Millimeter wave regular modular sparse active phased array antenna

Abstract

The invention provides a millimeter wave regular modular sparse active phased-array antenna which comprises a comprehensive mother board which is provided with a radio frequency power synthesis / distribution network, a component control network and a component power supply network. The plurality of sparse antenna modules are arranged above the comprehensive mother board; the chip assembly is arranged below the comprehensive mother board; the digital and power supply unit is arranged on the side, away from the comprehensive mother board, of the chip assembly and comprises a phased array wave control module and a power supply module, and the phased array wave control module is connected with the system master control and assembly control network; the power supply module is connected with a system power supply and a power supply network; the sparse antenna module and the comprehensive mother board are vertically stacked, and vertical interconnection is realized through a plurality of layers of PCBs; the integrated mother board is vertically connected with the digital and power supply unit through a plug-in low-frequency connector. According to the invention, decoupling of the integrated antenna can be realized; the sparse antenna module adopts sparse active feed, so that the number of array active channels and the heat flux density can be effectively reduced, and the system cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the field of phased array antennas, and in particular to a millimeter wave regular modular sparse active phased array antenna. Background Art

[0002] In recent years, with the rapid rise of 5G millimeter wave communications and low-orbit broadband satellites, millimeter wave active phased array antenna technology has ushered in unprecedented development. In the field of satellite communications, as the communication frequency band extends to the millimeter wave band, the size of terminal and satellite-borne phased array antennas has become more compact, moving towards small, low-profile, high-density integration and low-cost integration.

[0003] Most of the cost and power consumption of traditional phased array antennas come from transceiver components. The integrated device technology and application based on III-V compounds such as gallium arsenide and gallium nitride are very mature, but the high cost makes them unsuitable for large-scale batch applications. Thanks to the development of silicon-based integrated circuit technology and PCB mixed pressure process, multi-layer PCB board-level integrated phased array antenna products based on silicon-based chip integration are becoming a key research and development direction in the field of satellite communications. In particular, silicon-based technology has the advantage of single-chip high-density integration, which can integrate mixed circuits such as RF and control into a single chip, promoting the development of phased array transceiver components from discrete device circuits to monolithic microwave integrated circuits (MMIC), and further promoting the development of active subsystems towards high-density miniaturization. At the same time, the use of multi-layer PCB mixed pressure process to integrate multiple types of signal networks into a single board level can further reduce the profile of the active phased array, which is a low-cost solution for tile-type integrated phased arrays.

[0004] However, compared with traditional discrete active phased array antennas, tiled phased arrays have the disadvantages of difficult calibration and poor maintainability. Especially for millimeter wave phased arrays, the antenna size is further reduced and the RF channel density is increased, facing the following design challenges: 1) High-density integration: The wavelength of the millimeter wave band is short, and the contradiction between the array element spacing and the layout space of the active components during wide-angle scanning needs to be resolved; 2) Electromechanical thermal coupling: Due to the small physical size of the array surface, the phase change caused by thermal micro-deformation and vibration deformation is sensitive, which needs to be solved from the system-level electromechanical thermal coupling design; 3) For different application platforms, the array surface scale and installation structure are slightly different, but the antenna RF design is similar. The cycle and cost required for repeated development are high, which is not conducive to product iteration. Summary of the invention

[0005] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a millimeter-wave regular modular sparse active phased array antenna to realize array assembly of any scale and improve the design flexibility and general scalability of sparse arrays.

[0006] To achieve the above-mentioned object of the invention, the present invention provides a millimeter-wave regular modular sparse active phased array antenna, comprising:

[0007] An integrated motherboard, on which a number of signal network circuits are arranged, the signal network circuits including a radio frequency power synthesis / distribution network, a component control network and a component power supply network;

[0008] A plurality of sparse antenna modules are arranged above the integrated motherboard;

[0009] A chip assembly is arranged below the integrated motherboard;

[0010] The digital and power supply unit is arranged on a side of the chip assembly away from the integrated motherboard, and includes a phased array wave control module and a power supply module, wherein the phased array wave control module is connected to the system main control and the assembly control network; the power supply module is connected to the system power supply and the power supply network;

[0011] The sparse antenna module is vertically stacked with the integrated motherboard and vertically interconnected through a multi-layer PCB;

[0012] The integrated motherboard and the digital and power supply unit are vertically connected by plugging low-frequency connectors.

[0013] According to a technical solution of the present invention, each of the sparse antenna modules includes an antenna substrate and further includes:

[0014] The antenna radiation layer is arranged on the top surface of the antenna substrate and includes a plurality of antenna units;

[0015] A sparse feed switching layer is arranged on the bottom surface of the antenna substrate, electrically connected to the antenna unit through a feeding probe, and is used to perform passive power synthesis or passive power distribution on the antenna unit; the sparse feed switching layer is provided with a feeding interface for connecting to the integrated motherboard;

[0016] A vertical transition connection structure is provided on the integrated motherboard for connecting the feed interface and the chip pins of the chip assembly. The chip assembly is arranged below the integrated motherboard according to the rule of the number of active channels required by the sparse channel ratio.

[0017] According to a technical solution of the present invention, each of the sparse antenna modules includes 16 antenna units arranged in an equidistant rectangular grid; the spacing between the antenna units is half a wavelength;

[0018] The 16 antenna units are divided into four groups, and in a clockwise order, each group of antenna units is rotated 90 degrees as a whole compared with the previous group of antenna units;

[0019] Each chip of the chip assembly includes four independent amplitude-phase shaping radio frequency channels.

[0020] According to a technical solution of the present invention, the chip assembly at least includes an amplitude-phase weighted shaping chip, a driving amplifier chip, a delay chip and a frequency conversion assembly chip.

[0021] According to a technical solution of the present invention, the RF power synthesis / distribution network, the component control network and the power supply network on the integrated motherboard are welded to the sparse antenna module and the chip component through a ball grid array or a planar grid array.

[0022] According to a technical solution of the present invention, the integrated motherboard includes a chip power supply layer, a chip control layer, a RF power synthesis / distribution layer, and a chip component matching layer which are arranged in sequence from top to bottom; the component power supply network, the component control network, and the RF power synthesis / distribution network are respectively arranged on the chip power supply layer, the chip control layer, and the RF power synthesis / distribution layer; and different signal network circuits are isolated by ground layers.

[0023] According to a technical solution of the present invention, the digital and power supply unit further includes a digital processing module and a frequency conversion module.

[0024] According to a technical solution of the present invention, it also includes an antenna housing, in which an installation cavity is arranged, and the sparse antenna module, the integrated motherboard, the chip assembly and the digital and power supply unit are stacked in sequence from top to bottom in the installation cavity, and the antenna housing is provided with a power supply / control connector and a signal connector connected to the digital and power supply unit.

[0025] According to a technical solution of the present invention, a heat dissipation structure is also included, and the heat dissipation structure includes:

[0026] A heat dissipation cold plate is arranged above the digital and power supply unit; a temperature-averaging heat exchange circuit is buried inside the cold plate; the temperature-averaging heat exchange circuit is a temperature-averaging heat pipe or a liquid cooling circuit, and the temperature-averaging heat pipe or the liquid cooling circuit is connected to a circulation pump for introducing a temperature-averaging medium or a coolant to achieve temperature-averaging heat conduction or liquid cooling;

[0027] A thermal pad is arranged on the heat dissipation cold plate and is arranged in contact with the chip assembly;

[0028] The antenna housing heat sink structure is arranged on the outer surface or the inner surface of the antenna housing.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] The present invention proposes a millimeter-wave regular modular sparse active phased array antenna, which innovatively adopts a modular sparse antenna subarray design, which is conducive to the assembly of arrays of any scale; it solves the defects of insufficient flexibility and general scalability of sparse array design, and at the same time reduces the active channel density and heat flux density of the millimeter-wave phased array;

[0031] The innovative layered decoupling design of the antenna RF module reduces the number of vertical circuit integration layers of the tile-type integrated antenna, and reduces the difficulty and cost of implementing the multi-layer PCB process. Under the conditions of array topology constraints and determined feeding interfaces, it is conducive to the update and verification of multiple types of antenna units, which can accelerate the product R&D iteration cycle.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The present invention adopts a modular sparse antenna subarray design, which is conducive to the assembly of arrays of any scale; it solves the defects of insufficient flexibility and general scalability of sparse array design, and at the same time reduces the active channel density and heat flux density of the millimeter wave phased array.

[0034] The present invention performs a layered decoupling design on the antenna radio frequency module, reduces the number of vertical circuit layers of a single circuit board of a tile-type integrated antenna by separating the passive antenna from the active network on the integrated motherboard, reduces the difficulty of implementing the multi-layer PCB process and the pressing cost, solves the problem of reduced reliability of the entire board due to too many types of panels and limited pressing process when the multi-layer PCB is mixed pressed, and reasonably determines the scale of the passive sparse sub-array in combination with the sparse array topology requirements, which can reduce the system complexity while taking into account good array radiation performance. Under the fixed sparse array topology constraint conditions, it is beneficial to update and verify multiple types of antenna units, and can accelerate the product research and development iteration cycle.

[0035] 2) The present invention introduces a sparse feed switching layer in the sparse antenna module, which reduces the number of active channels in the array without reducing the number of antenna radiation units, thereby avoiding the problem of a sudden drop in scanning gain of a large-proportion sparse phased array antenna; thereby facilitating the passive synthesis of antenna units in an array sparse manner under system constraints, and realizing a single active channel of the component driving multiple passive antenna units, effectively reducing the density of active channels in the array, freeing up the wiring space of the back-stage motherboard and reducing the heat flux density of the component, which is beneficial to the heat dissipation of the system.

[0036] 3) In the present invention, the RF power synthesis network and the transceiver components are integrated and welded and assembled with the passive array module, realizing the decoupling design of the integrated antenna, so as to facilitate the pre-topological optimization calculation of the size of the passive antenna module for splicing in order to avoid the generation of grating lobes by large-angle scanning of the modular sparse array, and then the antenna unit and feed arrangement are performed according to the optimized antenna topology, thereby improving the antenna performance. The present invention can be applied to the design of an integrated antenna based on a multi-layer printed circuit board mixed pressing process, and realizes a hierarchical modular design in system design, which is convenient for array expansion and cutting of different sizes; when applied to high-frequency phased array systems such as millimeter waves, it can effectively reduce the system's RF channel density and heat flux density, thereby effectively reducing system cost and power consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 A schematic diagram schematically shows the structure of a millimeter wave regular modular sparse active phased array antenna provided according to an embodiment of the present invention;

[0039] Figure 2 A schematic diagram of the structure of a sparse antenna module provided according to an embodiment of the present invention is shown;

[0040] Figure 3 A schematic diagram schematically shows the position distribution of antenna units and feeding interfaces provided in one embodiment of the present invention;

[0041] Figure 4 A schematic diagram showing the distribution of 256-element antenna units provided in accordance with an embodiment of the present invention;

[0042] Figure 5 A schematic diagram showing the position distribution of antenna units and chip components provided in accordance with an embodiment of the present invention;

[0043] Figure 6 The figure schematically shows the structure of an integrated motherboard provided according to one embodiment of the present invention.

[0044] The corresponding relationship between the component names and the reference numerals is as follows:

[0045] 1. Integrated motherboard; 2. Sparse antenna module; 3. Chip assembly; 4. Digital and power supply unit; 5. Heat dissipation cold plate; 6. Antenna housing;

[0046] 11. Chip power supply layer; 12. Control layer; 13. RF power synthesis / distribution layer; 14. Chip component matching layer;

[0047] 21. Antenna substrate; 22. Antenna radiation layer; 23. Antenna unit; 24. Sparse feeding switching layer; 25. Feeding interface; 26. Feeding probe; 27. Isolation column;

[0048] 61. Power supply / control connector; 62. Signal connector. DETAILED DESCRIPTION

[0049] The description of the embodiments of this specification should be combined with the corresponding drawings, which should be considered as part of the complete specification. In the drawings, the shape or thickness of the embodiments may be enlarged and indicated for simplification or convenience. Furthermore, the parts of each structure in the drawings will be described separately. It is worth noting that the elements not shown in the drawings or not described in words are in a form known to ordinary technicians in the relevant technical field.

[0050] The description of the embodiments herein and any reference to directions and orientations are only for the convenience of description and are not to be construed as any limitation on the scope of protection of the present invention. The following description of the preferred embodiments may involve combinations of features, which may exist independently or in combination, and the present invention is not particularly limited to the preferred embodiments. The scope of the present invention is defined by the claims.

[0051] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0052] like Figure 1 As shown, a millimeter-wave regular modular sparse active phased array antenna provided by the present invention includes an integrated motherboard 1, a plurality of sparse antenna modules 2, a chip component 3, and a digital and power supply unit 4. The integrated motherboard 1 is provided with a plurality of signal network circuits, and the signal network circuit includes a radio frequency power synthesis / distribution network, a component control network, and a component power supply network. The sparse antenna module 2 is vertically stacked with the integrated motherboard 1, and vertical interconnection is achieved through a multi-layer PCB. The integrated motherboard 1 and the digital and power supply unit 4 are vertically connected by plugging in a low-frequency connector.

[0053] like Figure 2 and Figure 3As shown, each sparse antenna module 2 includes an antenna substrate 21, an antenna radiation layer 22 and a sparse feed switching layer 24. The antenna radiation layer 22 is arranged on the top surface of the antenna substrate 21, and includes a plurality of antenna units 23. The sparse feed switching layer 24 is arranged on the bottom surface of the antenna substrate 21, and is electrically connected to the antenna unit 23 through a feeding probe 26, and is used to perform passive power synthesis or passive power distribution on the antenna unit 23. A feeding interface 25 for connecting to the integrated motherboard 1 is provided on the sparse feed switching layer 24. A vertical transition connection structure is provided on the integrated motherboard 1, which is used to connect the feed interface 25 and the chip pins of the chip assembly 3. The chip assembly 3 is arranged below the integrated motherboard 1 according to the rule of the number of active channels required by the sparse channel ratio.

[0054] Through the sparse feed switching layer 24, a passive power synthesis or distribution layer can be introduced into the sparse antenna module 2. In this embodiment, the sparse feed switching layer 24 can use a stripline T-junction power divider or a stripline T-junction power combiner to achieve power synthesis or distribution of multiple units, thereby achieving sparse antenna unit feeding channels.

[0055] In order to avoid scanning grating lobes caused by the periodic arrangement of the phase center of the synthetic sub-array, the sub-array topology can be optimized by the sparse array synthesis method, and then the topological structure of the sparse antenna module 2 can be adjusted accordingly according to the optimization results. The sub-array topology optimization can adopt convex optimization or intelligent optimization algorithm, and the optimization process is not described here. The optimized 256-element array topology structure is as follows Figure 3 As shown, every 16 antenna units form a standard sparse subarray module, which is rotated and translated and expanded in the array area.

[0056] To facilitate modular design and processing, the antenna array is arranged in a regular rectangular grid. In this embodiment, each sparse antenna module 2 includes 16 antenna units 23 arranged in an equidistant rectangular grid; the spacing between the antenna units 23 is half a wavelength.

[0057] Furthermore, for the circularly polarized antenna array, the 16 antenna units 23 in the sparse antenna module 2 are divided into four groups. In a clockwise order, each group of antenna units 23 is rotated 90 degrees as a whole compared to the previous group of antenna units 23, thereby achieving the improvement of the scanning axis ratio performance through the sequential rotation feeding of the sparse antenna module 2 subarray as a whole.

[0058] like Figure 4As shown, in order to meet the modular splicing requirements, the positions of the feed interfaces 25 of the sparse antenna are arranged regularly. Following the tile-type integrated subarray design, according to the number of active channels required by the channel sparse ratio, the chip components 3 are regularly arranged on the lower layer of the integrated motherboard 1, and strip lines and various vertical transition structures are used in the inner layer of the integrated motherboard 1 to achieve matching interconnection from the antenna feed point to the chip pin, wherein each active channel is wired with equal length; in this embodiment, each chip contains 8 independent amplitude-phase shaping RF channels, and under the condition of 50% channel sparseness, 16 antenna units can be controlled.

[0059] As attached Figure 3 The figure shows a schematic diagram of a standard passive subarray module with 50% channel sparseness. A stripline T-junction power combiner is introduced in the antenna feed layer. Combined with array topology optimization, a non-equiphase design is performed on the passive power combiner in the modular subarray to disrupt the phase center arrangement of the regular subarray.

[0060] The chip assembly 3 at least includes an amplitude-phase weighted shaping chip, a driving amplifier chip, a delay chip and a frequency conversion component chip, which are soldered to the bottom layer of the integrated motherboard using the SMT surface mounting process, and its heat dissipation surface is exposed to facilitate contact with the heat dissipation structure.

[0061] The present invention, as Figure 6 As shown, the integrated motherboard 1 includes a chip power supply layer 11, a chip control layer 12, a radio frequency power synthesis / distribution layer 13, and a chip component matching layer 14, which are arranged in sequence from top to bottom. The component power supply network, the component control network, and the radio frequency power synthesis / distribution network are respectively arranged on the chip power supply layer 11, the chip control layer 12, and the radio frequency power synthesis / distribution layer 13, and are welded to the sparse antenna module 2 and the chip component 3 through a ball grid array or a plane grid array. Different signal network circuits are isolated by ground layers.

[0062] The integrated motherboard 1 uses multi-layer PCB mixed pressure to achieve integrated integration of the integrated motherboard, which is conducive to achieving a low profile of the phased array antenna; and it is pressed together with the antenna radiation array sub-board to avoid the mixed pressure reliability risk caused by the unevenness of the dielectric material during processing. Among them, in the vertical dimension, the control circuit and power supply circuit of the chip are distributed on the upper layer of the integrated board, and the RF signal power synthesis / distribution, as well as the delay frequency conversion and other switching circuits are integrated in the lower layer of the integrated motherboard. Different signal networks are isolated by ground layers to achieve good electromagnetic compatibility performance; the RF signal layer uses Wilkinson power synthesis / distributor to achieve good RF network port isolation.

[0063] The digital and power supply unit 4 is arranged on the side of the chip assembly 3 away from the integrated motherboard 1, and includes a phased array wave control module and a power supply module. The phased array wave control module is connected to the system main control and component control network through a low-frequency connector to obtain beam pointing information, and the amplitude phase and delay information of the channel is sent to the chip assembly 3 through the control circuit of the integrated motherboard 1. The power supply module is connected to the system power supply through a low-frequency connector, and distributes the voltage signals required by the active devices to various active devices through the power supply network of the integrated motherboard 1 through a voltage conversion circuit. For analog phased arrays, the digital and power supply unit 4 only needs a phased array wave control module and a power supply module; for digital phased arrays, the digital and power supply unit 4 also includes a digital processing module and a frequency conversion module, in which the up and down frequency conversion processing of the combined signal of the integrated motherboard is completed, and digital signal processing is realized through the digital-to-analog, analog-to-digital conversion and signal processing modules in the digital processing module.

[0064] like Figure 1 As shown, the present invention also includes an antenna housing 6, an installation cavity is set in the antenna housing 6, and the sparse antenna module 2, the integrated motherboard 1, the chip assembly 3 and the digital and power supply unit 4 are stacked in sequence from top to bottom in the installation cavity, and the antenna housing 6 is provided with a power supply / control connector 61 and a signal connector 62 connected to the digital and power supply unit 4.

[0065] The present invention also includes a heat dissipation structure, which includes a heat dissipation cold plate 5, a thermal pad, and an antenna housing heat sink structure. The heat dissipation cold plate 5 is arranged above the digital and power supply unit 4; a uniform temperature heat exchange circuit is buried inside it; the uniform temperature heat exchange circuit is a uniform temperature heat pipe or a liquid cooling circuit, and the uniform temperature heat pipe or the liquid cooling circuit is connected to a circulation pump for introducing a uniform temperature medium or a coolant to achieve uniform temperature heat conduction or liquid cooling. The thermal pad is arranged on the heat dissipation cold plate 5 and is arranged in contact with the chip assembly 3. The antenna housing heat sink structure is arranged on the outer surface or inner surface of the antenna housing 6.

[0066] For the millimeter wave phased array antenna system, as the operating frequency increases, the physical size of the array surface becomes compact, and when the chip density of the chip assembly 3 increases, the heat flux density of the active array surface is higher; according to the heat flux density of the system, the heat dissipation cold plate 5 can be embedded with heat pipes for uniform temperature heat conduction, or an embedded flow channel liquid cooling loop can be used to conduct the heat of the active device through the structural plate and the loop liquid to the circulation pump or the structural shell for further heat dissipation.

[0067] It should be noted that the above is a preferred embodiment of the present invention. It should be pointed out that although the preferred embodiment of the present invention has been described, once the basic creative concept of the present invention is known, a number of improvements and modifications can be made by a person skilled in the art without departing from the principles of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. Therefore, the attached claims are intended to be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the embodiments of the present invention.

Claims

1. A millimeter wave regular modular sparse active phased array antenna, characterized in that: include: An integrated motherboard (1) on which a plurality of signal network circuits are arranged, wherein the signal network circuits include a radio frequency power synthesis / distribution network, a component control network and a component power supply network; A plurality of sparse antenna modules (2) are arranged above the integrated motherboard (1); A chip assembly (3) is arranged below the integrated motherboard (1); A digital and power supply unit (4) is arranged on a side of the chip component (3) away from the integrated motherboard (1), and comprises a phased array wave control module and a power supply module, wherein the phased array wave control module is connected to the system main control and the component control network; and the power supply module is connected to the system power supply and the power supply network; The sparse antenna module (2) and the integrated motherboard (1) are vertically stacked and vertically interconnected via a multi-layer PCB; The integrated motherboard (1) and the digital and power supply unit (4) are vertically connected by plugging low-frequency connectors.

2. The millimeter wave regular modular sparse active phased array antenna according to claim 1, characterized in that: Each of the sparse antenna modules (2) comprises an antenna substrate (21), and further comprises: An antenna radiation layer (22), arranged on the top surface of the antenna substrate (21), comprising a plurality of antenna units (23); A sparse feeding switching layer (24) is arranged on the bottom surface of the antenna substrate (21), and is electrically connected to the antenna unit (23) via a feeding probe (26), and is used to perform passive power synthesis or passive power distribution on the antenna unit (23); the sparse feeding switching layer (24) is provided with a feeding interface (25) for connecting to the integrated motherboard (1); A vertical transition connection structure is provided on the integrated motherboard (1) for connecting the feed interface (25) and the chip pins of the chip assembly (3); the chip assembly (3) is arranged below the integrated motherboard (1) according to a rule of active channel number required by a sparse channel ratio.

3. The millimeter wave regular modular sparse active phased array antenna according to claim 2, characterized in that: Each of the sparse antenna modules (2) comprises 16 antenna units (23) arranged in an equidistant rectangular grid; the spacing between the antenna units (23) is half a wavelength.

4. The millimeter wave regular modular sparse active phased array antenna according to claim 3, characterized in that: The 16 antenna units (23) are divided into four groups. In a clockwise order, each group of antenna units (23) is rotated 90 degrees as a whole compared to the previous group of antenna units (23).

5. The millimeter wave regular modular sparse active phased array antenna according to claim 1, characterized in that: The chip component (3) comprises at least an amplitude-phase weighted shaping chip, a driving amplifier chip, a delay chip and a frequency conversion component chip.

6. The millimeter wave regular modular sparse active phased array antenna according to claim 1, characterized in that: The radio frequency power synthesis / distribution network, the component control network and the power supply network on the integrated motherboard (1) are welded to the sparse antenna module (2) and the chip component (3) via a ball grid array or a plane grid array.

7. The millimeter wave regular modular sparse active phased array antenna according to claim 1, characterized in that: The integrated motherboard (1) comprises a chip power supply layer (11), a chip control layer (12), a radio frequency power synthesis / distribution layer (13), and a chip component matching layer (14) which are arranged in sequence from top to bottom; the component power supply network, the component control network, and the radio frequency power synthesis / distribution network are respectively arranged on the chip power supply layer (11), the chip control layer (12), and the radio frequency power synthesis / distribution layer (13); and different signal network circuits are isolated by ground layers.

8. The millimeter wave regular modular sparse active phased array antenna according to claim 1, characterized in that: The digital and power supply unit (4) also includes a digital processing module and a frequency conversion module.

9. The millimeter wave regular modular sparse active phased array antenna according to claim 2, characterized in that: The invention also comprises an antenna housing (6), wherein a mounting cavity is arranged in the antenna housing (6), wherein the sparse antenna module (2), the integrated motherboard (1), the chip assembly (3) and the digital and power supply unit (4) are stacked in sequence from top to bottom in the mounting cavity, and the antenna housing (6) is provided with a power supply / control connector (61) and a signal connector (62) connected to the digital and power supply unit (4).

10. The millimeter wave regular modular sparse active phased array antenna according to claim 9, characterized in that: It also includes a heat dissipation structure, which includes: A heat dissipation cold plate (5) is arranged above the digital and power supply unit (4); a temperature-averaging heat exchange circuit is buried inside the cold plate; the temperature-averaging heat exchange circuit is a temperature-averaging heat pipe or a liquid cooling circuit, and the temperature-averaging heat pipe or the liquid cooling circuit is connected to a circulation pump for introducing a temperature-averaging medium or a cooling liquid to achieve temperature-averaging heat conduction or liquid cooling; A thermal pad, arranged on the heat dissipation cold plate (5) and arranged in contact with the chip assembly (3); The antenna housing heat sink structure is arranged on the outer surface or the inner surface of the antenna housing (6).

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