Optical module heat dissipation structure and heat dissipation method thereof

Abstract

The invention relates to the technical field of optical communication, in particular to an optical module heat dissipation structure and a heat dissipation method thereof.The optical module is composed of an upper cover, a base, a PCBA board, an upper heat dissipation assembly and a lower heat dissipation assembly, and the upper heat dissipation assembly and the lower heat dissipation assembly are arranged on the upper side and the lower side of the PCBA board respectively and each composed of a heat conduction board and a heat dissipation device; the heat-conducting plate is arranged between the PCBA plate and the radiator, the first side of the heat-conducting plate is in contact with the PCBA plate, the second side of the heat-conducting plate is in contact with the radiator, and the radiator is internally provided with a radiating main air duct extending in the length direction of the radiator; cooling fins are embedded in the first side and the second side of the radiator, the cooling fins embedded in the second side of the radiator make contact with the corresponding upper cover or base, and the second side of the radiator is the side away from the heat conduction plate. According to the invention, heat generated by components on the PCBA board is transferred and dissipated by adopting a heat dissipation mode of combining dual-channel air-cooled heat dissipation and contact heat dissipation, and the internal temperature of the optical module can be efficiently reduced.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an optical module heat dissipation structure and a heat dissipation method thereof. Background Art

[0002] The optical components in the optical communication module are very sensitive to temperature. Excessively high temperature will affect the working performance of the optical communication module and even make it unable to work normally. Therefore, the heat dissipation problem of the optical communication module has always been a difficult problem that is difficult to solve but must be solved.

[0003] Existing heat dissipation methods for optical communication modules are mainly divided into three methods: internal heat dissipation, external heat dissipation and a combination of internal and external heat dissipation. The internal heat dissipation method is proposed in the Chinese invention patent with publication number CN114895409B and patent name as heat dissipation optical module and heat dissipation method of optical module, and heat is dissipated through an internal heat conductive sheet and a cavity filled with cooling liquid; the external heat dissipation method is provided in the Chinese invention patent with publication number CN104125751B and patent name as heat dissipation structure of optical module, and heat is dissipated through an external radiator; the internal and external combined heat dissipation method is provided in the Chinese invention patent with publication number CN113448027B and patent name as heat dissipation structure of optical module, optical module and communication equipment, and heat is dissipated through internal heat pipes and external heat dissipation fins. The existing technologies such as the above-mentioned internal heat dissipation and the internal and external combined heat dissipation methods all have the problem of occupying the internal space of the optical communication module, which limits the space for components arranged on the PCBA and increases the weight of the optical communication module. The existing technology of the above-mentioned external heat dissipation method is overly dependent on external heat dissipation equipment and facilities, which is not conducive to the use of the optical communication module in situations where there are no external heat dissipation facilities.

[0004] Based on this, how to effectively control the internal temperature of the optical communication module while reducing the space occupied by the heat dissipation structure and improving the internal space utilization of the optical communication module is a technical problem that urgently needs to be solved. Summary of the invention

[0005] The purpose of the present invention is to provide an optical module heat dissipation structure and a heat dissipation method thereof, which adopts a heat dissipation method combining dual-channel air-cooled heat dissipation and contact heat dissipation to transfer and dissipate the heat generated by components on a PCBA board, and can effectively save internal space while efficiently reducing the internal temperature of the optical module, and provide more space margin for the arrangement of components on the PCBA board, so as to solve the technical problem of how to effectively control the internal temperature of the optical communication module, reduce the space occupation of the heat dissipation structure, and improve the internal space utilization of the optical communication module.

[0006] The present invention is implemented by the following technical scheme: an optical module heat dissipation structure, the optical module is composed of a structural component upper cover, a structural component base and a PCBA board, the structural component upper cover is covered on the structural component base to form a sealing structure, the PCBA board is arranged in the sealing structure, and also includes an upper heat dissipation component and a lower heat dissipation component arranged in the sealing structure, the upper heat dissipation component and the lower heat dissipation component are respectively arranged on the upper and lower sides of the PCBA board;

[0007] The upper heat dissipation assembly and the lower heat dissipation assembly are both composed of a heat conducting plate and a radiator;

[0008] The heat conducting plate is arranged between the PCBA board and the radiator, a first side of the heat conducting plate contacts the PCBA board and a second side of the heat conducting plate contacts the radiator, and a main heat dissipation duct extending along the length direction of the radiator is arranged inside the radiator;

[0009] The first side and the second side of the radiator are both embedded with heat sinks, wherein the heat sink embedded in the second side of the radiator is in contact with the corresponding structural member upper cover or structural member base, and the second side of the radiator is the side away from the heat conducting plate.

[0010] According to a preferred embodiment, the first side of the radiator is provided with heat dissipation ducts at both ends in the length direction thereof, and the heat dissipation ducts are connected to the heat dissipation main air duct;

[0011] The heat conducting plate is provided with a first through slot corresponding to the heat dissipation duct, and the PCBA board is provided with a second through slot corresponding to the heat dissipation duct, and the first through slot and the second through slot are both adapted to the shape of the heat dissipation duct;

[0012] The heat dissipation air ducts of the upper heat dissipation assembly and the lower heat dissipation assembly are connected to each other to form a heat dissipation auxiliary air duct.

[0013] According to a preferred embodiment, ports on both sides of the main heat dissipation air duct of the upper heat dissipation component are connected to the outside of the optical module, and ports on both sides of the main heat dissipation air duct of the lower heat dissipation component are sealed;

[0014] A diverter block is provided in the main heat dissipation air duct of the upper heat dissipation component, and the diverter block is arranged at the rear side of the air inlet of the auxiliary heat dissipation air duct.

[0015] According to a preferred embodiment, a plurality of heat dissipation fins arranged vertically and at intervals are provided in the radiator of the upper heat dissipation assembly, and the arranged gaps between the plurality of heat dissipation fins constitute a main heat dissipation air duct.

[0016] According to a preferred embodiment, the heat sink is arranged along the length direction of the heat sink and is in a zigzag or wavy shape.

[0017] According to a preferred embodiment, a first side of the heat conducting plate is provided with an avoidance groove corresponding to the on-board components of the PCBA board, and thermal conductive silicone grease is coated between the avoidance groove and the on-board components of the PCBA board.

[0018] According to a preferred embodiment, a first buckle is provided at a first side edge of the heat sink, and a first slot matching with the first buckle is provided on the heat conducting plate;

[0019] A second buckle is arranged on the outer side of the heat conducting plate of the upper heat dissipation assembly, and a second clamping groove matched with the second buckle is opened on the heat conducting plate of the lower heat dissipation assembly.

[0020] According to a preferred embodiment, a heat dissipation boss is provided at the edge of the first side of the heat conducting plate along its length direction, a heat dissipation groove is opened at the edge of the PCBA board along its length direction, a heat dissipation bar is embedded in the heat dissipation groove, and the heat dissipation boss is in contact with the heat dissipation bar.

[0021] According to a preferred embodiment, the upper cover of the structural member is composed of an upper structural member and an upper cover plate, the upper cover plate is arranged on the upper surface of the upper structural member, a first thermal pad is arranged between the upper cover plate and the radiator of the upper heat dissipation assembly, a second thermal pad is arranged between the base of the structural member and the radiator of the lower heat dissipation assembly, a mounting groove is arranged inside the upper structural member, and the upper heat dissipation assembly and the lower heat dissipation assembly are both arranged in the mounting groove.

[0022] The present invention also provides an optical module heat dissipation method, which is applied to the optical module heat dissipation structure as described above, comprising: a heat conducting plate and a heat sink are respectively arranged on the upper and lower sides of the PCBA board, and heat sinks are arranged on the first side and the second side of the heat sink, wherein a heat dissipation main air duct extending along the length direction of the heat sink is arranged inside the heat sink;

[0023] The heat generated by the components on the PCBA is transferred to the radiator through the heat conduction plate, and the heat is dissipated by air cooling;

[0024] The heat gathered on the radiator is transferred to the corresponding structural member upper cover or structural member base through the heat sink, and the heat is dissipated by contact heat dissipation.

[0025] The technical solution of an optical module heat dissipation structure and a heat dissipation method thereof provided by the present invention has at least the following advantages and beneficial effects: (1) a heat dissipation method combining dual-channel air-cooling and contact-type heat dissipation is adopted to transfer and dissipate the heat generated by components on the PCBA board, which can effectively reduce the internal temperature of the optical module; (2) a heat transfer path is designed based on a structural upper cover, a structural base, an upper heat dissipation assembly, and a lower heat dissipation assembly, which can dissipate heat while occupying as little space as possible in the internal cavity of the optical module, effectively saving internal space and providing more space margin for the arrangement of components on the PCBA board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 An exploded schematic diagram of the heat dissipation structure of the optical module provided in Embodiment 1 of the present invention;

[0027] Figure 2 A schematic diagram of the heat sink structure of the upper heat dissipation assembly provided in Example 2 of the present invention;

[0028] Figure 3 A schematic diagram of the heat conduction plate structure of the upper heat dissipation assembly provided in Example 2 of the present invention;

[0029] Figure 4 A schematic diagram of the PCBA structure provided in Example 2 of the present invention;

[0030] Figure 5 A schematic diagram of the heat conduction plate structure of the lower heat dissipation assembly provided in Example 2 of the present invention;

[0031] Figure 6 A schematic diagram of the heat sink structure of the lower heat dissipation assembly provided in Example 2 of the present invention;

[0032] Figure 7 A schematic diagram of the heat sink structure of the upper heat dissipation assembly provided in Example 2 of the present invention;

[0033] Figure 8 A schematic diagram of a heat transfer path provided in Example 4 of the present invention;

[0034] Figure markings: 1-upper cover, 2-upper structural member, 3-heat sink, 4-heat conducting plate, 5-sealing gasket, 6-PCBA board, 7-structural member base, 8-thermal pad, 9-sealing pad, 10-thermal grease, 11-heat dissipation strip, 12-buffer pad, 13-screw, 14-first heat sink, 15-second heat sink, 301-shunt block, 302-heat sink mounting groove, 303-heat dissipation duct, 304-first buckle, 305-base avoidance groove, 401-first slot, 402-first through slot, 403-heat dissipation boss, 404-avoidance groove, 405-second buckle, 406-second slot, 601-heat dissipation through slot, 602-second through slot, 603-components. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0036] Example 1

[0037] Figure 1 This is an exploded schematic diagram of the heat dissipation structure of the optical module provided by an embodiment of the present invention. Figure 1 As shown, the heat dissipation structure of the optical module is composed of a structural component upper cover, a structural component base 7 and a PCBA board 6.

[0038] The structural member upper cover is covered on the structural member base 7, and a sealing gasket 9 circle 5 is provided at the joint between the two; the structural member upper cover is composed of the upper structural member 2 and the upper cover plate 1, and the upper cover plate 1 is arranged on the upper surface of the upper structural member 2; a sealing groove is provided on the lower surface of one end of the upper structural member 2 and the upper surface of one end of the structural member base 7, and a sealing gasket 9 is embedded in the sealing groove, thereby forming a sealing structure; the PCBA board 6 is arranged in the sealing structure. In addition, the upper structural member 2 and the structural member base 7 are provided with screw 13 mounting holes correspondingly, and the upper structural member 2 and the structural member base 7 are connected by screws 13 that cooperate with the screw 13 mounting holes.

[0039] The optical module heat dissipation structure also includes an upper heat dissipation component and a lower heat dissipation component arranged in the sealing structure, and the upper heat dissipation component and the lower heat dissipation component are respectively arranged on the upper and lower sides of the PCBA board 6; an installation groove is provided inside the upper structural member 2, and the upper heat dissipation component and the lower heat dissipation component are both arranged in the installation groove.

[0040] The upper heat dissipation assembly and the lower heat dissipation assembly are both composed of a heat conducting plate 4 and a radiator 3; the heat conducting plate 4 is arranged between the PCBA board 6 and the radiator 3, and the first side of the heat conducting plate 4 contacts the PCBA board 6 and the second side contacts the radiator 3, so as to transfer the heat generated by the components 603 on the PCBA board 6 to the radiator 3.

[0041] In this embodiment, the PCBA board 6 is provided with a buffer pad 12 at a position not covered by the heat conducting plate 4, and the buffer pad 12 is located between the lower surface of the upper structural member 2 or the upper surface of the structural member base 7 and the PCBA board 6, and is used to protect the PCBA board 6; specifically, the first side of the heat conducting plate 4 is provided with an avoidance groove 404 corresponding to the on-board components 603 of the PCBA board 6, and the avoidance groove 404 and the on-board components 603 of the PCBA board 6 are coated with thermal conductive silicone grease 10; the first side of the heat conducting plate 4 is provided with a heat dissipation convex at the edge along its length direction The PCBA board 6 is provided with a heat dissipation groove 601 at its edge along the length direction, and a heat dissipation bar 11 is embedded in the heat dissipation groove 601. The thickness of the heat dissipation bar 11 is about half of the heat dissipation groove 601 of the PCBA board 6. The heat dissipation boss 403 is embedded in the heat dissipation groove 601 and contacts the heat dissipation bar 11. It should be noted that the heat sink and the heat dissipation bar 11 are made of copper. The radiator 3 is provided with a main heat dissipation air duct extending along the length direction thereof, and the transferred heat is dissipated by air cooling.

[0042] Furthermore, a heat sink mounting groove 302 is provided on the first side and the second side of the radiator 3, and a heat sink is embedded in the heat sink mounting groove 302. The first heat sink 14 embedded in the second side of the radiator 3 is in contact with the corresponding structural upper cover or structural base 7, and the second heat sink 15 embedded in the first side of the radiator 3 is in contact with the heat conducting plate 4. The second side of the radiator 3 is the side away from the heat conducting plate 4. A first thermal conductive pad 8 is provided between the upper cover plate 1 and the radiator 3 of the upper heat dissipation component, and a second thermal conductive pad 8 is provided between the structural base 7 and the radiator 3 of the lower heat dissipation component, so as to transfer the heat gathered on the radiator 3 to the corresponding structural upper cover or structural base 7, and dissipate the heat by contact heat dissipation.

[0043] In summary, the heat dissipation method combining dual-channel air-cooling and contact-type heat dissipation is used to transfer and dissipate the heat generated by the components 603 on the PCBA board 6, which can effectively reduce the internal temperature of the optical module; in addition, the heat transfer path design is based on the structural upper cover, the structural base 7, the upper heat dissipation component and the lower heat dissipation component, which can dissipate heat while occupying as little space as possible in the internal cavity of the optical module, effectively saving internal space, and providing more space margin for the arrangement of components 603 on the PCBA board 6.

[0044] Example 2

[0045] This embodiment is based on the technical solution provided in Embodiment 1, and a heat dissipation auxiliary air duct is added to connect the heat sinks 3 on the upper and lower sides of the PCBA board 6, as follows:

[0046] In this embodiment, see Figure 2 and Figure 6As shown, the first side of the radiator 3 is provided with heat dissipation ducts 303 at both ends in the length direction, and the heat dissipation ducts 303 are connected to the heat dissipation main air duct; see Figure 3 and Figure 5 As shown, the heat conducting plate 4 is provided with a first through slot 402 corresponding to the heat dissipation duct 303, see Figure 4 As shown, a second through slot 602 is provided on the PCBA board 6 corresponding to the heat dissipation air duct 303, and the first through slot 402 and the second through slot 602 are both adapted to the shape of the heat dissipation air duct 303. The heat dissipation air duct 303 of the upper heat dissipation component passes through the first through slot 402 and the second through slot 602 in sequence and is connected with the heat dissipation air duct 303 of the lower heat dissipation component to form a heat dissipation auxiliary air duct.

[0047] The ports on both sides of the main heat dissipation air duct of the upper heat dissipation component are connected to the outside of the optical module, and the hot air flow in the main heat dissipation air duct is blown out from the radiator 3 through an external blowing device; the ports on both sides of the main heat dissipation air duct of the lower heat dissipation component are sealed and connected to the main heat dissipation air duct of the upper heat dissipation component through the auxiliary heat dissipation air duct, so as to transfer the heat generated by the components 603 on the lower side of the PCBA board 6 to the radiator 3 of the upper heat dissipation component for dissipation.

[0048] Furthermore, a diverter block 301 is provided in the main heat dissipation air duct of the upper heat dissipation component, and the diverter block 301 is arranged on the rear side of the air inlet of the auxiliary heat dissipation air duct; the diverter block 301 divides the airflow entering the main heat dissipation air duct of the upper heat dissipation component into two parts, one part enters the main heat dissipation air duct of the upper heat dissipation component, and the other part enters the main heat dissipation air duct of the lower radiator 3 through the auxiliary heat dissipation air duct.

[0049] See also Figure 2 The heat sink 3 of the upper heat dissipation assembly is provided with a plurality of heat dissipation fins arranged vertically and spaced apart, and the arrangement gaps of the plurality of heat dissipation fins constitute the main heat dissipation air duct, see Figure 6 , the main air duct of the lower heat dissipation component is designed with a hollow inner cavity; in a preferred implementation of this embodiment, the diverter block 301 is triangular and arranged in each arrangement gap; in another implementation, see Figure 7 As shown, the diverter block 301 is a partition that blocks a portion of the arrangement gap on the rear side of the air inlet of the heat dissipation auxiliary air duct, intercepts a portion of the airflow and redirects it to the heat dissipation auxiliary air duct, and the remaining airflow enters the heat dissipation main air duct of the upper heat dissipation component through the unblocked arrangement gap.

[0050] Furthermore, the heat sink is arranged along the length direction of the radiator 3 and is zigzag or wavy, and the angles of adjacent sides of the heat sink are between 60° and 90°. This design can connect different arrangement gaps and different sections of different arrangement gaps to make the heat more uniform.

[0051] Example 3

[0052] This embodiment is based on the technical solution provided in Example 1, and further describes the assembly method of each component:

[0053] A first buckle 304 is provided at the first side edge of the radiator 3, and a first slot 401 matching the first buckle 304 is provided on the heat conducting plate 4 to achieve the connection between the radiator 3 and the heat conducting plate 4; base avoidance grooves 305 are provided on both sides of the radiator 3 of the lower heat dissipation component; a second buckle 405 is provided on the outer side of the heat conducting plate 4 of the upper heat dissipation component, and a bevel boss is provided at the lower end of the second buckle 405, and a second slot 406 matching the second buckle 405 is provided on the heat conducting plate 4 of the lower heat dissipation component to achieve the connection between the heat conducting plates 4 on the upper and lower sides of the PCBA board 6.

[0054] The complete assembly process of the optical module heat dissipation structure provided in this embodiment is described below:

[0055] Step 1: Air-cooled heat dissipation structure assembly:

[0056] The heat sink is pasted into the heat sink mounting groove 302 opened on the first side and the second side of the upper heat dissipation component heat sink 3, and then the heat sink 3 is matched and buckled with the heat conducting plate 4; the heat sink is pasted into the heat sink mounting groove 302 opened on the first side and the second side of the lower heat dissipation component heat sink 3, and then the heat sink 3 is matched and buckled with the heat conducting plate 4.

[0057] Step 2: Contact heat dissipation structure assembly:

[0058] Paste the thermal pad 8 on the upper surface of the structural member base 7, and paste the buffer pad 12 on the position of the PCBA board 6 not covered by the thermal conductive plate 4, and then match and install the radiator 3 of the lower heat dissipation component inside the structural member base 7; apply thermal conductive silicone grease 10 in the avoidance groove 404 of the thermal conductive plate 4, and then set the sealing pad 9 on the heat dissipation duct 303 after the radiator 3 of the lower heat dissipation component passes through the thermal conductive plate 4; set the heat dissipation strip 11 in the heat dissipation through groove 601 opened on the PCBA board 6, and then set the PCBA board 6 on the thermal conductive plate 4 of the lower heat dissipation component so that the second through groove 602 opened on the PCBA board 6 passes through The heat dissipation duct 303 of the radiator 3 of the lower heat dissipation component performs the same steps on the upper heat dissipation component, which will not be elaborated here; after the heat conduction plate 4 of the upper heat dissipation component is matched and buckled with the heat conduction plate 4 of the lower heat dissipation component, the first thermal pad 8 is pasted between the upper cover plate 1 and the radiator 3 of the upper heat dissipation component, and the second thermal pad 8 is pasted between the structural member base 7 and the radiator 3 of the lower heat dissipation component, and then the sealing gasket 9 circle 5 is set at the edge of the upper surface of the structural member base 7, and then the upper structure 2 welded with the upper cover plate 1 is buckled with the structural member base 7, and finally the connection between the structural member upper cover and the structural member base 7 is achieved by screws 13.

[0059] Example 4

[0060] The present embodiment provides a method for heat dissipation of an optical module, which is applied to the heat dissipation structure of the optical module as described in any one of Embodiments 1 to 3, comprising: a heat conducting plate 4 and a heat sink 3 are respectively arranged on the upper and lower sides of a PCBA board 6, and heat sinks are arranged on the first side and the second side of the heat sink 3, wherein a main heat dissipation air duct extending along the length direction of the heat sink 3 is arranged inside the heat sink 3; the heat generated by the components 603 on the PCBA board 6 is transferred to the heat sink 3 through the heat conducting plate 4, and the heat is dissipated by air cooling; the heat gathered on the heat sink 3 is transferred to the corresponding structural member upper cover or structural member base 7 through the heat sink, and the heat is dissipated by contact heat dissipation; for specific heat transfer paths, see Figure 8 shown.

[0061] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An optical module heat dissipation structure, the optical module is composed of a structural component upper cover, a structural component base (7) and a PCBA board (6), the structural component upper cover is covered on the structural component base (7) to form a sealing structure, the PCBA board (6) is arranged in the sealing structure, characterized in that: It also includes an upper heat dissipation component and a lower heat dissipation component arranged in the sealing structure, wherein the upper heat dissipation component and the lower heat dissipation component are respectively arranged on the upper and lower sides of the PCBA board (6); The upper heat dissipation component and the lower heat dissipation component are both composed of a heat conduction plate (4) and a heat sink (3); The heat conducting plate (4) is arranged between the PCBA board (6) and the heat sink (3); a first side of the heat conducting plate (4) is in contact with the PCBA board (6) and a second side is in contact with the heat sink (3); and a main heat dissipation duct extending along the length direction of the heat sink (3) is provided inside the heat sink (3); The first side and the second side of the heat sink (3) are both embedded with heat sinks, wherein the heat sink embedded in the second side of the heat sink (3) is in contact with the corresponding structural component upper cover or structural component base (7), and the second side of the heat sink (3) is the side away from the heat conduction plate (4).

2. The optical module heat dissipation structure according to claim 1, characterized in that: The first side of the radiator (3) is provided with heat dissipation ducts (303) at both ends in the length direction thereof, respectively, and the heat dissipation ducts (303) are connected to the heat dissipation main duct; The heat conducting plate (4) is provided with a first through groove (402) corresponding to the heat dissipation duct (303), and the PCBA board (6) is provided with a second through groove (602) corresponding to the heat dissipation duct (303), and both the first through groove (402) and the second through groove (602) are adapted to the shape of the heat dissipation duct (303); The heat dissipation air ducts (303) of the upper heat dissipation component and the lower heat dissipation component are connected to each other to form a heat dissipation auxiliary air duct.

3. The optical module heat dissipation structure according to claim 2, characterized in that: The ports on both sides of the main heat dissipation air duct of the upper heat dissipation component are connected to the outside of the optical module, and the ports on both sides of the main heat dissipation air duct of the lower heat dissipation component are sealed; A flow divider block (301) is provided in the main heat dissipation air duct of the upper heat dissipation component, and the flow divider block (301) is arranged at the rear side of the air inlet of the auxiliary heat dissipation air duct.

4. The optical module heat dissipation structure according to claim 3, characterized in that: A plurality of heat dissipation fins arranged vertically and at intervals are arranged in the radiator (3) of the upper heat dissipation component, and the arranged intervals between the plurality of heat dissipation fins constitute a main heat dissipation air duct.

5. The optical module heat dissipation structure according to claim 4, characterized in that: The heat sink fins are arranged along the length direction of the heat sink (3) and are in a sawtooth or wave shape.

6. The optical module heat dissipation structure according to claim 1, characterized in that: A first side of the heat conducting plate (4) is provided with an avoidance groove (404) corresponding to the on-board components (603) of the PCBA board (6), and thermal conductive silicone grease (10) is coated between the avoidance groove (404) and the on-board components (603) of the PCBA board (6).

7. The optical module heat dissipation structure according to claim 1, characterized in that: A first buckle (304) is provided at a first side edge of the heat sink (3), and a first slot (401) matching with the first buckle (304) is provided on the heat conducting plate (4); A second buckle (405) is provided on the outer side of the heat conduction plate (4) of the upper heat dissipation component, and a second clamping groove (406) matching with the second buckle (405) is provided on the heat conduction plate (4) of the lower heat dissipation component.

8. The optical module heat dissipation structure according to claim 1, characterized in that: A heat dissipation boss (403) is provided at an edge of the first side of the heat conducting plate (4) along its length direction, a heat dissipation groove (601) is provided at an edge of the PCBA board (6) along its length direction, a heat dissipation bar (11) is embedded in the heat dissipation groove (601), and the heat dissipation boss (403) is in contact with the heat dissipation bar (11).

9. The optical module heat dissipation structure according to claim 1, characterized in that: The structural component upper cover is composed of an upper structural component (2) and an upper cover plate (1); the upper cover plate (1) is arranged on the upper surface of the upper structural component (2); a first thermal conductive pad (8) is arranged between the upper cover plate (1) and the radiator (3) of the upper heat dissipation component; a second thermal conductive pad (8) is arranged between the structural component base (7) and the radiator (3) of the lower heat dissipation component; a mounting groove is arranged inside the upper structural component (2); the upper heat dissipation component and the lower heat dissipation component are both arranged in the mounting groove.

10. A method for heat dissipation of an optical module, characterized in that: The optical module heat dissipation structure applied to any one of claims 1 to 9 comprises: A heat conducting plate (4) and a heat sink (3) are respectively arranged on the upper and lower sides of the PCBA board (6), and heat sinks are arranged on the first side and the second side of the heat sink (3), wherein a main heat dissipation duct extending along the length direction of the heat sink (3) is arranged inside the heat sink (3); The heat generated by the components (603) on the PCBA board (6) is transferred to the radiator (3) through the heat conducting plate (4), and the heat is dissipated by air cooling; The heat gathered on the radiator (3) is transferred to the corresponding structural component upper cover or structural component base (7) through the heat sink, and the heat is dissipated by contact heat dissipation.

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