Heat dissipation protection type semiconductor packaging structure

Abstract

A heat dissipation protection type semiconductor packaging structure disclosed by the present invention comprises an upper shell and a lower shell, the center of the top of the lower shell is provided with a positioning plate, the positioning plate is internally provided with an electrical connecting piece, the inner side of the electrical connecting piece is provided with a chip, and the chip is connected with the upper shell and the lower shell. And movable pins are arranged at the top of the electric connecting piece at equal intervals through pressing points, and a cooling mechanism is installed at the top of the inner side of the upper shell. When the chip and an external element are not installed, the pin and the connecting sheet form a disconnected structure, and at the moment, the pin moves towards the outer side and drives the connecting block to be flush with the fixing block to enable the upper shell and the lower shell to be in a sealed state, so that the package protects the interior in a transportation state or other states; and when the chip and an external element need to be installed, the pin is connected with the connecting piece, and at the moment, the pin drives the connecting block and the fixing block to be staggered to form a channel, so that heat generated by the chip can be conveniently dissipated.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, in particular to a heat dissipation protection type semiconductor packaging structure. Background Art

[0002] Semiconductor packages are typically used to house and protect semiconductor chips including silicon, silicon carbide, gallium nitride, etc. These semiconductor chips can be configured to have a variety of different device types, such as microprocessors, discrete devices, amplifiers, controllers, sensors, etc.

[0003] When the chip is working, it will generate heat, which will cause the internal temperature of the chip to rise, thus affecting its normal operation or even causing damage. In the prior art, a heat sink is usually used inside the semiconductor package to dissipate the heat. However, this heat dissipation method is relatively simple and inefficient. The heat sink will absorb and dissipate the heat inside the semiconductor package. In this process, the temperature of the heat sink will be high, affecting the normal operation of the chip.

[0004] Therefore, it is necessary to provide a heat dissipation protection type semiconductor packaging structure to solve the above technical problems. Summary of the invention

[0005] The purpose of the present invention is to provide a heat dissipation protection type semiconductor packaging structure to solve the problems existing in the above-mentioned background technology. The technical solution of the present invention aims at the technical problem that the existing technical solution is too single, and provides a solution that is significantly different from the existing technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat dissipation protection type semiconductor packaging structure, comprising an upper shell and a lower shell, a positioning plate is installed at the top center of the lower shell, an electrical connector is installed inside the positioning plate, a chip is installed on the inner side of the electrical connector, movable pins are equidistantly arranged on the top of the electrical connector through pressure points, and a cooling mechanism is installed on the inner top of the upper shell.

[0007] Preferably, grooves are equidistantly provided at the front and rear ends of the top of the lower shell, pins penetrating the lower shell are installed inside the grooves, a connecting piece is connected to the top of the electrical connector via a pressure point, and the connecting piece and the pins are a spliced ​​structure.

[0008] Preferably, a fixing block fixed to the top of the lower housing is provided on one side of the pin, an end of the fixing block away from the chip is flush with the edge line of the lower housing, and a connecting block is connected to one side of the pin.

[0009] Preferably, the cooling mechanism includes a cooling box installed at the top center of the inner side of the upper shell body, an arc-shaped pipe is opened inside the cooling box body, the water inlet of the arc-shaped pipe is connected to a water inlet pipe, one end of the water inlet pipe is installed with a first water tank fixed to the bottom of the upper shell body, the water outlet of the arc-shaped pipe is connected to a water outlet pipe, and one end of the water outlet pipe is installed with a second water tank fixed to the bottom of the upper shell body.

[0010] Preferably, the arc-shaped pipe is inclined downward from the water inlet toward the water outlet.

[0011] Preferably, the front end surface of the second water tank is connected to an arc tube fixed to one end of the first water tank, and the arc tube is inclined downward from the first water tank toward the second water tank.

[0012] Preferably, a bimetallic strip is further installed on the top of the lower shell, a connecting rod penetrating into the first water tank is installed on the top of the bimetallic strip, and a first baffle plate and a second baffle plate of different heights are respectively installed on both ends of the outer wall of the connecting rod.

[0013] Compared with the prior art, the present invention has the following beneficial effects: The pins and the connecting sheet provided in the present invention form a splicing structure so that the pins and the grooves are movably connected. The chip can be connected and disconnected with external components by moving the pins. When a problem occurs in the subsequent chip, it is also possible to quickly find out whether the problem is with the pins. If so, it can be quickly solved. If not, the problem with the pins can be quickly eliminated, thereby speeding up the maintenance efficiency. In the present invention, when the chip and the external components are not installed, the pins and the connecting piece are in a disconnected structure. At this time, the pins will move outward, and at the same time, the connecting block will be driven to be flush with the fixing block so that the upper shell and the lower shell are in a sealed state, so that the package can protect the interior during transportation or other states to prevent dust from entering the interior. When the chip and the external components need to be installed, the pins are connected to the connecting piece. At this time, the pins will drive the connecting block and the fixing block to be misaligned to form a channel, which is convenient for dissipating the heat generated by the chip; When the chip needs to be cooled, the bimetallic strip will be deformed when the temperature inside the shell rises to a certain level. At this time, the bimetallic strip will deform upward to cause the connecting rod to move upward. At this time, the connecting rod will drive the first baffle and the second baffle to move upward, so that the water inlet pipe is opened and the arc tube is closed. First, the channel inside the first water tank is opened, and the water source will flow from the water inlet pipe to the inside of the arc tube and then flow to the inside of the second water tank. In this process, the arc tube will be filled with water to cool the chip. After the temperature inside the shell drops, the bimetallic strip will reset, driving the first baffle and the second baffle to move downward. At this time, the water inlet pipe is closed and the arc tube is opened, thereby achieving a good cooling effect by automatically triggering cooling due to excessive temperature inside the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A perspective view of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure inside the lower shell of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the lower housing internal pins and the connecting piece being separated according to the present invention; Figure 4 A three-dimensional diagram of the present invention with the upper housing removed; Figure 5 This is a separation diagram of the upper shell and the lower shell of the present invention; Figure 6 It is a three-dimensional diagram of the cooling mechanism of the present invention; Figure 7 It is a schematic diagram of the top view of the cooling mechanism of the present invention; Figure 8 It is a schematic side structural diagram of the first water tank of the present invention.

[0015] In the figure: 1. upper shell; 2. lower shell; 3. positioning plate; 4. electrical connector; 5. chip; 6. pin; 7. cooling mechanism; 701. cooling box; 702. arc pipe; 703. water inlet pipe; 704. first water tank; 705. water outlet pipe; 706. second water tank; 8. groove; 9. connecting piece; 10. fixing block; 11. connecting block; 12. arc pipe; 13. bimetallic strip; 14. connecting rod; 15. first baffle; 16. second baffle. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following is an explanation of an embodiment of the present invention based on the overall structure of the present invention.

[0018] See also Figure 1-8 A heat dissipation protection type semiconductor packaging structure includes an upper shell 1 and a lower shell 2, a positioning plate 3 is installed at the top center of the lower shell 2, an electrical connector 4 is installed inside the positioning plate 3, a chip 5 is installed on the inner side of the electrical connector 4, and movable pins 6 are equidistantly arranged on the top of the electrical connector 4 through pressure points, and a cooling mechanism 7 is installed on the inner top of the upper shell 1.

[0019] like Figure 1-8 As shown, grooves 8 are equidistantly provided at the front and rear ends of the top of the lower shell 2, and pins 6 that penetrate the lower shell 2 are installed inside the grooves 8. The top of the electrical connector 4 is connected with a connecting piece 9 through a pressure point, and the connecting piece 9 and the pin 6 are a splicing structure. The pin 6 and the connecting piece 9 are arranged in a splicing structure so that the pin 6 and the groove 8 are movably connected. The chip 5 can be connected and disconnected with external components by moving the pin 6. When a problem occurs with the chip 5 later, it can also be quickly found out whether the problem is with the pin 6. If so, it can be quickly solved. If not, the problem with the pin 6 can be quickly eliminated, thereby speeding up the maintenance efficiency.

[0020] like Figure 1-8As shown, a fixing block 10 fixed to the top of the lower shell 2 is provided on one side of the pin 6, and the end of the fixing block 10 away from the chip 5 is flush with the edge line of the lower shell 2, and a connecting block 11 is connected to one side of the pin 6. When the chip 5 and the external components are not installed, the pin 6 and the connecting piece 9 are in a disconnected structure. At this time, the pin 6 will move toward the outside, and at the same time, it will drive the connecting block 11 to be flush with the fixing block 10 so that the upper shell 1 and the lower shell 2 are in a sealed state, so that the package can protect the interior during transportation or other states to prevent dust from entering the interior. When the chip 5 and the external components need to be installed, the pin 6 is connected to the connecting piece 9. At this time, the pin 6 will drive the connecting block 11 and the fixing block 10 to be misaligned to form a channel, which is convenient for dissipating the heat generated by the chip 5.

[0021] like Figure 1-8 As shown, the cooling mechanism 7 includes a cooling box 701 installed at the top center of the inner side of the upper shell 1, and an arc-shaped pipe 702 is opened inside the cooling box 701. The water inlet of the arc-shaped pipe 702 is connected to the water inlet pipe 703, and one end of the water inlet pipe 703 is installed with a first water tank 704 fixed to the bottom of the upper shell 1, and the water outlet of the arc-shaped pipe 702 is connected to the water outlet pipe 705, and one end of the water outlet pipe 705 is installed with a second water tank 706 fixed to the bottom of the upper shell 1. When it is necessary to cool the chip 5, the channel inside the first water tank 704 is first opened, and the water source will flow from the water inlet pipe 703 to the inside of the arc-shaped pipe 702 and then to the inside of the second water tank 706. In this process, the arc-shaped pipe 702 will be filled with water, thereby cooling the chip 5.

[0022] like Figure 1-8 As shown, the arc pipe 702 is inclined downward from the water inlet toward the water outlet. The setting of the arc pipe 702 is inclined downward from the water inlet toward the water outlet so that when the water inlet pipe 703 is closed, the water source inside the arc pipe 702 will flow into the second water tank 706 for storage.

[0023] like Figure 1-8 As shown, the front end face of the second water tank 706 is connected to an arc tube 12 fixed at one end of the first water tank 704, and the arc tube 12 is inclined downward from the first water tank 704 toward the second water tank 706. The arc tube 12 is arranged to be inclined downward from the first water tank 704 toward the second water tank 706 so that the water source stored in the second water tank 706 will flow into the first tank body.

[0024] like Figure 1-8As shown, a bimetallic strip 13 is also installed on the top of the lower shell 2, and a connecting rod 14 that penetrates into the first water tank 704 is installed on the top of the bimetallic strip 13. A first baffle 15 and a second baffle 16 of different heights are respectively installed at both ends of the outer wall of the connecting rod 14. When the temperature inside the shell rises to a certain level, the bimetallic strip 13 will be deformed. At this time, the bimetallic strip 13 will deform upward to make the connecting rod 14 move upward. At this time, the connecting rod 14 will drive the first baffle 15 and the second baffle 16 to move upward, so that the water inlet pipe 703 is opened and the arc tube 12 is closed. After the temperature inside the shell drops, the bimetallic strip 13 will reset, driving the first baffle 15 and the second baffle 16 to move downward. At this time, the water inlet pipe 703 is closed and the arc tube 12 is opened, thereby achieving a good cooling effect by automatically triggering cooling due to excessive temperature inside the shell.

[0025] Working principle: When in use, the pin 6 and the connecting piece 9 are arranged in a splicing structure so that the pin 6 and the groove 8 are movably connected. The chip 5 can be connected and disconnected with the external components by moving the pin 6. When a problem occurs to the chip 5 later, it is also possible to quickly find out whether the problem is with the pin 6. If so, it can be quickly solved. If not, the problem with the pin 6 can be quickly eliminated, thereby speeding up the maintenance efficiency. When the chip 5 and the external components are not installed, the pin 6 and the connecting piece 9 are in a disconnected structure. At this time, the pin 6 will move toward the outside, and at the same time, it will drive the connecting block 11 to be flush with the fixing block 10 so that the upper shell 1 and the lower shell 2 are in a sealed state, so that the package can protect the interior during transportation or other states to prevent dust from entering the interior. When the chip 5 and the external components need to be installed, the pin 6 and the connecting piece 9 are connected. At this time, the pin 6 will drive the connecting block 11 and the fixing block 10 to be misaligned to form a channel, which is convenient for dissipating the heat generated by the chip 5. When the chip 5 needs to be cooled, the channel inside the first water tank 704 is first opened, and the water source will flow from the water inlet pipe 703 to the arc-shaped pipe 702 The inside of the arc pipe 702 then flows into the inside of the second water tank 706. In this process, the arc pipe 702 is filled with water to cool the chip 5. The arc pipe 702 is arranged to be inclined downward from the water inlet to the water outlet so that when the water inlet pipe 703 is closed, the water inside the arc pipe 702 will flow into the second water tank 706 for storage. The arc pipe 12 is arranged to be inclined downward from the first water tank 704 to the second water tank 706 so that the water stored in the second water tank 706 will flow into the inside of the first box body. When the temperature inside the shell rises to a certain level, the water inside the shell body will be cooled. When the temperature inside the shell drops to a certain level, the bimetallic strip 13 will be deformed. At this time, the bimetallic strip 13 will deform upward to make the connecting rod 14 move upward. At this time, the connecting rod 14 will drive the first baffle 15 and the second baffle 16 to move upward, so that the water inlet pipe 703 is opened and the arc tube 12 is closed. After the temperature inside the shell drops, the bimetallic strip 13 will reset, driving the first baffle 15 and the second baffle 16 to move downward. At this time, the water inlet pipe 703 is closed and the arc tube 12 is opened, thereby achieving a good cooling effect by automatically triggering cooling when the temperature inside the shell is too high.

[0026] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A heat dissipation protection type semiconductor packaging structure, comprising an upper housing (1) and a lower housing (2), characterized in that: A positioning plate (3) is installed at the top center of the lower shell (2), an electrical connector (4) is installed inside the positioning plate (3), a chip (5) is installed inside the electrical connector (4), movable pins (6) are equidistantly arranged at the top of the electrical connector (4) through pressure points, and a cooling mechanism (7) is installed at the inner top of the upper shell (1).

2. The heat dissipation protection type semiconductor packaging structure according to claim 1, characterized in that: Grooves (8) are equidistantly provided at the front and rear ends of the top of the lower shell (2); pins (6) penetrating the lower shell (2) are installed inside the grooves (8); a connecting piece (9) is connected to the top of the electrical connector (4) via a pressure point, and the connecting piece (9) and the pins (6) are a spliced ​​structure.

3. A heat dissipation protection type semiconductor packaging structure according to claim 2, characterized in that: A fixing block (10) fixed to the top of the lower housing (2) is provided on one side of the pin (6); an end of the fixing block (10) away from the chip (5) is flush with the edge of the lower housing (2); and a connecting block (11) is connected to one side of the pin (6).

4. The heat dissipation protection type semiconductor packaging structure according to claim 1, characterized in that: The cooling mechanism (7) comprises a cooling box (701) installed at the top center of the inner side of the upper shell (1); an arc-shaped pipe (702) is provided inside the cooling box (701); a water inlet of the arc-shaped pipe (702) is connected to a water inlet pipe (703); one end of the water inlet pipe (703) is installed with a first water tank (704) fixed to the bottom of the upper shell (1); a water outlet of the arc-shaped pipe (702) is connected to a water outlet pipe (705); one end of the water outlet pipe (705) is installed with a second water tank (706) fixed to the bottom of the upper shell (1).

5. The heat dissipation protection type semiconductor packaging structure according to claim 4, characterized in that: The arc-shaped pipe (702) is inclined downward from the water inlet toward the water outlet.

6. The heat dissipation protection type semiconductor packaging structure according to claim 5, characterized in that: The front end surface of the second water tank (706) is connected to an arc-shaped tube (12) fixed to one end of the first water tank (704), and the arc-shaped tube (12) is inclined downward from the first water tank (704) toward the second water tank (706).

7. The heat dissipation protection type semiconductor packaging structure according to claim 6, characterized in that: A bimetallic strip (13) is also installed on the top of the lower shell (2), and a connecting rod (14) penetrating into the interior of the first water tank (704) is installed on the top of the bimetallic strip (13), and a first baffle (15) and a second baffle (16) of different heights are respectively installed at both ends of the outer wall of the connecting rod (14).

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