Bearing base conveying method and semiconductor processing system

Abstract

The invention provides a bearing base conveying method and a semiconductor processing system. The semiconductor processing system comprises a transfer device, a transfer chamber, a main control device and at least two process chambers. And a caching device capable of adjusting the size of the bearing area is arranged in the transfer chamber. In the bearing base conveying method, the main control device obtains at least one received information of the process chamber and judges the process chamber needing to execute the bearing base transfer-out step according to the received information of the process chamber; the main control device controls the transfer device to transfer the bearing base in the process chamber to the transfer chamber, and the main control device obtains the received size information of the bearing base and controls the cache device to adjust the size of the bearing area according to the received size information of the bearing base so as to be matched with the size of the bearing base; the main control device controls the transfer device to place the bearing bases on the cache devices with the bearing area sizes adjusted, so that transfer of the bearing bases of different sizes is concentrated on one production line, the same cache device can accommodate the bearing bases of different sizes, and the storage flexibility and the utilization rate of the cache devices are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and more specifically, to a carrier base transfer method and a semiconductor processing system. Background Art

[0002] As an important component for carrying objects to be processed (such as wafers), the carrier base plays a key role in the semiconductor manufacturing process. After the wafer is carried on the carrier base, it is transferred into the process chamber to complete the process flow such as the vapor deposition process. After the process flow is completed, the carrier base or the base carrying the coated wafer needs to be transferred to the transfer chamber for buffering to cool down and prepare for subsequent use or to remove the coated wafer.

[0003] Some current semiconductor processing systems are equipped with multiple process chambers that can accommodate pedestals of different sizes. The pedestals of different sizes carry wafers of different sizes, or carry wafers of the same size but different quantities, thereby realizing parallel processing of multiple quantities or sizes of wafers in the semiconductor processing system.

[0004] In terms of caching of a bearing base or a base bearing a coated wafer, the prior art generally sets up multiple cache devices to store bearing bases or bases bearing coated wafers of specific sizes respectively. Although this method can realize the storage of bearing bases of different sizes, it requires a large number of cache devices, which increases the space occupied, and may result in a transfer room that accommodates bearing bases of one size being vacant, but a bearing base of another size, especially when its size is smaller than the bearing base of the aforementioned size, will not match the corresponding cache device, thereby reducing the space utilization rate. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a carrier base transmission method and a semiconductor processing system, which can concentrate the transfer process of carrier bases of different sizes on one production line for processing, and the same cache device can accommodate carrier bases of different sizes, thereby improving the storage flexibility and utilization rate of each cache device.

[0006] In a first aspect, the present application provides a method for transmitting a bearing base, comprising:

[0007] S0. Provide semiconductor processing system;

[0008] The semiconductor processing system at least includes a transfer device, a transfer chamber, at least two process chambers and a main control device; a cache device for placing a carrier base and capable of adjusting the size of a carrier area is provided in the transfer chamber; each process chamber contains a carrier base, and at least some process chambers contain carrier bases of different sizes, each process chamber is provided with a visual device for obtaining size information of the carrier base, and the main control device is connected to each process chamber, the transfer device and the cache device for communication;

[0009] S1, the main control device obtains and determines the process chamber that needs to perform the step of transferring the carrier base out through the received information of at least one process chamber;

[0010] S2, the main control device controls the transfer device to transfer the bearing base in the process chamber to the transfer chamber, and the main control device obtains and controls the cache device to adjust the bearing area size to match the bearing base size according to the received size information of the bearing base;

[0011] S3. The main control device controls the transfer device to place the bearing base on the cache device with the bearing area size adjusted.

[0012] In the second aspect, the semiconductor processing system provided by the present application includes a transfer device, a transfer chamber, at least two process chambers and a main control device; a cache device for placing a carrying base and having an adjustable carrying area size is provided inside the transfer chamber; at least some of the process chambers accommodate carrying bases of different sizes, and the main control device is communicatively connected with each process chamber, the transfer device, and the cache device.

[0013] The semiconductor processing system provided in the present application is used to execute the aforementioned carrier base transfer method.

[0014] Optionally, the cache device includes a plurality of linear displacement mechanisms distributed radially, each linear displacement mechanism is slidably provided with a support seat, and the cache device also includes a driving mechanism that is communicatively connected to the main control device and connected to each support seat.

[0015] Optionally, in step S2, the main control device obtains and controls the cache device to adjust the size of the carrying area according to the size information of the carrying base, including: the main control device sends a carrying area size adjustment instruction to the driving mechanism according to the size information of the carrying base, and the driving mechanism drives at least one support seat to slide along the extension direction of the corresponding linear displacement mechanism in response to the carrying area size adjustment instruction until the top of each support seat forms a carrying area for placing the carrying base.

[0016] Optionally, the cache device includes a positioning device communicatively connected to the main control device.

[0017] Optionally, in step S2, the step in which the main control device issues a load-bearing area size adjustment instruction to the driving mechanism according to the size information of the load-bearing base includes: the positioning device obtains and sends the position information of each support seat to the main control device; the main control device issues a load-bearing area size adjustment instruction to the driving mechanism according to the position information of each support seat and the size information of the load-bearing base.

[0018] Optionally, the main control device stores a first load-bearing lower limit threshold and a load-bearing difference threshold range, and the cache device includes a plurality of radially distributed linear displacement mechanisms, each of which is slidably arranged on a support seat, each support seat is a liftable support seat and is provided with a load-bearing sensor device that is communicatively connected to the main control device.

[0019] Optionally, in step S3, the step in which the main control device controls the transfer device to place the bearing base to be transferred on the cache device whose bearing area size has been adjusted includes:

[0020] S31, the main control device controls the transfer device to place the bearing base on the cache device with the bearing area size adjusted, and enables the transfer device to maintain a holding relationship with the bearing base;

[0021] S32, the main control device obtains and determines, based on the load-bearing values ​​sent by each load-bearing sensor device, that the load-bearing value of each support seat is greater than or equal to the first load-bearing lower limit threshold, and the difference in the load-bearing values ​​of any two support seats is within the range of the load-bearing difference minus the threshold;

[0022] S33, the main control device controls the transfer device to release the holding relationship between the transfer device and the carrying base.

[0023] Optionally, the main control device further stores a second load-bearing lower limit threshold value that is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value.

[0024] Optionally, after step S31 is executed, the main control device obtains and determines, based on each load-bearing value, that the load-bearing values ​​of the M support seats are greater than or equal to the second load-bearing lower limit threshold and less than the first load-bearing lower limit threshold, and the load-bearing values ​​of the remaining support seats are greater than or equal to the first load-bearing lower limit threshold, and step S33 is executed. The main control device then performs micro-motion lifting and lowering adjustments on the M support seats until step S32 is met.

[0025] Optionally, M is an integer greater than or equal to 1 and less than the number of support seats.

[0026] Optionally, after step S31 is executed, the main control device obtains and determines, based on the received load-bearing values, that the load-bearing value of at least one support seat is less than the second load-bearing lower limit threshold, and then controls the transfer device to carry the supporting base away from the transfer room, and then the main control device raises and lowers at least one support seat.

[0027] Optionally, the support seat includes a lifting body and a supporting body movably mounted around the lifting body, each lifting body is provided with a load-bearing sensor device, each lifting body is communicatively connected to a main control device, and each supporting body has a consistent height.

[0028] Optionally, the step of the main control device adjusting the lifting and lowering of at least one support seat includes: the main control device controls the lifting and lowering of each lifting body on the cache device until each lifting body is consistent in height with the corresponding supporting body, or is accommodated in the corresponding supporting body.

[0029] Optionally, at least one transfer cache cavity is provided in the transfer chamber, and a cache device is provided in the transfer cache cavity. The cache device includes a plurality of radially distributed linear displacement mechanisms, each linear displacement mechanism is slidably provided with a liftable support seat, and a main control device is communicatively connected to each support seat.

[0030] Optionally, after step S3 is executed, the main control device controls each support base to rise synchronously so that each support base rises to a set upper limit position to prevent the transfer device holding the supporting base from entering the space between the upper limit position and the inner top wall of the transfer buffer cavity.

[0031] Optionally, the semiconductor processing system also includes a plurality of visual devices which are communicatively connected to the main control device and are arranged in each process chamber.

[0032] Optionally, in step S1, the main control device obtains and determines the process chamber that needs to execute the carrier base transfer step through the information received from at least one process chamber, including: the main control device obtains image information in the process chamber through a visual device in the process chamber; when the main control device determines that the process chamber does not accommodate the carrier base based on the image information obtained by the visual device, it determines that the process chamber is a process chamber that needs to transfer the carrier base into.

[0033] Optionally, the semiconductor processing system further includes a pre-processing chamber and a shipping device, and the shipping device is provided with a cache device that is communicatively connected to the main control device.

[0034] Optionally, before executing step S1, the following steps are also included:

[0035] S01, the main control device obtains and determines the process chamber that needs to be transferred to the supporting base according to the received information of the transfer device or the information of at least one process chamber;

[0036] S02, the main control device obtains and controls the cache device provided in the consignment device to adjust the size of the carrying area according to the received size information of the carrying base that can be accommodated in the process chamber where the carrying base is to be transferred;

[0037] S03, placing a bearing base that matches the size of the bearing area on the shipping device on the corresponding bearing area;

[0038] S04, the main control device controls the shipping device to transport the bearing base to the front processing room;

[0039] Compared with the prior art, the beneficial effects of the present application include at least the following:

[0040] In the carrier base transmission method and semiconductor processing system of the present application, the semiconductor processing system includes a transfer device, a transfer chamber and at least two process chambers. The transfer chamber is provided with a cache device for placing the carrier base and having an adjustable carrying area size. The sizes of the carrier bases accommodated in at least some process chambers are different. After the main control device determines the process chamber that needs to execute the carrier base transfer step through the information received from at least one process chamber, it controls the cache device to adjust the carrying area size accordingly, and controls the transfer device to transfer the carrier base to the transfer chamber and place it on the cache device with the adjusted carrying area size, thereby integrating the transfer process of carrier bases of different sizes on one production line, reducing the number of production lines, reducing space occupancy and equipment cost expenditure.

[0041] At the same time, since the cache device in the transfer room can adjust the size of the bearing area, when faced with the caching needs of bearing bases of different sizes, the size of the bearing area of ​​the cache device can be controlled to make adaptive adjustments, thereby improving the storage flexibility and utilization of the cache device. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 A schematic diagram of a flow chart of a method for transporting a bearing base shown in an embodiment of the present application;

[0044] Figure 2 A schematic diagram of the composition of a semiconductor processing system shown in an embodiment of the present application;

[0045] Figure 3 A schematic diagram of the structure of a process chamber shown in an embodiment of the present application;

[0046] Figure 4 A three-dimensional structural diagram of a cache device shown in an embodiment of the present application;

[0047] Figure 5 for Figure 4 A top view of the cache device shown;

[0048] Figure 6 for Figure 4 A schematic diagram of a working state in which the size of the load-bearing area of ​​the cache device becomes larger;

[0049] Figure 7 for Figure 4A schematic diagram of a working state in which the size of the load-bearing area of ​​the cache device becomes smaller;

[0050] Figure 8 A structural diagram of a cache device with a positioning device shown in an embodiment of the present application;

[0051] Fig. 9 A schematic diagram of the structure of a transfer chamber with multiple transfer buffer cavities shown in an embodiment of the present application;

[0052] Fig.10 A schematic diagram of a top view of a transfer chamber with multiple transfer buffer cavities shown in an embodiment of the present application;

[0053] Fig.11 A schematic diagram of the working state of a semiconductor processing system with a shipping device according to an embodiment of the present application;

[0054] Fig.12 A schematic diagram of a working state of a transfer device and a transfer chamber shown in an embodiment of the present application;

[0055] Fig.13 This is a schematic diagram of another working state of the transfer device and the transfer chamber shown in an embodiment of the present application.

[0056] The reference numerals in the figure are as follows: 1. transfer device; 11. clamping device; 2. transfer chamber; 201. transfer buffer chamber; 3. process chamber; 31. gas injection device; 32. heating device; 33. rotating device; 34. isolation device; 35. exhaust device; 4. visual device; 5. main control device; 6. pre-processing chamber; 7. consignment device; 100. cache device; 101. linear displacement mechanism; 102. support seat; 1021. lifting body; 1022. support body; 103. positioning device; S. carrying area; 01. carrying base; 02. wafer. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0058] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0059] The embodiments of the present application provide a carrier base transmission method and a semiconductor processing system. The technical solution of the present application will be described in detail below in conjunction with the accompanying drawings of the specification.

[0060] Embodiment 1

[0061] like Figure 2 As shown, this embodiment provides a semiconductor processing system, including a transfer device 1, a transfer chamber 2, a process chamber 3, and a main control device 5. The number of process chambers 3 is 2. Among them, a cache device 100 for placing a bearing base and having an adjustable bearing area size is provided inside the transfer chamber 2. The sizes of the bearing bases accommodated in at least some of the process chambers 3 are different, and the main control device 5 is connected to each process chamber 3, the transfer device 1 and the cache device 100 for communication.

[0062] In the semiconductor processing system of the present embodiment, a cache device 100 with an adjustable carrying area size is provided in the transfer chamber 2. Therefore, when faced with the caching requirements of carrying bases 01 of different sizes, the carrying area size of the cache device 100 can be adaptively adjusted to carry carrying bases 01 of different sizes.

[0063] In one embodiment, the number of cache devices 100 in the transfer chamber 2 is 1. When a carrier base 01 to be transferred in a process chamber 3 is transferred to the cache device 100 and cooled to room temperature, the carrier base 01 is transferred out of the transfer chamber 2. At this time, the size of the carrying area of ​​the cache device 100 is adapted to the carrier base 01. When a carrier base 01 of a different size to be transferred in another process chamber 3 needs to be transferred to the cache device 100, because the carrying area of ​​the cache device 100 can be flexibly adjusted, the size of the carrying area of ​​the cache device 100 can be adjusted so that the cache device 100 can still be used to cache the carrier bases 01 of different sizes transferred out of another process chamber 3, thereby making full use of the cache device 100 and improving the flexibility of caching carrier bases 01 of different sizes.

[0064] In another embodiment, if Figure 2 As shown, there are multiple cache devices 100 in the transfer room 2, which further improves the cache capacity of the transfer room 2. In addition, since the size of the bearing area of ​​the unloaded cache device 100 can be adaptively adjusted according to the size of the bearing base to be transferred, the cache device 100 has more flexible adaptability and improved utilization.

[0065] At the same time, the cache device 100 with adjustable load area size cooperates with the transfer device 1 and the main control device 5 to integrate the transfer process of load bases of different sizes into one production line, thereby reducing the number of production lines, reducing space occupancy and equipment cost expenditure, reducing the idle rate of the cache device 100, and improving utilization.

[0066] In this embodiment, if Figure 2 As shown, the transfer device 1 may include a clamping device 11 for clamping the side wall of the bearing base 01 and having an adjustable clamping size. The transfer device 1 clamps the bearing base 01 through the clamping device 11 to achieve the transfer of the bearing base 01. For example, the clamping device 11 may include two clamping arms and a driving structure that are relatively arranged. The driving structure may be a combination of one or more of a motor, a servo, a linear module, a cylinder, a connecting rod mechanism, etc. The driving structure may make the distance between the two clamping arms move away from or closer to each other, and change the clamping size of the clamping device 11, so that it is suitable for clamping bearing bases of different sizes. The specific implementation means are conventional technical means in this field. In other embodiments, the transfer device 1 may also transfer the bearing base 01 by supporting, and the specific implementation means are conventional technical means in this field.

[0067] The supporting bases 01 of different sizes may support wafers 02 of different sizes, or support wafers 02 of the same size but in different quantities. Figure 2 As shown, there are two process chambers 3, and the sizes of the supporting bases 01 accommodated in the two process chambers 3 are different. In some embodiments, there are at least two process chambers 3, and the sizes of the supporting bases 01 accommodated in at least some of the process chambers 3 are different. The specific selection can be made according to the process requirements, which is conducive to realizing parallel processing of multiple numbers or multiple sizes of wafers 02 and improving production capacity.

[0068] In some embodiments, a visual device 4 is provided in each process chamber 3. The main control device 5 is in communication connection with the visual device 4. The visual device 4 is used to obtain and feed back image information in the process chamber 3 to the main control device 5, so that the main control device 5 can obtain size information of the supporting base 01 in the process chamber 3, or determine whether there is a supporting base 01 in the process chamber 3.

[0069] In some embodiments, the visual device 4 may include at least a camera, which takes an image of the carrier base 01 to be transported and sends it to the main control device 5, which analyzes the image and obtains the size information of the carrier base 01. Alternatively, the visual device 4 may include a camera and a visual processing device, and the visual processing device 4 has an independent image processing capability, which can analyze the image taken by the camera, calculate the size information of the carrier base 01, and then send the size information of the carrier base 01 to the main control device 5.

[0070] In this embodiment, the main control device 5 can be a programmable logic controller (PLC), an industrial personal computer (IPC), a single board computer (SBC), an embedded system, a digital signal processor (DSP), a field programmable gate array (FPGA), a microcontroller (MCU), a cloud server, etc.

[0071] In this embodiment, a load-bearing sensor device for sensing the mass of the object carried on the cache device 100 may be provided in the transfer room 2, and the load-bearing sensor device is connected to the main control device 5 in communication. The main control device 5 determines whether the bearing base has been placed on the corresponding cache device 100 of the transfer room 2 and can achieve stable support through the load-bearing information fed back by the load-bearing sensor device. Specifically, the load-bearing sensor device may be a weighing sensor.

[0072] In this embodiment, if Figure 4 and Figure 5 As shown, the cache device 100 may include linear displacement mechanisms 101 radially distributed around a central position O, and at least one support seat 102 that can slide and change its position is installed on each linear displacement mechanism 101. The cache device 100 also includes a driving mechanism (not shown in the figure) that is communicatively connected to the main control device 5, and the cache device 100 controls the driving mechanism to work so as to change the position of the support seat 102 on the linear displacement mechanism 101.

[0073] like Figure 5 As shown, the bearing plane formed by the top surfaces of the support seats 102 on all the linear displacement mechanisms 101 is the bearing area S (the bearing area S includes at least part of the top surface of each support seat 102). Figure 6 As shown, the support seats 102 on all linear displacement mechanisms 101 move away from the center position O, and the size of the bearing area S becomes larger, as shown in FIG. Figure 7 As shown, as it moves closer to the center position O, the size of the bearing area S becomes smaller. When the bearing base 01 is placed in the bearing area S, the top surface of each support seat 102 contacts the bottom surface of the bearing base 01 to achieve a stable supporting effect.

[0074] In some embodiments, the main control device 5 controls the positions, movement directions and movement distances of each support base 102 on the linear displacement mechanism 101 to remain consistent, that is, each support base 102 is synchronously adjusted on the linear displacement mechanism 101 .

[0075] In other embodiments, the support bases 102 that need to be adjusted are selectively adjusted according to the size data of the bearing base 01 to be transported, and the movement direction and distance of these support bases 102 are controlled, so that the enclosed bearing area S can achieve stable support for the bearing base 01.

[0076] In this embodiment, the linear displacement mechanism 101 can be a screw module or a synchronous belt module. In this case, the driving mechanism can be a servo motor that drives the screw module, the synchronous belt module, etc. The driving mechanism drives the linear displacement mechanism 101 to work, so that the support seat 102 installed on the linear displacement mechanism 101 is displaced to change its position.

[0077] In this embodiment, the linear displacement mechanism 101 may also be a guide rail, and the support seat 102 may be provided with a slide groove, and the support seat 102 is mounted on the guide rail through the cooperation between the slide groove and the guide rail. The driving mechanism may include a motor and a running wheel driven by the motor, the driving mechanism is mounted on the support seat 102, and the running wheel contacts the guide rail or a surface near the guide rail, and the motor controls the running wheel to rotate, thereby causing the support seat 102 to slide along the guide rail to change its position.

[0078] In this embodiment, if Figure 8 As shown, the buffer device 100 may also include a positioning device 103, which is arranged beside each linear displacement mechanism 101. The positioning device 103 is used to detect the position of the support seat 102 in the linear displacement mechanism 101, and the positioning device 103 is connected to the main control device 5 for communication; the main control device 5 determines whether the size of the bearing area is compatible with the size of the bearing base to be transported through the position signal fed back by the positioning device 103. The positioning device 103 may be, but is not limited to, a grating sensor, an ultrasonic sensor, a proximity switch, etc.

[0079] In this embodiment, if Fig. 9 and Fig.10 As shown, the transfer chamber 2 may be provided with a plurality of transfer cache cavities 201 , and a cache device 100 may be provided in each transfer cache cavity 201 .

[0080] In some embodiments, the number of cache devices 100 in each transit cache cavity 201 is at least 2. The cache devices 100 in the same transit cache cavity 201 may be arranged horizontally or vertically.

[0081] In this embodiment, if Fig. 9 As shown, the transfer buffer chamber 201 in the transfer chamber 2 can be arranged vertically. Fig.12 As shown, the transfer buffer cavities 201 in the transfer chamber 2 can be arranged in the same plane space.

[0082] Since the transfer chamber 2 has a plurality of transfer cache cavities 201 , and a cache device 100 is disposed in each transfer cache cavity 201 , it is possible to cache supporting bases 01 of various sizes in the same transfer chamber 2 .

[0083] In this embodiment, if Fig.11 As shown, the semiconductor processing system may further include a pre-processing chamber 6. After the cleaned and purged carrier 01 enters the pre-processing chamber 6 to hold the wafer, the main control device 5 controls the transfer device 1 to transfer it to the process chamber corresponding to the carrier.

[0084] In some embodiments, Fig.11As shown, the semiconductor processing system also includes a shipping device 7, which includes a buffer device 100 with an adjustable carrying area size, which facilitates the transfer of carriers of different sizes to the front processing chamber 6 on the same production line. The main control device 5 adjusts the carrying area size of the buffer device 100 set by the shipping device 7 according to the size information of the carrier to be transferred into the process chamber 3, so as to carry the corresponding carrier, and places the corresponding carrier 01 outside the shipping device 7 on the carrying area of ​​the buffer device 100 set by the shipping device 7 through manual or mechanical control.

[0085] In some embodiments, the pre-processing chamber 6 can also be used to clean and purge the support base 01. After the support base 01 is cleaned and purged in the pre-processing chamber 6, the cleaned wafer is placed on the support base 01. Since the cache device 100 supports the support base 01 through the support area S, most of the surface of the support base 01 is exposed, thereby improving the cleaning and purging effect.

[0086] In some embodiments, after the wafer 02 is loaded on the cleaned and purged supporting base 01 , the supporting base 01 may be transported to the pre-processing chamber 6 via the transporting device 7 . In this case, the supporting base 01 is the base carrying the wafer 02 .

[0087] In this embodiment, if Fig.12 and Fig.13 As shown, the cache device 100 of the semiconductor processing system can be configured as a cache device that can be raised and lowered. For example, each support seat 102 includes a lifting body 1021 and a supporting body 1022, the supporting body 1022 is movably mounted around the lifting body 1021 and is arranged outside the lifting body 1021, and the supporting body 1022 is installed on the linear displacement mechanism 101 in a form that can slide and change its position, each lifting body 1021 is connected to the main control device 5 for communication, and the top of the lifting body 1021 is used to support the bearing base 01. The main control device 5 controls the lifting body 1021 to perform lifting and lowering movements relative to the supporting body 1022.

[0088] In some embodiments, the lifting body 1021 is provided with a load-bearing sensor device.

[0089] Embodiment 2

[0090] The embodiment of the present application provides a method for transferring a carrier base, which is implemented using the semiconductor processing system in the first embodiment.

[0091] Reference Figure 1 The carrier base transmission method of this embodiment at least includes:

[0092] S1, the main control device obtains and determines the process chamber that needs to perform the step of transferring the carrier base out through the received information of at least one process chamber;

[0093] S2, the main control device controls the transfer device to transfer the bearing base in the process chamber to the transfer chamber, and the main control device obtains and controls the cache device to adjust the bearing area size to match the bearing base size according to the received size information of the bearing base;

[0094] S3. The main control device controls the transfer device to place the bearing base on the cache device with the bearing area size adjusted.

[0095] In step S1 of this embodiment, refer to Figure 2 When the processing process of the current wafer 02 in the process chamber 3 is completed, the process chamber 3 sends process information to the main control device 5 to indicate that the process flow (for example, vapor deposition process) of the current wafer 02 in the process chamber 3 has been completed, and it is necessary to execute the step of transferring the supporting base to be transferred (that is, the supporting base carrying the substrate, and the semiconductor material layer deposited on the substrate) to the transfer chamber 2.

[0096] Specifically, refer to Figure 2 and Figure 3 The process chamber 3 is provided with a gas injection device 31, a heating device 32, a pressure control device (not shown in the figure), an exhaust device 35, a rotating device 33 and an isolation device 34 which are all connected to the main control device 5 in communication. The main control device 5 pre-stores the process program information. The supporting base 01 is arranged on the rotating device 33 in the process chamber 3, the heating device 32 is arranged below the supporting base 01, the gas injection device 31 is arranged at the top of the process chamber 3 and is opposite to the surface of the supporting base 01 carrying the substrate, and the exhaust device 35 is arranged at the bottom of the process chamber 3. The main control device 5 controls the isolation device 34 to be closed according to the process program information, the heating device 32 to generate heat so that the temperature in the process chamber 3 meets the process temperature requirement, controls the pressure control device (not shown in the figure) and the exhaust device (not shown in the figure) so that the pressure in the process chamber 3 meets the process pressure requirement, and controls the gas injection device 31 to provide the type and flow rate of the process gas into the process chamber 3 so that the substrate surface undergoes a vapor deposition reaction, and controls the rotating device 33 to drive the substrate to rotate so as to grow a semiconductor material layer that meets the process requirements. After the vapor deposition reaction is completed, the main control device 5 controls the gas injection device 31 to inject an inert purge gas (such as nitrogen) into the process chamber 3, controls the rotating device 33 to gradually slow down to a stop state, and then moves axially along the process chamber 3 to a suitable position to facilitate the subsequent entry of the transfer device 1 into the process chamber 3 to transfer the supporting base 01, and controls the pressure control device and the exhaust device 35 to make the pressure difference between the inside and outside of the process chamber 3 meet the transfer requirements (for example, the pressure in the process chamber 3 is consistent with the pressure in the area where the transfer device 1 is located), and then controls the isolation device 34 to be in an open state.

[0097] In some embodiments, each process chamber 3 may be provided with a visual device 4. The main control device 5 is in communication connection with the visual device 4.

[0098] After the main control device 5 receives the process information of the completion of the current wafer processing in the process chamber 3 and determines that it is necessary to execute the step of transferring the carrier base 01 to be transferred to the transfer chamber 2, the main control device 5 obtains the base size information of the carrier base 01 to be transferred through the visual device 4 in the process chamber 3. Specifically, after the main control device 5 determines that the isolation device 34 is in the open state, it confirms that the corresponding process chamber 3 needs to transfer out the carrier base 01. In this case, the carrier base 01 is a carrier base carrying a coated wafer.

[0099] In some embodiments, after the main control device 5 determines that the isolation device 34 is in the open state, it can also first control the mechanism for taking out the wafer to enter the corresponding process chamber 3 to perform a wafer taking operation on the wafer 02, and then confirm that the corresponding process chamber 3 needs to transfer out the supporting base 01.

[0100] In step S2 of the carrier base transfer method of this embodiment, the main control device 5 controls the unloaded buffer device 100 in the transfer chamber 2 to adjust the size of the carrying area to match the size of the carrier base 01 to be transferred in the process chamber 3 based on the carrier base size information. Figure 2 , the main control device 5 receives the base size information acquired and sent by the visual device 4 in the process chamber 3 and generates a control signal, and the main control device 5 sends a control signal to an unloaded cache device 100 in the transfer chamber 2 to adjust the size of the carrying area of ​​the cache device 100 to match the size of the carrying base 01 to be transferred, so that the cache device 100 can stably carry the corresponding carrying base 01. In some other embodiments, the main control device 5 pre-stores the size information of the carrying base 01 that can be accommodated in each process chamber 3, that is, the corresponding relationship between the process chamber and the size information of the carrying base. When the main control device 5 determines the process chamber 3 that needs to execute the step of transferring the carrying base 01 through step S1, the size information of the carrying base is obtained by comparing the pre-stored corresponding relationship between the process chamber and the size information of the carrying base.

[0101] In one embodiment, the “adjusting the size of the bearing area of ​​the cache device 100 to match the size of the bearing base 01 to be transferred” means that the main control device 5 obtains the bottom surface size information of the bearing base 01 to be transferred, and adjusts the bearing area S (such as Figure 5 The size of the bearing area S is smaller than or equal to the bottom surface size of the bearing base 01 to achieve stable bearing.

[0102] In this embodiment, if Figures 4 to 7As shown, the cache device 100 may include a plurality of linear displacement mechanisms 101 distributed radially, each linear displacement mechanism 101 is slidably provided with a support seat 102, and the cache device 100 also includes a driving mechanism (not shown in the figure) in communication connection with the main control device 5. Therefore, in step S2, the main control device 5 obtains and controls the cache device 100 to adjust the size of the bearing area to match the size of the bearing base 01 according to the received size information of the bearing base 01, including:

[0103] The main control device 5 sends a bearing area size adjustment instruction to the driving mechanism according to the size information of the bearing base. The driving mechanism drives at least one support seat 102 to slide along the extension direction of the corresponding linear displacement mechanism 101 in response to the bearing area size adjustment instruction until the top of each support seat 102 forms a bearing area for placing the bearing base.

[0104] In some embodiments, Figure 8 As shown, the cache device 100 may include a positioning device 103 that is communicatively connected to the main control device 5, and a positioning device 103 is arranged next to each linear displacement mechanism 101. Therefore, in step S2, the main control device 5 sends a bearing area size adjustment instruction to the driving mechanism according to the size information of the bearing base, which may include:

[0105] The positioning device 103 obtains and sends the position information of each support base 102 to the main control device 5;

[0106] The main control device 5 sends a load-bearing area size adjustment instruction to the driving mechanism according to the position information of each support seat 102 and the size information of the load-bearing base.

[0107] In this embodiment, a load-bearing sensor device may be provided on each support seat 102, and the load-bearing sensor device is in communication connection with the main control device 5, and the main control device 5 pre-stores a first load-bearing lower limit threshold and a load-bearing difference threshold range. In step S3, the main control device 5 controls the transfer device 1 to place the bearing base 01 on the buffer device 100 whose bearing area size has been adjusted, including:

[0108] S31, the main control device 5 controls the transfer device 1 to place the carrying base 01 on the cache device 100 of which the carrying area size has been adjusted, and enables the transfer device 1 to maintain a holding relationship with the carrying base 01;

[0109] S32, the main control device 5 obtains the load-bearing value sent by each load-bearing sensor device, and determines that the load-bearing value of each support seat is greater than the first load-bearing lower limit threshold, and the difference between any two load-bearing values ​​is within the range of the load-bearing difference minus the threshold;

[0110] S33, the main control device 5 controls the transfer device 1 to release the holding relationship with the carrying base.

[0111] In step S33 of this embodiment, the main control device 5 controls the transfer device 1 to release the holding relationship with the carrying base, and then controls the transfer device 1 to move away from the transfer room 2.

[0112] Since each support seat 102 of the cache device 100 of the present application involves height adjustment and size adjustment of the bearing area in the plane direction, in order to further ensure that after the main control device 5 controls the transfer device 1 to transfer the bearing base 01 to the bearing area, the bearing area can achieve stable support for the bearing base 01, in step S31 of the present application, the main control device 5 controls the transfer device 1 to place the bearing base 01 to be transferred on the cache device 100 with the bearing area size adjusted, and also enables the transfer device 1 to maintain a holding relationship with the bearing base 01, which is equivalent to forming a target bearing position relationship on the cache device 100 by holding the bearing base 01 through the transfer device 1, and judging through step S32 whether the bearing area meets the condition of stable support for the bearing base 01 under the condition of S31.

[0113] In some embodiments, the first load lower limit threshold N0 is calculated based on the load base 01 with the smallest weight carried by the cache device 100, that is, the value of the weight carried by each support base 102 when the load base 01 with the smallest weight is stably placed on the cache device 100.

[0114] In some embodiments, the first load lower limit threshold N0 is related to the weight of the load-bearing base 01 held by the transfer device 1. The main control device 5 pre-stores the correspondence data between the load-bearing bases 01 that can be accommodated in each process chamber 3 and their weight and the first load lower limit threshold N0. After the main control device 5 determines the information of the load-bearing base 01 accommodated in the corresponding process chamber 3 from which the load-bearing base 01 needs to be transferred out through step S2, the first load lower limit threshold N0 is obtained in the correspondence data based on the information.

[0115] In some embodiments, a load-bearing sensor device is provided on the transfer device 1, which can obtain and feed back the weight of the clamped load-bearing base 01 to the main control device 5. The main control device 5 obtains and obtains the corresponding first load-bearing lower limit threshold value based on the weight of the load-bearing base 01 sent by the transfer device 1 and the correspondence data between the pre-stored load-bearing base weight and the first load-bearing lower limit threshold value.

[0116] In order to reduce or avoid the instability of the center of gravity of the bearing base 01 due to the large height difference between the support bases 102, the main control device 5 controls the transfer device 1 through step S31 to place the bearing base 01 to be transferred on the buffer device 100 with the adjusted bearing area size, and after maintaining the holding relationship with the bearing base 01, execute step S32 to judge the first bearing lower limit threshold and the load-bearing difference threshold range to ensure that the center of gravity of the bearing base 01 is stable after executing step S33. Specifically, refer to Figure 4, the first lower limit threshold of the four support seats 102 is N0 and the height is consistent. When the bearing base 01 is stably supported by each support seat 102, the loads of each support seat 102 are N1, N2, N3 and N4, and N1, N2, N3 and N4 are all greater than or equal to N0, and the difference in the load values ​​of any two support seats, such as (N1-N2), (N4-N1), etc., are within the range of the load difference minus the threshold, it is considered that the bearing area plays a role in stably supporting the bearing base 01.

[0117] Furthermore, the stable support of the bearing base 01 by each support seat 102 is the result of the joint action of each support seat 102, and the bottom surface of the bearing base 01 is not completely flat in some cases. Therefore, it is more time-saving and safer and more reliable to judge and adjust each support seat 102 to jointly achieve stable support for the bearing base 01 through the load-bearing value.

[0118] In some embodiments, the main control device 5 also stores a second load-bearing lower limit threshold value that is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value. After step S31 is executed, the main control device 5 obtains and determines, based on each load-bearing value, that the load-bearing values ​​of the M support seats 102 are greater than or equal to the second load-bearing lower limit threshold value and less than the first load-bearing lower limit threshold value, and after the load-bearing values ​​of the remaining support seats 102 are greater than or equal to the first load-bearing lower limit threshold value, step S33 is executed, and then the main control device 5 performs micro-motion lifting and lowering adjustments on the M support seats 102 until step S32 is satisfied, where M is an integer greater than or equal to 1 and less than the number of support seats. Since the load-bearing value of each support seat 102 is greater than or equal to the second load-bearing lower limit threshold, and the second load-bearing lower limit threshold is not less than 5% of the first load-bearing lower limit threshold, it means that each support seat 102 has formed a load-bearing relationship with the bottom surface of the bearing base 01, and there will be no risk of the bearing base 01 falling due to failure to be placed after being placed toward the bearing area due to the mismatch between the area of ​​the load-bearing area and the size of the bottom surface of the bearing base 01, or the risk of sliding due to significant unevenness after placement. In this case, it is only necessary to adjust the support seats 102 whose load-bearing values ​​are greater than or equal to the second load-bearing lower limit threshold and less than the first load-bearing lower limit threshold. Therefore, the transfer device 1 can first release the holding relationship with the bearing base 01 through step S33. At this time, the bearing base 01 can be supported by each support seat without falling. In this case, in order to further facilitate the stable support of the bearing base 01, the main control device 5 is used to perform micro-lifting and lowering adjustments until the main control device 5 determines that the load-bearing value of each support seat 102 meets the requirements of step S32. The micro-motion lifting adjustment can use the height of one of the support seats 102 whose load-bearing value is greater than the first load-bearing lower limit threshold as the reference height, and adjust the heights of the M support seats 102 to be adjusted in sequence. In some embodiments, the height adjustment sequence of the support seats 102 is based on the diagonal principle. For example, the height of one of the support seats 102 (recorded as the first support seat) is used as the reference, and the next support seat 102 to be adjusted is the support seat that is diagonally related to the first support seat. In some embodiments, in the process of micro-adjusting the target support seat 102, appropriate step-by-step control can be performed, that is, adjusting part of the height each time, which is more conducive to the stable placement of the bearing base 01 during the micro-adjustment process without slipping.

[0119] In some embodiments, after step S31 is executed, the main control device 5 obtains and determines that the load-bearing value of at least one support seat 102 is less than the second load-bearing lower limit threshold value based on the load-bearing value of each support seat 102 received, and then controls the transfer device 1 to maintain the holding relationship with the bearing base 01, and controls the transfer device 1 to move away from the transfer room 2 with the bearing base 01, and then the main control device 5 performs lifting and lowering adjustment on at least one support seat 102. When the main control device 5 determines that the load-bearing value of a support seat 102 is less than the second load-bearing lower limit threshold value, it means that the bearing relationship between the support seat 102 and the bearing base is not strong or there is no contact relationship, which makes it easy for the bearing base 01 to fall from the bearing area due to the inability to support stably. In this case, if the bearing base 01 is placed first and then the lifting and lowering adjustment is performed directly, it is easy for the bearing base 01 to be unable to be stably supported on the bearing area.

[0120] In some embodiments, the support seat 102 includes a lifting body 1021 and a support body 1022 movably mounted around the lifting body 1021, the heights of the support bodies 1022 are consistent, and each lifting body 1021 is provided with a load-bearing sensor device, and each lifting body 1021 is in communication with the main control device 5. The step of the main control device 5 performing lifting and adjusting at least one support seat 102 includes: the main control device 5 performs lifting and adjusting on each lifting body 1021 on the cache device 100 until each lifting body 1021 is in the same height as the corresponding support body 1022. In another embodiment, the step of the main control device 5 performing lifting and adjusting on at least one support seat 102 includes: the main control device 5 performs lifting and adjusting on each lifting body 1021 on the cache device 100 until each lifting body 1021 is accommodated in the corresponding support body 1022, so that the bearing base 01 can be stably supported by each supporting body 1022 of the same height. Compared with the solution of readjusting the heights of the lifting bodies 1021 to be consistent, the above control method does not need to judge whether the heights of the lifting bodies 1021 are consistent, which is more time-saving for achieving stable support of the supporting base 01.

[0121] In some embodiments, the lifting body 1021 is provided with a load-bearing sensing device. When the top surface of each lifting body 1021 is controlled to be flush with the top surface of the corresponding supporting body 1022, the transfer device 1 holds the carrying base 01 again and places it on the carrying area surrounded by each supporting seat 102. The main control device 5 can also detect the load-bearing condition of each supporting seat 102, so as to further judge and confirm whether the top surface of each lifting body 1021 is flush with the top surface of the corresponding supporting body 1022 or whether each lifting body 1021 is accommodated in the corresponding supporting body 1022, so as to further ensure the accuracy of the judgment.

[0122] In one embodiment, if Fig. 9 or Fig.10As shown, at least one transfer buffer cavity 201 is disposed in the transfer chamber 2, and the buffer device 100 is disposed in the transfer buffer cavity 201. Fig.12 and Fig.13 As shown, after step S3 is executed, the main control device 5 controls each support seat 102 to rise synchronously so that each support seat 102 rises to the set upper limit position to prevent the transfer device 1 holding the supporting base 01 from entering the space between the upper limit position and the inner top wall of the transfer buffer cavity 201.

[0123] Among them, Fig.13 As shown, after each support base 102 rises synchronously to the set upper limit position, the height of the empty space above the carrying base 01 can prevent the transfer device 1 holding other carrying bases 01 from entering again, thereby preventing the transfer device 1 holding other carrying bases 01 from entering the empty space and stacking the carrying base 01 it holds on the carrying base 01 that has been placed in the carrying area, thereby preventing the problem of stacking.

[0124] In this embodiment, if Figure 2 As shown, the transfer device 1 may include a clamping device 11 for clamping the side wall of the carrier base 01 and having an adjustable clamping size. Therefore, in step S3, the step in which the main control device 5 controls the transfer device 1 to transfer the carrier base in the process chamber 3 to the transfer chamber 2 may include: the main control device 5 obtains and controls the clamping device 11 to adjust the clamping size to match the size of the carrier base 01 to be transferred according to the received size information of the carrier base, and then controls the clamping device 11 to clamp the carrier base 01 to be transferred and transfer it to the transfer chamber 2.

[0125] In this embodiment, if Fig.11 As shown, the semiconductor processing system may further include a pre-processing chamber 6 and a shipping device 7 , and the shipping device 7 is provided with a cache device 100 .

[0126] In some embodiments, the pre-treatment chamber 6 , the transfer chamber 2 and the process chamber 3 are arranged around the transfer device 1 .

[0127] In some embodiments, before executing step S1, the following steps are also included:

[0128] S01, the main control device 5 obtains and determines the process chamber 3 that needs to be transferred to the supporting base 01 according to the received information of the transfer device 1 or the information of at least one process chamber 3;

[0129] S02, the main control device 5 obtains and controls the buffer device 100 provided in the shipping device 7 to adjust the size of the corresponding carrying area according to the size information of a process chamber to be transferred into the carrying base that can accommodate the carrying base 01;

[0130] S03, placing a bearing base 01 that matches the size of the bearing area on the shipping device on the corresponding bearing area;

[0131] S04, the main control device 5 controls the shipping device 7 to transport the supporting base 01 to the pre-processing chamber 6.

[0132] In some embodiments, after step S04 is executed, the wafer is placed on the supporting base 01 in the pre-processing chamber 6 , and then the main control device 5 controls the transfer device 1 to transfer the supporting base 01 loaded with the wafer to the corresponding process chamber 3 .

[0133] In some more specific embodiments, the shipping device 7 is a movable pallet, such as a pallet provided with a robotic arm.

[0134] In some specific embodiments, the pre-processing chamber 6 is a glove box.

[0135] In step S01 of some embodiments, after the main control device 5 controls the transfer device 1 to move the supporting base 01 in the process chamber 3 out of the process chamber 3, the main control device 5 will receive corresponding information fed back by the transfer device 1. The main control device 5 determines that the process chamber 3 needs to be transferred into the supporting base 01 based on the corresponding information fed back by the transfer device 1.

[0136] In some embodiments, each process chamber 3 is provided with a visual device 4, and in step S01, the main control device 5 determines the process chamber 3 that needs to be transferred into the carrier base 01 according to the information sent by the visual device 4 of each process chamber 3. Specifically, after the transfer device 1 transfers the carrier base in the process chamber 3, the main control device 5 obtains the image information in the process chamber 3 through the visual device 4 in the process chamber 3; when the main control device 5 determines that the process chamber 3 does not contain the carrier base according to the image information obtained by the visual device 4, it determines that the process chamber 3 is the process chamber 3 that needs to be transferred into the carrier base.

[0137] In some embodiments, the main control device 5 can inject an inert purge gas (such as nitrogen) into the corresponding process chamber 3 according to the control gas injection device 31, and control the rotating device 33 to gradually decelerate to a stop state and then move along the axial direction of the process chamber 3 to a suitable position to determine the process chamber 3 that needs to be transferred to the carrier base 01 at the time node, or can control the pressure control device and the exhaust device 35 so that the pressure difference between the inside and outside of the process chamber 3 meets the transfer requirements to determine the process chamber 3 that needs to be transferred to the carrier base 01 at the time node, that is, when the carrier base 01 of the process chamber 3 has not been transferred out, it is judged in advance according to the process beat that the process chamber 3 needs to be transferred to other carrier bases 01 later, so that the time node of the subsequent execution of transferring the carrier base 01 from the process chamber 3 coincides with or is not much different from the time node of the above-mentioned S04 execution, thereby improving efficiency. The specific judgment node can be reasonably set according to the efficiency requirements of the process for processing different batches of materials.

[0138] In step S02 of some embodiments, the main control device 5 pre-stores the size information of the carrier base 01 that can be accommodated in each process chamber 3, that is, the correspondence between the size information of the process chamber and the carrier base. When the main control device 5 determines through step S01 that the process chamber 3 that needs to be transferred to the carrier base 01 is required, the corresponding carrier base size information is obtained by comparing it with the pre-stored correspondence between the size information of the process chamber and the carrier base.

[0139] In step S03 of some embodiments, the main control device 5 controls the transfer device 1 to place the load-bearing base 01 to be transferred on the buffer device 100 of the shipping device 7 whose load-bearing area size has been adjusted. The transfer device 1 that performs step S03 and the transfer device 1 that performs steps S2 and S3 can be the same transfer device or different transfer devices. The specific selection is necessary to facilitate the production line efficiency of the semiconductor processing system.

[0140] In step S04 of some embodiments, the main control device 5 controls the shipping device 7 to carry the supporting base 01 to the pre-processing chamber 6 .

[0141] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for conveying a bearing base, characterized in that: include: S0. Provide semiconductor processing system; The semiconductor processing system comprises at least a transfer device, a transfer chamber, at least two process chambers and a main control device; The transfer chamber is provided with a cache device for placing a bearing base and having an adjustable bearing area size; each of the process chambers contains a bearing base, and at least some of the process chambers contain bearing bases of different sizes, and the main control device is connected to each of the process chambers, the transfer device, and the cache device for communication; S1, the main control device obtains and determines the process chamber that needs to perform the step of transferring the carrier base out through the received information of at least one process chamber; S2, the main control device controls the transfer device to transfer the carrying base in the process chamber to the transfer chamber, and the main control device obtains and controls the cache device to adjust the size of the carrying area to match the size of the carrying base according to the received size information of the carrying base; S3. The main control device controls the transfer device to place the bearing base on the cache device with the bearing area size adjusted.

2. The method for transporting a carrier base according to claim 1, characterized in that: The cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, and the cache device also includes a driving mechanism that is communicatively connected to the main control device and connected to each of the support seats; In step S2, the main control device acquires and controls the cache device to adjust the size of the bearing area to match the size of the bearing base according to the received size information of the bearing base, including: The main control device sends a bearing area size adjustment instruction to the driving mechanism based on the size information of the bearing base. In response to the bearing area size adjustment instruction, the driving mechanism drives at least one of the support seats to slide along the extension direction corresponding to the linear displacement mechanism until the top of each support seat forms a bearing area for placing the bearing base.

3. The method for transporting a bearing base according to claim 2, characterized in that: The cache device includes a positioning device that is communicatively connected to the main control device; In step S2, the main control device sends a bearing area size adjustment instruction to the driving mechanism according to the size information of the bearing base, including: The positioning device obtains and sends the position information of each support seat to the main control device; The main control device sends the bearing area size adjustment instruction to the driving mechanism according to the position information of each of the support seats and the size information of the bearing base.

4. The method for transporting a carrier base according to claim 1, characterized in that: The main control device stores a first load-bearing lower limit threshold and a load-bearing difference threshold range, and the cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, each of the support seats is a liftable support seat and is provided with a load-bearing sensor device that is communicatively connected to the main control device; In step S3, the main control device controls the transfer device to place the bearing base on the cache device with the bearing area size adjusted, including: S31, the main control device controls the transfer device to place the carrying base on the cache device with the adjusted carrying area size, and enables the transfer device to maintain a holding relationship with the carrying base; S32, the main control device obtains and determines, based on the load-bearing values ​​sent by each load-bearing sensor device, that the load-bearing value of each support seat is greater than or equal to the first load-bearing lower limit threshold, and the difference between the load-bearing values ​​of any two support seats is within the range of the load-bearing difference minus the threshold; S33, the main control device controls the transfer device to release the holding relationship with the carrying base.

5. The method for transporting a bearing base according to claim 4, characterized in that: The main control device further stores a second load-bearing lower limit threshold value which is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value; After the step S31 is executed, the main control device obtains and determines, based on each of the load-bearing values, that the load-bearing values ​​of the M support seats are greater than or equal to the second load-bearing lower limit threshold and less than the first load-bearing lower limit threshold, and the load-bearing values ​​of the remaining support seats are greater than or equal to the first load-bearing lower limit threshold, and executes the step S33. Then the main control device performs micro-motion lifting and lowering adjustments on the M support seats until the step S32 is satisfied; wherein M is an integer greater than or equal to 1 and less than the number of support seats.

6. The method for transporting a carrier base according to claim 4, characterized in that: The main control device further stores a second load-bearing lower limit threshold value which is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value; After the step S31 is executed, the main control device obtains and determines, based on the received load-bearing values, that the load-bearing value of at least one of the support seats is less than the second load-bearing lower limit threshold, and then controls the transfer device to carry the supporting base away from the transfer room, and then the main control device raises and lowers at least one of the support seats.

7. The method for transporting a carrier base according to claim 6, characterized in that: The support seat comprises a lifting body and a supporting body movably mounted around the lifting body, the heights of the supporting bodies are consistent, each lifting body is provided with the load-bearing sensor device, and each lifting body is connected to the main control device for communication; The step of the main control device adjusting the lifting and lowering of at least one of the support bases comprises: The main control device controls the lifting of each lifting body on the cache device until each lifting body is consistent in height with the corresponding supporting body or is accommodated in the corresponding supporting body.

8. The method for transporting a carrier base according to claim 1, characterized in that: At least one transfer cache cavity is arranged in the transfer chamber, the cache device is arranged in the transfer cache cavity, the cache device comprises a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a liftable support seat, and the main control device is communicatively connected to each of the support seats; After step S3 is executed, the main control device controls each of the support bases to rise synchronously so that each of the support bases rises to a set upper limit position to prevent the transfer device holding the supporting base from entering the space between the upper limit position and the inner top wall of the transfer cache cavity.

9. The method for transporting a carrier base according to claim 1, characterized in that: The semiconductor processing system further includes a pre-processing chamber and a shipping device, wherein the shipping device is provided with the cache device which is communicatively connected to the main control device; Before executing step S1, the following steps are also included: S01, the main control device obtains and determines the process chamber that needs to be transferred to the supporting base according to the received information of the transfer device or the information of at least one of the process chambers; S02, the main control device obtains and controls the buffer device provided in the shipping device to adjust the size of the corresponding carrying area according to the size information of the carrying base that can be accommodated by the process chamber to which the carrying base is to be transferred; S03, placing the bearing base matched with the size of the bearing area on the shipping device on the corresponding bearing area; S04: The main control device controls the shipping device to transport the supporting base into the pre-processing chamber.

10. The method for transporting a carrier base according to claim 1, characterized in that: Also included are a plurality of visual devices that are communicatively connected to the main control device and are disposed in each of the process chambers; In step S1, the main control device obtains and determines the process chamber that needs to perform the step of transferring the carrier base out through the received information of at least one process chamber, including: The main control device acquires image information in the process chamber through the visual device in the process chamber; When the main control device determines that the process chamber does not contain a carrier base based on the image information obtained by the visual device, the main control device determines that the process chamber is the process chamber that needs to be transferred into the carrier base.

11. A semiconductor processing system, characterized in that: The semiconductor processing system includes a transfer device, a transfer chamber, at least two process chambers and a main control device; a cache device for placing a supporting base and having an adjustable supporting area size is arranged inside the transfer chamber; the sizes of the supporting bases accommodated in at least some of the process chambers are different, and the main control device is communicatively connected with each of the process chambers, the transfer device and the cache device.

12. The semiconductor processing system according to claim 11, characterized in that: The cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, and the cache device also includes a driving mechanism that is communicatively connected to the main control device and connected to each of the support seats.

13. The semiconductor processing system according to claim 11, wherein: The cache device includes a positioning device that is communicatively connected to the main control device.

14. The semiconductor processing system according to claim 11, wherein: Each of the process chambers is provided with a visual device that is communicatively connected to the main control device.

15. The semiconductor processing system according to claim 12, wherein: The support seat includes a lifting body and a supporting body movably mounted around the lifting body. Each lifting body is provided with a load-bearing sensor device, and each lifting body is communicatively connected with the main control device.

16. The semiconductor processing system according to claim 11, wherein: It also includes at least one shipping device, which is provided with at least one cache device that is communicatively connected to the main control device.

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