Photoelectric integrated high-speed modulation and demodulation module based on microsystem packaging technology

Abstract

The invention discloses a photoelectric integrated high-speed modulation and demodulation module based on a microsystem packaging technology, which comprises a space laser modulation transmitting unit, a laser chip for realizing electro-optical conversion and laser transmission, and a collimating lens and a beam expanding lens which are matched to realize calibration and collimation of light spots emitted from the end surface of the laser chip, the collimated light beam is expanded and transmitted to a space channel; the space laser receiving and demodulating unit, the receiving lens and the focusing lens are matched to collect space light beams, and the light beams are focused on the photosensitive surface of the detector chip; the detector chip converts the received spatial light signal into a weak electric signal; the detector integrated driving chip is used for driving the detector chip, processing a weak electric signal output by the detector chip and converting the weak electric signal into a high-speed electric signal; the main control unit and the laser integrated driving chip realize CML level input and drive the laser chip; and the processor chip is respectively communicated with the laser integrated driving chip and the detector integrated driving chip.

Description

Technical Field

[0001] The invention relates to the technical field of space laser communication, in particular to an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology. Background Art

[0002] Microwave and space optical transmission technologies are undoubtedly the two best existing methods for the application scenarios of close-range massive data and information interaction within satellite platforms and between micro-spacecraft. Although microwave communication technology has developed relatively maturely and has been widely used compared to wireless optical communication, it has problems such as limited transmission rate, susceptibility to electromagnetic interference and electromagnetic radiation, and limited spectrum resources. Space optical communication is one of the ideal solutions for on- or inter-satellite cableless information transmission and networking due to its wide bandwidth, high transmission rate, small terminal and antenna size, light weight, low power consumption, and resistance to electromagnetic interference and interception. The use of near-field space optical communication technology as a high-speed data wireless transmission method will bring revolutionary changes to cableless signal transmission.

[0003] The space optical communication system combines space optical technology and fiber optic communication technology. One of its core components, the high-speed signal modulation and demodulation module, is developed based on ground fiber optic communication technology. It is equivalent to a converter between media in the entire communication system. Its principle is mainly to use the photoelectric conversion and electro-optical conversion of the optical module to achieve the interconnection of high-speed electrical signals. The intermediate transmission medium is mostly optical fiber, which cannot be directly connected to the space optical path system and must pass through the fiber coupling system. Limited by the refractive index and numerical aperture of the fiber core layer, the space light reception loses nearly 50% of the light energy during unbiased alignment coupling. At the same time, for the near-field, there is a certain relative motion between the platforms, and the alignment coupling space light emission and reception efficiency will decrease exponentially with the offset distance, and most of the energy is transmitted and attenuated in the fiber cladding.

[0004] How to optimize the design of high-speed and high-efficiency integrated modulation and demodulation modules and promote the high integration and miniaturization of communication modules is of great importance for providing flexible, high-speed, cable-free communications and reliable broadband access. Summary of the invention

[0005] The present invention provides an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology, which can improve light receiving efficiency and increase system coupling tolerance, and adopts microsystem packaging technology to perform multi-layer stacking welding and inter-chip gold wire bonding and routing signal interconnection on a space laser modulation and emission unit, a space laser receiving and demodulation unit and a main control unit, so as to realize optoelectronic integrated integration. The module has the advantages of miniaturization, high integration, high system performance, low power consumption, and resistance to space environment, and its advantages are particularly prominent in satellite payload systems.

[0006] In order to achieve the above-mentioned object of the present invention, the present invention provides an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology, comprising:

[0007] A spatial laser modulation emission unit, comprising a laser chip, a collimating lens and a beam expander lens. The laser chip is used to realize electro-optical conversion and laser emission. The collimating lens and the beam expander lens cooperate to realize the calibration and collimation of the emission spot on the end face of the laser chip, and expand the collimated light beam and emit it to the spatial channel.

[0008] A space laser receiving and demodulating unit, the space laser receiving and demodulating unit comprises a receiving lens, a focusing lens, a detector chip and a detector integrated driving chip, the receiving lens and the focusing lens cooperate to realize the collection of space light beams, and focus the light beams on the photosensitive surface of the detector chip; the detector chip is used to convert the received space light signal into a weak electrical signal; the detector integrated driving chip is used to realize the driving of the detector chip, perform low-noise amplification and limiter control on the weak electrical signal output by the detector chip, convert it into a high-speed electrical signal, and output a CML level;

[0009] A main control unit, the main control unit includes a processor chip and a laser integrated driver chip, the laser integrated driver chip is used to realize CML level input and drive the laser chip; the processor chip communicates with the laser integrated driver chip and the detector integrated driver chip respectively, the processor chip reads and monitors the status of each register of the laser integrated driver chip, and reads and monitors the status of each register of the detector integrated driver chip.

[0010] Optionally, a metal tube shell is further included, and the spatial laser modulation and emission unit, the spatial laser receiving and demodulation unit and the main control unit are arranged inside the metal tube shell.

[0011] Optionally, the spatial laser modulation emission unit further includes:

[0012] A backlight detector, which is used to detect the emission light power of the laser chip;

[0013] A thermistor, wherein the thermistor is used to detect the working stability of the laser chip;

[0014] Heat sink;

[0015] A semiconductor refrigerator, wherein the semiconductor refrigerator and the heat sink are used to achieve temperature regulation of the laser chip.

[0016] Optionally, the lower layer of the semiconductor refrigerator is bonded to the bottom of the metal tube shell, and the upper layer is bonded to the heat sink. The laser chip, the backlight detector and the thermistor are mounted on the second step plane of the heat sink through gold-tin material, and the collimating lens is bonded to the first step plane of the heat sink through optical glue.

[0017] Optionally, the spatial laser receiving and demodulating unit further includes:

[0018] A ceramic carrier, on which the detector chip is mounted by means of a gold-tin material;

[0019] The ceramic substrate, the ceramic carrier and the detector integrated driving chip are bonded to the upper surface of the ceramic substrate by silver glue, and the focusing lens is bonded to the upper surface of the ceramic substrate by optical glue.

[0020] Optionally, the beam expander lens and the receiving lens are fixed to the bottom of the metal tube shell by optical glue.

[0021] Optionally, the laser chip emits laser light in a wavelength band of 1550 nm.

[0022] Optionally, the detector integrated driver chip integrates an amplifier power supply and an automatic gain circuit, which are used to perform low-noise amplification and limiting control on the weak electrical signal output by the detector chip.

[0023] Optionally, the main control unit further includes:

[0024] An electrical connector, through which the laser integrated driver chip receives high-speed electrical signals from an external device; through which the detector integrated driver chip outputs high-speed electrical signals that are transmitted to the external device; and through which the processor chip performs I2C communication with the external device.

[0025] The circuit board, the processor chip and the laser integrated driver chip are mounted on the circuit board by using a surface mounting process.

[0026] Optionally, the processor chip monitors the bias current, average current, temperature, channel closure and interruption faults of the laser chip; the processor chip monitors the weak electrical signal output by the detector chip.

[0027] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0028] The present invention designs an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology, comprehensively considering the technical characteristics of space optical systems and optical fiber communication systems, and showing significant advantages in bandwidth, power consumption, coupling efficiency, installation convenience, cost control and multi-functional integration, and provides important technical support for the development of future space communication systems. The module optical fiber medium is removed, and a transmitting and receiving module for space laser communication is designed. The laser transmission signal is directly emitted through the space optical lens and can be connected to the subsequent optical antenna. On the contrary, the subsequent optical antenna receives the optical signal and is directly coupled to the photosensitive surface of the detector through the space optical lens, which can improve the light receiving efficiency and increase the system optical path alignment coupling tolerance; at the same time, the microsystem packaging process is used to perform multi-layer stacking welding and inter-chip gold wire bonding and routing signal interconnection on the space laser modulation and transmission unit, the space laser receiving and demodulation unit and the main control signal processing unit, so as to realize optoelectronic integration, which has the advantages of miniaturization, high integration, high system performance, low power consumption, and resistance to space environment, and its advantages are particularly prominent in satellite payload systems.

[0029] The optoelectronic integrated high-speed modulation and demodulation module proposed in the present invention can achieve a compact and low-crosstalk structure through precise space optical design and currently mature coupling capabilities, which helps to reduce the weight of the overall system and is very suitable for spacecraft applications that require lightweight miniaturization and high integration. The design and packaging process of the module can be compatible with further integration with subsequent space optical system components, further improving the functionality and reliability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology according to an embodiment of the present invention;

[0031] Figure 2 A schematic side view of an optical interface of an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology according to an embodiment of the present invention;

[0032] Figure 3 The schematic diagram of the electrical interface of the optoelectronic integrated high-speed modulation and demodulation module based on the microsystem packaging technology according to an embodiment of the invention is a side view.

[0033] Description of reference numerals:

[0034] 1-metal tube shell; 21-semiconductor refrigerator; 22-heat sink; 23-laser chip; 24-backlight detector; 25-thermistor; 26-collimating lens; 27-beam expanding lens; 31-ceramic substrate; 32-detector chip; 33-ceramic carrier board; 34-detector integrated driver chip; 35-focusing lens; 36-receiving lens; 41-circuit board; 42-power chip; 43-processor chip; 44-laser integrated driver chip; 45-electrical connector. DETAILED DESCRIPTION

[0035] The following is a further detailed description of an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology proposed by the present invention in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the accompanying drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0036] See also Figure 1-Figure 3 , Figure 1 This is a schematic diagram of the structure of an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology according to an embodiment of the present invention. Figure 2 This is a schematic side view of an optical interface of an optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology according to an embodiment of the present invention. Figure 3 The schematic diagram of the electrical interface side view of the optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology of an embodiment of the invention is shown in FIG. The optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology provided in this embodiment includes a spatial laser modulation and transmission unit, a spatial laser receiving and demodulation unit, a main control unit and a metal tube shell 1, which cooperate to complete the modulation and demodulation of high-speed signals and the transceiver function of spatial laser signals.

[0037] The spatial laser modulation emission unit comprises a laser chip 23, a backlight detector 24, a thermistor 25, a heat sink 22, a semiconductor refrigerator (TEC) 21, a collimating lens 26 and a beam expansion lens 27. The electro-optical conversion process and the laser collimation and beam expansion emission are realized, and the electrical signal is used to excite the laser chip 23 to modulate into a spatial light signal for transmission.

[0038] The spatial laser receiving and demodulating unit comprises a detector chip 32, a ceramic carrier board 33, an integrated detector driving chip 34, a ceramic substrate 31, a focusing lens 35 and a receiving lens 36. The spatial light beam focusing receiving and photoelectric conversion process is realized to convert the spatial light signal into a corresponding high-speed electrical signal.

[0039] The main control unit includes a processor chip 43 , a power chip 42 , a laser integrated driver chip 44 , an electrical connector 45 and a circuit board 41 .

[0040] The laser chip 23 mainly functions to realize electro-optical conversion and laser emission, and the laser emission band is 1550nm band; the backlight detector 24 mainly functions to realize the detection of the light power emitted by the laser chip 23; the thermistor 25 mainly functions to realize the detection of the working temperature of the laser chip 23; the semiconductor refrigerator 21 mainly functions to realize the adjustment of the working temperature of the laser chip 23; the collimating lens 26 and the beam expanding lens 27 cooperate to realize the calibration and collimation of the end face emission spot of the laser chip 23, and expand the collimated light beam and emit it to the space channel.

[0041] The semiconductor refrigerator 21 is bonded by silver glue, the lower layer is bonded to the metal tube shell 1, and the upper layer is bonded to the heat sink 22. The laser chip 23, the backlight detector chip 24 and the thermistor 25 are mounted on the second step plane of the heat sink 22 by gold-tin solder (Au80Sn20), and the collimating lens 26 is glued to the first step plane of the heat sink 22 by optical glue.

[0042] The detector chip 32 is mounted on the ceramic carrier 33 by gold-tin solder (Au80Sn20), and its main function is to convert the received spatial optical signal into an electrical signal; the detector integrated driver chip 34 integrates an amplifier unit and an automatic gain control circuit, and its main function is to drive the detector chip 32, perform low-noise amplification and limiting control on the weak electrical signal output by the detector chip 32, convert it into a high-speed electrical signal, and output a CML level; the receiving lens 36 and the focusing lens 35 cooperate to realize spatial light beam collection and focus the light beam on the photosensitive surface of the detector chip 32.

[0043] The ceramic carrier board 33 and the detector integrated driving chip 34 are bonded to the upper surface of the ceramic substrate 31 by silver glue, and the focusing lens 35 is bonded to the upper surface of the ceramic substrate 31 by optical glue.

[0044] The beam expander lens 27 and the receiving lens 36 are fixed on the metal tube shell 1 by optical gluing.

[0045] The processor chip 43 mainly controls and monitors the real-time working conditions of the laser chip 23 and the detector chip 32, and adjusts the corresponding parameters according to the specific status, and communicates with external devices at the same time; the power chip 42 mainly converts the input level into the voltage required for the operation of each chip; the laser integrated driver chip 44 mainly realizes CML level input, driving, monitoring and controlling the laser chip 23 and the semiconductor refrigerator 21.

[0046] The electrical connector 45 includes pins and structural parts, and its main function is to realize the interconnection of high-speed signals and low-frequency communication signals between the module and external devices.

[0047] The processor chip 43 communicates with the laser integrated driver chip 44 and the detector integrated driver chip 34 respectively through the I2C protocol; the processor chip 43 reads and monitors the status of each register of the laser integrated driver chip 44, and monitors the bias current, average current, temperature, channel closing and interruption faults of the laser chip 23; the processor chip 43 reads and monitors the status of each register of the detector integrated driver chip 34, and monitors the weak electrical signal and temperature output by the detector chip 32, that is, the digital diagnosis and temperature monitoring functions.

[0048] The processor chip 43 , the laser integrated driver chip 44 and the power chip 42 are mounted on the processing circuit board 41 using a surface mounting process.

[0049] The working process of the optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology of this embodiment is as follows:

[0050] The high-speed electrical signal of the external device is input to the laser integrated driver chip 23 through the electrical connector 45. The processor chip 43 communicates with the external device through I2C through the electrical connector 45. The processor chip 43 then configures the parameters of the laser integrated driver chip 44 (mainly the average current, bias current, and working current of the semiconductor refrigerator 21 of the laser chip 23) so that it can normally drive the laser chip 23 and ensure the stability of the output light power. The laser chip 23 emits a corresponding modulated light signal, which is formed into a spatial light signal through the collimating beam expansion lens group.

[0051] The spatial light signal is received by the focusing lens group and the light beam is directly coupled to the photosensitive surface of the detector chip 32 to complete the photoelectric conversion. At the same time, the processor chip 43 communicates with the external device through the electrical connector 45 via I2C, and configures the parameters (output signal amplitude and threshold level) of the detector integrated driver chip 34 so that it can drive the detector chip 32 to work normally and output high-speed electrical signals, which are output to the external device through the electrical connector 45.

[0052] The present invention is not limited to the above-mentioned specific application examples, and can be extended to any new features or any new combinations disclosed in this specification.

[0053] The optoelectronic integrated high-speed modulation and demodulation module designed in this embodiment based on microsystem packaging technology comprehensively considers the technical characteristics of space optical systems and optical fiber communication systems, and shows significant advantages in bandwidth, power consumption, coupling efficiency, installation convenience, cost control and multi-functional integration, which provides important technical support for the development of future space communication systems. The module optical fiber medium is removed, and the transmitting and receiving module for space laser communication is designed. The laser transmission signal is directly emitted through the space optical lens and can be connected to the subsequent optical antenna. On the contrary, the subsequent optical antenna receives the optical signal and is directly coupled to the photosensitive surface of the detector through the space optical lens, which can improve the light receiving efficiency and increase the system optical path alignment coupling tolerance; at the same time, the microsystem packaging process is used to perform multi-layer stacking welding and inter-chip gold wire bonding and routing signal interconnection on the space laser modulation and transmission unit, the space laser receiving and demodulation unit and the main control signal processing unit, so as to realize optoelectronic integration, which has the advantages of miniaturization, high integration, high system performance, low power consumption, and resistance to space environment, and its advantages are particularly prominent in satellite payload systems.

[0054] The optoelectronic integrated high-speed modulation and demodulation module proposed in this embodiment can achieve a compact and low-crosstalk structure through precise space optical design and currently mature coupling capabilities, which helps to reduce the weight of the overall system and is very suitable for spacecraft applications that require lightweight miniaturization and high integration. The design and packaging process of this module can be compatible with further integration with subsequent space optical system components, further improving the functionality and reliability of the system.

[0055] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0056] In the description of the present invention, it should be understood that the terms "center", "height", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0057] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. An optoelectronic integrated high-speed modulation and demodulation module based on microsystem packaging technology, characterized in that: include: A spatial laser modulation emission unit, comprising a laser chip, a collimating lens and a beam expander lens. The laser chip is used to realize electro-optical conversion and laser emission. The collimating lens and the beam expander lens cooperate to realize the calibration and collimation of the emission spot on the end face of the laser chip, and expand the collimated light beam and emit it to the spatial channel. A space laser receiving and demodulating unit, the space laser receiving and demodulating unit comprises a receiving lens, a focusing lens, a detector chip and a detector integrated driving chip, the receiving lens and the focusing lens cooperate to realize the collection of space light beams, and focus the light beams on the photosensitive surface of the detector chip; the detector chip is used to convert the received space light signal into a weak electrical signal; the detector integrated driving chip is used to realize the driving of the detector chip, perform low-noise amplification and limiter control on the weak electrical signal output by the detector chip, convert it into a high-speed electrical signal, and output a CML level; A main control unit, the main control unit includes a processor chip and a laser integrated driver chip, the laser integrated driver chip is used to realize CML level input and drive the laser chip; the processor chip communicates with the laser integrated driver chip and the detector integrated driver chip respectively, the processor chip reads and monitors the status of each register of the laser integrated driver chip, and reads and monitors the status of each register of the detector integrated driver chip.

2. The optoelectronic integrated high-speed modulation and demodulation module based on micro-system packaging technology according to claim 1, characterized in that: Also includes: A metal tube shell, wherein the spatial laser modulation and emission unit, the spatial laser receiving and demodulation unit and the main control unit are arranged inside the metal tube shell.

3. The optoelectronic integrated high-speed modulation and demodulation module based on micro-system packaging technology as claimed in claim 2, characterized in that: The spatial laser modulation emission unit also includes: A backlight detector, which is used to detect the emission light power of the laser chip; A thermistor, wherein the thermistor is used to detect the operating temperature of the laser chip; Heat sink; A semiconductor refrigerator, wherein the semiconductor refrigerator and the heat sink are used to achieve temperature regulation of the laser chip.

4. The optoelectronic integrated high-speed modulation and demodulation module based on micro-system packaging technology as claimed in claim 3, characterized in that: The lower layer of the semiconductor refrigerator is bonded to the bottom of the metal tube shell, and the upper layer is bonded to the heat sink. The laser chip, the backlight detector and the thermistor are mounted on the second step plane of the heat sink through gold-tin material, and the collimating lens is bonded to the first step plane of the heat sink through optical glue.

5. The optoelectronic integrated high-speed modulation and demodulation module based on micro-system packaging technology as claimed in claim 1, characterized in that: The spatial laser receiving and demodulating unit also includes: A ceramic carrier, on which the detector chip is mounted by means of a gold-tin material; The ceramic substrate, the ceramic carrier and the detector integrated driving chip are bonded to the upper surface of the ceramic substrate by silver glue, and the focusing lens is bonded to the upper surface of the ceramic substrate by optical glue.

6. The optoelectronic integrated high-speed modulation and demodulation module based on micro-system packaging technology as claimed in claim 2, characterized in that: The beam expanding lens and the receiving lens are fixed to the bottom of the metal tube shell by optical glue.

7. The optoelectronic integrated high-speed modulation and demodulation module based on micro-system packaging technology as claimed in claim 1, characterized in that: The laser chip emits laser light in the 1550 nm wavelength band.

8. The optoelectronic integrated high-speed modulation and demodulation module based on microsystem technology as claimed in claim 1, characterized in that: The detector integrated driver chip has an amplifier power supply and an automatic gain circuit integrated therein, which are used to perform low-noise amplification and amplitude limiting control on the weak electrical signal output by the detector chip.

9. The optoelectronic integrated high-speed modulation and demodulation module based on microsystem technology as claimed in claim 1, characterized in that: The main control unit also includes: An electrical connector, through which the laser integrated driver chip receives high-speed electrical signals from an external device; through which the detector integrated driver chip outputs high-speed electrical signals that are transmitted to the external device; and through which the processor chip performs I2C communication with the external device. The circuit board, the processor chip and the laser integrated driver chip are mounted on the circuit board by using a surface mounting process.

10. The optoelectronic integrated high-speed modulation and demodulation module based on micro-system packaging technology according to claim 1, characterized in that: The processor chip monitors the bias current, average current, temperature, channel closure and interruption fault of the laser chip; the processor chip monitors the weak electrical signal output by the detector chip.

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