of independently arranged storage layers, each storage layer is provided with a plurality of independent curing mechanisms 82, which are used to press the material seat bonded with a new resin plate to cure it; the storage mechanism 83 and the storage mechanism 84 are arranged relative to the cache warehouse 81, and the two have the same structure, and are both provided with a lifting component 831 and a translation component 832, and the translation component 832 is connected to the lifting component 831, and can be connected to the curing mechanism 82 in a aligned manner.

[0061] Specifically, the translation component 832 of the warehousing mechanism 83 is connected to the transmission line 21, and the material holder with the new resin plate bonded thereto is placed on the translation component 832. The translation component 832 is driven by the lifting component 831 to reach a storage layer, and through the action of the translation component 832, the material holder with the new resin plate bonded thereto is transferred to a vacant curing mechanism 82 for pressing, and is left to stand for a preset time to achieve complete curing, and then is stored in the cache 81; the out-of-warehouse mechanism 84 removes the cured material holder and the resin plate from the curing mechanism 82 as needed, so as to put them into use in the next process.

[0062] The above-mentioned cache 81 is a frame structure formed by connecting a plurality of horizontal beams and a plurality of vertical beams together, which includes a plurality of storage layers arranged along the height direction, each storage layer is provided with a plurality of curing mechanisms 82, one end of which is provided with a feed port, the feed mechanism 83 is arranged at the feed port, and the other end opposite to the feed port is provided with a discharge port, and the discharge mechanism 84 is arranged at the discharge port.

[0063] The lifting assembly 831 includes a lifting drive and a lifting moving member. The lifting moving member is connected to the driving end of the lifting drive. Under the action of the lifting drive, the lifting member moves up and down along the buffer 81. The translation assembly 832 is connected to the lifting moving member so that the translation assembly 832 drives the material holder with the new resin plate bonded to a storage layer. The lifting assembly 831 can be a pneumatic guide rail transmission, or a gear rack transmission, or other lifting and moving devices. No specific requirements are made here. Preferably, the lifting assembly 831 is a gear rack transmission, and the lifting drive is a servo motor. The lifting assembly 831 also includes a guide rail, which is arranged along the height direction of the buffer 81 and is provided with a rack. The lifting drive is arranged on the lifting moving member, and its driving end is provided with a gear matched with the rack. Under the drive of the servo motor, it moves up and down along the guide rail.

[0064] The above-mentioned translation assembly 832 is arranged on the lifting and moving part, and can move horizontally relative to the lifting and moving part, so as to facilitate the transportation of the material holder with the new resin plate bonded thereto to the curing mechanism 82; the translation assembly 832 can adopt pneumatic guide rails, cylinder transmission or chain gear transmission, which is not limited here; preferably, the translation assembly 832 adopts chain gear transmission, including a translation bracket, a translation drive member, a telescopic guide rail and a translation tray, the translation bracket is arranged on the lifting and moving part, and the translation drive member and the telescopic guide rail are arranged on the translation bracket; the translation tray is connected to the telescopic guide rail and is located at the upper part of the telescopic guide rail, and is used to place the material holder and the resin plate pasted body; the telescopic guide rail is connected to the driving end of the translation drive member through a chain, and includes a plurality of telescopic joints, which can be extended or retracted under the control of the translation drive member to drive the translation tray to approach or move away from the curing mechanism 82, thereby completing the transfer of the material holder and the resin plate pasted body. The telescopic guide rail and the translation drive member in this embodiment are similar to the telescopic fork, and their specific structures are prior art and will not be described in detail here.

[0065] A number of curing mechanisms 82 are arranged in sequence along the direction of extension and retraction of the telescopic guide rail, including a fixed pallet 821, a pressing assembly 822, a positioning member 823, a first alignment assembly 824 and a second alignment assembly 825, wherein the fixed pallet 821 is relatively arranged with a spacing therebetween for translating the pallet through therebetween; the pressing assembly 822 includes a counterweight plate and a counterweight driving member, the counterweight plate approaches or moves away from the fixed pallet 821 under the action of the counterweight driving member, so as to press the material holder on the fixed pallet 821 with a new resin plate bonded thereto to solidify it; the positioning member 823 is relatively arranged to the fixed pallet 821 for positioning the material holder in the width direction; the first alignment assembly 824 is relatively arranged, including a push member and a push driving member, the push member is connected to the driving end of the push driving member, and is used to push against both ends of the length direction of the resin plate above the material holder to align the length direction of the resin plate with the length direction of the material holder. The second alignment component 825 is relatively arranged, including an alignment card strip and an alignment driving member. The alignment card strip is relatively arranged at the driving end of the alignment driving member, and is moved closer to or away from each other under the control of the alignment driving member, and is used to adjust the position of the resin plate in the width direction so that it is aligned with the width direction of the material holder.

[0066] Specifically, during the warehousing process, the control system will automatically match the vacant curing mechanism 82 in the cache warehouse 81, and compare it to find the vacant curing mechanism 82 in the same storage layer that is relatively close to the discharge port and has no obstacles on the moving route of the translation pallet, and use it as the intended placement target; during the warehousing process, the control system will automatically match the curing mechanism 82 in the cache warehouse 81 that stores the cured material seat and resin plate, and compare it to find the curing mechanism 82 in the same storage layer that is relatively close to the discharge port and has no obstacles on the moving route of the translation pallet, and use the cured material seat and resin plate therein as the retrieval target.

[0067] Furthermore, if Figure 1 As shown, the high-frequency heating fully automatic board gluing machine proposed in the present application also includes a manual feeding mechanism 90 disposed between the feeding mechanism 10 and the high-frequency heating mechanism 30 for manual feeding. The manual feeding mechanism 90 includes a manual transmission device and a manual feeding lifting mechanism. The manual transmission device is used to transport the material holder with the waste resin board to the manual feeding lifting mechanism. The manual feeding lifting mechanism places the material holder with the waste resin board on the transmission line 21.

[0068] The artificial transmission device may adopt chain transmission, rolling transmission, or other transmission forms; in this embodiment, the artificial transmission device includes a support frame and a transmission roller, the width of the transmission roller is greater than the width of the material seat, and can drive the material seat to move horizontally; The manual loading and lifting mechanism is arranged on the transmission line 21, including a vertical moving device and a lifting roller, wherein the vertical moving device is arranged between two transmission chains, preferably using cylinder transmission, and the lifting roller is arranged at the free end of the vertical moving device. Under the action of the vertical moving device, the lifting roller moves in the vertical direction; when the lifting roller is raised, it can be connected with the transmission roller to facilitate the material holder with the waste resin board to move from the transmission roller to the lifting roller; then the lifting roller descends under the action of the vertical moving device, and the material holder with the waste resin board is placed on the transmission chain, so that the material holder with the waste resin board can be transferred to the high-frequency heating mechanism 30.

[0069] The above-mentioned manual transmission device is provided with several groups of positioning components, which are used to limit the material holder with waste resin plates stuck on it from being transmitted to the manual feeding and lifting mechanism; the above-mentioned manual feeding and lifting mechanism is arranged between the feeding waiting station and the high-frequency heating mechanism 30; when manual feeding is required, the positioning component of the feeding waiting station rises to limit the material holder with waste resin plates stuck on it at the feeding waiting station from moving forward, so as to avoid interference with manual feeding.

[0070] When the high-frequency heating fully automatic board gluing machine is in use, the material holder with the waste resin board glued thereon is placed on the transmission line 21 through the loading robot 12 or the manual loading mechanism 90. The operation of the transmission line 21 drives the material holder with the waste resin board glued thereon to be transferred to the interior of the box 31 of the high-frequency heating mechanism 30. The control system controls the operation of the positioning component to prevent the next material holder with the waste resin board glued thereon from entering the interior of the box 31.

[0071] When the material holder with the waste resin board is moved to above the heating and lifting mechanism, the control system controls the heating and lifting mechanism to operate, so that the heating platform lifts the material holder with the waste resin board to a set height; operates the heating main unit 322, so that the induction coil 321 forms an alternating electromagnetic field; operates the transverse movement component 33, drives the heating main unit 322 to move along the length direction of the material holder with the waste resin board at a set speed, so that all parts of the material holder with the waste resin board are evenly heated; during the heating process, the temperature sensor located inside the box 31 measures the temperature of each monitoring point on the upper surface of the material holder with the waste resin board, and when the temperature reaches the preset temperature, the temperature sensor sends a signal to the control system, and the control system controls the heating main unit 322 to stop running; keeps the heated material holder with the waste resin board still, and keeps warm for a preset time to ensure that the glue between the resin board and the material holder is evenly softened.

[0072] During the heating and heat preservation process, the exhaust mechanism 34 and the exhaust gas treatment mechanism continue to work, exhausting and treating the exhaust gas in the box 31, and finally discharging it into the air; After the insulation time is over, the control system controls the heating lifting mechanism to operate, so that the heating platform drives the material holder with the waste resin board to fall onto the transmission line 21, and is transmitted to the outside of the box 31 as the transmission line 21 operates.

[0073] At this time, the control system controls the operation of the positioning component, so that the next material holder with the waste resin plate adhered thereto is transported into the box body 31 along the transmission line 21 for heating and heat preservation, thereby realizing automatic continuous operation.

[0074] The temperature sensor is preset with a safety temperature. When the temperature monitored by the temperature sensor exceeds the safety temperature, an alarm signal is sent to the control system. In response to the signal, the control system controls the operation of the spray system to spray liquid onto the material holder with the waste resin board to quickly cool it down.

[0075] The transmission line 21 drives the softened material holder with the waste resin board to leave the high-frequency heating mechanism 30 and arrive at the bottom of the conveying mechanism 22. The clamping claw of the conveying mechanism 22 moves to the top of the transmission line 21 under the action of the longitudinal moving mechanism, and is aligned with the softened material holder with the waste resin board. The material holder with the softened waste resin board is clamped under the action of the clamping and lifting mechanism, and is driven to rise and move to the top of the waste board removal mechanism 40, and the softened material holder with the waste resin board is placed on the waste board removal mechanism 40.

[0076] The scraper assembly 412 of the scraper mechanism 41 moves under the action of the lateral moving device to scrape off the waste resin plates, and the conveyor belt 413 drives the waste resin plates to fall into the waste plate box 414 below the support frame.

[0077] The conveying mechanism 22 conveys the material holder with the waste resin plate removed from the scraper mechanism 41 to the glue removal mechanism 42. The first glue scraper device and the second glue scraper device are driven by the glue scraper transverse movement device 423 to scrape off the residual glue on the upper surface and side of the material holder. Then the conveying mechanism 22 conveys the material holder with the residual glue preliminarily scraped off from the glue removal mechanism 42 to the polishing mechanism 43.

[0078] The grinding head of the grinding device 433 rotates, and moves along the surface of the material seat driven by the grinding lateral moving device 431 and the grinding lifting device 432 to further remove the residual glue on the surface of the material seat; then the material seat with the waste resin plate and the residual glue removed is transported to the cooling mechanism 50 under the action of the conveying mechanism 22; the control system automatically matches the empty cold water tank 51, and the conveying mechanism 22 puts the material seat with the waste resin plate and the residual glue removed into the cold water tank 51 for cooling. After the cooling is completed, the conveying mechanism 22 sends the material seat to the air drying device 52, and the upper blowing device 522 and the bottom blowing device 525 spray the surface of the material seat to dry the moisture on the surface of the material seat. After the moisture is dried, the conveying mechanism 22 transports the material seat to the transmission line 21 on one side of the cooling mechanism 50, and under the action of the transmission line 21, it is conveyed to the gluing mechanism 60, and stops at the gluing station of the transmission line 21 for coating of adhesive; The control system controls the actions of the gluing lateral moving device 61 and the gluing longitudinal moving device 62 of the gluing mechanism 60. The gluing device 64 applies glue according to a predetermined gluing rule and applies the glue on the upper surface of the material holder. The glue storage device 63 supplies glue to the gluing device 64 at a preset frequency to ensure smooth gluing of the material holder. The material seat after glue coating is transmitted to the resin plate loading mechanism 70 through the transmission line 21, and stops at the resin plate loading station of the transmission line 21. The resin plate adsorption device 73 of the resin plate loading mechanism 70 operates to adsorb a new resin plate in the resin plate storage device 71 and send it to the resin plate transmission device 72. The resin plate transmission device transports the new resin plate to the bottom of the resin plate transfer device 74. The transfer suction cup of the resin plate transfer device 74 adsorbs the resin plate and moves to the top of the material seat under the action of the transfer transverse movement device and the transfer lifting device, and places the new resin plate on the upper surface of the material seat to complete the loading of the new resin plate.

[0079] The material holder with the new resin plate bonded thereto is transported to the front of the curing warehouse 80 via the transmission line 21, and the translation component 832 of the warehousing mechanism 83 is aligned with the transmission line 21 under the action of the lifting component 831, and the material holder with the new resin plate bonded thereto is lifted up from the transmission line 21, completing the transfer of the material holder with the new resin plate bonded thereto. At this time, the material holder with the new resin plate bonded thereto is located on the translation pallet of the translation component 832; the control system automatically matches the vacant curing mechanism 82, and the material holder with the new resin plate bonded thereto is moved along the height direction of the cache warehouse 81 to the storage layer of the curing mechanism 82 under the action of the lifting component 831, and the operation of the translation component 832 causes the translation pallet to move between the fixed pallets 821 of the curing mechanism 82 to be placed; then the operation of the lifting component 831 causes the translation pallet to move to between the fixed pallets 821 of the curing mechanism 82 to be placed; The transfer tray descends, thereby causing the material holder with the new resin plate bonded thereto to descend onto the positioning piece 823 of the fixed tray 821, and then the translation assembly 832 is operated to move the translation tray to the outside of the buffer 81; the second alignment assembly 825 and the first alignment assembly 824 of the curing mechanism 82 are operated to align the new resin plate with the material holder; then the pressing assembly 822 is operated to move the counterweight plate downward until it contacts the resin plate, and applies downward pressure to the resin plate through the action of the pressing drive member, and maintains the loading pressure for a preset time, so that the glue between the material plate and the resin plate is squeezed evenly; after the preset time ends, the control system controls the pressing assembly 822 to reset, and the cured material plate and resin plate are placed on the fixed tray 821 of the curing mechanism 82 for use. When in use, the control system automatically matches the curing mechanism 82 that stores the material plates and the resin plates. The translation component 832 of the out-of-warehouse mechanism 84 moves to the storage layer of the curing mechanism 82 under the action of the lifting component 831. The operation of the translation component 832 causes the translation pallet to move to under the simulated material seat and the resin plate. Then, the lifting component 831 operates to cause the translation pallet to rise, lift up the material seat and the resin plate, and the operation of the translation component 832 drives the material seat and the resin plate to move to the outside of the cache 81, and moves to the preset position under the action of the lifting component 831 to enter the next process.

[0080] Through the above actions, the processes of heating and separating the material holder and the discarded resin board, handling the residual glue of the material holder, cooling the material holder, gluing the material holder, bonding, curing and storing the new resin board are realized, which realizes less-manpower, automation, and simultaneous work of multiple mechanisms, thereby improving the bonding efficiency of the resin boards, reducing labor intensity, reducing production costs, and increasing efficiency and reducing consumption.

[0081] Due to the adoption of the above technical solution, the material holder and the waste resin plate are transferred between the feeding mechanism, the high-frequency heating mechanism, the waste plate removal mechanism, the cooling mechanism, the gluing mechanism, the resin plate feeding mechanism and the curing warehouse under the cooperation of the transmission line and the handling mechanism, which reduces the difficulty of collaborative operation, is more convenient to use, has a reasonable layout of each mechanism, and a more compact structure; The high-frequency heating device is used to generate eddy currents inside the material holder through the alternating electromagnetic field generated by the induction coil to make the material holder heat up. The heating process is fast and the heating is uniform. Through the automatic control of the control system, continuous operation is achieved and the heating efficiency is improved. It has strong applicability, high safety and is more environmentally friendly.

[0082] The curing process is combined with storage to avoid material accumulation that affects the operation of the production line. At the same time, multiple curing mechanisms can be set up on each storage layer, with strong storage capacity and maximum space utilization; each curing mechanism operates independently, which improves the overall curing efficiency; through the first alignment component and the second alignment component, the resin plate can be accurately aligned with the material seat, which improves the bonding accuracy of the material seat and the resin plate; by setting up the storage mechanism and the out-of-stock mechanism, the first cured material plate and resin plate are taken out of the cache first, ensuring the curing time of the material seat and the resin plate, and can quickly complete the curing and circulation of the material seat and the resin plate, with strong flexibility.

[0083] The feeding mechanism, high-frequency heating mechanism, waste plate removal mechanism, cooling mechanism, gluing mechanism, resin plate feeding mechanism and curing warehouse are all automatically controlled by the control system, with precise linkage and rapid response, which reduces the number of workers, improves production efficiency and further saves costs.

[0084] The embodiments of the present invention are described in detail above, but the contents described are only preferred embodiments of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A high frequency heating fully automatic board gluing machine, characterized in that: It includes a feeding mechanism, a high-frequency heating mechanism, a waste plate removal mechanism, a cooling mechanism, a gluing mechanism, a resin plate feeding mechanism and a curing warehouse which are arranged in sequence along the transmission direction of the material holder, wherein: The feeding mechanism is used to carry the material holder with the waste resin plate stuck on it; The high-frequency heating mechanism is used to perform high-frequency heating on the material holder with the waste resin plate adhered thereto to soften the adhesive; The curing warehouse is used to cure the new resin plate on the material holder and store the material holder bonded with the new resin plate; It also includes a transmission mechanism, which includes a transmission line and a conveying mechanism. The conveying mechanism is erected above the waste plate removal mechanism and the cooling mechanism. The transmission line is aligned with the conveying mechanism and connected to the feeding mechanism and the high-frequency heating mechanism, and the resin plate feeding mechanism and the curing warehouse, respectively.

2. The high frequency heating fully automatic board gluing machine according to claim 1 is characterized in that: The loading mechanism includes a storage rack storing a plurality of material holders with waste resin plates adhered thereto and a loading robot. The storage rack is adjacent to the automatic loading port of the transmission line, and the loading robot clamps the material holders with waste resin plates adhered thereto and places them in the automatic loading port.

3. The high frequency heating fully automatic board gluing machine according to claim 2 is characterized in that: The high-frequency heating mechanism includes a box, a high-frequency heating component, a transverse movement component, an exhaust mechanism, an exhaust gas treatment mechanism and a spray mechanism; wherein, The transmission line passes through the box; The high-frequency heating component includes an induction coil and a heating main unit, which is used to generate an induction magnetic field to heat the material holder bonded with the resin plate to soften the adhesive; The traverse assembly is connected to the induction coil and is used to move the induction coil along the length direction of the material holder to which the resin plate is bonded; The spray mechanism is connected to an external water source through a circulation pipeline and is used to spray liquid onto the material holder to which the resin plate is bonded to cool it down; The exhaust mechanism and the waste gas treatment mechanism are connected to the box body and are used to treat and discharge the irritating gas in the box body.

4. The high frequency heating fully automatic board gluing machine according to any one of claims 1 to 3, characterized in that: The waste plate removal mechanism includes a plate removal mechanism, a glue scraping mechanism and a polishing mechanism. By means of the lifting, clamping and moving actions of the transporting jaws of the transporting mechanism, the material holder with the waste resin plate adhered thereto, which has been heated at high temperature, is successively transported to the plate removal mechanism, the glue scraping mechanism and the polishing mechanism to remove the waste resin plate and the residual glue on the surface of the material holder.

5. The high frequency heating fully automatic board gluing machine according to claim 4 is characterized in that: The grinding mechanism includes a grinding lateral moving device, a grinding lifting device and a grinding device. The grinding lifting device is arranged on the grinding lateral moving device. The grinding device is connected to the grinding lifting device to facilitate the lateral movement and lifting movement of the grinding device. The grinding device includes a rotary drive and a grinding head. The rotary drive drives the grinding head to rotate to remove the residual glue on the surface of the material seat.

6. The high frequency heating fully automatic board gluing machine according to claim 5 is characterized in that: The cooling mechanism includes a plurality of cold water tanks, air drying devices and circulation pipelines, wherein: The air-drying device comprises an air-drying tank, an upper air-blowing device, an air-blowing lateral moving device, an air-blowing lifting device and a bottom air-blowing device. The air-blowing lateral moving device is connected to the air-drying tank, and the air-blowing lifting device is connected to the air-blowing lateral moving device, so as to facilitate the lateral movement and lifting of the upper air-blowing device. The bottom air-blowing device is arranged at the bottom of the air-drying tank. The cold water tank and the air drying tank are both connected to the circulation pipeline.

7. The high frequency heating fully automatic board gluing machine according to claim 5 or 6, characterized in that: The resin plate feeding mechanism includes a resin plate storage device, a resin plate transmission device, a resin plate adsorption device and a resin plate transfer device; wherein, The resin plate storage device is arranged on both sides of the resin plate transmission device, and the resin plate adsorption device is arranged across the resin plate storage device and the resin plate transmission device, whereby the resin plate adsorption device is moved so that the resin plate is placed on the resin plate transmission device; The resin plate transfer device is arranged across the transmission line; The resin plate transmission device is arranged at one side of the transmission line and is connected to the resin plate transfer device in an aligned manner. With the action of the resin plate transfer device, the resin plate is placed on the material holder.

8. The high frequency heating fully automatic board gluing machine according to claim 7 is characterized in that: The solidified library includes a cache library, a storage mechanism and a storage mechanism; wherein, The cache has a plurality of independently arranged storage layers, each of which is provided with a plurality of independent curing mechanisms for pressing the material holder bonded with the new resin plate to cure it; The storage entry mechanism and the storage exit mechanism are arranged relatively to the buffer library, and are both provided with a lifting component and a translation component; the translation component is connected to the lifting component and can be connected to the curing mechanism in an aligned manner.

9. The high frequency heating fully automatic board gluing machine according to claim 8 is characterized in that: It also includes an artificial feeding mechanism disposed between the feeding mechanism and the high-frequency heating mechanism for artificial feeding.

10. The high frequency heating fully automatic board gluing machine according to any one of claims 1-3, 5, 6, 8, and 9, characterized in that: It also includes a control system, which is electrically connected to the feeding mechanism, the high-frequency heating mechanism, the waste plate removal mechanism, the cooling mechanism, the gluing mechanism, the resin plate feeding mechanism, and the curing warehouse, respectively, to control the actions of the feeding mechanism, the high-frequency heating mechanism, the waste plate removal mechanism, the cooling mechanism, the gluing mechanism, the resin plate feeding mechanism, and the curing warehouse.

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