Temperature control assembly structure, pan-tilt-type network camera and temperature control method
By designing the temperature control component structure, the two-way temperature control of the control chip is achieved using thermally conductive structural parts and heating devices, the problem of difficulty in working under extreme temperature conditions in the prior art is solved, and efficient and stable temperature control effect is achieved , reduces production costs.
Patent Information
- Application Number
- CN202411598596.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-02-18
AI Technical Summary
Existing electronic equipment is difficult to work properly under extreme temperature conditions, and the existing temperature control methods have problems such as increasing volume and interference with each other, resulting in poor temperature control effect.
A temperature control component structure is designed, including a thermally conductive structural member, a heating device and a main control circuit board. The heat of the heating device is transferred to the control chip through the thermally conductive structural member, and the heat of the chip is exported through the shell to achieve bidirectional temperature control.
It realizes heating of the control chip under low temperature conditions and effectively dissipates heat under high temperature conditions, meets the operating temperature requirements of the equipment under high and low temperature conditions, reduces production costs, and avoids mutual interference between heating and heat dissipation devices.
Smart Images
Figure CN119472851A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of temperature control of electronic equipment, and in particular to a temperature control component structure, a pan-tilt type network camera and a temperature control method. Background Art
[0002] For some electronic devices used under extreme conditions, especially security monitoring equipment, the equipment needs to be able to work normally under high and low temperature conditions. At this time, the operating temperature of the electronic components used in the equipment becomes the biggest constraint on the operating temperature range of the whole equipment. For example, some low-end electronic components may not be able to start or run normally under low or high temperature conditions. In order to broaden the application scenarios of electronic equipment, in order to enable electronic equipment to be used under wider temperature conditions, there are usually two ways to solve it: the first is to use high-end electronic components with a wider operating temperature range and meet the use conditions. The second is to control the temperature of electronic components whose operating temperature does not meet the requirements, and to achieve the operating temperature required by the whole equipment by dissipating and heating the electronic components accordingly. The first solution is to use electronic components with a wider operating temperature range. Although it is easy to solve the above problems, the price of the electronic components is high, which will greatly increase the cost of the whole electronic equipment. The second solution is the best choice for reducing costs and increasing efficiency, but electronic components themselves have both heating requirements and heat dissipation requirements. If two temperature control devices are set up separately for heating and cooling control, it will not only increase the overall volume of the electronic equipment, but also may cause the two to interfere with each other during operation, resulting in poor heating and cooling control effects. Summary of the invention
[0003] Based on this, the present application provides a temperature control component structure, a pan-tilt type network camera and a temperature control method to improve the problems of small operating temperature range and poor temperature control effect of electronic components in the prior art.
[0004] To achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:
[0005] In a first aspect, an embodiment of the present application provides a temperature control component structure for an electronic device, including a heat-conducting structural member, a heating device, and a main control circuit board;
[0006] The heat-conducting structure comprises a heat-conducting frame, and the heat-conducting frame forms a receiving cavity for installing the heating device;
[0007] The heating device is arranged in the accommodating cavity;
[0008] The main control circuit board is provided with a control chip and a temperature control module, and the control chip and the heating device are respectively arranged on both sides of the heat-conducting frame and are respectively connected to the heat-conducting frame;
[0009] The temperature control module is used to control the opening and closing of the heating device; the heating device is used to heat up the control chip; and the heat-conducting structural member is used to conduct heat away from the control chip.
[0010] In one embodiment, the heating device includes one of a PTC ceramic heating plate, a PI electric heating film (FPC electric heating film) or a silicone rubber heating plate.
[0011] In one embodiment, a first heat-conducting member is provided between the heating device and the heat-conducting frame, and a second heat-conducting member is provided between the control chip and the heat-conducting frame.
[0012] In one embodiment, the temperature control component structure also includes a shell and a heat conducting plate, the heat conducting plate is fixed on the inner wall of the shell, and a third heat conducting member is provided between the heat conducting plate and the shell, and there is a gap between the heating device and the heat conducting plate; the shell is used to export the heat of the heat conducting plate.
[0013] In one embodiment, the thermal conductivity of the third heat-conducting member is smaller than the thermal conductivity of the first heat-conducting member.
[0014] In one embodiment, the thermal conductivity of the first heat-conducting member is 2 to 3 times the thermal conductivity of the third heat-conducting member.
[0015] In one embodiment, the first heat-conducting member, the second heat-conducting member and the third heat-conducting member respectively include one of a thermally conductive silicone pad, thermally conductive silicone grease or thermally conductive gel.
[0016] In one of the embodiments, the temperature control component structure further includes a temperature detection device, which is disposed on the main control circuit board and is used to detect the temperature of the control chip and send the temperature detection result to the temperature control module.
[0017] In a second aspect, an embodiment of the present application provides a pan-tilt type network camera, comprising a temperature control component structure as described above.
[0018] In a third aspect, an embodiment of the present application provides a temperature control method for the temperature control component structure as described above, the temperature control method comprising the following steps:
[0019] The temperature detection device detects the temperature of the control chip before the control chip is started, and sends the temperature detection result to the temperature control module;
[0020] The temperature control module receives the temperature detection result and performs the following steps: if the temperature detection result is greater than the startup preset temperature, the control chip is controlled to start and the temperature detection device is controlled to be turned off; if the temperature detection result is not greater than the startup preset temperature, the heating device is controlled to start and the temperature detection device is controlled to continuously detect the temperature of the control chip until the temperature detection result is greater than the startup preset temperature, the heating device is controlled to be turned off, the control chip is controlled to start, and the temperature detection device is controlled to be turned off.
[0021] The present application has at least the following beneficial effects: the temperature control component structure of the embodiment of the present application is provided with a heat-conducting structural member and a heating device at the same time, and the heating device and the control chip of the main control circuit board are respectively arranged on both sides of the heat-conducting frame, so that under low temperature conditions, the heating device can transfer heat from the heat-conducting frame to the control chip, so that the temperature of the control chip rises to its operating temperature range. When the control chip is normally started, the control chip needs to dissipate heat when working, and its heat can be conducted out through the heat-conducting frame, so that the entire temperature control component structure can both heat up the control chip and dissipate heat to meet its operating temperature requirements under high and low temperature conditions without replacing the expensive control chip, effectively reducing the production cost. At the same time, its entire cooling process is physical conduction and passive heat dissipation, without any energy consumption, and there is no mutual restriction between heating and cooling work, and reliable temperature control work can be performed separately, and energy is effectively saved during temperature control, which has the effect of reducing costs. The pan-tilt type network camera and temperature control method provided by the embodiment of the present application include the above-mentioned temperature control component structure, and therefore also have the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a schematic diagram of the overall structure of the temperature control component structure of an embodiment of the present application.
[0023] Figure 2 This is a schematic diagram of the exploded structure of the temperature control component structure of an embodiment of the present application.
[0024] Figure 3 Schematic diagram of the structure of the heat-conducting structural member of an embodiment of the present application.
[0025] Figure 4 It is a schematic cross-sectional structural diagram of the temperature control component structure of an embodiment of the present application.
[0026] Figure 5 Schematic diagram of the temperature control method according to an embodiment of the present application.
[0027] The meanings of the symbols in the accompanying drawings are as follows:
[0028] 1. Shell; 2. Heat-conducting structural member; 21. Heat-conducting frame; 22. Heat-conducting plate; 23. Accommodating cavity; 3. Main control circuit board; 31. Control chip; 32. Temperature detection device; 4. Heating device; 5. Connecting structural member; 51. Avoidance hole; 6. Second heat-conducting member; 7. Third heat-conducting member; 8. First heat-conducting member. DETAILED DESCRIPTION
[0029] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the implementation of this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0031] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, "multiple" means two or more.
[0032] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0033] See also Figure 1 and Figure 2 The temperature control component structure of the embodiment of the present application is used for electronic equipment, such as a pan-tilt type network camera, etc. The temperature control component structure includes a heat conducting structure 2, a heating device 4 and a main control circuit board 3.
[0034] The heat-conducting structural member 2 includes a heat-conducting frame 21, and the heat-conducting frame 21 forms a receiving cavity 23 for installing the heating device 4. The heating device 4 is arranged in the receiving cavity 23. The heating device 4 can be, for example, a PTC ceramic heating plate (composed of a PTC ceramic heating element and an aluminum tube. This type of PTC heater has the advantages of low thermal resistance and high heat exchange efficiency), a PI electric heating film (FPC electric heating film, polyimide heating plate) or a silicone rubber heating plate. The specific types of the above-mentioned heating device 4 are only examples, and are not limited to the above-mentioned types of heating devices in practical applications.
[0035] The main control circuit board 3 is provided with a control chip 31 and a temperature control module (not shown). The control chip 31 and the heating device 4 are respectively provided on both sides of the heat-conducting frame 21 and are respectively in contact with the heat-conducting frame 21. The control chip 31 can be, for example, an FPGA chip control chip 31.
[0036] The temperature control module is used to control the opening and closing of the heating device 4 ; the heating device 4 is used to heat up the control chip 31 ; and the heat-conducting structural member 2 is used to conduct heat away from the control chip 31 .
[0037] The control chip 31 selected in the embodiment of the present application has a narrow operating temperature range, for example, it can only work normally above -20°C, but its price is relatively cheap, which can effectively reduce the manufacturing cost of the entire electronic device. However, the electronic device is likely to need to work at around -40°C. Then, when the electronic device works at a lower temperature, the control chip 31 cannot start normally due to the low temperature. The control chip 31 will generate heat after working. If the heat cannot be effectively output, the operating temperature of the control chip 31 will be too high, which will also affect the normal operation of the control chip 31. If both a heating device 4 and a cooling and heat dissipation device are set inside the device, it will cause the problem of the overall volume of the device being too large. At the same time, the heating device 4 and the cooling and heat dissipation device may interfere with each other, resulting in the device being unable to operate normally, and the operation of the heating device 4 and the cooling and heat dissipation device will also increase the power consumption of the entire device. Therefore, when the inventor developed the temperature control component structure of this embodiment, after fully considering the above-mentioned problems, the heat dissipation and heating components were designed as follows.
[0038] Specifically, Figure 3 and Figure 4As shown, in this embodiment, the heat-conducting structure also includes a heat-conducting plate 22, and the heat-conducting plate 22 is arranged in parallel with the main control circuit board 3. The temperature control component structure also includes a shell 1, which is the shell of the electronic device. The shell 1 is a metal part that is easy to conduct heat, and the heat-conducting structure is also a metal part that is easy to conduct heat. The heat absorbed by the heat-conducting structure can be dissipated to the outside of the electronic device through the shell 1 to achieve cooling of the control chip 31. The heat-conducting plate 22 is arranged close to the shell 1 on the side away from the main control circuit board 3, and the heat-conducting plate 22 is fixed to the inner wall of the shell 1 (that is, the inner wall on the side close to the main control circuit board 3). The heat-conducting plate 22 and the shell 1 can be fixed in a detachable manner, for example, by screws and other connecting parts. If the heat-conducting plate 22 cannot be directly connected to the shell 1 due to the installation space of the electronic device, it can also be indirectly connected to the shell 1 through other heat-conducting parts. The heat-conducting frame 21 is arranged on one side of the heat-conducting plate 22 close to the main control circuit board 3. The heat-conducting frame 21 and the heat-conducting plate 22 are jointly enclosed to form a receiving cavity 23 for installing the heating device 4. The heating device 4 is arranged in the receiving cavity 23 and is fixedly connected to the inner wall of the heat-conducting frame 21. In order to increase the heat dissipation performance of the temperature control component structure, a first heat-conducting member 8 can be arranged between the heating device 4 and the heat-conducting frame 21, a second heat-conducting member 6 can be arranged between the control chip 31 and the heat-conducting frame 21, and a third heat-conducting member 7 can be arranged between the heat-conducting plate 22 and the housing 1. The first heat-conducting member 8, the second heat-conducting member 6 or the third heat-conducting member 7 can be, for example, one of a heat-conducting silicone pad, a heat-conducting silicone grease or a heat-conducting gel. The specific type of the above-mentioned heat-conducting member 8 is only an example, and in practical applications, it is not limited to the above-mentioned types of heat-conducting members. At the same time, the heating device 4 can be made to contact only with the heat-conducting frame 21 (directly or indirectly through an intermediate member), but not directly with the heat-conducting plate 22, that is, one side surface of the heating device 4 is fixed to the heat-conducting frame 21 through the first heat-conducting member 8, and the other side surface thereof is kept at a certain gap with the heat-conducting plate 22, so as to prevent the heat of the heating device 4 from being lost from the side of the heat-conducting plate 22 during heating, thereby increasing the power consumption of the product and reducing the heating efficiency. In order to further improve the heating efficiency of the heating device 4 to the control chip 31, the first heat-conducting member 8 and the third heat-conducting member 7 can be selected so that the thermal conductivity of the third heat-conducting member 7 is smaller than the thermal conductivity of the first heat-conducting member 8. In this way, when the heating device 4 is heated, its heat is easily transferred from the first heat-conducting member 8 and the heat-conducting frame 21 with high thermal conductivity to the control chip 31, while the heat is transferred out only after passing through the heat-conducting frame 21 and the heat-conducting plate 22, and then transferred to the housing 1 through the third heat-conducting member 7 with low thermal conductivity, so that the heating efficiency of the heating device 4 is improved and energy loss is reduced. Preferably, the thermal conductivity of the first heat-conducting member 8 can be selected to be 2 to 3 times the thermal conductivity of the third heat-conducting member 7 .
[0039] like Figure 1 and Figure 2As shown, the temperature control assembly structure may further include a connecting structure 5, through which the main control circuit board 3 is fixedly connected to the housing 1, for example, the main control circuit board 3 is threadedly connected to the connecting structure 5 by screws, and the connecting structure 5 is threadedly connected to the housing 1 by screws. The connecting structure 5 is directly connected to the housing 1, and a avoidance hole 51 is provided in the middle of the connecting structure 5, and the avoidance hole 51 is used to avoid the heat conducting plate 22, so that the heat conducting plate 22 is easily connected to the housing 1.
[0040] like Figure 2 of Figure 4 As shown, in order to increase the intelligent function of the temperature control component structure, a temperature detection device 32 can also be set on the main control circuit board 3. The temperature detection device 32 can be, for example, a temperature sensor, etc. The temperature detection device 32 can be attached near the control chip 31 by insulating structural adhesive to monitor the temperature of the control chip 31. The temperature detection device 32 is used to detect the temperature of the control chip 31 and send the temperature detection result to the temperature control module. The temperature control module controls the opening and closing of the heating device 4 by judging the temperature detection result.
[0041] The embodiment of the present application also provides a pan-tilt type network camera, including the temperature control component structure of the above embodiment, the housing 1 of the temperature control component structure is the shell of the pan-tilt type network camera device, and the control chip 31 can be heat-conducted and heat-dissipated through the shell.
[0042] like Figure 5 As shown, the embodiment of the present application also provides a temperature control method, which is used for the temperature control component structure of the above embodiment. Specifically, the temperature control method includes the following steps:
[0043] The temperature detection device 32 detects the temperature of the control chip 31 before the control chip 31 is started, and sends the temperature detection result to the temperature control module;
[0044] The temperature control module receives the temperature detection result and performs the following steps: if the temperature detection result is greater than the startup preset temperature, the control chip 31 is controlled to start and the temperature detection device 32 is controlled to be turned off; if the temperature detection result is not greater than the startup preset temperature, the heating device 4 is controlled to start and the temperature detection device 32 is controlled to continuously detect the temperature of the control chip 31 until the temperature detection result is greater than the startup preset temperature, the heating device 4 is controlled to be turned off, the control chip 31 is controlled to start, and the temperature detection device 32 is controlled to be turned off.
[0045] Specifically, an electronic device such as a pan-tilt type network camera is used as an example for explanation. The user presses the power button of the electronic device, triggering the temperature detection device 32 to detect the temperature of the control chip 31, and sends the temperature detection result to the temperature control module. When the temperature detection result received by the temperature control module is greater than the startup preset temperature of the control chip 31, that is, the temperature of the control chip 31 is normal and can be started normally, the temperature control module controls the control chip 31 to start, and controls the temperature detection device 32 and the heating device 4 to turn off (the specific control order is not limited), and the electronic device starts and runs normally. When the temperature detection result received by the temperature control module is not greater than the preset startup temperature of the control chip 31, that is, the temperature of the control chip 31 is too low and cannot be started normally, at this time, the temperature control module controls the heating device 4 to start, and the heating device 4 heats the control chip 31. At the same time, the temperature control module controls the temperature detection device 32 to continuously detect the temperature of the control chip 31 until the temperature detection result exceeds the preset startup temperature of the control chip 31. The temperature control module first controls the heating device 4 to turn off, then controls the control chip 31 to start, and controls the temperature detection device 32 to turn off. The control chip 31 is no longer subjected to temperature detection and heating, and the electronic device starts up normally.
[0046] After the electronic device is turned on and running, the temperature of the control chip 31 gradually increases, and the heat of the control chip 31 is dissipated from the heat conduction frame 21 to the outside of the electronic device via the heat conduction plate 22 and the housing 1. The cooling of the control chip 31 is passive cooling, which does not need to be controlled and does not consume energy, thereby reducing the investment cost and space occupied by the cooling device, which is conducive to the development of electronic equipment towards lightweight and thinness, and can also reduce the production cost of electronic equipment.
[0047] The temperature control component structure and the overall structure of the pan-tilt network camera provided by the embodiment of the present application are simple, and the components can work normally within the operating temperature range of the equipment without increasing the cost of the components. The control chip can be heated or cooled respectively in different use stages of the equipment, and the two operations will not interfere with each other, ensuring the stability and reliability of the equipment operation, and having the advantages of small size, low price, and saving power consumption of the whole machine. Its temperature control method is simple and reliable, and there is no need to control the cooling. As long as the control chip generates heat, it can be dissipated to the outside through the heat-conducting structure and the shell, which effectively reduces energy consumption, reduces the cost of use, and extends the battery life of the equipment.
[0048] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.
[0049] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A temperature control component structure for electronic equipment, characterized in that: It comprises a heat-conducting structural component (2), a heating device (4) and a main control circuit board (3); The heat-conducting structural component (2) comprises a heat-conducting frame (21), and the heat-conducting frame (21) forms a receiving cavity (23) for installing the heating device (4); The heating device (4) is arranged in the accommodating cavity (23); The main control circuit board (3) is provided with a control chip (31) and a temperature control module, and the control chip (31) and the heating device (4) are respectively arranged on two sides of the heat-conducting frame (21) and are respectively connected to the heat-conducting frame (21); The temperature control module is used to control the opening and closing of the heating device (4); the heating device (4) is used to increase the temperature of the control chip (31); and the heat-conducting structural component (2) is used to conduct heat away from the control chip (31).
2. The temperature control assembly structure according to claim 1, characterized in that: The heating device (4) comprises one of a PTC ceramic heating plate, a PI electric heating film or a silicone rubber heating plate.
3. The temperature control assembly structure according to claim 1, characterized in that: A first heat-conducting member (8) is provided between the heating device (4) and the heat-conducting frame (21), and a second heat-conducting member (6) is provided between the control chip (31) and the heat-conducting frame (21).
4. The temperature control assembly structure according to claim 3, characterized in that: The invention also comprises an outer shell (1) and a heat conducting plate (22), wherein the heat conducting plate (22) is fixed on the inner side wall of the outer shell (1), and a third heat conducting member (7) is provided between the heat conducting plate (22) and the outer shell (1), and a gap exists between the heating device (4) and the heat conducting plate (22); the outer shell (1) is used to conduct heat away from the heat conducting plate (22).
5. The temperature control assembly structure according to claim 4, characterized in that: The thermal conductivity of the third heat-conducting member (7) is smaller than the thermal conductivity of the first heat-conducting member (8).
6. The temperature control assembly structure according to claim 5, characterized in that: The thermal conductivity of the first heat-conducting member (8) is 2 to 3 times the thermal conductivity of the third heat-conducting member (7).
7. The temperature control assembly structure according to claim 4, characterized in that: The first heat-conducting member (8), the second heat-conducting member (6) and the third heat-conducting member (7) respectively comprise one of a heat-conducting silicone pad, a heat-conducting silicone grease or a heat-conducting gel.
8. The temperature control assembly structure according to claim 1, characterized in that: It also includes a temperature detection device (32), which is arranged on the main control circuit board (3) and is used to detect the temperature of the control chip (31) and send the temperature detection result to the temperature control module.
9. A pan-tilt type network camera, characterized in that: It comprises a temperature control component structure as described in any one of claims 1 to 8.
10. A temperature control method, characterized in that: For the temperature control assembly structure according to any one of claims 1 to 8, the temperature control method comprises the following steps: The temperature detection device (32) detects the temperature of the control chip (31) before the control chip (31) is started, and sends the temperature detection result to the temperature control module; The temperature control module receives the temperature detection result and performs the following steps: if the temperature detection result is greater than the preset startup temperature, the control chip (31) is controlled to start and the temperature detection device (32) is controlled to turn off; if the temperature detection result is not greater than the preset startup temperature, the heating device (4) is controlled to start and the temperature detection device (32) is controlled to continuously detect the temperature of the control chip (31) until the temperature detection result is greater than the preset startup temperature, the heating device (4) is controlled to turn off, the control chip (31) is controlled to start and the temperature detection device (32) is controlled to turn off.