High-integrated-power module system composed of plastic package single tubes and capable of expanding wiring

Abstract

The invention relates to a high-integration-power module system composed of plastic package single tubes and capable of expanding wiring. The high-integration-power module system comprises a PCB and at least one plastic package single tube. The plastic package single tube is embedded in the PCB; the surface of the PCB is provided with wiring terminal groups, and the wiring terminals in each wiring terminal group are electrically connected with the corresponding pins in the corresponding plastic package single tube. The power density is high, high voltage and large current can be covered, and multiple dies are connected in parallel; the expansibility is high, and the range of industrial and vehicle gauge power modules can be covered; the cost can be reduced; the integration level is high, and active and passive devices can be integrated; the parasitic stray inductance is very low and can be about 1nH, and the loss can be reduced; meanwhile, the thermal resistance can be further reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit manufacturing, and in particular to a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring. Background Art

[0002] With the development trend of high frequency and high speed, high voltage and high current, high temperature, high heat dissipation and high reliability of IGBT / SiC power modules, the IGBT / SiC power module packaging technology based on packaging structure and packaging materials is also constantly updated. Compared with the packaging structure, the characteristics of IGBT / SiC power module packaging materials are mainly high heat dissipation and high reliability requirements of ceramic copper-clad substrates, heat dissipation base plates, adhesive materials, interconnection materials and potting materials to meet the application requirements of IGBT / SiC power modules.

[0003] Integration and miniaturization: With the advancement of technology, the requirements for device size and integration are getting higher and higher. In the future, IGBT technology will develop in the direction of miniaturization and high integration, or be gradually replaced by SiC to achieve more compact circuit design and more efficient energy conversion.

[0004] After summarizing, there are the following deficiencies:

[0005] 1. The internal connection of the existing module relies on copper wire, aluminum wire, clip, etc. The path is long and will cause noise problems. If the process is copper wire, DTS must be added for wire buffering, which is costly;

[0006] 2. The module process is complex, and some process defects are not easy to be discovered, which will cause potential reliability risks;

[0007] 3. Low integration. Modules, components and control boards in the system are welded separately in relative positions, which occupies a large area, has high cost and high reliability risk. Summary of the invention

[0008] The purpose of this patent is to provide a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring.

[0009] It includes a PCB board and at least one plastic-encapsulated single tube;

[0010] The plastic-sealed single tube is embedded in the PCB board;

[0011] The surface of the PCB board is provided with a terminal group, and the terminals in each terminal group are electrically connected to corresponding pins in the corresponding plastic-sealed single tube.

[0012] Furthermore, it also includes a heat sink, the lower surface of the PCB board is provided with a thermally conductive insulating layer, and the heat sink is mounted on the lower surface of the PCB board through the thermally conductive insulating layer.

[0013] Specifically, the plastic-encapsulated single tube includes at least one chip, a metal conductive layer, a lead frame and a plastic encapsulation body;

[0014] The chip is arranged on the lead frame, and metal conductive medium is arranged on both sides of the chip;

[0015] The S pole and the G pole on the chip are electrically connected to the corresponding pins on the lead frame through a metal conductive medium;

[0016] The D pole on the chip is electrically connected to the metal conductive layer through a metal conductive medium;

[0017] The plastic package body covers the chip, the metal conductive layer and the lead frame, and the surface of the metal conductive layer and the surface of the lead frame are exposed outside the plastic package body.

[0018] Specifically, the plastic-encapsulated single tube includes at least one chip, a lead frame and a plastic encapsulation body;

[0019] The chip is arranged on the lead frame, and a metal conductive medium is arranged on the front side of the chip;

[0020] The S pole and the G pole on the front side of the chip are electrically connected to the corresponding pins on the lead frame through a metal conductive medium;

[0021] The plastic package covers the chip and the lead frame, and the back side of the chip and the surface of the lead frame are exposed outside the plastic package.

[0022] Specifically, the plastic-encapsulated single tube is embedded in the PCB board in a face-up or face-down manner.

[0023] Furthermore, the pins of the plastic-sealed single tube on the PCB are provided with channel holes, the channel holes are filled with a conductive medium, and the G pole and the S pole on the plastic-sealed single tube are electrically connected to the corresponding wiring terminals on the PCB through the conductive medium;

[0024] An insulating layer is provided between the channel hole and the copper layer in the PCB board, and the conductive medium in the channel hole is separated from the copper layer in the PCB board by the insulating layer.

[0025] Furthermore, the outlet of the channel hole corresponding to the D pole of the plastic-sealed single tube is directly mounted on the thermally conductive insulating layer.

[0026] Furthermore, the channel hole corresponding to the D pole of the plastic-encapsulated single tube extends to the surface of the PCB board, and the terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal, and the D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium in the channel hole.

[0027] Furthermore, it also includes a main board, which is electrically connected to the connection terminals in all the connection terminal groups.

[0028] Optionally, a distance is left between the main board and the PCB board.

[0029] Optionally, the main board is mounted on the upper surface of the PCB board and is located directly above the plastic-sealed single tube.

[0030] Optionally, the main board is mounted on one side of the upper surface of the PCB board, and there is no main board covering the upper portion of the plastic-sealed single tube.

[0031] Furthermore, the PCB board is also provided with active components and / or passive components.

[0032] Optionally, the chip is one or more power chips.

[0033] Specifically, the chip is an IGBT power chip and / or a SIC power chip.

[0034] Specifically, the PCB board has a structure of more than 2 layers.

[0035] Furthermore, the PCB board has a 6-layer structure.

[0036] Compared with the prior art, the highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring of the present invention has the following advantages:

[0037] (1) High power density, can cover high voltage and high current, and multiple dies in parallel; strong scalability, can cover the range of industrial and automotive power modules; cost can be reduced; high integration, can integrate active and passive devices; parasitic inductance is very low, can be achieved at about 1nH, loss can be reduced; at the same time, thermal resistance can be further reduced;

[0038] (2) The above-mentioned change in the power module structure results in a shorter process flow, fewer material varieties, and a shorter production cycle;

[0039] (3) The copper-clad drilling process is used in the PCB board to achieve the shortest path, without the need for wire bonding and DTS processes, and the cost is low;

[0040] (4) Directly coupling the structures through interconnection technology eliminates the inductance problem caused by long wires, which can significantly improve electrical performance and possibilities;

[0041] (5) High integration. Through interconnection technology, the corresponding pins can be connected to passive and main components, and can also be connected to the motherboard to form an integrated whole, which greatly reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 1;

[0043] Figure 2 The structure of the plastic-sealed single tube in Example 1 is shown in FIG. Figure 1 ;

[0044] Figure 3 The structure of the plastic-sealed single tube in Example 1 is shown in FIG. Figure 2 ;

[0045] Figure 4 A schematic diagram of the structure of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 2;

[0046] Figure 5 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 3;

[0047] Figure 6 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 4;

[0048] Figure 7 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 5;

[0049] Figure 8 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 6;

[0050] Fig. 9 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 7;

[0051] Fig.10 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 8;

[0052] Fig.11 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 9;

[0053] Fig.12 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 10;

[0054] Fig.13 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 11;

[0055] Fig.14 This is a schematic diagram of the structure of a plastic-sealed single tube in Example 12;

[0056] Fig.15 This is a schematic structural diagram of a plastic-sealed single tube in Example 12 without a metal conductive layer;

[0057] Fig.16 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 13;

[0058] Fig.17 This is a schematic structural diagram of a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring according to Example 14. DETAILED DESCRIPTION

[0059] The specific implementation methods of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0060] Example 1

[0061] In this embodiment, if Figure 1 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring includes a PCB board 1, a plastic-encapsulated single tube 2 and a heat sink 3; the number of the plastic-encapsulated single tube 2 is one.

[0062] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0063] The surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0064] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0065] In this embodiment, if Figure 2 As shown, the plastic-encapsulated single tube 2 includes a chip 6, a metal conductive layer 7, a lead frame 8 and a plastic encapsulation body 9;

[0066] The chip 6 is arranged on the lead frame 8, and both sides of the chip 6 are provided with a metal conductive medium 10;

[0067] The S pole and the G pole on the chip 6 are electrically connected to the corresponding pins on the lead frame 8 through the metal conductive medium 10;

[0068] The D pole on the chip 6 is electrically connected to the metal conductive layer 7 through the metal conductive medium 10;

[0069] The plastic package 9 covers the chip 6 , the metal conductive layer 7 and the lead frame 8 , and the surface of the metal conductive layer 7 and the surface of the lead frame 8 are both exposed outside the plastic package 9 .

[0070] In addition, the plastic-sealed single tube may not be provided with the metal conductive layer 7. Figure 3 As shown;

[0071] The chip 6 is arranged on the lead frame 8, and a metal conductive medium 10 is arranged on the front side of the chip 6;

[0072] The S pole and G pole on the front side of the chip 6 are electrically connected to the corresponding pins on the lead frame 8 through the metal conductive medium 10;

[0073] The plastic package 9 covers the chip 6 and the lead frame 8 , and the back side of the chip 6 and the surface of the lead frame 8 are exposed outside the plastic package 9 .

[0074] In this embodiment, the plastic-encapsulated single tube is embedded in the PCB board.

[0075] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal on the PCB board 1 through the conductive medium 12;

[0076] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0077] In this embodiment, the outlet of the channel hole corresponding to the D pole of the plastic-sealed single tube 2 is directly mounted on the thermally conductive insulating layer 5 .

[0078] In this embodiment, the chip 6 is an IGBT, which may be a power chip and / or a SIC power chip.

[0079] In this embodiment, if Figure 1 As shown, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board have a total of 6 layers, and are arranged in sequence and at intervals).

[0080] The plastic-encapsulated single tube is embedded in the PCB board, and then a hole is punched at a specific position by means of laser or other means, and copper is covered in the hole for electrical connection;

[0081] In the 3D structure, the shortest path can be taken, and the copper is surrounded by insulating material, which can wrap the wiring very well, achieving the purpose of less noise, excellent electrical properties and good reliability.

[0082] The materials and processes of PCB boards and main boards are similar, so they can be used as a whole product. Different components can be connected through the free leads in the PCB, greatly improving the integration of the product.

[0083] Example 2

[0084] like Figure 4 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring includes a PCB board 1, a plastic-encapsulated single tube 2 and a heat sink 3;

[0085] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0086] The surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0087] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0088] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0089] Optionally, the plastic-sealed single tube 2 is embedded in the PCB board 1 .

[0090] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal on the PCB board 1 through the conductive medium 12;

[0091] An insulating layer 14 is provided between the channel hole and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0092] The channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube 2 is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0093] In this embodiment, the chip 6 is an IGBT power chip and / or a SIC power chip.

[0094] In this embodiment, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board have a total of 6 layers, and are arranged in sequence and at intervals).

[0095] Example 3

[0096] like Figure 5 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0097] It includes a PCB board 1, two plastic-sealed single tubes 2 and a radiator 3;

[0098] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0099] The surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0100] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0101] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0102] In this embodiment, the plastic-sealed single tube 2 is embedded in the PCB board 1 .

[0103] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube are electrically connected to the corresponding terminal on the PCB board through the conductive medium;

[0104] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0105] In this embodiment, the outlet of the channel hole 11 corresponding to the D pole of the plastic-sealed single tube 2 is directly mounted on the thermally conductive insulating layer 5 .

[0106] In this embodiment, the chip is an IGBT power chip and / or a SIC power chip, which is configured according to actual needs.

[0107] In this embodiment, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board 1 have a total of 6 layers, and are arranged in sequence and at intervals).

[0108] Example 4

[0109] like Figure 6 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0110] It includes a PCB board 1, two plastic-sealed single tubes 2 and a radiator 3;

[0111] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0112] The upper surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0113] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0114] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0115] In this embodiment, the plastic-sealed single tube 2 is embedded in the PCB board 1 .

[0116] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal 4 on the PCB board 1 through the conductive medium 12;

[0117] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0118] In this embodiment, the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube 2 is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0119] In this embodiment, the chip 6 is an IGBT power chip and / or a SIC power chip.

[0120] In this embodiment, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board 1 have a total of 6 layers, and are arranged in sequence and at intervals).

[0121] Example 5

[0122] like Figure 7 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0123] It includes a PCB board 1, a plastic-sealed single tube 2 and a radiator 3;

[0124] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0125] The upper surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0126] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0127] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0128] In this embodiment, if Figure 7 As shown, the plastic-encapsulated single tube 2 is flip-chip embedded in the PCB board 1.

[0129] In the preparation of this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12. The G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal 4 on the PCB board 1 through the conductive medium 12;

[0130] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0131] The channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0132] In this embodiment, the chip is an IGBT power chip and / or a SIC power chip.

[0133] In this embodiment, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board 1 have a total of 6 layers, and are arranged in sequence and at intervals).

[0134] Example 6

[0135] like Figure 8 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0136] It includes a PCB board 1, two plastic-sealed single tubes 2 and a radiator 3;

[0137] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0138] The upper surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0139] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0140] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0141] In this embodiment, if Figure 8 As shown, one plastic-encapsulated single tube is embedded in the PCB board 1 in a positive manner, and the other plastic-encapsulated single tube is embedded in the PCB board 1 in a flip-chip manner.

[0142] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal on the PCB board 1 through the conductive medium 12;

[0143] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0144] In this embodiment, the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0145] In this embodiment, in the inverted plastic-encapsulated single tube, the outlet of the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube is directly mounted on the thermally conductive insulating layer 5 .

[0146] In this embodiment, the chip 6 is an IGBT power chip and / or a SIC power chip.

[0147] In this embodiment, the PCB board 1 has a 6-layer structure.

[0148] Example 7

[0149] like Fig. 9 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0150] It includes a PCB board 1, two plastic-sealed single tubes 2 and a radiator 3;

[0151] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0152] The upper surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0153] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0154] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0155] In this embodiment, if Fig. 9 As shown, one plastic-encapsulated single tube is embedded in the PCB board 1 in a positive manner, and the other plastic-encapsulated single tube is embedded in the PCB board 1 in a flip-chip manner.

[0156] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube, and the channel hole 11 is filled with a conductive medium 12. The G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal 4 on the PCB board 1 through the conductive medium 12.

[0157] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0158] In this embodiment, in the upright and inverted plastic-encapsulated single tubes, the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal, and the D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium in the channel hole.

[0159] In this embodiment, the chip 6 is an IGBT power chip and / or a SIC power chip.

[0160] In this embodiment, the PCB board 1 has a 6-layer structure.

[0161] Example 8

[0162] like Fig.10 , a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0163] It includes a PCB board 1, two plastic-sealed single tubes 2 and a radiator 3;

[0164] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0165] The upper surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0166] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0167] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0168] In this embodiment, if Fig.10As shown, one plastic-encapsulated single tube is embedded in the PCB board 1 in a positive manner, and the other plastic-encapsulated single tube is embedded in the PCB board 1 in a flip-chip manner.

[0169] The PCB board 1 is provided with channel holes 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel holes 11 are filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding wiring terminals on the PCB board 1 through the conductive medium;

[0170] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0171] In this embodiment, in the inverted plastic-encapsulated single tube, the outlet of the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube is directly mounted on the thermally conductive insulating layer 5 .

[0172] In this embodiment, in the inverted plastic-encapsulated single tube, the channel hole corresponding to the D pole of the plastic-encapsulated single tube extends to the surface of the PCB board, and the terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0173] In this embodiment, the chip 6 is an IGBT power chip and / or a SIC power chip.

[0174] In this embodiment, the PCB board 1 has a four-layer structure.

[0175] Example 9

[0176] like Fig.11 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0177] It includes a PCB board 1, two plastic-sealed single tubes 2 and a radiator 3;

[0178] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0179] The upper surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0180] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0181] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0182] In this embodiment, if Fig.11 As shown, one plastic-encapsulated single tube is embedded in the PCB board 1 in a positive manner, and the other plastic-encapsulated single tube is embedded in the PCB board 1 in a flip-chip manner.

[0183] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal on the PCB board 1 through the conductive medium 13;

[0184] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0185] In this embodiment, in the upright and inverted plastic-encapsulated single tube, the channel hole 11 corresponding to the D pole extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0186] In this embodiment, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring also includes a mainboard 16, and the mainboard 16 is electrically connected to the terminals in all the terminal groups. Furthermore, a gap is left between the mainboard 16 and the PCB board 1, and an external cooling fan can blow in cold air to improve the heat dissipation effect.

[0187] In this embodiment, the PCB board 1 is further provided with active components 17 and passive components 18, which are designed according to actual needs.

[0188] In this embodiment, the chip 6 is an IGBT power chip and / or a SIC power chip.

[0189] In this embodiment, the PCB board 1 has a 6-layer structure.

[0190] Example 10

[0191] like Fig.12 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0192] It includes a PCB board 1, two plastic-sealed single tubes 2 and a radiator 3;

[0193] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0194] The upper surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0195] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0196] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0197] In this embodiment, if Fig.12 As shown, one plastic-encapsulated single tube is embedded in the PCB board 1 in a positive manner, and the other plastic-encapsulated single tube is embedded in the PCB board 1 in a flip-chip manner.

[0198] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal on the PCB board 1 through the conductive medium 13;

[0199] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0200] In this embodiment, in the upright and inverted plastic-encapsulated single tube, the channel hole 11 corresponding to the D pole extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0201] In this embodiment, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring also includes a mainboard 16, and the mainboard 16 is electrically connected to the terminals in all the terminal groups. The mainboard 16 is mounted on the surface of the PC B board 1 and is located directly above the plastic-encapsulated single tube 2. The function of the mainboard is that some signals and instructions are given to the module through the mainboard, such as opening or closing, which requires the mainboard to give instructions to the module before it can work.

[0202] In this embodiment, the PCB board 1 is further provided with active components 17 and passive components 18, which are designed according to actual needs.

[0203] In this embodiment, the chip 6 is an IGBT power chip and / or a SIC power chip.

[0204] In this embodiment, the PCB board 1 has a 6-layer structure.

[0205] Embodiment 11

[0206] like Fig.13 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring,

[0207] It includes a PCB board 1, a plastic-sealed single tube 2 and a radiator 3;

[0208] The plastic-sealed single tube 2 is embedded in the PCB board 1;

[0209] The surface of the PCB board 1 is provided with a terminal group, and the terminal 4 in each terminal group is electrically connected to the corresponding pins in the corresponding plastic-sealed single tube 2;

[0210] A heat-conducting insulating layer 5 is provided on the lower surface of the PCB board 1 , and the heat sink 3 is mounted on the lower surface of the PCB board 1 through the heat-conducting insulating layer 5 .

[0211] The structure of the plastic-sealed single tube in this embodiment is the same as that of the plastic-sealed single tube in Embodiment 1.

[0212] In this embodiment, if Fig.13 As shown, the plastic-sealed single tube is embedded in the PCB board 1.

[0213] In this embodiment, the PCB board 1 is provided with a channel hole 11 at the pins corresponding to the plastic-sealed single tube 2, and the channel hole 11 is filled with a conductive medium 12, and the G pole and the S pole on the plastic-sealed single tube 2 are electrically connected to the corresponding terminal on the PCB board 1 through the conductive medium 13;

[0214] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1 , and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14 .

[0215] In this embodiment, the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0216] In this embodiment, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring also includes a mainboard 16, and the mainboard 16 is electrically connected to the terminals in all the terminal groups. The mainboard 16 is mounted on one side of the upper surface of the PC B board 1, and there is no mainboard 16 covering the upper part of the plastic-encapsulated single tube 2. The heat in the area above the plastic-encapsulated single tube is the largest, so as to avoid affecting the mainboard.

[0217] In this embodiment, the chip 6 is an IGBT power chip and / or a SIC power chip.

[0218] In this embodiment, the PCB board 1 has a 6-layer structure.

[0219] Example 12

[0220] The inventors need to explain that two or more chips can be arranged in a plastic-sealed single tube according to actual needs, such as Fig.14 and Fig.15 shown.

[0221] Embodiment 13

[0222] In this embodiment, if Fig.16 As shown, the PCB board is a one-layer structure, namely, the PCB insulation layer, and the other structures are the same as those in Example 3.

[0223] Embodiment 14

[0224] In this embodiment, if Fig.17 As shown, the PCB board is a one-layer structure, namely, the PCB insulation layer, and the other structures are the same as those in Example 4.

[0225] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring, characterized in that: It includes a PCB board and at least one plastic-encapsulated single tube; The plastic-sealed single tube is embedded in the PCB board; The surface of the PCB board is provided with a terminal group, and the terminals in each terminal group are electrically connected to corresponding pins in the corresponding plastic-sealed single tube.

2. A highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring, characterized in that: It also includes a heat sink. The lower surface of the PCB board is provided with a heat-conducting insulating layer, and the heat sink is mounted on the lower surface of the PCB board through the heat-conducting insulating layer.

3. The highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring as claimed in claim 1, characterized in that: The plastic-encapsulated single tube comprises at least one chip, a metal conductive layer, a lead frame and a plastic encapsulation body; The chip is arranged on the lead frame, and metal conductive medium is arranged on both sides of the chip; The S pole and the G pole on the chip are electrically connected to the corresponding pins on the lead frame through a metal conductive medium; The D pole on the chip is electrically connected to the metal conductive layer through a metal conductive medium; The plastic package body covers the chip, the metal conductive layer and the lead frame, and the surface of the metal conductive layer and the surface of the lead frame are exposed outside the plastic package body.

4. The highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring as claimed in claim 1, characterized in that: The plastic-encapsulated single tube comprises at least one chip, a lead frame and a plastic-encapsulated body; The chip is arranged on the lead frame, and a metal conductive medium is arranged on the front side of the chip; The S pole and the G pole on the front side of the chip are electrically connected to the corresponding pins on the lead frame through a metal conductive medium; The plastic package covers the chip and the lead frame, and the back side of the chip and the surface of the lead frame are exposed outside the plastic package.

5. The highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 2, characterized in that: The plastic-encapsulated single tube is embedded in the PCB board in a positive or reverse manner.

6. The highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 5, characterized in that: The PCB board is provided with channel holes at the pins corresponding to the plastic-sealed single tube, and the channel holes are filled with a conductive medium, and the G pole and the S pole on the plastic-sealed single tube are electrically connected to the corresponding wiring terminals on the PCB board through the conductive medium; An insulating layer is provided between the channel hole and the copper layer in the PCB board, and the conductive medium in the channel hole is separated from the copper layer in the PCB board by the insulating layer.

7. The highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring as claimed in claim 6, characterized in that: The outlet of the channel hole corresponding to the D pole of the plastic-sealed single tube is directly mounted on the heat-conducting insulating layer.

8. The highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 6, characterized in that: The channel hole corresponding to the D pole of the plastic-encapsulated single tube extends to the surface of the PCB board, and the terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium in the channel hole.

9. A highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 5, 6, 7 or 8, characterized in that: It also includes a main board, which is electrically connected to the connection terminals in all the connection terminal groups.

10. The highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 9, characterized in that: A distance is left between the main board and the PCB board.

11. The highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 9, characterized in that: The main board is mounted on the upper surface of the PCB board and is located directly above the plastic-sealed single tube.

12. The highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring as claimed in claim 9, characterized in that: The main board is mounted on one side of the upper surface of the PCB board, and there is no main board covering the upper part of the plastic-sealed single tube.

13. The highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 9, characterized in that: The PCB board is also provided with active components and / or passive components.

14. The highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 9, characterized in that: The chip is one or more power chips.

15. The highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring as claimed in claim 14, characterized in that: The chip is an IGBT power chip and / or a SIC power chip.

16. The highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring as claimed in claim 1, characterized in that: The PCB board has a structure of more than 2 layers.

17. The highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring as claimed in claim 1, characterized in that: The PCB board has a 6-layer structure.

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