Efficient heat dissipation butterfly-shaped packaging tube shell

Abstract

The invention relates to the technical field of laser packaging heat dissipation, in particular to an efficient heat dissipation butterfly-shaped packaging tube shell which comprises at least one tube shell bottom plate and four tube shell side plates, and a cavity is defined by the four tube shell side plates and fixed to the tube shell bottom plate. And a heat dissipation channel inlet, a heat dissipation channel outlet and a liquid cooling heat dissipation channel which are communicated with one another are respectively formed in each tube shell bottom plate and at least one tube shell side plate. The heat dissipation channel inlet, the heat dissipation channel outlet and the liquid cooling heat dissipation channel are introduced into the side plate and bottom plate structure of the butterfly-shaped packaging tube shell, so that the first-stage or second-stage heat dissipation mode of the butterfly-shaped packaging device is changed into liquid cooling heat dissipation, the advantages of large space, flexible and compact structure, multiple pins and the like of the butterfly-shaped packaging device are reserved, and the heat dissipation efficiency of the butterfly-shaped packaging device is improved. The heat dissipation efficiency and the heat dissipation capacity are greatly improved, the heat dissipation path is shortened, the heat dissipation structure is simplified, the packaging difficulty is reduced, the heat dissipation level is reduced, the total power consumption of the system is reduced, the influence of the external environment temperature on the device is reduced, and the stability and the reliability of the device are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of laser packaging and heat dissipation, and in particular relates to a butterfly-shaped packaging tube shell with high efficiency heat dissipation. Background Art

[0002] Semiconductor lasers are one of the core technologies of optoelectronics science and one of the most important light sources in the information age. They are widely used in communications, sensing, detection, medical, industrial, military, aerospace and other fields. According to the characteristics of semiconductor lasers and the needs of application scenarios, semiconductor lasers have a variety of packaging forms, such as TO packaging, C-mount packaging, butterfly packaging, plastic packaging and ceramic packaging. Among them, the butterfly package is a comprehensive structure that integrates packaging, protection, heat dissipation and connection. It has significant characteristics and advantages such as large space, flexible design, many pins and compact structure. As a packaging form with comprehensive functions and stable performance, the butterfly package has been widely used in many fields such as optical communication, optical sensing, and optical detection. Usually, the butterfly package uses a cubic tube shell with a closed structure made of metal or ceramic, and the pins are evenly distributed on the two side walls of the tube shell, with a transparent optical window or a tube mouth that allows optical fiber to be inserted. The typical butterfly package has 14 pins, allowing semiconductor lasers, thermistors, semiconductor refrigerators, photodetectors, optical lenses, inductors and other components to be installed in the tube shell.

[0003] Semiconductor lasers generate a lot of heat during operation. If the heat cannot be transferred in time to reduce the chip temperature, it will affect the power and service life of the laser. Therefore, the heat dissipation structure is an important part of the packaging structure design, which aims to ensure the stability and reliability of the device by effectively dissipating the heat generated by the device during operation. At present, the heat dissipation methods used by lasers include passive heat dissipation, air cooling, liquid cooling, and semiconductor refrigerator cooling. Due to the small size of semiconductor lasers and the limited internal space of the butterfly package shell, passive heat dissipation or semiconductor refrigerator heat dissipation is basically adopted. The heat dissipation design of the butterfly package shell usually includes material design, internal thermal management design, and external secondary heat dissipation design. Internal thermal management design is to manage the heat generated by the semiconductor laser chip by introducing one or more semiconductor coolers or a heat sink structure for passive heat dissipation inside the shell. Both methods can transfer the heat generated by the laser to the bottom plate of the shell. Material design is to select metal or ceramic with high thermal conductivity as the shell bottom plate material on the heat transfer path, and then increase the contact area to increase the heat conduction, so as to effectively transfer the heat generated by the laser from the inside of the shell to the outside. External secondary heat dissipation design is to set air cooling, liquid cooling, semiconductor cooler and other heat dissipation devices on the outside of the shell to perform secondary heat dissipation on the shell and improve the heat dissipation. In the liquid cooling and semiconductor cooler cooling schemes, the shell bottom plate is in close contact with the heat sink through mechanical fixing to conduct heat generated inside the shell.

[0004] For semiconductor lasers with high output power and high temperature control accuracy, passive heat dissipation or air cooling cannot meet the heat dissipation and temperature control requirements. A semiconductor refrigerator with high cooling power is usually used in the shell. The heat dissipation path inside the butterfly package semiconductor laser with a semiconductor refrigerator is generally semiconductor laser chip, high melting point solder, ceramic heat sink, low melting point solder, semiconductor refrigerator, low melting point solder. There are problems such as long heat dissipation path, complex mechanical structure, complex assembly process, and high cost. The heat accumulation formed by long-term work can easily cause the low melting point solder area to produce voids and cracks, affecting the stability and reliability of the device. External heat dissipation structures such as secondary heat dissipation and tertiary heat dissipation need to be designed outside the shell. The system is large in size and has high total power consumption. There is hard contact between the external heat dissipation structure and the shell bottom plate. The contact surface is prone to virtual contact and warping deformation, resulting in low heat dissipation efficiency and poor reliability and stability of the device. In addition, in high-temperature application environments, the ambient temperature will indirectly affect the temperature inside the shell, thereby affecting the device characteristics. The existing butterfly package shell heat dissipation design cannot reduce the interference of ambient temperature on the device. Summary of the invention

[0005] In view of this, the present invention aims to provide a high-efficiency heat dissipation butterfly-shaped package tube shell with a liquid-cooled heat dissipation channel to simplify the heat dissipation structure inside the tube shell, shorten the heat dissipation path, and reduce the difficulty of packaging.

[0006] To achieve the above object, the technical solution created by the present invention is implemented as follows:

[0007] A high-efficiency heat dissipation butterfly-shaped package tube shell comprises at least one tube shell bottom plate and four tube shell side plates. The four tube shell side plates form a cavity and are fixed on the tube shell bottom plate. A heat dissipation channel inlet, a heat dissipation channel outlet and a liquid cooling heat dissipation channel are respectively formed in each tube shell bottom plate and in at least one tube shell side plate.

[0008] Furthermore, the heat dissipation channel inlet and heat dissipation channel outlet in the tube shell bottom plate and the heat dissipation channel inlet and heat dissipation channel outlet in the tube shell side plate are respectively connected to the liquid inlet holes and liquid outlet holes of two refrigeration devices; or the heat dissipation channel inlet and heat dissipation channel outlet in the tube shell bottom plate are connected to the liquid inlet hole and liquid outlet hole of one refrigeration device, and the heat dissipation channel inlet and heat dissipation channel outlet in the tube shell side plate are connected to the liquid cooling heat dissipation channel in the tube shell bottom plate.

[0009] Furthermore, the heat dissipation channel inlet and the heat dissipation channel outlet on the bottom plate of the tube shell are located in the same plane or in different planes.

[0010] Furthermore, when the heat dissipation channel inlet and the heat dissipation channel outlet on the tube shell side plate are not connected to the liquid cooling heat dissipation channel on the tube shell bottom plate, the heat dissipation channel inlet and the heat dissipation channel outlet on the tube shell side plate are located in the same plane or different planes.

[0011] Furthermore, the heat dissipation channel inlet and heat dissipation channel outlet in the tube shell bottom plate and the tube shell side plate are connected to the external water pipe or directly connected to the water-through heat dissipation bottom plate through a metal adapter; the heat dissipation channel inlet and the metal adapter, the heat dissipation channel outlet and the metal adapter, and the metal adapter and the external water pipe are sealed respectively with sealant or sealing tape; the heat dissipation channel inlet and the water-through heat dissipation bottom plate, and the heat dissipation channel outlet and the water-through heat dissipation bottom plate are sealed with a sealing ring.

[0012] Furthermore, each tube shell base plate includes an upper tube shell base plate and a lower tube shell base plate, and grooves are processed on the opposite surfaces of the upper tube shell base plate and the lower tube shell base plate respectively. When the upper tube shell base plate and the lower tube shell base plate are combined, a heat dissipation channel inlet, a heat dissipation channel outlet and a liquid cooling heat dissipation channel are formed.

[0013] Furthermore, positioning holes and positioning protrusions are formed on the upper bottom plate of the tube shell and the lower bottom plate of the tube shell.

[0014] Furthermore, the tube shell bottom plate and the tube shell side plates are made of metal or ceramic materials.

[0015] Furthermore, a light hole is formed on one or two of the opposite shell side plates, pins and electrodes are installed on the other two opposite shell side plates, and a semiconductor laser chip is installed in the cavity surrounded by the four shell side plates.

[0016] Compared with the prior art, the invention can achieve the following beneficial effects:

[0017] The present invention introduces a heat dissipation channel inlet, a heat dissipation channel outlet and a liquid-cooled heat dissipation channel into the side plate and bottom plate structure of the butterfly package tube shell, so that the primary or secondary heat dissipation mode of the butterfly package device is changed to liquid cooling. While retaining the advantages of the butterfly package device such as large space, flexible and compact structure, and multiple pins, the heat dissipation efficiency and heat dissipation are greatly improved, the heat dissipation path is shortened, the heat dissipation structure is simplified, the packaging difficulty is reduced, the heat dissipation levels are reduced, the total power consumption of the system is reduced, and the influence of the external environment temperature on the device is reduced, thereby improving the stability and reliability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 It is a structural schematic diagram of a high-efficiency heat dissipation butterfly packaging tube shell according to an embodiment of the invention;

[0020] Figure 2 It is a schematic diagram of a layout of the bottom plate heat dissipation channel inlet and the bottom plate heat dissipation channel outlet according to an embodiment of the invention;

[0021] Figure 3 It is a schematic diagram of another layout of the bottom plate heat dissipation channel inlet and the bottom plate heat dissipation channel outlet according to an embodiment of the invention;

[0022] Figure 4 It is a schematic diagram of the structure of the tube shell side plate according to the embodiment of the invention.

[0023] Explanation of the reference numerals: tube shell bottom plate 1, bottom plate heat dissipation channel inlet 11, bottom plate heat dissipation channel outlet 12, bottom plate liquid-cooling heat dissipation channel 13, tube shell upper bottom plate 14, tube shell lower bottom plate 15, positioning hole 16, tube shell side plate 2, side plate heat dissipation channel inlet 21, side plate heat dissipation channel outlet 22, side plate liquid-cooling heat dissipation channel 23, light hole 3, pin 4, electrode 5. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the invention more clear, the invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the invention and do not constitute a limitation of the invention.

[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0027] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0028] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0029] like Figure 1-Figure 4 As shown, the present invention provides an efficient heat dissipation butterfly package tube shell, including at least one tube shell bottom plate 1 ( Figure 1The figure shows a tube shell bottom plate 1 and four tube shell side plates 2. The tube shell bottom plate 1 and the tube shell side plates 2 are made of metal material or ceramic material. The metal material can be oxygen-free copper, Kovar alloy and other metal materials with high thermal conductivity. The four tube shell side plates 2 surround a cavity and are welded and fixed on the tube shell bottom plate 1. A bottom plate heat dissipation channel inlet 11, a bottom plate heat dissipation channel outlet 12, and a bottom plate liquid cooling heat dissipation channel 13 are formed in each tube shell bottom plate 1. The bottom plate heat dissipation channel inlet 11 and the bottom plate heat dissipation channel outlet 12 serve as the liquid inlet and liquid outlet of the refrigerant on the tube shell bottom plate 1. The bottom plate liquid cooling heat dissipation channel 13 serves as the flow channel of the refrigerant on the tube shell bottom plate 1. The cooling liquid flows into the tube shell bottom plate 1 from the bottom plate heat dissipation channel inlet 11 and flows out from the bottom plate heat dissipation channel outlet 12 through the bottom plate liquid cooling heat dissipation channel 13; a side plate heat dissipation channel inlet 21, a side plate heat dissipation channel outlet 22 and a side plate liquid cooling heat dissipation channel 23 that are connected are formed in at least one tube shell side plate 2. The side plate heat dissipation channel inlet 21 and the side plate heat dissipation channel outlet 22 serve as a liquid inlet and a liquid outlet for the cooling liquid on the tube shell side plate 2. The side plate liquid cooling heat dissipation channel 23 serves as a flow channel for the cooling liquid on the tube shell side plate 2. The cooling liquid flows into the tube shell side plate 2 from the side plate heat dissipation channel inlet 21 and flows out from the side plate heat dissipation channel outlet 22 through the side plate liquid cooling heat dissipation channel 23.

[0030] The tube shell bottom plate 1 includes a tube shell upper bottom plate 14 and a tube shell lower bottom plate 15. Grooves are formed on the surfaces of the tube shell upper bottom plate 14 and the tube shell lower bottom plate 15 respectively by etching or corrosion. The tube shell upper bottom plate 14 and the tube shell lower bottom plate 15 after the grooves are formed are physically and chemically polished to remove surface impurities and uneven parts of the tube shell upper bottom plate 14 and the tube shell lower bottom plate 15. Acetone, ethanol and deionized water are used to ultrasonically clean the surfaces of the tube shell upper bottom plate 14 and the tube shell lower bottom plate 15 in turn to remove impurities and uneven parts of the surfaces of the tube shell upper bottom plate 14 and the tube shell lower bottom plate 15 during polishing. The residues that may be generated during the irradiation process are removed to ensure the surface is clean; the processed upper base plate 14 and the lower base plate 15 of the tube shell are stacked and welded together by arc welding, or the upper base plate 14 and the lower base plate 15 of the tube shell are bonded together by sealant to form a tube shell bottom plate 1 with a bottom plate heat dissipation channel inlet 11, a bottom plate heat dissipation channel outlet 12, and a bottom plate liquid cooling heat dissipation channel 13; Ni / Au is used to change the metallization properties to complete the preparation process of the tube shell bottom plate 1; and then it is welded to the tube shell side plate 2 structure.

[0031] In order to ensure that the upper base plate 14 of the tube shell is aligned with the lower base plate 15 of the tube shell, positioning holes 16 are processed at the four corners of the upper base plate 14 of the shell, and positioning protrusions (not shown in the figure) are formed at the four corners of the lower base plate 15 of the tube shell. The positioning of the upper base plate 14 of the tube shell and the lower base plate 15 of the tube shell are achieved through the positioning cooperation between the positioning holes 16 and the positioning protrusions.

[0032] The manufacturing method of the tube shell side plate 2 is the same as that of the tube shell bottom plate 1, so it is not repeated. A light hole 3 is formed on one or two of the opposite tube shell side plates 2, and pins 4 and electrodes 5 are installed on the other two opposite tube shell side plates 2. A semiconductor laser chip (not shown) is installed in the cavity surrounded by the four tube shell side plates 2.

[0033] The bottom plate heat dissipation channel inlet 11 and the bottom plate heat dissipation channel outlet 12 on the tube shell bottom plate 1 can be placed in the same plane or in different planes. If the bottom plate heat dissipation channel inlet 11 and the bottom plate heat dissipation channel outlet 12 are placed in the same plane, the bottom plate heat dissipation channel inlet 11 and the bottom plate heat dissipation channel outlet 12 can be placed on the bottom surface of the tube shell bottom plate 1 or any side of the front, back, left, and right sides at the same time, or they can be placed on different sides at the same time. If the bottom plate heat dissipation channel inlet 11 and the bottom plate heat dissipation channel outlet 12 are placed in different planes, the bottom plate heat dissipation channel inlet 11 is placed on the bottom surface of the tube shell bottom plate 1, and the bottom plate heat dissipation channel outlet 12 is placed on any side of the tube shell bottom plate 1, or the bottom plate heat dissipation channel outlet 12 is placed on the bottom surface of the tube shell bottom plate 1, and the bottom plate heat dissipation channel inlet 11 is placed on any side of the tube shell bottom plate 1.

[0034] When the bottom plate heat dissipation channel inlet 11 and the bottom plate heat dissipation channel outlet 12 are simultaneously disposed on the bottom surface of the tube shell bottom plate 1 , the thickness of the tube shell bottom plate 1 can be further reduced.

[0035] The bottom plate heat dissipation channel inlet 11 and the bottom plate heat dissipation channel outlet 12 of the tube shell bottom plate 1 and the side plate heat dissipation channel inlet 21 and the side plate heat dissipation channel outlet 22 of the tube shell side plate 2 are respectively connected to an external water pipe (not shown in the figure) through a metal adapter (not shown in the figure), and the bottom plate heat dissipation channel inlet 11 and the metal adapter, the bottom plate heat dissipation channel outlet 12 and the metal adapter, the side plate heat dissipation channel inlet 21 and the metal adapter, and the side plate heat dissipation channel outlet 22 and the metal adapter are sealed respectively with sealant or sealing tape.

[0036] The bottom plate heat dissipation channel inlet 11 and the bottom plate heat dissipation channel outlet 12 of the tube shell bottom plate 1 and the side plate heat dissipation channel inlet 21 and the side plate heat dissipation channel outlet 22 of the tube shell side plate 2 can also be directly connected to the water-through heat dissipation bottom plate (not shown in the figure), and sealing rings are used to seal between the bottom plate heat dissipation channel inlet 11 and the water-through heat dissipation bottom plate, between the bottom plate heat dissipation channel outlet 12 and the water-through heat dissipation bottom plate, between the side plate heat dissipation channel inlet 21 and the water-through heat dissipation bottom plate, and between the side plate heat dissipation channel outlet 22 and the water-through heat dissipation bottom plate.

[0037] When a passive heat dissipation structure is used in a butterfly package tube shell, no semiconductor cooler is installed in the tube shell, and passive heat dissipation is only performed through a metal or ceramic heat sink. The butterfly package tube shell uses liquid cooling to perform primary heat dissipation (heat dissipation for semiconductor laser chips). While retaining the advantages of the passive heat dissipation structure, such as fewer internal components, simple structure, and high reliability, the heat dissipation and heat dissipation efficiency of the device are greatly improved.

[0038] When the butterfly package tube shell adopts an active heat dissipation structure, a semiconductor cooler is installed in the butterfly package tube shell, and the butterfly package tube shell adopts liquid cooling to perform secondary heat dissipation (cooling the semiconductor cooler). While retaining high temperature control accuracy, it increases the heat dissipation capacity, simplifies the heat dissipation structure, shortens the heat dissipation path, reduces the packaging difficulty, reduces the heat dissipation level, and reduces the total power consumption of the system.

[0039] When the butterfly packaged device is sensitive to ambient temperature and is in a high temperature working environment or in an environment with a large temperature variation range, the butterfly package shell with liquid cooling channels on the bottom plate and side plates can isolate the impact of ambient temperature on the device while achieving efficient thermal management, thereby improving the stability and reliability of the device and expanding the application range of the butterfly package.

[0040] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the disclosure of the present invention can be performed in parallel, sequentially or in different orders, as long as the desired results of the technical solution disclosed in the present invention can be achieved, and this document does not limit this.

[0041] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An efficient heat dissipation butterfly package tube shell, comprising at least one tube shell bottom plate and four tube shell side plates, wherein the four tube shell side plates are fixed on the tube shell bottom plate to form a cavity, characterized in that: A heat dissipation channel inlet, a heat dissipation channel outlet, and a liquid cooling heat dissipation channel that are interconnected are respectively formed in each tube shell bottom plate and in at least one tube shell side plate.

2. The high-efficiency heat dissipation butterfly package tube shell according to claim 1, characterized in that: The heat dissipation channel inlet and heat dissipation channel outlet in the tube shell bottom plate and the heat dissipation channel inlet and heat dissipation channel outlet in the tube shell side plate are respectively connected to the liquid inlet holes and liquid outlet holes of two refrigeration devices; or the heat dissipation channel inlet and heat dissipation channel outlet in the tube shell bottom plate are connected to the liquid inlet hole and liquid outlet hole of one refrigeration device, and the heat dissipation channel inlet and heat dissipation channel outlet in the tube shell side plate are connected to the liquid cooling heat dissipation channel in the tube shell bottom plate.

3. The high-efficiency heat dissipation butterfly package tube shell according to claim 2, characterized in that: The heat dissipation channel inlet and the heat dissipation channel outlet on the tube shell bottom plate are located in the same plane or in different planes.

4. The high-efficiency heat dissipation butterfly package tube shell according to claim 2, characterized in that: When the heat dissipation channel inlet and the heat dissipation channel outlet on the tube shell side plate are not connected to the liquid cooling heat dissipation channel on the tube shell bottom plate, the heat dissipation channel inlet and the heat dissipation channel outlet on the tube shell side plate are located in the same plane or different planes.

5. The high-efficiency heat dissipation butterfly package tube shell according to claim 4, characterized in that: The heat dissipation channel inlet and heat dissipation channel outlet in the tube shell bottom plate and the tube shell side plate are connected to the external water pipe or directly connected to the water-through heat dissipation bottom plate through the metal adapter; the heat dissipation channel inlet and the metal adapter, the heat dissipation channel outlet and the metal adapter, and the metal adapter and the external water pipe are sealed respectively with sealant or sealing tape; the heat dissipation channel inlet and the water-through heat dissipation bottom plate, and the heat dissipation channel outlet and the water-through heat dissipation bottom plate are sealed with sealing rings.

6. The high-efficiency heat dissipation butterfly package tube shell according to any one of claims 1 to 5, characterized in that: Each tube shell base plate includes an upper tube shell base plate and a lower tube shell base plate. Grooves are processed on the opposite surfaces of the upper tube shell base plate and the lower tube shell base plate respectively. When the upper tube shell base plate and the lower tube shell base plate are combined, a heat dissipation channel inlet, a heat dissipation channel outlet and a liquid cooling heat dissipation channel are formed.

7. The high-efficiency heat dissipation butterfly package tube shell according to claim 6, characterized in that: Positioning holes and positioning protrusions are formed on the upper bottom plate of the tube shell and the lower bottom plate of the tube shell.

8. The high-efficiency heat dissipation butterfly package tube shell according to claim 1, characterized in that: The tube shell bottom plate and the tube shell side plate are made of metal or ceramic material.

9. The high-efficiency heat dissipation butterfly package tube shell according to claim 1, characterized in that: A light-through hole is formed on one or two of the opposite tube shell side plates, pins and electrodes are installed on the other two opposite tube shell side plates, and a semiconductor laser chip is installed in a cavity surrounded by four tube shell side plates.

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