Cooling device for heat release element

Abstract

According to one embodiment of the present disclosure, there is provided a cooling device for a heat radiating element, comprising: a main body part including a cavity in which a working fluid circulates therein, and a capillary core part disposed on at least a portion of an inner wall of the main body part so as to flow the working fluid to a heat source; a space portion formed by extending from both ends of the main body portion and including a cavity; and a block part which is inserted and welded in the space part.

Description

Technical Field

[0001] The present disclosure relates to a cooling device for an exothermic element. Background Art

[0002] The contents recorded in this section are simply used to provide background information for the present utility model and do not constitute prior art.

[0003] Electronic components that make up electronic devices generate heat when they are in operation. Electronic devices such as computers, servers, and high-performance antenna devices include electronic components such as IC chips, CPUs, and signal transceiver components. Such electronic components (hereinafter referred to as "heat-dissipating components") generate a large amount of heat when they are in operation. If the heat-dissipating components that generate heat are not treated for heat dissipation, their performance will be significantly reduced or, depending on the situation, they may be damaged and become difficult to operate normally. Therefore, heat-dissipating components need to be cooled.

[0004] The requirements for ultra-thin, highly integrated, and high-performance electronic devices in recent years have led to narrowing of the spacing between components and increasing the heat dissipation load. Therefore, cooling of heat dissipation components has become almost inevitable, and most electronic devices are equipped with a cooling device for cooling heat dissipation components.

[0005] The most widely used cooling devices include heat pipe type or vapor chamber type cooling devices that circulate a predetermined refrigerant while changing its phase according to the ambient temperature difference.

[0006] A cavity (or internal space) is formed on a heat pipe type or vacuum heat plate type cooling device, and a porous chain-like capillary wick (capillary wick) can be manufactured by sintering inside a tubular (or plate-shaped) main tube (or main plate) made of a thermally conductive material.

[0007] If a heat sink is additionally provided on the outside of a heat pipe type or a vacuum heat sink type cooling device, the two ends of the cooling device may protrude more than the heat sink. In this case, the two ends of the cooling device do not include a capillary core or an additional support portion, so there is a problem that the two ends of the cooling device are easily damaged by impact. Summary of the invention

[0008] 1. Technical issues to be resolved

[0009] The cooling device of the heat dissipating element according to an embodiment may be combined with additional block parts at both ends of the main body part.

[0010] The technical problems to be solved by the present invention are not limited to the technical problems described above, and other technical problems not mentioned above can be clearly understood by a person skilled in the art based on the following description.

[0011] (II) Technical solution

[0012] According to one embodiment of the present disclosure, a cooling device for a heat-releasing element is provided, comprising: a main body portion, the interior of which includes a cavity for circulation of a working fluid, and a capillary core portion, which is arranged on at least a portion of an inner wall of the main body portion to allow the working fluid to flow toward a heat source; a space portion, which is extended from both ends of the main body portion and includes a cavity; and a block portion, which is inserted into and welded to the space portion.

[0013] (III) Beneficial effects

[0014] According to an embodiment, the cooling device of the heat dissipating element can prevent the two ends of the cooling device of the heat dissipating element from being easily damaged due to impact or the like by combining additional block parts at the two ends of the main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a combined three-dimensional diagram of a cooling device of a heat-releasing element according to an embodiment of the present disclosure.

[0016] Figure 2 is an exploded perspective view of a cooling device for a heat-releasing element according to an embodiment of the present disclosure.

[0017] Figure 3 is a side cross-sectional view of a cooling device for a heat release element according to an embodiment of the present disclosure.

[0018] Figure 4 1 is an enlarged cross-sectional view of a main body portion and a block portion of a cooling device of a heat dissipating element according to an embodiment of the present disclosure.

[0019] Figure 5 FIG. 4 is a diagram of a block portion of a cooling device for a heat dissipating element according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0020] Below, some embodiments of the present disclosure are described in detail using the accompanying drawings. When marking the figure marks in each figure, the same figure marks are used as much as possible even if the same components appear in different figures. Throughout the specification, if it is considered that the detailed description of the relevant known components and functions may make the subject matter of the present disclosure unclear, its detailed description will be omitted.

[0021] In the process of describing the constituent elements according to the embodiments of the present disclosure, symbols such as first, second, i), ii), a), b) may be used. Such symbols are only used to distinguish constituent elements from other constituent elements, and the nature, order or sequence of the corresponding constituent elements are not limited based on the symbols. Throughout the entire specification, if a constituent element "includes" or "has" another constituent element, unless there is a special record to the contrary, it can be understood that a constituent element also includes another constituent element, rather than being understood as a constituent element excluding another constituent element.

[0022] The cooling device 1 for a heat-dissipating element according to an embodiment of the present disclosure is a heat-dissipating component, and the heat-dissipating method adopted by the device is different from the concept of making the refrigerant phase change based on the compressor. The device is designed to cool the heat-dissipating element that is electrically driven and generates heat by causing phase change and transferring heat at atmospheric pressure without using a compressor, and can be applied to a vacuum heat-dissipating plate (vapor chamber), a heat pipe (heat pipe) and a heat sink (heat sink), etc.

[0023] Figure 1 It is a combined three-dimensional diagram of a cooling device of a heat-releasing element according to an embodiment of the present disclosure.

[0024] Reference Figure 1 The cooling device 1 of the heat dissipating element of the present disclosure may include a body unit 11 , a block unit 12 , and all or part of a heat sink 13 .

[0025] The main body 11 may be Figure 1 The length in the y-axis direction) is greater than the thickness direction ( Figure 1 The main body 11 may include a cavity in which the refrigerant is filled and moved.

[0026] The inner wall of the main body 11 may be formed with a capillary core 113. The capillary core 113 is formed by heating the inner wall of the main body 11 with the high energy of a laser and scratching it to a certain depth or forming a burn mark. The capillary core 113 can cause the working fluid such as the refrigerant filled in the main body 11 to produce a capillary phenomenon and flow. The capillary core 113 can cause the liquid working fluid to flow from the condenser unit to the evaporator unit. For example, if heat is introduced into the interior of the cooling device 1 of the heat-releasing element, the working fluid filled inside may undergo a phase change due to the introduced heat. The working fluid that undergoes a phase change utilizes the capillary core 113, so that it can dissipate heat to the outside through surface tension and capillary force.

[0027] The capillary core 113 may extend along the length direction of the main body 11. Figure 1 The capillary core 113 may be formed parallel to the x-axis direction of the main body 11 at a predetermined interval along the width direction of the main body 11. The capillary core 113 may be formed protrudingly on the upper and lower inner walls of the main body 11 in the thickness direction.

[0028] The heat sink 13 may be formed on at least a portion of the outer wall of the main body 11. The heat sink 13 may be formed on the outer wall of the main body 11 in the thickness direction. The heat sink 13 may be formed in parallel at a predetermined interval along the width direction of the main body 11. The cooling device 1 of the heat-dissipating element of the present disclosure forms the heat sink 13 on the outer wall of the main body 11, thereby achieving the effect of further heat dissipation together with the main body 11. The cooling device 1 of the heat-dissipating element of the present disclosure is manufactured based on an extrusion process, so even if the heat sink 13 is formed on the main body 11, it has the effect of facilitating manufacturing.

[0029] Figure 2 is an exploded perspective view of a cooling device for a heat-releasing element according to an embodiment of the present disclosure.

[0030] Figure 3 is a side cross-sectional view of a cooling device for a heat release element according to an embodiment of the present disclosure.

[0031] Reference Figure 2 and Figure 3 The cooling device 1 of the heat dissipating element of the present disclosure may further include a space portion 111 and a bending portion 112 .

[0032] The space portion 111 may be formed at both ends of the main body 11 in the longitudinal direction. For example, the space portion 111 may be formed protruding along the longitudinal direction of the main body 11 compared to the heat sink 13 formed on the outer wall of the main body 11. The space portions 111 are formed at both ends of the main body 11, so that the working fluid can circulate freely inside the main body 11. As a result, the fluidity of the working fluid is increased, so that the heat dissipation efficiency of the cooling device 1 of the heat-dissipating element can be improved.

[0033] The space portion 111 may be formed extending at both ends of the length direction of the main body 11 and may be formed integrally with the main body 11. The space portion 111 may include a cavity 111a that can be filled and moved by the working fluid. However, the space portion 111 is different from the main body 11, and the inner wall thereof is not formed with a capillary wick 113 or an additional support portion. Therefore, when the space portion 111 is directly vacuum-sealed, there is a problem that both ends of the cooling device 1 of the heat release element are easily damaged due to external impact or the like.

[0034] The block 12 of the heat dissipation element cooling device 1 of the present disclosure can be inserted into the cavity 111a of the space 111. After the block 12 is inserted into the space 111, the block 12 and the space 111 can be combined by welding. The block 12 can have a shape corresponding to the width and length of the space 111.

[0035] After the block portion 12 is inserted into the space portion 111, it can be welded as a whole along the edge. The processed surface is welded as a whole using a wobble welding method. At this time, wobble welding refers to welding in a manner that forms a certain pattern during welding. The welding conditions are described as follows.

[0036] When welding the block portion 12 and the space portion 111, a continuous welding method can be used. At this time, the laser wavelength used can be 1030nm. A dual beam with two beam characteristics can be used for welding, and the output ratio of the CORE beam and the RING beam can be 4:6. For example, when the welding machine outputs 2KW, the output of the Core beam can be 800W, and the output of the Ring beam can be 1.2KW. The size and frequency of the swing can be 0.15mm and 200Hz, respectively. The output of the laser can be adjusted to 90% (1100W)-10% (750W). That is, based on a certain length, 90% can be welded at 1100W, and the last 10% can be welded at 750W. However, the welding conditions of the block portion 12 and the space portion 111 disclosed in the present invention can be variously designed as needed, and are not limited to this.

[0037] The bending portion 112 can be formed by bending at least a portion of the length direction of the main body 11. The bending portion 112 can be bent at a predetermined angle within a range that does not hinder the movement of the working fluid in the main body 11. The main body 11 except the bending portion 112 can be formed in parallel. However, the number and angle of the bending portion 112 and the shape of the main body 11 in the present disclosure can be variously designed as needed, and are not limited thereto.

[0038] Figure 4 1 is an enlarged cross-sectional view of a main body portion and a block portion of a cooling device of a heat dissipating element according to an embodiment of the present disclosure.

[0039] Figure 5 FIG. 4 is a diagram of a block portion of a cooling device for a heat dissipating element according to an embodiment of the present disclosure.

[0040] Reference Figure 4 and Figure 5 The block portion 12 of the cooling device 1 of the heat release element of the present disclosure may include a support portion 121 and a main body 122 .

[0041] The support portion 121 may be arranged at a predetermined interval along the width direction of the block portion 12. The support portion 121 is arranged at a predetermined interval and can be arranged parallel to and aligned with the capillary core portion 113 formed on the inner wall of the main body portion 11. The support portion 121 is arranged parallel to and aligned with the capillary core portion 113, so that the working fluid can circulate smoothly in the main body portion 11 and the space portion 111.

[0042] If the block 12 is inserted into the space 111, the body 122 can seal the cavity 111a of the space 111, and the space 111 can be vacuum-sealed by the solder block 12 and the space 111. At this time, the shape of the body 122 can correspond to the shape of the cavity 111a of the space 111.

[0043] The support portion 121 may further include at least one groove 121a for circulating the working fluid. The support portion 121 includes at least one circular groove 121a, which allows the working fluid to circulate smoothly in the main body 11 and the space portion 111. The groove 121a formed in each support portion 121 may be formed corresponding to the groove 121a formed in the adjacent support portion 121. However, the shape and number of the support portion 121 and the groove 121a can be variously designed as needed, and are not limited thereto.

[0044] The block portion 12 may have a shape corresponding to the width and length of the space portion 111. The body 122 may have a shape corresponding to the cavity 111a of the space portion 111. The thickness of the body 122 and the support portion 121 may correspond to the thickness of the cavity 111a of the space portion 111. The length of the block portion 12 may correspond to the length of the space portion 111. Therefore, the block portion 12 may support the space portion 111, and the inner wall of the space portion 111 is not formed with a capillary wick 113 or an additional support portion.

[0045] After the block 12 is inserted into the space 111, the block 12 can be welded to the space 111. Therefore, when the space 111 is directly vacuum-sealed, since the block 12 can support the space 111, it is possible to prevent both ends of the cooling device 1 of the heat-dissipating element from being easily damaged due to external impact or the like.

[0046] The above description is only an exemplary description of the technical idea of ​​the present embodiment. For those with general knowledge in the technical field to which the present embodiment belongs, various modifications and deformations can be made without exceeding the essential features of the present embodiment. Therefore, the present embodiment is used to illustrate rather than limit the technical idea of ​​the present embodiment, and these embodiments are not used to limit the scope of the technical idea of ​​the present embodiment. The protection scope of the present embodiment is interpreted based on the attached claims, and all technical ideas within the equivalent scope thereof should be interpreted as belonging to the scope of rights of the present embodiment.

[0047] [Explanation of Reference Numerals]

[0048] 1: Cooling device for heat-dissipating elements

[0049] 11: Main body

[0050] 12: Block

[0051] 13: Heat sink

[0052] [CROSS-REFERENCE TO RELATED APPLICATIONS]

[0053] This patent application claims priority to Patent Application No. 10-2022-0087358 filed in the Korean Patent Office on July 15, 2022, all of which are incorporated by reference into this patent application.

Claims

1. A cooling device for a heat release element, comprising: A main body, the interior of which includes a cavity for circulating a working fluid, and includes a capillary wick, the capillary wick being arranged on at least a portion of an inner wall of the main body so as to allow the working fluid to flow toward a heat source; a space portion extending from both ends of the main body portion and comprising a cavity; and The block portion is inserted into and welded into the space portion.

2. The cooling device for a heat-dissipating element according to claim 1, wherein: The inner wall of the space portion has no capillary wick arrangement.

3. The cooling device for a heat-dissipating element according to claim 1, wherein: The capillary wicks are arranged along the length direction of the main body at predetermined intervals along the width direction of the main body.

4. The cooling device for a heat-dissipating element according to claim 1, wherein: The block portion further includes support portions arranged at predetermined intervals along a width direction of the block portion.

5. The cooling device for a heat-dissipating element according to claim 4, wherein: The support portion further includes at least one groove through which the working fluid can circulate.

6. The cooling device for a heat-dissipating element according to claim 4, wherein: The support portion is arranged in parallel alignment with the capillary core portion.

7. The cooling device for a heat-dissipating element according to claim 1, wherein: The main body further includes a bending portion at least a portion of which is in a bent shape.

8. The cooling device for a heat-dissipating element according to claim 1, wherein: The block portion has a shape corresponding to the width and length of the space portion.

9. The cooling device for a heat-dissipating element according to claim 1, wherein: The invention further comprises a heat sink arranged on at least a portion of the outer wall of the main body.

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