COB LED adaptive thermal management system

Abstract

The invention relates to a COB LED self-adaptive thermal management system, and aims to improve the heat dissipation performance and prolong the service life of a COB LED through an intelligent temperature monitoring and adjusting means. The system comprises an infrared thermal imaging module which is used for obtaining real-time thermal images of a COB LED packaging substrate and an LED unit; the image processing module is used for analyzing the acquired thermal image and identifying a hot spot area; and the current adjusting module is used for dynamically adjusting the driving current of the corresponding LED unit according to the identified hot spot area so as to slow down the generation of hot spots. If the current adjustment cannot sufficiently reduce the hot spot temperature, the cooling mechanism control module starts a cooling mechanism, including adjusting the fan speed, prompting a user to optimize external environment heat dissipation conditions, or partially shutting down the LED unit in extreme cases to reduce heat generation. According to the system, by combining real-time thermal imaging, intelligent current regulation and cooling mechanisms, the COB LED system is ensured to maintain a stable temperature in a high-efficiency working state, so that the overall light output efficiency is improved, and the service life of the LED is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of COB LEDs, and in particular to a COB LED adaptive thermal management system. Background Art

[0002] In the prior art, LEDs (light-emitting diodes) are widely used in the field of lighting and display technology, and have attracted much attention due to their advantages such as high efficiency, energy saving, and long life. In large-scale applications, COB (Chip on Board) technology is particularly common. It directly packages multiple LED chips on a substrate to make the light output more uniform and the integration higher, while reducing the space between chips, thereby improving the overall performance and reliability of LED equipment. In order to ensure the long-term stable operation of LED chips, existing systems usually use heat dissipation design and current regulation methods to prevent LEDs from overheating and affecting their light output efficiency and life.

[0003] However, existing COB LED thermal management technologies have certain limitations. First, traditional thermal management systems mostly rely on fixed fan cooling or heat sinks, and are only activated at extreme temperatures, without the ability to accurately control real-time heat distribution. Second, existing systems lack specificity in current regulation of each LED unit, and often cannot accurately respond to dynamic changes in hot spots, resulting in performance degradation in some local areas due to overheating. In addition, existing heat dissipation methods are not adaptable enough to the external environment, and it is difficult to achieve effective heat dissipation management under different temperature or air flow conditions.

[0004] Therefore, it is urgent to develop a new COB LED adaptive thermal management system. Summary of the invention

[0005] The present application provides a COB LED adaptive thermal management system to improve the heat dissipation performance and service life of the COB LED.

[0006] The present application provides a COB LED adaptive thermal management system, comprising:

[0007] Infrared thermal imaging module, used to obtain real-time thermal images of COB LED package substrates and LED units;

[0008] An image processing module, connected to the infrared thermal imaging module, for analyzing the acquired real-time thermal image and identifying hot spots on the LED unit and the package substrate;

[0009] A current regulating module, connected to the image processing module, for adjusting the driving current of the corresponding LED unit according to the identified hot spot area;

[0010] A cooling mechanism control module is connected to the image processing module and is used to activate a cooling mechanism when current regulation cannot sufficiently reduce the temperature of the hot spot area. The cooling mechanism includes: adjusting the fan speed to enhance air flow, prompting the user to adjust the external environment to enhance the heat dissipation effect, or partially shutting down the LED unit to reduce heat generation in extreme cases.

[0011] Furthermore, the infrared thermal imaging module includes a multispectral imaging sensor, which is used to simultaneously acquire infrared thermal images and visible light images; the infrared thermal imaging module realizes accurate hot spot area positioning through image superposition processing based on the infrared thermal images and visible light images acquired simultaneously.

[0012] Furthermore, the infrared thermal imaging module includes a calibration and real-time compensation unit, which is used to adjust the detection accuracy and sensitivity of the multi-spectral imaging sensor according to changes in ambient temperature, usage time and sensor aging status; wherein the calibration and real-time compensation unit includes an internal heat source reference subunit, which is used to perform self-inspection regularly and correct the detection deviation of the infrared sensor to ensure continuous provision of high-precision thermal images under different environmental conditions.

[0013] Furthermore, the image processing module is configured with an image analysis algorithm based on edge detection and region segmentation, which is used to identify subtle temperature differences on the packaging substrate and to finely divide the boundaries of the hot spot area; wherein, the image analysis algorithm automatically adjusts the driving current distribution strategy of the LED unit by analyzing the temperature gradient, thereby ensuring a more uniform temperature distribution and effectively preventing overheating spread and local damage.

[0014] Furthermore, the current regulation module includes a partitioned current regulation unit, which is used to independently adjust the driving current of the LED unit in each area based on the heat distribution of different areas on the packaging substrate; wherein the current regulation unit is configured with a balancing optimization algorithm, which is used to dynamically adjust the current distribution priority according to the heat load of different areas, while reducing the temperature of the hot spot area and maximizing the light output efficiency of the non-hot spot area.

[0015] Furthermore, the current regulation unit includes a feedback loop control mechanism, which continuously adjusts the current output of the LED unit by collecting temperature change data of the hot spot area in real time; wherein the feedback loop control mechanism includes an adaptive current regulator, which is used to gradually reduce the operating current of the LED unit in the hot spot area, and gradually restore the normal current when the temperature in the area drops below a predetermined threshold, thereby avoiding frequent current changes from causing shocks to the LED unit and extending its service life.

[0016] Furthermore, the cooling mechanism control module includes an external environmental sensor network for monitoring the temperature, humidity, air flow rate and cleanliness of the heat dissipation channel of the surrounding environment, and adjusting the fan speed and cooling mode according to the monitored environmental data.

[0017] Furthermore, the cooling mechanism control module has a multi-stage fan speed regulation mechanism, including three speed adjustments: low speed, medium speed and high speed; the multi-stage fan speed regulation mechanism is used to automatically select the most suitable fan speed level according to the temperature changes in the hot spot area and the feedback from the environmental sensor, and at the same time has a fan overload protection function to prevent fan wear or cooling system failure caused by long-term high-speed operation.

[0018] Furthermore, the current regulating module regulates the driving current of the corresponding LED unit by the following dynamic formula 1:

[0019]

[0020] Among them, I LED (t) is the real-time driving current of the corresponding LED unit at time t; I max is the maximum rated current of the corresponding LED unit; β is the ambient cooling capacity coefficient; T hot (t) is the temperature of the hot spot area at time t; T env (t) is the ambient temperature of the corresponding LED unit at time t; γ is the weight coefficient of the historical temperature change curve; τ is the length of the retrospective time window, indicating the time range of the historical temperature data; is the integral of the temperature change within the time window τ, which is used to capture the rate of temperature change and adjust the current; η is the temperature over-threshold sensitivity coefficient, which is used to control the current regulation intensity when the temperature approaches or exceeds the threshold; T threshold It is the temperature threshold when the LED unit works normally.

[0021] Furthermore, the cooling mechanism control module dynamically adjusts the fan speed to enhance air flow by the following formula 2:

[0022]

[0023] Among them, V f (t) is the real-time speed of the fan at time t; V max is the maximum speed of the fan; λ is the sensitivity adjustment coefficient, which is used to control the response intensity of temperature change to fan speed adjustment; T avg (t) is the average temperature on the package substrate at time t; T threshold1is the temperature threshold when the system is working normally; k is the weighting coefficient of the historical temperature change, which is used to amplify the impact of the temperature change trend on the fan speed; ε is the time window length of the historical temperature change; is the square integral of the temperature change rate of the hot spot area within the time window ε, which is used to capture and amplify the impact of rapid temperature changes on the fan speed. hot (t′) is the temperature of the hot spot area at time t′.

[0024] The beneficial effects of the present application mainly include: (1) Through the combination of the infrared thermal imaging module and the image processing module, the system can obtain the thermal images of the LED package substrate and the LED unit in real time, and accurately identify the hot spot area, thereby realizing dynamic monitoring of local overheating and avoiding performance degradation or failure caused by local overheating. (2) The current regulation module dynamically adjusts the driving current of the corresponding LED unit according to the identified hot spot area, which can accurately reduce the temperature of the hot spot area while maintaining efficient light output in the non-hot spot area. This targeted current regulation method improves the working efficiency of the LED and extends the service life of the equipment. (3) When the current regulation is not enough to reduce the hot spot temperature, the cooling mechanism control module is activated to effectively reduce heat generation by adjusting the fan speed, prompting the user to optimize the external heat dissipation environment, or shutting down some LED units in extreme cases, thereby ensuring that the system can maintain the best heat dissipation effect under various working environments. (4) Through precise temperature management and multi-level thermal control means, the system reduces the loss of LED units caused by long-term high temperature, avoids light decay and failure caused by overheating, thereby significantly extending the service life of COB LEDs and improving the reliability and stability of the overall product. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of a COB LED adaptive thermal management system provided in the first embodiment of the present application. DETAILED DESCRIPTION

[0026] Many specific details are described in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application, so the present application is not limited by the specific implementation disclosed below.

[0027] The first embodiment of the present application provides a COB LED adaptive thermal management system. Figure 1 , which is a schematic diagram of the first embodiment of the present application. Figure 1 A COB LED adaptive thermal management system is described in detail in the first embodiment of the present application.

[0028] The COB LED adaptive thermal management system includes a biometric recognition module 101 , a behavior analysis module 102 , an adaptive learning module 103 and a control module 104 .

[0029] The infrared thermal imaging module 101 is used to obtain real-time thermal images of the COB LED package substrate and the LED unit.

[0030] The infrared thermal imaging module 101 is a key component of the COB LED adaptive thermal management system. It is used to monitor and obtain the thermal distribution information of the COB LED package substrate and LED unit in real time. The module is mainly composed of a highly sensitive infrared sensor, which can capture the infrared thermal radiation generated by the LED unit when it is working and convert it into a visual thermal image. The selection of infrared sensors is crucial and needs to have high resolution and fast response capabilities to ensure that temperature changes can be accurately recorded when the LED unit heats up rapidly. This is especially important for large-scale integrated COB LED packages, because the dense arrangement of LED chips will lead to heat accumulation in local areas, which may cause performance degradation or even failure.

[0031] The working principle of the infrared thermal imaging module is based on the detection of infrared radiation, which is emitted due to the heat generated by the LED unit when it is working. After receiving these radiations, the infrared sensor converts them into electronic signals through signal processing and further processes them into two-dimensional thermal images. These thermal images show different temperature areas on the package substrate, clearly showing the location and temperature distribution of the hot spot areas.

[0032] In order to ensure the accuracy of thermal imaging, the infrared thermal imaging module 101 can be configured with an automatic calibration function to regularly adjust the sensitivity and accuracy of the sensor through a built-in reference temperature source and an ambient temperature sensor. This automatic calibration process can adjust the calibration parameters in real time according to changes in ambient temperature or the aging state of the sensor, ensuring that the module can still provide accurate thermal images even in long-term operation. In addition, the infrared thermal imaging module can also exclude interfering light sources in the external environment through a built-in filter to ensure that the acquired thermal image only contains the effective thermal radiation of the COB LED package substrate and the LED unit.

[0033] The viewing angle and detection range of the module also need to be reasonably designed according to the specific application. Since the LED units in the COB LED system may be arranged very closely, the infrared thermal imaging module should have a high enough spatial resolution to ensure that the thermal state of each LED unit can be distinguished without blurring the image or unclear hot spots. In addition, the response speed of the sensor is also very critical, especially when the LED unit is quickly brightened or dimmed, the heat changes very quickly, so the infrared thermal imaging module must have a high frame rate to capture these changes in real time.

[0034] The infrared thermal imaging module 101 is closely connected to the image processing module 102, and the acquired thermal image is transmitted to the image processing module for analysis in real time through a data interface (such as a high-speed serial interface). This module is not only suitable for high-heat application scenarios such as COB LED display screens, but can also be extended to other electronic devices with strict requirements on thermal management, such as high-power LED lighting systems and outdoor display screens.

[0035] In summary, the infrared thermal imaging module 101 assumes the core function of real-time temperature monitoring in this system, ensuring that accurate and fast thermal image capture provides a reliable basis for subsequent thermal management and control. By configuring high resolution, fast response, automatic calibration and interference filtering and other technical means, the infrared thermal imaging module can meet the needs of various harsh working environments.

[0036] Furthermore, the infrared thermal imaging module includes a multispectral imaging sensor, which is used to simultaneously acquire infrared thermal images and visible light images; the infrared thermal imaging module realizes accurate hot spot area positioning through image superposition processing based on the infrared thermal images and visible light images acquired simultaneously.

[0037] The infrared thermal imaging module in the COB LED adaptive thermal management system is equipped with a multi-spectral imaging sensor. The sensor can simultaneously acquire infrared thermal images and visible light images, and achieve more accurate hot spot location by superimposing these two different types of images. The combination of infrared thermal imaging and visible light imaging has significant advantages in thermal management systems because it can provide more comprehensive information for better understanding and analysis of the thermal distribution and working status of LED systems.

[0038] Infrared thermal imaging mainly captures the thermal radiation generated by the COB LED unit when it is working, and accurately reflects the temperature distribution of the LED unit by detecting the infrared spectrum. In this way, the system can clearly identify the hot spot area on the package substrate. Infrared imaging is very sensitive to monitoring temperature changes and can quickly detect the temperature rise trend. Especially in high-density COB LED packaging, infrared imaging can well detect local overheating. However, single infrared imaging may sometimes have limitations in distinguishing physical structures, especially when different LED units are difficult to distinguish clearly due to similar temperatures, the accuracy of infrared imaging may be affected.

[0039] To solve this problem, multispectral imaging sensors have added visible light image acquisition. Visible light images provide information about the system's physical layout and structure, so that the physical position of each LED unit can be accurately mapped and identified. By superimposing visible light images, the system can accurately match temperature data with physical positions, thereby achieving more accurate hotspot positioning. For example, in COB LED packaging, the LED units are arranged very densely, and some units may overlap in thermal radiation due to their positional relationships, which may not be distinguishable by infrared imaging alone. By comparing the physical positions of visible light images, the position of each unit and its corresponding temperature distribution can be clearly distinguished.

[0040] The core of this image overlay processing technology is to fuse infrared thermal images and visible light images at the pixel level. Specifically, the system uses an image registration algorithm to align infrared thermal images and visible light images so that each pixel of the two images corresponds to the same physical position. The registration process requires extremely high precision, and usually needs to take into account factors such as optical axis differences between imaging sensors and lens distortion. Through precise registration, the system can obtain a multi-level image: containing both physical layout information and real-time temperature data. This method allows the system to quickly and accurately identify hot spots and avoid misjudgments and positioning errors.

[0041] It is worth mentioning that the joint imaging of infrared and visible light is not limited to hotspot positioning, but can also be used to expand other thermal management-related functions. For example, the system can detect certain abnormal physical conditions (such as object obstruction or dust accumulation) through visible light images, while infrared imaging can identify temperature anomalies in the corresponding areas. By combining these two types of information, the system can quickly adjust the cooling mechanism or issue an alarm when physical anomalies are detected, prompting the user to clean or maintain. This multiple feedback mechanism significantly improves the reliability and responsiveness of the system.

[0042] In addition, the collaborative work of infrared and visible light imaging sensors also needs to consider the influence of environmental factors. Since LED systems usually work under different lighting conditions, such as outdoors or under strong light, single infrared imaging may be interfered by background radiation, and visible light imaging may be distorted due to reflection and illumination changes. Therefore, multispectral imaging technology requires precision adjustment and compensation under different environmental conditions to ensure the stability and reliability of the two imaging methods in various scenarios. This can be achieved through automatic calibration technology, where the system periodically adjusts the sensitivity of infrared and visible light sensors to ensure the accuracy of image superposition under different working conditions.

[0043] Through multi-spectral imaging technology, COB LED adaptive thermal management system can achieve more precise temperature control and heat distribution management. The system can provide higher accuracy, reliability and scalability in practical applications, and is particularly suitable for high-density COB LED packaging that requires efficient heat dissipation and other electronic equipment management systems that require precise temperature control.

[0044] Furthermore, the infrared thermal imaging module includes a calibration and real-time compensation unit, which is used to adjust the detection accuracy and sensitivity of the multi-spectral imaging sensor according to changes in ambient temperature, usage time and sensor aging status; wherein the calibration and real-time compensation unit includes an internal heat source reference subunit, which is used to perform self-inspection regularly and correct the detection deviation of the infrared sensor to ensure continuous provision of high-precision thermal images under different environmental conditions.

[0045] The infrared thermal imaging module in the COB LED adaptive thermal management system further includes a calibration and real-time compensation unit to improve the detection accuracy and sensitivity of the multi-spectral imaging sensor. The purpose of this module is to solve the imaging error problem caused by changes in ambient temperature, extended sensor usage time, and sensor aging. Over time, the performance of the infrared sensor may deviate due to external environmental influences or the degradation of the device itself, which will lead to a decrease in the accuracy of the thermal image. Therefore, the calibration and real-time compensation unit plays a vital role in ensuring the long-term stability and accuracy of the system.

[0046] The key function of the calibration and real-time compensation unit is its ability to dynamically adjust according to changes in ambient temperature. In LED systems, the temperature of the external environment may fluctuate significantly. For example, when the device is exposed outdoors, it may be affected by seasonal temperature changes, day and night temperature differences, and direct sunlight. These external temperature changes may affect the sensitivity and accuracy of the infrared sensor. Therefore, the calibration unit monitors the ambient temperature in real time and adjusts the operating parameters of the sensor according to a predetermined algorithm to ensure that the system can always provide accurate hotspot detection regardless of how the external temperature changes.

[0047] The calibration and real-time compensation unit can also adjust the detection accuracy and sensitivity of the sensor according to the usage time. With the long-term use of the sensor, especially when working in a high temperature environment, the material properties of the sensor may age, resulting in a decrease in sensitivity. To solve this problem, the real-time compensation function in the system automatically detects the working status of the sensor through a built-in algorithm and dynamically adjusts the response characteristics of the sensor according to the accumulated usage over time. This adaptive adjustment mechanism can automatically maintain the high accuracy of the sensor without manual calibration, ensuring data stability and reliability after long-term use.

[0048] In addition, the calibration and real-time compensation unit is equipped with an internal heat source reference subunit, which is one of the core mechanisms to ensure the accuracy of the infrared sensor. The internal heat source reference subunit is equivalent to the "standard" inside the system, providing a known and constant reference temperature. The system can perform self-tests regularly to detect and correct sensor deviations by comparing the output of the infrared sensor with the known temperature value of the internal heat source. This self-test mechanism enables the system to continuously provide high-precision thermal images under various environmental conditions. Even if the sensor has errors due to aging or changes in external conditions, it can be quickly corrected through the calibration process to avoid loss of accuracy.

[0049] In order to make this self-checking and compensation process more effective, the design of the internal heat source reference subunit needs to ensure that its temperature is constant and not affected by the external environment. Usually, this subunit is isolated from the outside world by a thermal insulation design and maintained within a specific temperature range to serve as the calibration reference of the sensor. During the calibration process, the infrared sensor periodically reads the temperature of the internal heat source and compares it with its known accurate temperature value. If a deviation is detected, the calibration system automatically adjusts the sensor's response curve. This process can effectively correct the sensor's detection errors and restore its accuracy in a very short time, ensuring that there is no distortion of the thermal image due to sensor drift during operation.

[0050] It is worth noting that the calibration and real-time compensation unit does not interrupt the normal operation of the system. It can perform calibration and compensation in the background to ensure the continuity of the system. This means that even when the LED unit is working at high intensity or the system is processing critical temperature data, the calibration process can still be carried out without affecting the real-time performance of the overall system. This is especially important for application scenarios with extremely high heat dissipation requirements, such as high-power LED displays or devices that require continuous long-term operation.

[0051] In summary, the calibration and real-time compensation unit ensures that the multispectral imaging sensor always maintains high-precision detection capability under various working conditions through multiple means such as internal heat source reference subunit, ambient temperature adjustment and sensor aging compensation.

[0052] The image processing module 102 is connected to the infrared thermal imaging module and is used to analyze the acquired real-time thermal image and identify the hot spots on the LED unit and the packaging substrate.

[0053] The image processing module 102 is an important component of the COB LED adaptive thermal management system, and is responsible for receiving and analyzing the real-time thermal image provided by the infrared thermal imaging module 101. The module processes the thermal image data to identify the hot spots on the package substrate and the LED unit, thereby providing a basis for subsequent current regulation and the start of the cooling mechanism.

[0054] In actual implementation, the core functions of the image processing module 102 are image analysis and data extraction. First, it pre-processes the original thermal image transmitted from the infrared thermal imaging module. This may include noise filtering, image sharpening, and contrast enhancement to ensure that the image quality is high enough for subsequent accurate analysis. By eliminating noise and improving image clarity, the system can more accurately identify hot spots with higher temperatures and avoid misjudgments caused by image quality issues.

[0055] Next, the image processing module will use a specific algorithm to analyze the preprocessed image. Common algorithms include edge detection, region segmentation, and temperature gradient analysis to accurately locate and evaluate the temperature of each LED unit. Edge detection technology can help the image processing module distinguish the boundaries between different LED units to prevent confusion of temperature information. The region segmentation algorithm can effectively isolate the hot spots in the image for further temperature processing. Temperature gradient analysis can identify which areas have the most drastic temperature changes, helping the system prioritize these key areas.

[0056] In addition, the image processing module 102 is not limited to simple hot spot identification, but can also introduce more advanced functions such as predictive analysis and temperature distribution modeling. By analyzing the thermal images of multiple consecutive frames, the system can determine the trend of the hot spot area and predict the overheating area that may appear in the future. This predictive function is very useful for preventing overheating, especially when the LED unit is working for a long time or the load is increasing. The system can take adjustment measures in advance instead of waiting until the overheating phenomenon has occurred before responding.

[0057] In order to ensure real-time performance, the image processing module 102 should have efficient processing capabilities and be able to process a large amount of thermal image data in a very short time. In modern image processing technology, the use of parallel computing or GPU acceleration can greatly improve the processing speed, ensuring that the system can still accurately identify hot spots and respond in a timely manner under high load or rapid changes. In order to avoid processing lags, the image processing module can be configured with a cache function to store multiple frames of thermal images at the same time and speed up analysis efficiency through parallel processing.

[0058] The image processing module 102 is closely linked with the current regulation module and the cooling mechanism control module. Once a hot spot area is identified, the image processing module will transmit the data to the current regulation module to adjust the driving current of the relevant LED unit. At the same time, if multiple hot spots or areas with excessively high temperatures are identified, the image processing module will also trigger the cooling mechanism control module to start the fan to accelerate heat dissipation or take other heat dissipation measures. In addition, the image processing module can also perform further temperature evaluation and optimization adjustments based on external sensor data (such as ambient temperature, humidity, etc.) to ensure the stability of the system under various environmental conditions.

[0059] The implementation of the image processing module 102 is not limited to a single algorithm or processing method. Depending on the application scenario, the type and complexity of the processing algorithm can be flexibly adjusted to adapt to different heat dissipation requirements. For example, in some high-precision applications, deep learning or neural network technology can be used to improve the accuracy of hot spot area identification by learning and analyzing a large amount of historical data. For LED application scenarios with fast dynamic changes, inter-frame difference detection technology can be introduced to capture hot spot changes more sensitively.

[0060] In summary, the image processing module 102 not only undertakes the basic image analysis and hotspot identification functions, but also can realize real-time temperature control and predictive analysis by introducing advanced algorithms and processing technologies. This module plays a vital role in this system. It not only provides accurate hotspot data, but also ensures that the system can maintain stable operation in a complex and rapidly changing use environment, providing core support for overall thermal management.

[0061] Furthermore, the image processing module is configured with an image analysis algorithm based on edge detection and region segmentation, which is used to identify subtle temperature differences on the packaging substrate and to finely divide the boundaries of the hot spot area; wherein, the image analysis algorithm automatically adjusts the driving current distribution strategy of the LED unit by analyzing the temperature gradient, thereby ensuring a more uniform temperature distribution and effectively preventing overheating spread and local damage.

[0062] In the COB LED adaptive thermal management system, the image processing module is configured with an image analysis algorithm based on edge detection and region segmentation to identify subtle temperature differences on the package substrate and finely divide the boundaries of the hot spot area. The core function of this image processing module is to accurately capture and analyze the temperature distribution of the LED unit through a high-precision algorithm, thereby optimizing the thermal management effect of the system.

[0063] First, the edge detection algorithm is used in this module to identify the temperature difference between different areas on the package substrate. Edge detection is a commonly used technology in image processing. It identifies the boundaries between objects by detecting the grayscale change rate in the image. In thermal images, the temperature difference between different areas will be reflected in the brightness difference of the pixels. The edge detection algorithm can quickly and accurately identify the edge areas with large temperature gradient changes. In COB LED systems, the boundaries of hot spots are often very fuzzy, and simple temperature detection may be difficult to distinguish the exact range of the hot spots. Through edge detection, the system can accurately identify the specific boundaries of these hot spots and provide clearer temperature distribution information.

[0064] At the same time, the region segmentation algorithm further enhances the processing power of the module. Region segmentation is a technology used to divide an image into several regions with similar characteristics, usually by grouping pixels according to similar characteristics (temperature in this case). In COB LED packaging, there may be multiple LED units on a single substrate, and the temperature distribution of each unit is different. Especially in the case of high-density packaging, the temperature difference is more significant. Through the region segmentation algorithm, the system can divide the various LED units on the substrate into different hot zones, each with similar temperature characteristics. This segmentation enables the system to monitor each hot zone separately to avoid affecting the performance of the entire package substrate due to local overheating.

[0065] Based on the above-mentioned image analysis algorithm of edge detection and area segmentation, the system can not only identify temperature differences, but also finely divide hot spot areas. The significance of this fine division is that it allows the system to make targeted adjustments to each hot spot area. For example, some hot spot areas may only involve local LED units on the package substrate, rather than the entire area. In this case, the system can accurately control the LED units in the hot spot area without affecting other areas with normal temperatures. This local regulation avoids excessive current adjustment or cooling operations, thereby improving the overall efficiency of the system.

[0066] During the implementation process, the image analysis algorithm further optimizes the driving current distribution strategy of the LED unit through in-depth analysis of the temperature gradient. The temperature gradient reflects the temperature change rate of each area on the substrate. By analyzing these gradients, the system can identify which areas have rapid temperature changes and which areas are relatively stable. For areas with rapid temperature changes, the system can actively reduce the driving current of the LED unit in the area to slow down the temperature rise rate; for areas with stable temperature, the system can maintain the current current distribution to ensure that its light output performance is not affected. This adaptive current adjustment strategy not only ensures the uniformity of temperature distribution, but also effectively prevents the spread of overheating and avoids damage to local areas due to overheating.

[0067] In order to avoid the influence of image noise on edge detection and region segmentation, image preprocessing steps such as noise filtering and image enhancement should also be considered in the algorithm to ensure that the input image quality is high enough to support subsequent refinement processing.

[0068] Finally, the image analysis algorithm is not only applicable to the current LED drive current regulation, but can also work in conjunction with the cooling mechanism. For example, when the system recognizes that the temperature in a certain area continues to rise, in addition to adjusting the current distribution, it can also start additional cooling mechanisms, such as speeding up the fan or adjusting the performance of the heat dissipation material, to further reduce the temperature of the area. This multi-level thermal management mechanism can maintain the stability and efficiency of the LED system in a complex working environment.

[0069] In summary, the image analysis algorithm based on edge detection and region segmentation realizes the precise identification and control of temperature in the image processing module. By combining the temperature gradient analysis, the system can automatically adjust the current distribution of the LED unit to ensure uniform temperature distribution and effectively prevent overheating spread and local damage.

[0070] The current regulating module 103 is connected to the image processing module and is used to adjust the driving current of the corresponding LED unit according to the identified hot spot area.

[0071] The current regulation module 103 is one of the core functional modules in the COB LED adaptive thermal management system. Its main task is to dynamically adjust the driving current of the corresponding LED unit according to the hot spot area identified by the image processing module 102, so as to control the temperature of the LED unit. The implementation of this module requires not only a precise control mechanism, but also close cooperation with the infrared thermal imaging module and the image processing module to ensure the response speed and control accuracy of the thermal management system.

[0072] In a specific implementation, the current regulation module receives data from the image processing module, which includes the location information of the identified hot spot area and the corresponding temperature value. Based on this data, the current regulation module controls the LED units in each hot spot area individually or in groups. The module can adjust the current intensity of different LED units according to the temperature difference, and this adjustment is usually nonlinear. The system can choose to gradually reduce the driving current of the LED units in the hot spot area according to the severity of the current temperature to alleviate local overheating.

[0073] The regulation mechanism of this module relies on a precise feedback control loop. The controller in the current regulation module determines the adjustment range by comparing the temperature of the current hot spot area with the preset temperature threshold. The adjustment range can be continuous or based on multiple preset current levels. As the temperature of the LED unit gradually decreases, the system will dynamically adjust the current to restore the original value to avoid affecting the light output efficiency due to excessive current reduction. The specific regulation can be achieved based on proportional-integral-differential control (PID control) to ensure the stability and fast response of the regulation process and avoid excessive or insufficient current regulation.

[0074] The current regulation module 103 is not only used to regulate a single LED unit, but can also independently manage LED units in multiple areas through the regional control function. For example, the LEDs in some areas may have a higher operating temperature due to design or load reasons, while other areas are in a more normal temperature range. Through regional control, the current regulation module can independently adjust the current output according to the specific temperature requirements of each area, maximizing the heat dissipation effect while maintaining efficient light output. This regional control function enables the entire COB LED system to maintain optimal performance under a variety of working conditions.

[0075] In addition to conventional current regulation, the current regulation module also has certain intelligent features. For example, when the system detects that the temperature in the hot spot area changes rapidly, the current regulation module will respond quickly and quickly reduce the drive current to prevent the temperature from rising further. This dynamic adjustment mechanism can effectively prevent equipment damage caused by overheating in a short period of time. In addition, in some cases, the module can work in conjunction with the cooling mechanism. When the current regulation cannot sufficiently reduce the temperature, other cooling methods are triggered, such as fan acceleration or prompting the user to adjust the external environment.

[0076] The design of the current regulation module needs to take into account the electrical characteristics and heat dissipation requirements of the LED unit to ensure that the regulation does not have a negative impact on the life and performance of the LED. To achieve this, the module is usually equipped with a current limiting mechanism. When the regulated current is too low or too high, the system automatically adjusts to operate within a safe range. In addition, the module can also dynamically adjust the current according to the working time of the LED unit to extend the service life of the LED. For example, as the use time of the LED unit increases, the risk of heat accumulation will also increase, so the system can automatically reduce the maximum drive current to reduce power consumption and heat generation.

[0077] The current regulation module can also be integrated with an external power management system to optimize the power consumption of the entire system. When the image processing module detects that a large area of ​​LED units is overheating, the current regulation module will uniformly manage the current of the entire area, rather than just regulating a single LED unit. This integration not only improves the energy efficiency of the system, but also reduces the operating cost of the equipment.

[0078] In general, the current regulation module 103 achieves dynamic temperature regulation through real-time current control of the LED unit, ensuring the stable operation of the COB LED system. It not only responds quickly to hot spots, but also has intelligent regulation characteristics, ensuring that the system can maintain optimal performance for a long time in complex environments.

[0079] Furthermore, the current regulation module includes a partitioned current regulation unit, which is used to independently adjust the driving current of the LED unit in each area based on the heat distribution of different areas on the packaging substrate; wherein the current regulation unit is configured with a balancing optimization algorithm, which is used to dynamically adjust the current distribution priority according to the heat load of different areas, while reducing the temperature of the hot spot area and maximizing the light output efficiency of the non-hot spot area.

[0080] The current regulation module in the COB LED adaptive thermal management system includes a partitioned current control unit. The main function of this unit is to independently regulate the current of the LED units in each area based on the heat distribution of different areas on the package substrate, thereby achieving precise thermal management and optimizing light output performance. This feature is particularly suitable for densely arranged COB LED packages, because such high-density packages may produce significant local overheating during operation, and traditional overall current control methods are difficult to effectively deal with these subtle differences in heat distribution.

[0081] The partitioned current control unit identifies the heat load conditions in different areas by monitoring the temperature distribution on the package substrate in real time. The LED units in each area may present different temperature states due to different positions, workloads or heat dissipation conditions. The module can independently adjust the drive current in each area based on these differences. For example, in some areas, if the temperature detects overheating, the system can automatically reduce the drive current of the LED unit in that area, reduce power consumption and heat generation, and prevent local overheating from affecting system performance. At the same time, for those areas with lower temperatures and stable operation, the system can maintain or even increase their drive current, thereby maximizing the light output efficiency of these areas.

[0082] The balanced optimization algorithm configured by the current control unit plays a vital role in this process. The algorithm dynamically adjusts the priority of current distribution based on the thermal load of each area. The core goal of the balanced optimization algorithm is to reduce the temperature of the hot spot area while ensuring that the overall light output of the entire COB LED system is not affected, and even to increase the output of non-hot spot areas under appropriate circumstances. This algorithm intelligently distributes current by analyzing the temperature data of each area in real time: the current in the hot spot area will be reduced first, while the cooling area will be given priority to maintain or increase the current. This flexible current regulation mechanism ensures that the total light output of the system can remain efficient in complex thermal environments.

[0083] To achieve this dynamic current regulation, the balancing optimization algorithm may consider multiple parameters, including the current temperature of each zone, the rate of temperature change, historical temperature data, and the current light output demand. For example, if the temperature of some areas rises too quickly, the system may prioritize adjusting the current of that area to quickly reduce its temperature. For areas with relatively stable temperatures and higher light output demands, the algorithm may prioritize allocating more current resources to these areas to ensure that the light output of these areas is maintained at a high level. This priority adjustment is real-time and can be continuously optimized based on the actual working conditions of the system.

[0084] It is worth noting that the balance optimization algorithm also has a certain self-learning ability. By analyzing the temperature and current data of the system's long-term operation, the algorithm can gradually optimize the current distribution mode of each area. For example, under certain specific usage conditions (such as high temperature or high load), the system can predict which areas are prone to overheating through adaptive adjustment of the algorithm, so as to adjust the current in advance to avoid extreme temperatures. This self-learning mechanism can greatly improve the operating efficiency of the system and effectively extend the service life of the LED unit.

[0085] In addition, the design of the partitioned current control unit needs to take into account the response speed and stability of the system. Since temperature changes may occur in a very short period of time, the system needs to be able to make adjustments quickly to prevent the temperature in the hot spot area from being too high. But at the same time, frequent current adjustments may cause system instability, especially in large-area COB LED packages. Therefore, the balance optimization algorithm needs to consider smooth transition when adjusting the current to avoid unnecessary impact on the LED unit caused by excessive current fluctuations. In addition, the system can also set a certain current adjustment threshold to ensure that adjustments are not made too frequently in a short period of time, preventing the system from affecting the overall light efficiency and stability due to excessive adjustments.

[0086] In short, the partitioned current control unit can not only cope with the temperature changes in each area of ​​the COB LED system, but also achieve efficient and stable current distribution through a balanced optimization algorithm. This module not only improves the thermal management capability of the system, but also ensures the overall performance and reliability of the system under different working conditions by optimizing the light output efficiency.

[0087] Furthermore, the current regulation unit includes a feedback loop control mechanism, which continuously adjusts the current output of the LED unit by collecting temperature change data of the hot spot area in real time; wherein the feedback loop control mechanism includes an adaptive current regulator, which is used to gradually reduce the operating current of the LED unit in the hot spot area, and gradually restore the normal current when the temperature in the area drops below a predetermined threshold, thereby avoiding frequent current changes from causing shocks to the LED unit and extending its service life.

[0088] The COB LED adaptive thermal management system includes a feedback loop control mechanism in the current control unit. The core function of this mechanism is to continuously adjust the current output of the LED unit by collecting temperature change data of hot spots in real time to ensure that the system can dynamically respond to changes in heat loads in different areas, thereby achieving efficient temperature management and stable light output performance.

[0089] The implementation of the feedback loop control mechanism relies on real-time monitoring of the temperature of the hot spot area. The system continuously tracks the temperature status of each LED unit or area through a temperature sensor or a thermal imaging module (such as an infrared thermal imaging module). When the temperature of a certain area rises and exceeds the set safety threshold, the feedback loop control mechanism is immediately activated to reduce the temperature of the area by adjusting the operating current of the LED unit. The adaptive current regulator of this mechanism plays a key role in this process. It can gradually reduce the current output of the hot spot area according to the temperature change trend, rather than reducing the current significantly at one time. In this way, the system avoids performance fluctuations or sharp changes in light output caused by a sudden reduction in current, thereby maintaining the overall stability of the system.

[0090] The adaptive current regulator is highly flexible and accurate. It responds immediately after the temperature exceeds the threshold, gradually reducing the current output in the hot spot area until the temperature in that area begins to drop to a safe level. When the temperature drops below the predetermined threshold, the system does not immediately restore the full current, but gradually restores the current output in a step-by-step manner. This gradual current recovery can not only prevent the LED unit from suddenly heating up, but also avoid the impact of large current fluctuations on the LED unit. This strategy is particularly suitable for COB LED systems that need to run for a long time, which can effectively extend the service life of the LED unit and reduce the occurrence of failures.

[0091] In actual operation, the feedback loop control mechanism can also dynamically adjust the speed and amplitude of current regulation by continuously monitoring and analyzing temperature change data. For example, if the temperature rises very quickly in a certain area, the system will speed up the current adjustment process to avoid overheating caused by too fast a temperature rise. In areas where the temperature changes more slowly, the current adjustment process can be slowed down accordingly to maintain the stability of the system's light output. This intelligent current regulation method ensures that the system can quickly respond to various complex working environments while avoiding the problems of overreaction or under-adjustment.

[0092] Another significant advantage of the feedback loop control mechanism is its adaptability. Through the self-learning function, the system can gradually optimize the current control strategy based on the data collected over a long period of time. For example, the system can analyze the temperature change pattern of the hot spot area, predict in advance which areas are prone to temperature rise, and take measures in advance to reduce the current output in these areas to avoid overheating. As the system runs longer, the adaptive current regulator can become more "intelligent" and can self-adjust under different working conditions to achieve the best temperature management effect.

[0093] It is worth mentioning that the feedback loop control mechanism is designed to avoid the negative impact of frequent current adjustments on the LED unit. Frequent current changes may have an adverse effect on the life of the LED, especially when a large amount of current fluctuations occur in a short period of time, the LED unit may be subjected to mechanical or thermal stress. Therefore, the system is designed to gradually adjust the current strategy to ensure that the temperature is effectively controlled while avoiding excessive current shocks to the LED unit. This flexible current adjustment method effectively extends the life of the LED unit and improves the reliability of the system.

[0094] In general, the feedback loop control mechanism in the current control unit achieves precise temperature control through multi-level control methods such as real-time monitoring, gradual current adjustment, and adaptive learning, and ensures that the system maintains stable light output while efficiently dissipating heat.

[0095] Furthermore, the current regulating module regulates the driving current of the corresponding LED unit by the following dynamic formula 1:

[0096]

[0097] Among them, I LED (t) is the real-time driving current of the corresponding LED unit at time t; I max is the maximum rated current of the corresponding LED unit; β is the ambient cooling capacity coefficient; T hot (t) is the temperature of the hot spot area at time t; T env(t) is the ambient temperature of the corresponding LED unit at time t; γ is the weight coefficient of the historical temperature change curve; τ is the length of the retrospective time window, indicating the time range of the historical temperature data; is the integral of the temperature change within the time window τ, which is used to capture the rate of temperature change and adjust the current; η is the temperature over-threshold sensitivity coefficient, which is used to control the current regulation intensity when the temperature approaches or exceeds the threshold; T threshold It is the temperature threshold when the LED unit works normally.

[0098] In this embodiment, the corresponding LED unit refers to a specific LED chip or chip group associated with a hot spot area identified by a thermal imaging module, sensor or other monitoring device in a COB (Chip on Board) LED system. COB technology usually involves mounting multiple LED chips directly on a substrate, so multiple LED units are densely arranged together, and each LED unit is an independent light source.

[0099] The specific meaning of corresponding LED units is that in a specific area, these LED chips may exhibit different thermal characteristics due to workload, heat dissipation conditions or environmental influences. When the system detects that the temperature in a specific area is too high through sensors, the LED chips in that area will be identified as "corresponding LED units". These units are in a state where they need to dynamically adjust the current at this moment in order to reduce overheating and prevent heat accumulation.

[0100] The current regulation module of the COB LED adaptive thermal management system adopts dynamic formula 1 to adjust the driving current of the corresponding LED unit. The formula regulates the current output of the LED unit through the interaction of multiple variables and parameters, thereby effectively managing the temperature and avoiding overheating problems. The following is a detailed explanation of each item in the formula, and explains how to obtain it and its function.

[0101] Formula 1 is as follows:

[0102]

[0103] The meaning of each item is as follows:

[0104] 1.I LED (t):

[0105] This is the real-time driving current of the corresponding LED unit at time t, indicating the current value that the LED unit is subjected to at a certain moment. This value is dynamically adjusted with the changes in factors such as the hot spot temperature and ambient temperature to ensure that the temperature of the LED unit operates within a safe range.

[0106] 2.I max :

[0107] It is the maximum rated current of the corresponding LED unit, which is the highest current that the LED unit can safely withstand under ideal conditions. This value is usually provided by the LED manufacturer and indicates the maximum current that can be applied under optimal environmental conditions.

[0108] 3. Beta:

[0109] The environmental cooling capacity coefficient indicates the effect of the cooling capacity of the external environment on the thermal management of the LED unit. This coefficient is usually determined by the external environmental conditions of the system (such as ventilation, heat sink efficiency, air flow, etc.). If the environment has good cooling conditions, the value of β may be small, indicating that the LED unit requires less current regulation; if the environment is not conducive to heat dissipation, the value of β is large, and more regulation is required to prevent overheating.

[0110] 4.T hot (t):

[0111] is the temperature of the hot spot area of ​​the LED unit at time t. This is usually obtained through a built-in temperature sensor or infrared thermal imaging module. The system monitors this temperature value in real time to ensure that the LED unit does not overheat.

[0112] 5.T env (t):

[0113] It is the temperature of the environment where the LED unit is located at time t, reflecting the cooling condition of the external environment. This value is obtained by an external environment sensor, such as an air temperature sensor. The ambient temperature directly affects the heat dissipation capacity of the LED unit. The higher the ambient temperature, the more difficult it is to dissipate heat, so a larger current adjustment is required.

[0114] 6.γ:

[0115] is the weight coefficient of the historical temperature change curve, which is used to reflect the impact of past temperature changes on current regulation. This coefficient determines the weight of historical temperature changes in the formula. The system analyzes historical temperature data and evaluates the temperature change trend, thereby making forward-looking adjustments to the current output. If γ is large, the system will rely more on past temperature change information for current regulation. , obtained through experimental data, or directly set based on expert knowledge.

[0116] 7. τ:

[0117] τ is the length of the time window for looking back, which indicates the time range of the historical temperature data. This means that when the system calculates the current output, it will take into account the temperature change trend over the past τ time. The time window length can be set based on the response speed of the LED system and the temperature change rate, and is generally used to capture short-term fluctuations in the temperature of the LED unit.

[0118] 8.

[0119] This is the integral of the temperature change within the time window τ, capturing the rate of temperature change over time. By integrating the rate of temperature change over the past period of time, the system can understand the overall trend of temperature change in the hot spot area. For example, if the integral value is large, it means that the temperature has risen rapidly over the past period of time, and the system will increase the current regulation accordingly; conversely, if the temperature changes more slowly, the regulation will be reduced.

[0120] 9.η:

[0121] η is the temperature over-threshold sensitivity coefficient, which is used to control the current regulation intensity when the temperature approaches or exceeds the threshold. This coefficient determines the system's sensitivity to temperature exceeding the threshold. If the η value is large, the system will quickly reduce the current output when the temperature approaches the threshold to prevent overheating; if the η value is small, the current regulation amplitude is more moderate.

[0122] 10.T threshold :

[0123] It is the temperature threshold when the LED unit is working normally. This value is determined by the design safety standard of the system or equipment. hot (t) exceeds T threshold , the system will start to reduce the current to prevent the LED unit from overheating; when the temperature returns to T threshold When the current drops below 0.05, the output current will gradually recover.

[0124] The formula dynamically adjusts the LED drive current by comprehensively considering the current temperature of the LED unit, historical temperature changes, and the influence of the external ambient temperature. First, the system monitors the temperature of the hot spot area and the ambient temperature in real time through sensors, and uses the first term in the formula to to evaluate the current temperature difference. If T hot (t) is much higher than T env (t), the system will significantly reduce the current to reduce the temperature.

[0125] Next, the second term of the formula The rate of temperature change is captured, and the system makes corresponding adjustments based on past temperature trends. The system can sensitively respond to whether the temperature exceeds the threshold, ensuring that the current is adjusted in time when the temperature approaches the threshold to prevent the LED unit from overheating and damage.

[0126] This dynamic current regulation strategy ensures that the system can maintain the safe and efficient operation of the LED unit in a changing working environment by monitoring and analyzing multi-dimensional temperature and environmental factors.

[0127] The cooling mechanism control module 104 is connected to the image processing module and is used to start the cooling mechanism when the current regulation cannot sufficiently reduce the temperature of the hot spot area. The cooling mechanism includes: adjusting the fan speed to enhance air flow, prompting the user to adjust the external environment to enhance the heat dissipation effect, or partially shutting down the LED unit to reduce heat generation in extreme cases.

[0128] The cooling mechanism control module 104 is one of the key modules in the COB LED adaptive thermal management system. Its main function is to start other auxiliary cooling mechanisms to ensure that the temperature of the LED unit and the package substrate is maintained within a safe range when the current regulation module cannot effectively reduce the temperature of the hot spot area. This module monitors and manages the temperature of the LED unit through close cooperation with the image processing module and the current regulation module, and performs stronger heat dissipation intervention when necessary.

[0129] The cooling mechanism control module first increases air flow by adjusting the fan speed, which is one of the most common and efficient ways to dissipate heat. When the image processing module detects that the temperature of some LED units exceeds the set safety threshold and the current regulation fails to effectively reduce the temperature, the cooling mechanism control module will start the fan and adjust the fan speed according to the temperature of the hot spot area. The speed adjustment is usually not linear, and the system may adopt graded regulation. The fan speed will gradually increase as the temperature of the hot spot area increases, thereby providing stronger cooling effect when needed, while avoiding the increase in energy consumption and noise caused by excessive fan operation.

[0130] In addition, the cooling mechanism control module can optimize the heat dissipation strategy based on the environmental conditions detected in real time. For example, in an external environment with high temperature or poor ventilation, the fan speed may be increased earlier to cope with adverse external conditions. To this end, the system can be equipped with environmental sensors to monitor the external air temperature, humidity, and air flow. This data is fed back to the cooling mechanism control module, which can make optimization decisions based on the internal and external temperature conditions. If the external environmental conditions are not conducive to heat dissipation, the system will start or accelerate the cooling mechanism in advance to prevent overheating.

[0131] In addition to fan control, the cooling mechanism control module also has a user prompt function. When the system detects that the external environmental conditions seriously affect the heat dissipation of the LED, the module will issue a notification to prompt the user to take necessary measures to improve the heat dissipation environment. The user prompt can be in a variety of ways, including displaying warning messages on the system's control panel or sending notifications by connecting to external network devices. For example, the system can suggest that the user move the device to a better ventilated area or reduce obstacles around the device to enhance air circulation. Such prompts can remind users to intervene in time to avoid potential overheating risks.

[0132] In extreme cases, when fan speed adjustment and user prompts fail to effectively reduce the temperature, the cooling mechanism control module also has the function of shutting down some LED units. By shutting down some LED units in hot spots or high-temperature areas, the system can significantly reduce the power consumption and heat generation in these areas, thereby quickly reducing the temperature. This shutdown operation can be temporary and locally controlled for specific LED unit areas to avoid significant impact on the light output and performance of the entire system. Once the temperature returns to a safe range, the system can reactivate the shut-down LED units to resume normal operation.

[0133] The design of the cooling mechanism control module must also take into account the reliability of the system and the stability during long-term operation. In order to prevent excessive wear of fans and other heat dissipation components, the system may set certain cooling strategies, such as slowing down or turning off the fan when not necessary to extend the life of the fan. In addition, the module can also regularly detect the operating status of the cooling system, including the speed, power consumption and wear of the fan, and issue maintenance prompts when abnormalities are found to ensure that the cooling performance of the system remains stable during long-term operation.

[0134] In general, the cooling mechanism control module 104 not only achieves effective heat dissipation by adjusting the fan speed and prompting the user to optimize the external environment, but also has the ability to shut down some LED units in extreme cases, thereby providing multi-level temperature control methods. By working in conjunction with other modules, the module provides refined thermal management and response mechanisms at high temperatures, ensuring that the system can maintain efficient operation in various complex environments and avoiding system failures or performance degradation caused by overheating.

[0135] Furthermore, the cooling mechanism control module includes an external environmental sensor network for monitoring the temperature, humidity, air flow rate and cleanliness of the heat dissipation channel of the surrounding environment, and adjusting the fan speed and cooling mode according to the monitored environmental data.

[0136] The COB LED adaptive thermal management system, the cooling mechanism control module includes an external environmental sensor network. The sensor network is designed to provide the system with real-time environmental data, including parameters such as ambient temperature, humidity, air flow rate, and cleanliness of the heat dissipation channel. By monitoring these environmental variables, the system can dynamically adjust the cooling mechanism, especially the fan speed and cooling mode, to more effectively optimize the heat dissipation performance and ensure that the COB LED system always maintains the best thermal management effect in different working environments.

[0137] One of the main functions of the external environmental sensor network is to monitor the ambient temperature. The heat dissipation efficiency of the LED system is closely related to the ambient temperature, especially in high temperature environments, where the heat dissipation efficiency may be greatly reduced. If the ambient temperature is too high, the heat dissipation mechanism may have difficulty effectively transferring heat from the LED unit to the outside world, causing the system temperature to rise rapidly. By monitoring the ambient temperature, the system can adjust the fan speed according to actual conditions, such as speeding up the fan speed under high temperature conditions to increase air flow and improve heat dissipation. Conversely, at lower ambient temperatures, the system can reduce the fan speed to save energy and reduce unnecessary noise.

[0138] Humidity is also an important factor affecting the heat dissipation effect, especially in an environment with high humidity, the thermal conductivity of the air may be reduced, which may further affect the efficiency of the heat dissipation channel. The humidity sensor in the external environmental sensor network can monitor humidity changes in real time and adjust the cooling mode accordingly. For example, when the humidity is high, the system can choose to enhance the cooling mechanism, such as increasing the power of the fan or starting other auxiliary cooling methods to ensure that the heat inside the system can be quickly discharged. The feedback from the humidity sensor can also be used in combination with other parameters, such as the combination with the ambient temperature, to comprehensively adjust the system's heat dissipation mode to ensure stable operation.

[0139] Air flow rate is another key monitoring parameter. For LED systems, especially COB LEDs in closed or semi-closed packages, the flow rate of the surrounding air directly affects the heat dissipation efficiency. If the air flow is not smooth, heat will accumulate inside the package, causing the temperature to rise rapidly. The external environmental sensor network can monitor the surrounding air flow rate in real time through the wind speed sensor to ensure smooth air circulation in the heat dissipation channel. When the system detects poor air flow, it may take a variety of countermeasures, such as increasing the fan speed or notifying the user to optimize the placement of the device to ensure that the air can circulate freely. This adjustment mechanism based on ambient wind speed allows the system to respond flexibly to various working environments, thereby avoiding local overheating.

[0140] In addition, the cooling mechanism control module also monitors the cleanliness of the heat dissipation channel through the sensor network. Over time, the heat dissipation channel may deteriorate due to the accumulation of dust or other impurities. The cleanliness sensors in the sensor network can detect blockages in the heat dissipation channel and provide corresponding feedback. Once it is detected that the dust accumulation in the channel exceeds the preset safety range, the system can issue a prompt to notify the user to clean the heat dissipation channel to ensure the normal operation of the cooling system. In severe cases, the system can automatically reduce power or enter energy-saving mode to prevent overheating failures caused by heat dissipation channel blockage.

[0141] By taking these external environmental factors into consideration, the cooling mechanism control module can not only adjust the fan speed, but also flexibly switch the cooling mode. For example, when the ambient temperature is low and the air circulation is good, the system can switch to energy-saving mode, reduce the fan speed, and reduce unnecessary energy consumption. In the case of high temperature, low wind speed or blocked heat dissipation channels, the system will switch to high-efficiency cooling mode to ensure that the internal temperature of the system remains within a safe range.

[0142] The external environment sensor network also needs to be designed with durability and accuracy in mind, especially when working outdoors or in harsh environments, where the sensors may be affected by environmental conditions such as dust, moisture, or temperature changes. To ensure long-term stability, the sensor network typically includes a self-calibration function to periodically adjust the accuracy to prevent sensor data from deviating too much. In addition, a high-speed data transmission channel is required between the sensor and the cooling mechanism control module to ensure that all environmental information can be transmitted in real time and timely adjustments can be made.

[0143] In short, the cooling mechanism control module can accurately adjust the fan speed and cooling mode through real-time data feedback from the external environmental sensor network, realizing an intelligent thermal management system.

[0144] Furthermore, the cooling mechanism control module has a multi-stage fan speed regulation mechanism, including three speed adjustments: low speed, medium speed and high speed; the multi-stage fan speed regulation mechanism is used to automatically select the most suitable fan speed level according to the temperature changes in the hot spot area and the feedback from the environmental sensor, and at the same time has a fan overload protection function to prevent fan wear or cooling system failure caused by long-term high-speed operation.

[0145] The COB LED adaptive thermal management system and cooling mechanism control module are designed with a multi-level fan speed adjustment mechanism. This mechanism can automatically select the most suitable fan speed level according to the temperature changes in the hot spot areas detected by the system and the information fed back by the external environment sensor network to achieve efficient heat dissipation, while maximizing energy conservation and extending the service life of system components.

[0146] The core of the multi-level fan speed regulation mechanism is that it has three speed adjustment functions: low speed, medium speed and high speed. Through this hierarchical regulation, the system can provide the most optimized heat dissipation solution under different working conditions. When the system detects that the temperature in the hot spot area is low or the rise is small, the system will choose to run the fan at a low speed. In this case, the fan can provide sufficient heat dissipation with lower energy consumption without generating additional noise or consuming unnecessary energy. At the same time, this gentle cooling method helps prevent temperature fluctuations in the hot spot area and maintain the temperature stability of the LED unit.

[0147] When the system detects that the temperature of a hot spot area begins to rise or the environmental sensor feedbacks that the external temperature is high, the fan speed will automatically increase to medium speed. In this mode, the fan can significantly increase air flow to help remove excess heat from the hot spot area. Medium speed is usually used when the system is under medium workload to balance heat dissipation and energy consumption, while ensuring that the LED unit does not affect performance due to temperature rise.

[0148] When the system detects that the temperature of the hot spot area continues to rise, or the external environment is extremely unfavorable for heat dissipation (such as high temperature, low wind speed), the system will increase the fan speed to high speed. In this state, the fan runs at maximum power to ensure maximum acceleration of air flow and quickly reduce the temperature of the hot spot area. The high-speed fan mode is usually used when the LED unit is working under high load and the external environment is harsh. It can effectively prevent the temperature of the hot spot area from exceeding the safe range and protect the system from overheating damage.

[0149] Another important function of the multi-level speed regulation mechanism is its automatic adjustment capability. The fan speed is automatically determined by the system based on the temperature changes and external environmental parameters monitored in real time. For example, environmental sensors can feedback changes in air flow rate or humidity, and the system will comprehensively evaluate the efficiency of the heat dissipation channel based on this, and then intelligently select the fan speed. This dynamic adjustment not only improves the energy efficiency of the system, but also extends the service life of fans and other heat dissipation components, because the fan will not always run at the maximum speed, and will only enter the high-speed mode when necessary.

[0150] In addition, the fan overload protection function is also an important part of the multi-level fan speed control mechanism. Long-term high-speed operation may cause fan wear and increase the risk of failure. Therefore, the system is designed with a function to automatically monitor the fan's operating status. When it is detected that the fan is in long-term high-load operation or is about to reach the limit of its design life, the system will automatically reduce the fan speed or prompt the user to perform maintenance or replacement operations on the fan. This can not only prevent the failure of the cooling system due to fan failure, but also further improve the overall reliability of the system.

[0151] The overload protection function also takes into account the wear and tear of the system during long-term use. As the fan is used for a long time, the speed and heat dissipation efficiency may gradually decrease. Therefore, the system can monitor the actual operating efficiency of the fan, estimate its lifespan and adjust the fan's operating frequency when necessary. In addition, during the multi-level speed regulation process, the system can also set the fan's use time interval to ensure that the fan will not accelerate wear due to excessively frequent starting and stopping.

[0152] The design of the multi-level fan speed adjustment mechanism provides a highly flexible and efficient heat dissipation solution for the entire COB LED adaptive thermal management system. Under different working conditions, the system can automatically adjust the fan speed to ensure that the temperature of the hot spot area is effectively controlled to prevent equipment failure or performance degradation due to overheating.

[0153] Furthermore, the cooling mechanism control module dynamically adjusts the fan speed to enhance air flow by the following formula 2:

[0154]

[0155] Among them, V f (t) is the real-time speed of the fan at time t; V max is the maximum speed of the fan; λ is the sensitivity adjustment coefficient, which is used to control the response intensity of temperature change to fan speed adjustment; T avg (t) is the average temperature on the package substrate at time t; T threshold1 is the temperature threshold when the system is working normally; κ is the weighting coefficient of historical temperature changes, which is used to amplify the impact of temperature change trends on fan speed; ε is the time window length of historical temperature changes; is the square integral of the temperature change rate of the hot spot area within the time window ε, which is used to capture and amplify the impact of rapid temperature changes on the fan speed. hot (t′) is the temperature of the hot spot area at time t′.

[0156] COB LED adaptive thermal management system, the cooling mechanism control module dynamically adjusts the fan speed through formula 2 to enhance air flow and optimize heat dissipation performance. This formula combines multiple parameters to ensure that the system can intelligently adjust the fan speed according to real-time temperature data and historical temperature change trends, thereby providing the best heat dissipation effect under different temperature conditions. The following is a detailed description of each item in the formula.

[0157] Formula 2 is as follows:

[0158]

[0159] 1.V f (t):

[0160] This is the real-time speed of the fan at time t. This value indicates the speed at which the fan is currently running. The fan speed is dynamically adjusted according to the temperature in the system. As the temperature detected by the system and the rate of temperature change vary, the fan speed will be adjusted in real time to ensure effective heat dissipation.

[0161] 2.V max :

[0162] is the maximum speed of the fan. This value is usually provided by the fan manufacturer and indicates the maximum speed the fan can reach at maximum operating power. The system will not allow the fan to exceed this maximum value, so this constant limits the maximum operating speed of the fan.

[0163] 3. Lambda:

[0164] is the sensitivity adjustment coefficient, which controls the response strength of the fan speed adjustment to temperature changes. This coefficient is used to adjust the fan's sensitivity to temperature changes. If the λ value is large, the fan will respond more quickly to temperature changes, while a small λ value means that the system responds more slowly to temperature changes. This coefficient can be adjusted according to the heat dissipation requirements of the system design and the fan characteristics.

[0165] 4.T avg (t):

[0166] It is the average temperature on the package substrate at time t. This temperature is obtained in real time through the temperature sensor inside the system, indicating the temperature condition of the entire LED package substrate. The average temperature is obtained by reading the data of multiple sensors and averaging them, which reflects the overall heat dissipation requirements of the package substrate. If the average temperature is high, the system may need to increase the fan speed to enhance heat dissipation.

[0167] 5.T threshold1 :

[0168] It is the temperature threshold of the system when it is working normally. It is a preset temperature value, usually set according to the design specifications of the system and the safe operating temperature range of the LED unit. If the average temperature T avg (t) exceeds this threshold, the fan speed adjustment term in the formula will start to take effect, gradually increasing the fan speed to help reduce the system temperature.

[0169] 6.κ:

[0170] κ is a weighting factor of historical temperature changes, which is used to amplify the impact of temperature change trends on fan speed. This factor adjusts the fan's sensitivity to historical temperature changes. When the system detects a faster rate of temperature change, a larger κ value will make the fan respond faster and run faster. This value can be tuned experimentally to ensure that the system can adjust appropriately under different temperature fluctuations. κ is obtained through experimental data or set directly based on expert knowledge.

[0171] 7.ε:

[0172] It is the time window length of the historical temperature change. It determines how long the system considers the temperature change data when calculating the current fan speed. This time window can be from a few seconds to a few minutes, and the specific length depends on the thermal inertia and heat dissipation requirements of the LED system. By selecting the appropriate time window, the system can capture the temperature change trend in the short term.

[0173] 8.

[0174] It is the square integral of the temperature change rate within the time window ε. It is used to capture the temperature change rate of the hot spot area and amplify the change trend, helping the system to detect the rapid change of temperature more sensitively. If the temperature changes rapidly in a short period of time, this integral term will increase, thereby accelerating the fan speed. Conversely, if the temperature changes smoothly, this term has little effect on the fan speed.

[0175] 9.T hot (t′):

[0176] is at time t ′ The temperature of the hot spot area at the moment. The value is obtained through infrared thermal imaging or built-in temperature sensor, and the system tracks the temperature changes of the hot spot area in real time. This item is used to reflect the temperature conditions of the local area of ​​the package substrate, especially those areas that are prone to overheating.

[0177] This formula regulates fan speed through two main parts. is a nonlinear adjustment term based on the sigmoid function, which ensures that the system responds appropriately to changes in average temperature. This term is designed so that when the average temperature of the package substrate is close to T threshold1 When the fan speed increases gradually, rather than jumping to maximum speed immediately, this smooth adjustment helps avoid unnecessary energy consumption and noise caused by sudden fan acceleration.

[0178] Part 2 The rate of temperature change is captured and amplified. If the temperature in a hot spot changes dramatically, this term will increase significantly, prompting the fan to speed up quickly to prevent overheating. By monitoring historical temperature changes, the system not only reacts to the current temperature, but also foresees possible temperature problems in the future and adjusts the fan speed in advance to ensure that the temperature is within a safe range.

[0179] Through this formula, the system can intelligently adjust the fan speed, saving energy when the temperature is low and responding quickly to enhance the heat dissipation effect when the temperature rises.

[0180] Although the present application is disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field may make possible changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims of the present application.

Claims

1. A COB LED adaptive thermal management system, characterized in that: include: Infrared thermal imaging module, used to obtain real-time thermal images of COB LED package substrates and LED units; An image processing module, connected to the infrared thermal imaging module, for analyzing the acquired real-time thermal image and identifying hot spots on the LED unit and the package substrate; A current regulating module, connected to the image processing module, for adjusting the driving current of the corresponding LED unit according to the identified hot spot area; A cooling mechanism control module is connected to the image processing module and is used to activate a cooling mechanism when current regulation cannot sufficiently reduce the temperature of the hot spot area. The cooling mechanism includes: adjusting the fan speed to enhance air flow, prompting the user to adjust the external environment to enhance the heat dissipation effect, or partially shutting down the LED unit to reduce heat generation in extreme cases.

2. The COB LED adaptive thermal management system according to claim 1, characterized in that: The infrared thermal imaging module includes a multispectral imaging sensor, which is used to simultaneously acquire infrared thermal images and visible light images; the infrared thermal imaging module realizes accurate hot spot area positioning through image superposition processing based on the infrared thermal images and visible light images acquired simultaneously.

3. The COB LED adaptive thermal management system according to claim 2, characterized in that: The infrared thermal imaging module includes a calibration and real-time compensation unit, which is used to adjust the detection accuracy and sensitivity of the multi-spectral imaging sensor according to changes in ambient temperature, usage time and sensor aging status; wherein the calibration and real-time compensation unit includes an internal heat source reference subunit, which is used to perform self-inspection regularly and correct the detection deviation of the infrared sensor to ensure continuous provision of high-precision thermal images under different environmental conditions.

4. The COB LED adaptive thermal management system according to claim 1, characterized in that: The image processing module is configured with an image analysis algorithm based on edge detection and region segmentation, which is used to identify subtle temperature differences on the packaging substrate and to finely divide the boundaries of the hot spot area; wherein, the image analysis algorithm automatically adjusts the driving current distribution strategy of the LED unit by analyzing the temperature gradient, thereby ensuring a more uniform temperature distribution and effectively preventing overheating diffusion and local damage.

5. The COB LED adaptive thermal management system according to claim 1, characterized in that: The current regulation module includes a partitioned current regulation unit, which is used to independently adjust the driving current of the LED unit in each area based on the heat distribution of different areas on the packaging substrate; wherein the current regulation unit is configured with a balancing optimization algorithm, which is used to dynamically adjust the current distribution priority according to the heat load of different areas, while reducing the temperature of the hot spot area and maximizing the light output efficiency of the non-hot spot area.

6. The COB LED adaptive thermal management system according to claim 5, characterized in that: The current regulation unit includes a feedback loop control mechanism, which continuously adjusts the current output of the LED unit by collecting temperature change data of the hot spot area in real time; wherein, the feedback loop control mechanism includes an adaptive current regulator, which is used to gradually reduce the operating current of the LED unit in the hot spot area, and gradually restore the normal current when the temperature in the area drops below a predetermined threshold, thereby avoiding the impact of frequent current changes on the LED unit and extending its service life.

7. The COB LED adaptive thermal management system according to claim 1, characterized in that: The cooling mechanism control module includes an external environment sensor network for monitoring the temperature, humidity, air flow rate and cleanliness of the heat dissipation channel of the surrounding environment, and adjusting the fan speed and cooling mode according to the monitored environmental data.

8. The COB LED adaptive thermal management system according to claim 7, characterized in that: The cooling mechanism control module has a multi-stage fan speed regulation mechanism, including three speed adjustments: low speed, medium speed and high speed; the multi-stage fan speed regulation mechanism is used to automatically select the most suitable fan speed level according to the temperature changes in the hot spot area and the feedback from the environmental sensor, and also has a fan overload protection function to prevent fan wear or cooling system failure due to long-term high-speed operation.

9. The COB LED adaptive thermal management system according to claim 1, characterized in that: The current regulation module adjusts the driving current of the corresponding LED unit through the following dynamic formula 1: Among them, I LED (t) is the real-time driving current of the corresponding LED unit at time t; I max is the maximum rated current of the corresponding LED unit; β is the ambient cooling capacity coefficient; T hot (t) is the temperature of the hot spot area at time t; T env (t) is the ambient temperature of the corresponding LED unit at time t; γ is the weight coefficient of the historical temperature change curve; τ is the length of the retrospective time window, indicating the time range of the historical temperature data; is the integral of the temperature change within the time window τ, which is used to capture the rate of temperature change and adjust the current; η is the temperature over-threshold sensitivity coefficient, which is used to control the current regulation intensity when the temperature approaches or exceeds the threshold; T threshold It is the temperature threshold when the LED unit works normally.

10. The COB LED adaptive thermal management system according to claim 1, characterized in that: The cooling mechanism control module dynamically adjusts the fan speed to enhance air flow by the following formula 2: Among them, V f (t) is the real-time speed of the fan at time t; V max is the maximum speed of the fan; λ is the sensitivity adjustment coefficient, which is used to control the response intensity of temperature change to fan speed adjustment; T avg (t) is the average temperature on the package substrate at time t; T threshold1 is the temperature threshold when the system is working normally; κ is the weighting coefficient of historical temperature changes, which is used to amplify the impact of temperature change trends on fan speed; ε is the time window length of historical temperature changes; is the square integral of the temperature change rate of the hot spot area within the time window ε, which is used to capture and amplify the impact of rapid temperature changes on the fan speed. hot (t′) is the temperature of the hot spot area at time t′.

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