Silicon wafer edge retaining system and method

Abstract

The invention provides a silicon wafer edge keeping system and method. The system comprises a carrying table, a plurality of movable keeping units arranged on the carrying table and a driving unit arranged below the carrying table. Wherein the driving unit is used for synchronously driving the plurality of movable retaining units to corresponding retaining positions so as to retain the edge of the silicon wafer, or the driving unit is used for synchronously driving the plurality of movable retaining units to corresponding loosening positions so as to loosen the edge of the silicon wafer; a first distance between the holding position and a center of the stage is less than a second distance between the loosening position and the center of the stage. According to the invention, one driving unit is used for synchronously driving a plurality of movable holding units, so that deviation or damage of silicon wafers in the transmission process is reduced, the control difficulty is reduced, the hardware cost of the system is reduced, and the installation and debugging are relatively simple.

Description

Technical Field

[0001] The present application relates to the field of silicon wafer manufacturing and detection technology, and in particular to a silicon wafer edge maintenance system and method. Background Art

[0002] In the field of semiconductor silicon wafer manufacturing, the quality and processing accuracy of silicon wafers affect the subsequent chip manufacturing process. In order to ensure that the front and back sides of the silicon wafers are not contaminated or damaged in each process step, silicon wafer edge clamping technology is widely used in silicon wafer transmission and inspection equipment. The relevant clamping system has some limitations in design and operation, which may cause the silicon wafer to deviate or be damaged during the transmission process, thus affecting the overall production efficiency and product quality.

[0003] Based on this, the present application provides a silicon wafer edge maintenance system and method to improve the related technology. Summary of the invention

[0004] The purpose of this application is to provide a silicon wafer edge maintenance system and method to reduce the deviation or damage of silicon wafers during transmission, thereby reducing the control difficulty, hardware cost and maintenance cost.

[0005] The purpose of this application is achieved by the following technical solutions:

[0006] In a first aspect, the present application provides a silicon wafer edge holding system, the system comprising:

[0007] Carrier;

[0008] A plurality of movable holding units disposed on the stage;

[0009] A driving unit disposed below the platform;

[0010] Wherein, the driving unit is used to synchronously drive the multiple movable holding units to corresponding holding positions to hold the edge of the silicon wafer, or, the driving unit is used to synchronously drive the multiple movable holding units to corresponding release positions to release the edge of the silicon wafer; the first distance between the holding position and the center of the carrier is smaller than the second distance between the release position and the center of the carrier.

[0011] In some embodiments, the system further comprises:

[0012] A plurality of transmission units connected to the driving unit, the transmission units are connected to the movable holding units in a one-to-one correspondence, and the driving unit is used to drive the corresponding movable holding unit through the transmission unit; one of the transmission units is provided with a plug, and the carrier is provided with a plugging hole, and when the plurality of movable holding units are located at corresponding holding positions, the plug corresponds to the position of the plugging hole to close the upper surface of the plugging hole;

[0013] A negative pressure suction head, used to be connected to the lower surface of the blocking hole to create a negative pressure environment in the blocking hole;

[0014] The negative pressure sensor is used to obtain a negative pressure test value in the air inhalation path of the negative pressure suction head.

[0015] In some embodiments, the driving unit is a cylinder, and the system further comprises a rotating base disposed on the carrier, the rotating base being pivotally connected to each transmission unit respectively;

[0016] The cylinder is used to move downward to drive the rotating base to rotate along the first rotation direction, so that the multiple movable holding units are synchronously driven to corresponding holding positions through the rotating base and the multiple transmission units; or,

[0017] The cylinder is used to move upward to drive the rotating base to rotate along the second rotation direction, so as to synchronously drive the multiple movable holding units to corresponding release positions through the rotating base and the multiple transmission units;

[0018] The first rotation direction and the second rotation direction are opposite to each other.

[0019] In some embodiments, the transmission unit adopts a connecting rod mechanism, the connecting rod mechanism includes a plurality of connecting rod segments pivotally connected in sequence, the plug is arranged on the end connecting rod segment of one of the connecting rod mechanisms, and the system further includes:

[0020] A guide member is arranged on the carrier, the guide member corresponds to the connecting rod mechanism one by one, and the guide member is used to limit the movement direction of the end connecting rod segment of the corresponding connecting rod mechanism; the end connecting rod segment of the connecting rod mechanism is the connecting rod segment connected to the movable holding unit.

[0021] In some embodiments, the straight line in which the movement direction of the end link segment lies passes through the center of the carrier.

[0022] In some embodiments, the system further comprises:

[0023] The alarm controller is used to receive the negative pressure test value from the negative pressure sensor and perform an alarm operation when the negative pressure test value is less than the negative pressure target value.

[0024] In some embodiments, the system further comprises:

[0025] A cylinder controller is used to adjust the gas pressure of the cylinder according to the size and / or position of the silicon wafer so that the holding force of the multiple movable holding units matches the silicon wafer.

[0026] In some embodiments, the system further comprises:

[0027] At least one fixing and holding unit is used to hold the edge of the silicon wafer.

[0028] In some embodiments, the movable holding unit is a movable clamping jaw.

[0029] In some embodiments, the fixing and holding unit is a supporting clamp.

[0030] In a second aspect, the present application provides a silicon wafer edge holding method, which is applied to a silicon wafer edge holding system, the system comprising a carrier, a plurality of movable holding units arranged on the carrier, and a driving unit arranged below the carrier;

[0031] The method comprises:

[0032] Sending a hold control instruction or a release control instruction to the driving unit;

[0033] Wherein, the driving unit is used to synchronously drive the multiple movable holding units to corresponding holding positions to hold the edge of the silicon wafer after receiving the holding control instruction, or the driving unit is used to synchronously drive the multiple movable holding units to corresponding release positions to release the edge of the silicon wafer after receiving the release control instruction; the first distance between the holding position and the center of the carrier is smaller than the second distance between the release position and the center of the carrier.

[0034] The present application provides a silicon wafer edge holding system and method, which realizes the synchronous holding and release of the silicon wafer edge through multiple movable holding units on the stage. The drive unit is installed under the stage and can drive the movable holding unit to move synchronously. If the silicon wafer needs to be held, the drive unit drives multiple movable holding units synchronously to a holding position close to the center of the stage, at which position, the movable holding unit firmly holds the edge of the silicon wafer. On the contrary, if the silicon wafer needs to be released, the drive unit drives multiple movable holding units synchronously to a release position away from the center of the stage to release the edge of the silicon wafer. The present application uses a drive unit to synchronously drive multiple movable holding units, simplifies the structural design, reduces the dependence on multiple independent motors, reduces the control difficulty, reduces the hardware cost of the system, and is relatively simple to install and debug. Secondly, the system allows the relevant position (including holding position and release position) and holding force of the movable holding unit to be adjusted, can adapt to silicon wafers of different sizes and shapes, reduce the damage of silicon wafers caused by excessive or uneven holding force, thereby reducing the displacement or damage of silicon wafers during transmission. At the same time, the movable holding unit moves synchronously when holding and releasing the edge of the silicon wafer, which improves the detection consistency of the silicon wafer and reduces the detection error caused by inconsistent silicon wafer size, position offset or looseness. In addition, the system can improve overall stability and accuracy and reduce maintenance frequency and maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present application is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0036] Figure 1 It is a schematic diagram of a structure using multiple motors for edge clamping provided in an embodiment of the present application.

[0037] Figure 2 It is a front view of a silicon wafer edge retention system provided in an embodiment of the present application.

[0038] Figure 3 1 is a top view of a silicon wafer edge retention system provided in an embodiment of the present application.

[0039] Figure 4 yes Figure 3 Corresponding partial enlarged view (front view). DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in this application to clearly and completely describe the technical solutions in the implementation mode of this application. Obviously, the described implementation mode is only a part of the implementation mode of this application, not all implementation modes. Based on the implementation mode in this application, all other implementation modes obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0041] In the description of the embodiments of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0042] In the field of semiconductor silicon wafer manufacturing, products include polished wafers, epitaxial wafers and LTO wafers, etc., and the requirements for front and back surface detection are relatively strict, which affects the non-conductivity of the chip substrate manufactured later. It is required that the relevant equipment has no contact points on the front and back surfaces during the transportation and transmission of silicon wafers. Therefore, edge retention is widely used in the semiconductor industry. The retention method can be clamping, adsorption, etc.

[0043] See also Figure 1 , Figure 1 1 is a schematic diagram of a structure for edge clamping using multiple motors 102 provided in an embodiment of the present application. Figure 1 2 shows the positions of the motor clamp 101 in the holding state and the releasing state. It can be seen that the position of the motor clamp 101 in the clamping state is closer to the center of the carrier 103 than the position in the releasing state.

[0044] Taking clamping as an example, 6 to 8 motors 102 are used to clamp the edge directly, and the position parameters of clamping and releasing are set in advance in the programmable logic controller (PLC). After the silicon wafer is transferred to the carrier 103 by the robotic arm, all motors 102 simultaneously issue a clamping action to firmly clamp the silicon wafer. The disadvantages of this type of clamping method are also obvious: this mechanism requires 6 to 8 groups of motors 102 plus a drive controller, which is expensive and difficult to install and debug. During assembly, the center of the silicon wafer is required to be in the same position when clamped and unclamped, so as to reduce the inconsistency of the detection results after the angle and position of the silicon wafer change due to loose clamping, and reduce the defects caused by the unclear focus of the silicon wafer edge due to eccentricity. Over-inspection and missed inspection. In addition, the position sensing of the motor clamp 101 usually uses a baffle and a photoelectric sensor. However, the method of obtaining position information by blocking the photoelectric sensor with a baffle has the disadvantage of insufficient accuracy, and the accuracy is affected by the width of the baffle and the size of the photoelectric sensor receiver. When the size of the silicon wafer is different, it is easy to over-clamp or incomplete clamping, resulting in an angle deviation of the silicon wafer. When the silicon wafer is abnormally positioned or too large, it is easy to over-clamp, which may cause adverse effects such as silicon wafer breakage. When the adverse effects are small, it is necessary to re-clean and verify the environment in the chamber, but when the adverse effects are large, it may cause equipment damage or long-term downtime.

[0045] The implementation methods of the present application will be described in detail below.

[0046] See also Figures 2 to 4 , Figure 2 is a front view of a silicon wafer edge retention system provided in an embodiment of the present application, Figure 3 is a top view of a silicon wafer edge retention system provided in an embodiment of the present application, Figure 4 yes Figure 3 Corresponding partial enlarged view (front view).

[0047] like Figure 2 and Figure 3 As shown, an embodiment of the present application provides a silicon wafer edge holding system, the system comprising a stage 212, a plurality of movable holding units 201 disposed on the stage 212, and a driving unit 202 disposed below the stage 212. The driving unit 202 is used to synchronously drive the plurality of movable holding units 201 to corresponding holding positions to hold the edge of the silicon wafer. Alternatively, the driving unit 202 is used to synchronously drive the plurality of movable holding units 201 to corresponding release positions to release the edge of the silicon wafer. The first distance between the holding position and the center of the stage 212 is less than the second distance between the release position and the center of the stage 212.

[0048] In order to improve the stability of the edge of the silicon wafer, in some embodiments, the system may further include at least one fixing and holding unit 210 for holding the edge of the silicon wafer.

[0049] The above embodiment does not limit the holding method and structural design of the movable holding unit 201. In some embodiments, the movable holding unit 201 may be a movable clamp. The above embodiment does not limit the number of movable holding units 201, which can be selected according to actual needs. As an example, the number of movable holding units 201 may be 2, 3, 4, 5, 6, 10, 20, etc. A plurality of movable holding units 201 may be arranged along the circumference of the carrier 212. In some embodiments, a plurality of movable holding units 201 may be evenly arranged along the circumference of the carrier 212. In other embodiments, a plurality of movable holding units 201 may be unevenly arranged along the circumference of the carrier 212.

[0050] The above embodiment does not limit the holding method and structural design of the fixed holding unit 210. In some embodiments, the fixed holding unit 210 may be a supporting clamp. The above embodiment does not limit the number of the fixed holding units 210, which may be selected according to actual needs. As an example, the number of the fixed holding units 210 may be 1, 2, 3, 4, 5, 6, 10, 20, etc. A plurality of fixed holding units 210 may be arranged along the circumference of the carrier 212. In some embodiments, a plurality of fixed holding units 210 may be evenly arranged along the circumference of the carrier 212. In other embodiments, a plurality of fixed holding units 210 may be unevenly arranged along the circumference of the carrier 212.

[0051] In some embodiments, the plurality of movable holding units 201 and the plurality of fixed holding units 210 may be arranged in a staggered and uniform manner along the circumference of the carrier 212. Figure 3 As shown, the three movable holding units 201 and the three fixed holding units 210 are staggered and evenly arranged along the circumference of the carrier 212 .

[0052] In the above embodiment, the carrier 212 is a support structure in the system for placing and supporting silicon wafers and other components. The carrier 212 can be provided with a rotating base 203 or a fixed bracket, etc., to provide a stable platform for other components. The movable holding unit 201 can move to hold or release the edge of the silicon wafer. The holding method is, for example, clamping or adsorption. The movable holding unit 201 can move synchronously under the driving action of the driving unit 202. The driving unit 202 can provide power to drive the movable holding unit 201. The holding position is the position of the movable holding unit 201 when holding the silicon wafer (for example, corresponding to the holding state of the movable holding unit 201), and the movable holding unit 201 holds the edge of the silicon wafer in this position (i.e., the holding position) to ensure that the silicon wafer is fixed on the carrier 212. The released position is the position when the movable holding unit 201 releases the silicon wafer (for example, corresponding to the released state of the movable holding unit 201). At this position (i.e., the released position), the movable holding unit 201 is away from the center of the carrier 212, releasing the edge of the silicon wafer, allowing the silicon wafer to be freely placed or removed.

[0053] Compared with the release position, the distance between the hold position and the center of the stage 212 is closer, which is in line with the actual situation of holding the edge of the silicon wafer. Specifically, the distance between the hold position and the center of the stage 212 is recorded as the first distance, and the distance between the release position and the position of the stage 212 is recorded as the second distance, and the first distance is smaller than the second distance. The above embodiment does not limit the first distance and the second distance, and they can be selected according to actual needs.

[0054] In the related art, the silicon wafer edge clamping system uses multiple motors 102 to realize the synchronous action of multiple motor clamps 101. This design is not only costly and difficult to install and debug, but also has the risk of inconsistent detection results, over-detection or missed detection. The above embodiment realizes the synchronous holding and release of the edge of the silicon wafer through multiple movable holding units 201 on the carrier 212. The driving unit 202 is installed under the carrier 212 and can drive the movable holding unit 201 to move synchronously. If the silicon wafer needs to be held, the driving unit 202 drives the multiple movable holding units 201 synchronously to a holding position close to the center of the carrier 212, at which position the movable holding unit 201 firmly holds the edge of the silicon wafer. On the contrary, if the silicon wafer needs to be released, the driving unit 202 drives the multiple movable holding units 201 synchronously to a release position away from the center of the carrier 212 to release the edge of the silicon wafer. The system synchronously drives multiple movable holding units 201 through the driving unit 202 to ensure that the silicon wafer will not be offset or tilted during the pick-up and placement process, which is conducive to improving the detection consistency of the silicon wafer.

[0055] The above embodiment uses a driving unit 202 to synchronously drive multiple movable holding units 201, simplifies the structural design, reduces the dependence on multiple independent motors, reduces the hardware cost of the system, and is relatively simple to install and debug. Secondly, the system allows the relevant position (including holding position and release position) and holding force of the movable holding unit 201 to be adjusted, and can adapt to silicon wafers of different sizes and shapes, reducing the damage of silicon wafers caused by excessive or uneven holding force. At the same time, the movable holding unit 201 acts synchronously when holding and releasing the edge of the silicon wafer, improves the detection consistency of the silicon wafer, and reduces the detection error caused by inconsistent silicon wafer size, position offset or looseness. In addition, the system can improve overall stability and accuracy, and reduce maintenance frequency and maintenance costs.

[0056] In some embodiments, the system further includes a plurality of transmission units 204, a negative pressure suction head 207 and a negative pressure sensor 208 connected to the driving unit 202. The transmission unit 204 is connected to the movable holding unit 201 in a one-to-one correspondence, and the driving unit 202 is used to drive the corresponding movable holding unit 201 through the transmission unit 204; one of the transmission units 204 is provided with a plug 206, and the carrier is provided with a plug hole 211. When the plurality of movable holding units 201 are located at the corresponding holding position, the plug 206 corresponds to the position of the plug hole 211 to close the upper surface of the plug hole 211; the negative pressure suction head 207 is used to connect to the lower surface of the plug hole 211 to create a negative pressure environment in the plug hole 211; the negative pressure sensor 208 is used to obtain the negative pressure test value in the suction air path of the negative pressure suction head 207. The structural design of the driving unit 202 and the transmission unit 204 will be described first, and then the negative pressure monitoring part will be described.

[0057] The above embodiment does not limit the type of the driving unit 202 , which may be, for example, a cylinder, a motor, etc.

[0058] Continue as Figure 2 and Figure 3As shown, in some embodiments, the driving unit 202 can be a cylinder; the system also includes a rotating base 203 arranged on the carrier 212, and the rotating base 203 is pivotally connected to each transmission unit 204 respectively; the cylinder is used to move downward to drive the rotating base 203 to rotate along a first rotation direction, so that the multiple movable holding units 201 are synchronously driven to corresponding holding positions through the rotating base 203 and the multiple transmission units 204; or, the cylinder is used to move upward to drive the rotating base 203 to rotate along a second rotation direction, so that the multiple movable holding units 201 are synchronously driven to corresponding release positions through the rotating base 203 and the multiple transmission units 204; wherein, the first rotation direction and the second rotation direction are in opposite directions.

[0059] The above embodiment does not limit the shape of the rotating base 203, and its cross section may be, for example, circular, elliptical, regular polygonal, irregular, etc. In some embodiments, the rotating base 203 may have a disk shape.

[0060] In some embodiments, the first rotation direction may be counterclockwise, and the second rotation direction may be clockwise. In other embodiments, the first rotation direction may be clockwise, and the second rotation direction may be counterclockwise.

[0061] In some embodiments, the cylinder may be an electric cylinder, a pneumatic cylinder or a hydraulic cylinder.

[0062] In the above embodiment, the driving unit 202 adopts a cylinder, and realizes the rotation of the rotating base 203 by moving upward or downward. The rotation of the rotating base 203 drives the transmission unit 204 to move, and then synchronously drives multiple movable holding units 201 to perform the action of holding or releasing the edge of the silicon wafer. The rotating base 203 is installed on the carrier 212. The cylinder drives the rotating base 203 to rotate, driving the multiple transmission units 204 to move, thereby driving the multiple movable holding units 201 to move synchronously. The first rotation direction refers to the rotation direction of the rotating base 203 when the driving cylinder moves downward, which is used to drive the movable holding unit 201 to the holding position. The second rotation direction is opposite to the first rotation direction, occurs when the cylinder moves upward, and is used to drive the movable holding unit 201 to the release position. The above embodiment uses a cylinder as the driving unit 202 to drive the rotating base 203 on the carrier 212, so that multiple movable holding units 201 move synchronously. When the cylinder moves downward, the rotating base 203 rotates along the first rotation direction, and drives the multiple movable holding units 201 to move to the holding position through the transmission unit 204, and firmly holds the edge of the silicon wafer on the carrier 212. When the cylinder moves upward, the rotating base 203 rotates in the opposite direction (i.e., rotates along the second rotation direction), and drives the movable holding unit 201 to move to the release position through the transmission unit 204, releases the edge of the silicon wafer, and allows the manipulator to perform the pick-and-place operation of the silicon wafer. In other words, the up and down movement of the cylinder is converted into the horizontal rotation movement of the rotating base 203, and the synchronous drive of the multiple movable holding units 201 is realized. The above embodiment uses the cylinder as the driving unit 202, simplifies the structural complexity of the system, and reduces the manufacturing and maintenance costs of the system. The cylinder drive has the characteristics of fast response and strong controllability, and can accurately adjust the holding position and the release position, which is convenient for adapting to silicon wafers of different sizes and shapes, and reduces the breakage of silicon wafers caused by improper holding. In addition, the system synchronously drives multiple movable holding units 201 through a rotating base 203 and multiple transmission units 204, thereby ensuring the synchronization and stability of operations, effectively improving the consistency of silicon wafer inspection results, reducing the risk of false detection or missed detection, and improving overall production efficiency.

[0063] It can be seen that in the above embodiment, the rotating base 203 is used to drive the corresponding movable holding unit 201 through the transmission unit 204. The transmission unit 204 is used as a power transmission device connecting the rotating base 203 and the movable holding unit 201, and its function is to transmit the rotational motion of the rotating base 203 to the movable holding unit 201, so that it performs a synchronous holding or releasing action. Each movable holding unit 201 is connected to the rotating base 203 through a transmission unit 204 to achieve precise motion control. The rotating base 203 and the transmission unit 204 are pivotally connected, allowing the transmission unit 204 to rotate relative to the rotating base 203. The above embodiment sets the rotating base 203 to be pivotally connected with multiple transmission units 204, and the transmission units 204 are connected to the movable holding units 201 one by one. When the rotating base 203 rotates, the power is synchronously transmitted to each movable holding unit 201 through the transmission unit 204, driving the movable holding units 201 to move to the holding position or the releasing position at the same time. The overall power transmission process is, for example: driving unit 202 (e.g., cylinder) - rotating base 203 - transmission unit 204 - movable holding unit 201. Specifically, the cylinder moves downward, the rotating base 203 rotates along a first rotation direction (e.g., counterclockwise), driving each transmission unit 204 to move, and the transmission unit 204 drives the movable holding unit 201 to approach the center of the carrier 212 to hold the edge of the silicon wafer; or, the cylinder moves upward, the rotating base 203 rotates along a second rotation direction (e.g., clockwise), driving each transmission unit 204 to move, and the transmission unit 204 drives the movable holding unit 201 away from the center of the carrier 212 to loosen the edge of the silicon wafer, so as to facilitate the pick-up and placement operation of the silicon wafer.

[0064] The above embodiment simplifies the structure involved in the power transmission process, reduces the use of multiple independent drive devices, and reduces system cost and complexity (including structural complexity and control complexity) through the coordinated design of the cylinder, the rotating base 203 and the multiple transmission units 204. At the same time, the rotation of the rotating base 203 can accurately and synchronously drive each movable holding unit 201 through the transmission unit 204, ensuring the consistency and accuracy of the action, and reducing silicon chip damage or detection errors caused by inconsistent operations.

[0065] In some embodiments, the transmission unit 204 can adopt a connecting rod mechanism, which includes a plurality of connecting rod segments pivoted in sequence, and the plug is arranged on the end connecting rod segment of one of the connecting rod mechanisms. The system also includes a guide member 205 arranged on the carrier 212, and the guide member 205 corresponds to the connecting rod mechanism one by one, and the guide member 205 is used to limit the movement direction of the end connecting rod segment of the corresponding connecting rod mechanism; the end connecting rod segment of the connecting rod mechanism is the connecting rod segment connected to the movable retaining unit 201.

[0066] In some embodiments, the straight line in which the movement direction of the terminal connecting rod segment is located can pass through the center of the carrier 212. This design ensures that each terminal connecting rod segment always moves along a fixed straight line passing through the center of the carrier 212 during the movement. The terminal connecting rod segment is connected to the movable holding unit 201, so the straight line in which the movement direction of the movable holding unit 201 is located also passes through the center of the carrier 212. Through the coordinated action of the connecting rod mechanism and the guide member 205, the movement direction of the movable holding unit 201 (such as the movable clamp) is highly accurate when holding or releasing. The holding force provided by multiple movable holding units 201 points to the center of the carrier 212, reducing the phenomenon of asymmetry or offset of the center of the silicon wafer during the holding or releasing process, thereby improving the holding stability of the edge of the silicon wafer and reducing the risk of damage to the silicon wafer due to uneven force.

[0067] The above embodiment does not limit the structure of the guide member 205. In some embodiments, the guide member 205 may be a guide rail.

[0068] The above embodiment does not limit the number of connecting rod segments in the connecting rod mechanism, which can be, for example, 2, 3, 4, 6, 10, etc. Multiple connecting rod segments can be connected end to end in sequence, which is not limited in the above embodiment. In order to achieve a larger translational motion within the limited space of the carrier 212 to accommodate silicon wafers of more sizes, in some embodiments, in the same connecting rod mechanism, the length of the end connecting rod segment can be greater than the length of the remaining connecting rod segments.

[0069] In the above embodiment, the transmission unit 204 adopts a connecting rod mechanism composed of a plurality of connecting rod segments pivoted in sequence, and the power is transmitted from the driving unit 202 to the movable holding unit 201 through the interaction of these connecting rod segments. The connecting rod mechanism is composed of a plurality of interconnected rods (i.e., connecting rod segments), and can transmit rotational or linear motion from one component to another. In the above embodiment, the connecting rod mechanism realizes the precise transmission of power through the connection between the rotating base 203 and the movable holding unit 201. The connecting rod segment is a component of the connecting rod mechanism, and a plurality of connecting rod segments are connected by pivoting to form a complete connecting rod mechanism. The guide member 205 is used to guide and limit the movement direction of the terminal connecting rod segment. The guide member 205 can be fixedly mounted on the carrier 212, corresponding to the connecting rod mechanism one by one (therefore, the guide member 205 also corresponds to the movable holding unit 201 one by one), and by limiting the movement direction of the terminal connecting rod segment of the connecting rod mechanism, it is ensured that the movable holding unit 201 performs the holding or releasing operation on the specified path. The end connecting rod section is the part of the connecting rod mechanism that is closest to the movable holding unit 201. Through the guidance of the guide member 205, it is ensured that the movable holding unit 201 moves along a predetermined direction, thereby achieving precise control of the edge of the silicon wafer.

[0070] The above embodiment adopts a connecting rod mechanism as the transmission unit 204, and the rotational movement of the rotating base 203 is gradually transmitted to the terminal connecting rod segment through the front connecting rod segment, and the terminal connecting rod segment is connected to the movable holding unit 201. The guide member 205 is fixed on the carrier 212, corresponding to each connecting rod mechanism respectively, and the movement direction of the terminal connecting rod segment is limited by the guide member 205 to ensure that the movable holding unit 201 moves in a predetermined direction. The structural design combining the connecting rod mechanism and the guide member 205 improves the complexity and high cost of the relevant multi-motor drive system. The introduction of the connecting rod mechanism makes the transmission of the system simpler and more reliable, and multiple connecting rod segments form an efficient power transmission path through pivoting to ensure the synchronous movement of the movable holding unit 201. The use of the guide member 205 ensures that the movement direction of the terminal of the connecting rod mechanism is accurately controlled, effectively reduces the direction deviation of the movable holding unit 201 during the movement process, improves the stability and safety of the silicon wafer holding, and is conducive to achieving the consistency of the silicon wafer detection results.

[0071] like Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, the end link segment of one of the link mechanisms may be provided with a plug 206, and the carrier 212 may be provided with a plug hole 211. When the plurality of movable holding units 201 are located at corresponding holding positions, the plug 206 corresponds to the position of the plug hole 211 to close the upper surface of the plug hole 211, as shown in FIG. Figure 2 The negative pressure suction head 207 is used to connect to the lower surface of the blocking hole 211 to create a negative pressure environment in the blocking hole 211. The negative pressure sensor 208 is used to obtain a negative pressure test value in the suction air path of the negative pressure suction head 207.

[0072] In some embodiments, the system may further include an alarm controller for receiving a negative pressure test value from the negative pressure sensor 208 and executing an alarm operation when the negative pressure test value is less than a negative pressure target value.

[0073] In some embodiments, the inhalation air path may be connected to a negative pressure generating device 209, which is used to generate negative pressure. In some embodiments, the negative pressure value output by the negative pressure generating device 209 may be monitored as a negative pressure target value. As an example, the negative pressure generating device 209 may use a vacuum system.

[0074] The above embodiment does not limit the negative pressure target value, and it can also be selected according to actual needs.

[0075] In the above embodiment, when the movable holding unit 201 is located in the holding position, the plug 206 on the end connecting rod segment of the connecting rod mechanism is used to cooperate with the blocking hole 211 on the carrier 212 to close the upper surface of the blocking hole 211, so as to establish a negative pressure environment in the blocking hole 211. The blocking hole 211 can be a through hole arranged on the carrier 212, the upper surface of the blocking hole 211 is closed by the plug 206, and the lower surface is connected to the negative pressure suction head 207, which is used to create and maintain a negative pressure environment to detect the holding state of the edge of the silicon wafer. The negative pressure suction head 207 is used to connect to the lower surface of the blocking hole 211, and generate a negative pressure environment by suction, which is used to determine whether the movable holding unit 201 correctly holds the silicon wafer. If the plug 206 does not completely close the blocking hole 211, the negative pressure environment will be difficult to establish, and even if it is established, it will be difficult to meet the corresponding negative pressure conditions, thereby identifying the situation where the holding is not in place, such as Figure 4 The negative pressure sensor 208 is used to detect the negative pressure value (i.e., the negative pressure test value) in the air inhalation path connected to the negative pressure suction head 207. If the detected negative pressure test value does not match the preset value (e.g., the negative pressure target value), it means that the holding is not in place, and the system can perform an alarm operation.

[0076] In the above embodiment, a plug 206 is provided at the end link section of the link mechanism, and cooperates with the plug hole 211 on the carrier 212 to form a closed negative pressure environment. When the movable holding unit 201 is in the holding position, the plug 206 corresponds to the position of the plug hole 211, and closes the upper surface of the plug hole 211. The negative pressure suction head 207 is connected to the lower surface of the plug hole 211, and a negative pressure environment is formed by exhausting air. The negative pressure sensor 208 detects the negative pressure value in the inhalation air path in real time. When the holding state is normal, the plug 206 completely closes the plug hole 211, and the negative pressure test value is consistent with the negative pressure target value, indicating that the rotating base 203 is rotated into place (for example, the rotation angle reaches the target rotation angle), the end connecting rod section of the movable holding unit 201 moves into place, and the silicon wafer is correctly held; if it is not held in place, the plug 206 does not completely close the plug hole 211, then the negative pressure test value will deviate from the negative pressure target value, for example, the negative pressure test value is less than the negative pressure target value, indicating that the rotating base 203 is not rotated into place (for example, the rotation angle is less than the target rotation angle), and / or, the end connecting rod section of the movable holding unit 201 is not moved into place, and the system will perform an alarm operation, such as a sound alarm operation and / or a light alarm operation, prompting the staff to check the holding state of the edge of the silicon wafer and troubleshoot related problems. The sound alarm operation is, for example, playing an electronic prompt sound or a pre-recorded voice. The target rotation angle can be selected according to actual needs, and the above embodiment does not limit this.

[0077] The above embodiment adds a real-time negative pressure monitoring function to the system, which can detect the size deviation and position offset of the silicon wafer in time, and the detection accuracy is higher than that of the shielded photoelectric sensor, and it is applicable to silicon wafers of various sizes. Through the negative pressure monitoring function, the holding state of the edge of the silicon wafer is monitored in real time, which significantly improves the safety and reliability of the holding operation, and is conducive to ensuring the consistency of the silicon wafer detection results. The precise detection of the negative pressure sensor 208 can timely detect improper holding or looseness, and reduce silicon wafer breakage or detection errors caused by insufficient holding force or holding position offset. Even when the size or position of the silicon wafer deviates, the system can still detect that it is not in place and alarm in time, which is convenient for early human intervention (for example, manual troubleshooting of related problems).

[0078] In some embodiments, the system may further include a cylinder controller for adjusting the gas pressure of the cylinder according to the size and / or position of the silicon wafer so that the holding force of the plurality of movable holding units 201 matches the silicon wafer.

[0079] The movable holding unit 201 can be driven by a cylinder, and the risk of damage to the silicon wafer due to excessive holding force can be reduced by adjusting the gas pressure of the cylinder.

[0080] In some embodiments, the system may be provided with a control module, the control module includes an alarm controller and a cylinder controller, and the alarm controller and the cylinder controller may adopt an integrated design or a split design.

[0081] Please combine Figures 2 to 4In a specific application scenario, the embodiment of the present application provides a silicon wafer edge clamping system, including a carrier 212, three movable jaws (as an example of a movable holding unit 201), three supporting jaws (as an example of a fixed holding unit 210), and a cylinder that can be driven up and down (as an example of a driving unit 202), and the up and down movement of the cylinder is converted into a clockwise rotational motion or a counterclockwise rotational motion through a guide rail (also known as a slide rail, as an example of a guide member 205). This clockwise and counterclockwise rotational motion can be a rotational motion at a fixed angle, or it can also be a rotational motion at a non-fixed angle. When the cylinder moves upward, the disk (as an example of a rotating base 203) located on the carrier 212 rotates clockwise (as an example of a second rotation direction), and the three movable jaws extend to reach the loose state of the movable jaws (corresponding to the loose position of the movable jaws), so as to achieve the purpose of synchronously driving the three movable jaws by one cylinder at the same time, and ensure the coordination of the movable jaws. At this time, the manipulator (i.e., the robot arm) can freely place and remove the silicon wafer on the clamp (including the movable clamp and the supporting clamp). When the cylinder moves downward, the disc on the carrier 212 rotates counterclockwise (as an example of the first rotation direction), and the end connecting rod section of the connecting rod mechanism (for example, using a slider structure) slides in the fixed guide rail to realize the loosening of the movable clamp. For example, as the three movable clamps shrink, the clamping state (or holding state, corresponding to the holding position of the movable clamp) of the movable clamp is reached, and the edge of the silicon wafer on the carrier 212 is firmly clamped on the clamp (including the movable clamp and the supporting clamp). In addition, since the cylinder is used as the driving unit 202, the risk of over-clamping caused by the size or position of the silicon wafer can be reduced by adjusting the size of the cylinder gas pressure, thereby reducing the situation of silicon wafer breakage caused by over-clamping. The silicon wafer size problem is, for example, that the silicon wafer size is too large or too small. Wafer position problems may include position deviation caused by uneven clamping force or loose clamping.

[0082] When the wafer edge clamping system is used in the detection equipment, its clamping force is also very important. When the clamping is loose, the high-speed rotation required for wafer detection may cause the wafer edge and the clamping jaw to move relative to each other. At this time, the defect angle position is offset, resulting in the same defect being detected at two angles and causing an over-detection event, or vice versa, a missed detection event. In order to improve this problem, a negative pressure sensor 208 with higher accuracy than the shielded photoelectric sensor can be introduced to characterize the moving distance of the movable clamping jaw by the rotation angle of the disc. When the movable jaws completely clamp the silicon wafer, a negative pressure suction head 207 is used to create a negative pressure environment at the position of the blocking hole 211. If the blocking head 206 just completely blocks the blocking hole 211 at this time, the suction pipeline (also called the suction air path) connected to the negative pressure suction head 207 is a closed circuit, and the corresponding negative pressure target value of the negative pressure suction head 207 should be equal to the gauge test value of the negative pressure sensor 208 (i.e., the negative pressure test value). It can be determined that the movable jaws are in a fully clamped state (i.e., clamped in place, and the movable jaws are in the holding position); when the movable jaws are in a fully clamped state due to the size or position of the silicon wafer, the movable jaws are in a fully clamped state. When the clamping action is not fully in place, the rotation angle of the disc is small, resulting in the retraction distance of the movable clamp being too small, and the plug 206 cannot fully reach the plugging hole 211 to maintain pressure, so that the suction air path connected to the negative pressure suction head 207 is a passage, and the gauge test value of the negative pressure sensor 208 (i.e., the negative pressure test value) is smaller than the pipeline supply negative pressure value (as an example of a negative pressure target value), triggering an alarm operation, warning the staff that the edge of the silicon wafer is not fully clamped (or, not clamped in place), and manual troubleshooting is required.

[0083] The embodiment of the present application also provides a silicon wafer edge holding method, which is applied to a silicon wafer edge holding system, wherein the system includes a carrier 212, a plurality of movable holding units 201 disposed on the carrier 212, and a driving unit 202 disposed below the carrier 212. The method includes: sending a holding control instruction or a release control instruction to the driving unit 202. The driving unit 202 is used to synchronously drive the plurality of movable holding units 201 to corresponding holding positions to hold the silicon wafer edge after receiving the holding control instruction, or the driving unit 202 is used to synchronously drive the plurality of movable holding units 201 to corresponding release positions to release the silicon wafer edge after receiving the release control instruction; the first distance between the holding position and the center of the carrier 212 is less than the second distance between the release position and the center of the carrier 212.

[0084] It should be noted that each embodiment in the present application is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0085] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0086] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0087] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0088] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A silicon wafer edge holding system, characterized in that: The system comprises: Carrier; A plurality of movable holding units disposed on the stage; A driving unit disposed below the platform; Wherein, the driving unit is used to synchronously drive the multiple movable holding units to corresponding holding positions to hold the edge of the silicon wafer, or, the driving unit is used to synchronously drive the multiple movable holding units to corresponding release positions to release the edge of the silicon wafer; the first distance between the holding position and the center of the carrier is smaller than the second distance between the release position and the center of the carrier.

2. The silicon wafer edge holding system according to claim 1, characterized in that: The system further comprises: A plurality of transmission units connected to the driving unit, the transmission units are connected to the movable holding units in a one-to-one correspondence, and the driving unit is used to drive the corresponding movable holding unit through the transmission unit; one of the transmission units is provided with a plug, and the carrier is provided with a plugging hole, and when the plurality of movable holding units are located at corresponding holding positions, the plug corresponds to the position of the plugging hole to close the upper surface of the plugging hole; A negative pressure suction head, used to be connected to the lower surface of the blocking hole to create a negative pressure environment in the blocking hole; The negative pressure sensor is used to obtain a negative pressure test value in the air inhalation path of the negative pressure suction head.

3. The silicon wafer edge holding system according to claim 2, characterized in that: The driving unit adopts a cylinder, and the system further comprises a rotating base arranged on the carrier, and the rotating base is pivotally connected to each transmission unit respectively; The cylinder is used to move downward to drive the rotating base to rotate along the first rotation direction, so that the multiple movable holding units are synchronously driven to corresponding holding positions through the rotating base and the multiple transmission units; or, The cylinder is used to move upward to drive the rotating base to rotate along the second rotation direction, so as to synchronously drive the multiple movable holding units to corresponding release positions through the rotating base and the multiple transmission units; Wherein, the first rotation direction and the second rotation direction are opposite.

4. The silicon wafer edge holding system according to claim 3, characterized in that: The transmission unit adopts a connecting rod mechanism, the connecting rod mechanism includes a plurality of connecting rod segments pivotally connected in sequence, the plug is arranged on the end connecting rod segment of one of the connecting rod mechanisms, and the system further includes: A guide member is arranged on the carrier, the guide member corresponds to the connecting rod mechanism one by one, and the guide member is used to limit the movement direction of the end connecting rod segment of the corresponding connecting rod mechanism; the end connecting rod segment of the connecting rod mechanism is the connecting rod segment connected to the movable holding unit.

5. The silicon wafer edge holding system according to claim 4, characterized in that: The straight line where the movement direction of the terminal link segment lies passes through the center of the carrier.

6. The silicon wafer edge holding system according to claim 2, characterized in that: The system further comprises: The alarm controller is used to receive the negative pressure test value from the negative pressure sensor and perform an alarm operation when the negative pressure test value is less than the negative pressure target value.

7. The silicon wafer edge holding system according to claim 2, characterized in that: The system further comprises: A cylinder controller is used to adjust the gas pressure of the cylinder according to the size and / or position of the silicon wafer so that the holding force of the multiple movable holding units matches the silicon wafer.

8. The silicon wafer edge holding system according to claim 1, characterized in that: The system further comprises: At least one fixing and holding unit is used to hold the edge of the silicon wafer.

9. The silicon wafer edge holding system according to claim 8, characterized in that: The movable holding unit is a movable clamping jaw; and / or, The fixing and holding unit is a supporting clamp.

10. A method for maintaining a silicon wafer edge, characterized in that: Applicable to a silicon wafer edge holding system, the system comprising a carrier, a plurality of movable holding units arranged on the carrier, and a driving unit arranged below the carrier; The method comprises: Sending a hold control instruction or a release control instruction to the driving unit; Wherein, the driving unit is used to synchronously drive the multiple movable holding units to corresponding holding positions to hold the edge of the silicon wafer after receiving the holding control instruction, or the driving unit is used to synchronously drive the multiple movable holding units to corresponding release positions to release the edge of the silicon wafer after receiving the release control instruction; the first distance between the holding position and the center of the carrier is smaller than the second distance between the release position and the center of the carrier.

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