Plastic packaging machine for battery chip processing and method thereof

Abstract

The plastic packaging machine comprises a first plastic packaging mechanism, a second plastic packaging mechanism is arranged at the top of the first plastic packaging mechanism, a cleaning mechanism is arranged on the opposite sides of the first plastic packaging mechanism and the second plastic packaging mechanism, and a mounting frame is fixedly connected to the rear sides of the first plastic packaging mechanism and the second plastic packaging mechanism. The plastic packaging machine has the advantage that the plastic packaging mold is convenient to clean, and the problems that in the using process of an existing plastic packaging machine for battery chip processing, impurities remaining in the plastic packaging mold are inconvenient to clean, the impurities may cause bubbles and cavities to be generated in the filling process of a plastic packaging material, the defects may affect the integrity and sealing performance of packaging, and the packaging efficiency is poor are solved. And the performance and the reliability of the chip are further influenced.

Description

Technical Field

[0001] The present invention relates to the technical field of battery chip processing, in particular to a plastic packaging machine for battery chip processing and a method thereof. Background Art

[0002] The battery chip processing laminator is a device specially used to encapsulate the chip of the battery management system or other electronic components related to the battery. The main function of this laminator is to heat the plastic material and apply pressure so that the plastic material can tightly wrap the chip and its lead frame to form a solid protective shell, thereby protecting the internal chip from external environmental factors such as humidity, dust, chemicals, etc. This not only improves the physical strength and durability of the chip, but also enhances its reliability in various working environments.

[0003] During the use of existing battery chip processing plastic packaging machines, it is not convenient to clean the impurities remaining inside the plastic packaging mold. Impurities may cause bubbles and voids in the plastic packaging material during the filling process. These defects will affect the integrity and sealing of the package, and thus affect the performance and reliability of the chip. Summary of the invention

[0004] The purpose of the present invention is to provide a plastic packaging machine and method for battery chip processing, which has the advantage of being easy to clean the plastic packaging mold, and solves the problem that the existing plastic packaging machine for battery chip processing is not convenient for cleaning impurities remaining inside the plastic packaging mold during use. Impurities may cause bubbles and voids in the plastic packaging material during the filling process. These defects will affect the integrity and sealing of the package, and thus affect the performance and reliability of the chip.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a plastic sealing machine for processing battery chips, comprising a first plastic sealing mechanism, a second plastic sealing mechanism is arranged on the top of the first plastic sealing mechanism, a cleaning mechanism is arranged on the opposite side of the first plastic sealing mechanism and the second plastic sealing mechanism, and a mounting frame is fixedly connected to the rear sides of the first plastic sealing mechanism and the second plastic sealing mechanism.

[0006] As a preferred plastic packaging machine for battery chip processing of the present invention, the first plastic packaging mechanism includes a first plastic packaging mold, a first liquid cooling connection nozzle is connected to the right side of the first plastic packaging mold, a first cylinder is fixedly connected to the four corners of the bottom of the first plastic packaging mold, a support frame is fixedly connected to the bottom of the first cylinder, and the support frame is fixedly connected to the mounting frame.

[0007] As a preferred embodiment of a plastic packaging machine for processing a battery chip of the present invention, both left and right sides of the first plastic packaging mold are fixedly connected with sliding rods, and the sliding rods are movably connected to the support frame.

[0008] As a preferred plastic packaging machine for battery chip processing of the present invention, the bottom of the first plastic packaging mold is fixedly connected to a fixing frame, the four corners of the top of the fixing frame are fixedly connected to a second cylinder, the piston rod of the second cylinder is fixedly connected to a stripping plate, and a plurality of ejector rods are provided on the top of the stripping plate, and the ejector rods extend to the interior of the first plastic packaging mold.

[0009] As a preferred plastic packaging machine for battery chip processing of the present invention, the second plastic packaging mechanism includes a second plastic packaging mold, the right side of the second plastic packaging mold is connected to a second liquid cooling connection nozzle, the top center of the second plastic packaging mold is connected to a conveying auger, the top of the second plastic packaging mold is fixedly connected to a fixed plate, the fixed plate is fixedly sleeved on the surface of the conveying auger, and the fixed plate is fixedly connected to the mounting frame.

[0010] As a preferred plastic packaging machine for battery chip processing of the present invention, a first motor is fixedly connected to the top of the conveying auger, the output shaft of the first motor extends to the inner cavity of the conveying auger and is fixedly connected to a spiral rod, a feeding pipe is connected to the top of the surface of the conveying auger, a plurality of electric heating rings are fixedly provided on the surface of the conveying auger, a temperature sensor is fixedly installed on the right side of the conveying auger, and the detection end of the temperature sensor passes through the inner cavity of the conveying auger.

[0011] As a preferred plastic packaging machine for battery chip processing of the present invention, the cleaning mechanism includes two brush plates, the two brush plates are arranged oppositely, cleaning tubes are provided on the front and back sides of the brush plates, a plurality of nozzles are connected to the surface of the cleaning tube, a fixed sleeve is provided on the surface of the cleaning tube, and the fixed sleeve is fixedly connected to the brush plate.

[0012] As a preferred plastic packaging machine for battery chip processing of the present invention, the left side of the brush plate is fixedly connected to a rotating rod, the bottom of the rotating rod is rotatably connected to a base, the base is fixedly connected to the surface of the support frame, a second motor is fixedly installed on the base, the output shaft of the second motor is fixedly connected to a small gear, the top of the small gear is rotatably connected to a support member, the support member is fixedly installed on the top of the base, the surface of the small gear is meshed with a large gear, and the large gear is fixedly sleeved on the surface of the rotating rod.

[0013] As a preferred plastic sealing machine for battery chip processing of the present invention, the air inlet end of the cleaning tube is connected to a hose, the air inlet end of the hose is connected to an air inlet pipe, a flange is provided at the bottom of the air inlet pipe, and the air inlet pipe is fixedly connected to the surface of the base.

[0014] A plastic packaging method for battery chip processing, comprising the following steps:

[0015] S1. Place the battery chip to be packaged at a designated position of the first plastic encapsulation mold, and check whether the first plastic encapsulation mold and the second plastic encapsulation mold are clean and free of impurities;

[0016] S2, closing the mold, starting the first cylinder, so that the first plastic sealing mold moves upward and closes with the second plastic sealing mold, ensuring good sealing between the first plastic sealing mold and the second plastic sealing mold;

[0017] S3, heating and plastic packaging material delivery, start the first motor to drive the screw rod in the delivery auger to rotate, and deliver the plastic packaging material from the feeding pipe to the delivery auger. The electric heating ring heats the plastic packaging material in the delivery auger to make it reach an appropriate melting state. The temperature sensor monitors the temperature in the delivery auger to ensure that the temperature is within the set range:

[0018] S4, injecting the plastic encapsulation material, the molten plastic encapsulation material is transported to the injection port of the second plastic encapsulation mold by the conveying auger, and then injected into the cavity formed between the first plastic encapsulation mold and the second plastic encapsulation mold, and covers the battery chip to plastic encapsulate the battery chip. After the plastic encapsulation is completed, the first liquid cooling connection nozzle and the second liquid cooling connection nozzle are connected to the coolant to cool the first plastic encapsulation mold and the second plastic encapsulation mold, so that the plastic encapsulation material is quickly solidified;

[0019] S5, demoulding, the first cylinder is started to move the first plastic encapsulation mold downward and separate from the second plastic encapsulation mold, the second cylinder is started to push the demoulding plate upward, and the ejector pin ejects the solidified plastic encapsulation battery chip from the first plastic encapsulation mold;

[0020] S6. Clean the mold and start the second motor. The second motor drives the small gear to rotate. The small gear is transmitted through the large gear to rotate the rotating rod. The rotation of the rotating rod drives the brush plate to rotate. The brush on the brush plate cleans the surface of the first plastic sealing mold and the second plastic sealing mold. The cleaning tube is connected to the compressed air from the outside through the hose and the air inlet pipe, and the compressed air is sprayed through the nozzle to further remove the residue on the mold.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The sliding rods on the left and right sides of the first plastic sealing mold of the present invention are movably connected to the support frame, ensuring the stability and linearity of the first plastic sealing mold during the up and down movement, avoiding the packaging quality problem caused by offset, and the four first cylinders are distributed at the four corners of the bottom of the first plastic sealing mold, providing uniform support and stable up and down movement, ensuring the accuracy and stability of the first plastic sealing mold when closing and opening, and the first liquid cooling connection nozzle can be connected to the coolant to quickly cool the first plastic sealing mold and accelerate the curing process of the plastic sealing material, which not only improves the production efficiency, but also ensures the uniform cooling of the plastic sealing material and avoids deformation or cracks caused by uneven cooling. The four second cylinders on the top of the fixed frame are connected to the stripping plate, and the stripping plate is pushed up by the piston rod, and the ejector rod ejects the solidified plastic sealing body from the first plastic sealing mold. This design realizes automatic demolding, reduces manual intervention, and improves production efficiency and safety. The fixed frame at the bottom of the first plastic sealing mold not only provides additional support, but also facilitates installation and maintenance.

[0023] 2. The present invention can transport the plastic sealing material from the feeding pipe to the injection port of the second plastic sealing mold by setting a conveying auger. The first motor drives the spiral rod to rotate, ensuring that the plastic sealing material can be transported evenly and continuously, thereby improving the stability and efficiency of the plastic sealing process. A fixed sleeve on the surface of the conveying auger is provided with a plurality of electric heating rings, which can heat the plastic sealing material being transported to ensure that it reaches an appropriate molten state, which is convenient for filling the mold. The temperature sensor monitors the temperature to ensure precise control of the heating process and avoid changes in material properties caused by overheating or insufficient temperature. The distribution design of multiple electric heating rings can achieve uniform heating of the conveying auger, ensuring that the temperature of the plastic sealing material is consistent during the entire conveying process, thereby improving the fluidity and filling effect of the plastic sealing material. The second liquid cooling connection nozzle on the right side of the second plastic sealing mold can be connected to the coolant to quickly cool the mold and accelerate the curing process of the plastic sealing material. The fixed plate fixed sleeve is arranged on the surface of the conveying auger and is fixedly connected to the mounting frame to ensure the stability and positioning accuracy of the conveying auger.

[0024] 3. The two brush plates of the present invention are arranged oppositely, and can effectively brush the inside of the first plastic sealing mold and the second plastic sealing mold during the process of closing and opening the mold. The brushes on the brush plates can penetrate into the small gaps of the mold to remove residual plastic sealing materials and other impurities. The surface of the cleaning tube is connected to a plurality of nozzles, and the nozzles can spray compressed air to further remove the residues on the surface and inside of the mold. The high-speed jet of compressed air can effectively blow away fine particles and dust to ensure the cleanliness of the mold. The cleaning mechanism drives the small gear and the large gear through the second motor to rotate the brush plate to achieve automatic cleaning. Since the cleaning process is automated, it can be cleaned immediately after each plastic sealing is completed, reducing the downtime caused by manual cleaning and ensuring the continuous operation of the production line. Regular cleaning can prevent impurities from accumulating inside the mold, reduce scratches and wear on the mold surface, and extend the service life of the mold. In addition, cleaning the mold can ensure that the plastic sealing material will not produce bubbles and voids due to impurities during the filling process, thereby improving the integrity and sealing of the package. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the present invention;

[0026] Figure 2 The first plastic sealing mechanism of the present invention is schematically shown in FIG. Figure 1 ;

[0027] Figure 3 The first plastic sealing mechanism of the present invention is schematically shown in FIG. Figure 2 ;

[0028] Figure 4 It is a schematic diagram of the stripping plate structure of the present invention;

[0029] Figure 5 The second plastic sealing mechanism of the present invention is schematically shown in FIG. Figure 1 ;

[0030] Figure 6 The second plastic sealing mechanism of the present invention is schematically shown in FIG. Figure 2 ;

[0031] Figure 7 Schematic diagram of the cleaning mechanism structure of the present invention Figure 1 ;

[0032] Figure 8 Schematic diagram of the cleaning mechanism structure of the present invention Figure 2 .

[0033] In the figure: 1. first plastic sealing mechanism; 101. first plastic sealing mold; 102. fixing frame; 103. supporting frame; 104. first cylinder; 105. sliding rod; 106. ejector rod; 107. first liquid cooling connection nozzle; 108. second cylinder; 109. stripping plate; 2. second plastic sealing mechanism; 201. second plastic sealing mold; 202. fixing plate; 203. temperature sensor; 204. electric heating ring; 205. conveying auger; 206. first motor; 207. feeding pipe; 208. second liquid cooling connection nozzle; 3. cleaning mechanism; 301. brush plate; 302. cleaning pipe; 303. nozzle; 304. fixing sleeve; 305. base; 306. air inlet pipe; 307. hose; 308. second motor; 309. supporting member; 310. small gear; 311. large gear; 312. rotating rod; 4. mounting frame. DETAILED DESCRIPTION

[0034] Example 1

[0035] See also Figure 1-Figure 8 A plastic sealing machine for battery chip processing includes a first plastic sealing mechanism 1, a second plastic sealing mechanism 2 is arranged on the top of the first plastic sealing mechanism 1, a cleaning mechanism 3 is arranged on the opposite side of the first plastic sealing mechanism 1 and the second plastic sealing mechanism 2, and a mounting frame 4 is fixedly connected to the rear sides of the first plastic sealing mechanism 1 and the second plastic sealing mechanism 2.

[0036] Furthermore, the first plastic encapsulation mechanism 1 includes a first plastic encapsulation mold 101, the right side of the first plastic encapsulation mold 101 is connected to a first liquid cooling connection nozzle 107, the four corners of the bottom of the first plastic encapsulation mold 101 are fixedly connected to a first cylinder 104, the bottom of the first cylinder 104 is fixedly connected to a support frame 103, and the support frame 103 is fixedly connected to the mounting frame 4.

[0037] Furthermore, the left and right sides of the first plastic encapsulation mold 101 are fixedly connected with sliding rods 105 , and the sliding rods 105 are movably connected to the support frame 103 .

[0038] Furthermore, a fixing frame 102 is fixedly connected to the bottom of the first plastic encapsulation mold 101, and a second cylinder 108 is fixedly connected to the four corners of the top of the fixing frame 102. The piston rod of the second cylinder 108 is fixedly connected to a stripping plate 109. A plurality of ejector rods 106 are provided on the top of the stripping plate 109, and the ejector rods 106 extend into the interior of the first plastic encapsulation mold 101.

[0039] The slide bars 105 on the left and right sides of the first plastic encapsulation mold 101 are movably connected to the support frame 103, ensuring the stability and linearity of the first plastic encapsulation mold 101 during the up and down movement, avoiding packaging quality problems caused by offset. The four first cylinders 104 are distributed at the four corners of the bottom of the first plastic encapsulation mold 101, providing uniform support and stable up and down movement, ensuring the accuracy and stability of the first plastic encapsulation mold 101 when closing and opening. The first liquid cooling connection nozzle 107 can be connected to the coolant to quickly cool the first plastic encapsulation mold 101 and accelerate the plastic encapsulation material. The curing process not only improves production efficiency, but also ensures uniform cooling of the plastic packaging material, avoiding deformation or cracks caused by uneven cooling. The four second cylinders 108 on the top of the fixing frame 102 are connected to the stripping plate 109, which is pushed up by the piston rod. The ejector rod 106 ejects the solidified plastic packaging body from the first plastic packaging mold 101. This design realizes automatic demoulding, reduces manual intervention, and improves production efficiency and safety. The fixing frame 102 at the bottom of the first plastic packaging mold 101 not only provides additional support, but also facilitates installation and maintenance.

[0040] Furthermore, the second plastic encapsulation mechanism 2 includes a second plastic encapsulation mold 201, the right side of the second plastic encapsulation mold 201 is connected to a second liquid cooling connection nozzle 208, the top center of the second plastic encapsulation mold 201 is connected to a conveying auger 205, the top of the second plastic encapsulation mold 201 is fixedly connected to a fixed plate 202, the fixed plate 202 is fixedly sleeved on the surface of the conveying auger 205, and the fixed plate 202 is fixedly connected to the mounting frame 4.

[0041] Furthermore, a first motor 206 is fixedly connected to the top of the conveying auger 205, the output shaft of the first motor 206 extends to the inner cavity of the conveying auger 205 and is fixedly connected to a spiral rod, a feeding pipe 207 is connected to the top of the surface of the conveying auger 205, a plurality of electric heating rings 204 are fixedly sleeved on the surface of the conveying auger 205, a temperature sensor 203 is fixedly installed on the right side of the conveying auger 205, and the detection end of the temperature sensor 203 passes through the inner cavity of the conveying auger 205.

[0042] By setting up a conveying auger 205, the plastic encapsulation material can be conveyed from the feeding pipe 207 to the injection port of the second plastic encapsulation mold 201. The first motor 206 drives the screw rod to rotate to ensure that the plastic encapsulation material can be conveyed evenly and continuously, thereby improving the stability and efficiency of the plastic encapsulation process. A plurality of electric heating rings 204 are fixedly sleeved on the surface of the conveying auger 205. These electric heating rings 204 can heat the plastic encapsulation material being conveyed to ensure that it reaches an appropriate molten state to facilitate filling the mold. The temperature sensor 203 monitors the temperature to ensure accurate control of the heating process and avoid overheating. Or changes in material properties caused by insufficient temperature, the distribution design of multiple electric heating rings 204 can achieve uniform heating of the conveying auger 205, ensuring that the temperature of the plastic packaging material is consistent during the entire conveying process, improving the fluidity and filling effect of the plastic packaging material, and the second liquid cooling connection nozzle 208 on the right side of the second plastic packaging mold 201 can be connected to the coolant to quickly cool the mold and accelerate the solidification process of the plastic packaging material. The fixed plate 202 is fixedly mounted on the surface of the conveying auger 205 and is fixedly connected to the mounting frame 4, ensuring the stability and positioning accuracy of the conveying auger 205.

[0043] Furthermore, the cleaning mechanism 3 includes two brush plates 301, which are arranged oppositely. Cleaning tubes 302 are provided on the front and rear sides of the brush plates 301. The surface of the cleaning tube 302 is connected to a plurality of nozzles 303. A fixed sleeve 304 is fixedly provided on the surface of the cleaning tube 302, and the fixed sleeve 304 is fixedly connected to the brush plate 301.

[0044] Furthermore, a rotating rod 312 is fixedly connected to the left side of the brush plate 301, and a base 305 is rotatably connected to the bottom of the rotating rod 312. The base 305 is fixedly connected to the surface of the support frame 103, and a second motor 308 is fixedly installed on the base 305. The output shaft of the second motor 308 is fixedly connected to a pinion 310, and the top of the pinion 310 is rotatably connected to a support member 309. The support member 309 is fixedly installed on the top of the base 305. A large gear 311 is meshed on the surface of the pinion 310, and the large gear 311 is fixedly sleeved on the surface of the rotating rod 312.

[0045] Furthermore, the air inlet end of the cleaning tube 302 is connected to a hose 307 , and the air inlet end of the hose 307 is connected to an air inlet pipe 306 . A flange is provided at the bottom of the air inlet pipe 306 , and the air inlet pipe 306 is fixedly connected to the surface of the base 305 .

[0046] The two brush plates 301 are oppositely arranged, and the interior of the first plastic encapsulation mold 101 and the second plastic encapsulation mold 201 can be effectively brushed during the process of closing and opening the mold. The brushes on the brush plates 301 can penetrate into the small gaps of the mold to remove residual plastic encapsulation materials and other impurities. The surface of the cleaning tube 302 is connected with a plurality of nozzles 303, and the nozzles 303 can spray compressed air to further remove the residues on the surface and inside of the mold. The high-speed injection of compressed air can effectively blow away fine particles and dust to ensure the cleanliness of the mold. The cleaning mechanism 3 drives the small gear 310 and the large gear 311 through the second motor 308 to rotate the brush plates 301 to achieve automatic cleaning. Since the cleaning process is automated, cleaning can be performed immediately after each plastic encapsulation is completed, reducing the downtime caused by manual cleaning and ensuring the continuous operation of the production line. Regular cleaning can prevent impurities from accumulating inside the mold, reduce scratches and wear on the mold surface, and extend the service life of the mold. In addition, cleaning the mold can ensure that the plastic encapsulation material will not produce bubbles and cavities due to impurities during the filling process, thereby improving the integrity and sealing of the package.

[0047] Example 2

[0048] See also Figure 1-Figure 8 , a plastic packaging method for battery chip processing, comprising the following steps:

[0049] S1, placing the battery chip to be packaged at a designated position of the first plastic encapsulation mold 101, and checking whether the first plastic encapsulation mold 101 and the second plastic encapsulation mold 201 are clean and free of impurities;

[0050] S2, closing the mold, starting the first cylinder 104, so that the first plastic encapsulation mold 101 moves upward and closes with the second plastic encapsulation mold 201, ensuring good sealing between the first plastic encapsulation mold 101 and the second plastic encapsulation mold 201;

[0051] S3, heating and plastic packaging material delivery, start the first motor 206, drive the screw rod in the delivery auger 205 to rotate, and deliver the plastic packaging material from the feeding pipe 207 to the delivery auger 205. The electric heating ring 204 heats the plastic packaging material in the delivery auger 205 to make it reach a proper melting state. The temperature sensor 203 monitors the temperature in the delivery auger 205 to ensure that the temperature is within the set range:

[0052] S4, injecting plastic encapsulation material, the molten plastic encapsulation material is transported to the injection port of the second plastic encapsulation mold 201 through the conveying auger 205, and then injected into the cavity formed between the first plastic encapsulation mold 101 and the second plastic encapsulation mold 201, and covers the battery chip to plastic encapsulate the battery chip. After the plastic encapsulation is completed, the first liquid cooling connection nozzle 107 and the second liquid cooling connection nozzle 208 are connected to the cooling liquid to cool the first plastic encapsulation mold 101 and the second plastic encapsulation mold 201, so that the plastic encapsulation material is quickly solidified;

[0053] S5, demoulding, the first cylinder 104 is started to move the first plastic encapsulation mold 101 downward and separate from the second plastic encapsulation mold 201, the second cylinder 108 is started to push the demoulding plate 109 upward, and the ejector rod 106 ejects the solidified plastic encapsulation battery chip from the first plastic encapsulation mold 101;

[0054] S6, cleaning the mold, starting the second motor 308, the second motor 308 drives the small gear 310 to rotate, the small gear 310 is transmitted through the large gear 311, so that the rotating rod 312 rotates, the rotation of the rotating rod 312 drives the brush plate 301 to rotate, the brush on the brush plate 301 cleans the surface of the first plastic encapsulation mold 101 and the second plastic encapsulation mold 201, the cleaning pipe 302 is connected to the external compressed air through the hose 307 and the air inlet pipe 306, and the compressed air is sprayed through the nozzle 303 to further remove the residue on the mold.

[0055] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A plastic packaging machine for battery chip processing, comprising a first plastic packaging mechanism (1), characterized in that: A second plastic sealing mechanism (2) is provided on the top of the first plastic sealing mechanism (1), a cleaning mechanism (3) is provided on the opposite side of the first plastic sealing mechanism (1) and the second plastic sealing mechanism (2), and a mounting frame (4) is fixedly connected to the rear sides of the first plastic sealing mechanism (1) and the second plastic sealing mechanism (2).

2. A plastic packaging machine for battery chip processing according to claim 1, characterized in that: The first plastic encapsulation mechanism (1) comprises a first plastic encapsulation mold (101), the right side of the first plastic encapsulation mold (101) is connected to a first liquid cooling connection nozzle (107), the four corners of the bottom of the first plastic encapsulation mold (101) are fixedly connected to a first cylinder (104), the bottom of the first cylinder (104) is fixedly connected to a support frame (103), and the support frame (103) is fixedly connected to a mounting frame (4).

3. A plastic packaging machine for battery chip processing according to claim 2, characterized in that: Sliding rods (105) are fixedly connected to the left and right sides of the first plastic encapsulation mold (101), and the sliding rods (105) are movably connected to the support frame (103).

4. A plastic packaging machine for battery chip processing according to claim 3, characterized in that: The bottom of the first plastic encapsulation mold (101) is fixedly connected to a fixing frame (102), the four corners of the top of the fixing frame (102) are fixedly connected to a second cylinder (108), the piston rod of the second cylinder (108) is fixedly connected to a stripping plate (109), and the top of the stripping plate (109) is provided with a plurality of ejector rods (106), and the ejector rods (106) extend into the interior of the first plastic encapsulation mold (101).

5. The battery chip processing plastic packaging machine according to claim 1, characterized in that: The second plastic encapsulation mechanism (2) comprises a second plastic encapsulation mold (201), the right side of the second plastic encapsulation mold (201) is connected to a second liquid cooling connection nozzle (208), the top center of the second plastic encapsulation mold (201) is connected to a conveying auger (205), the top of the second plastic encapsulation mold (201) is fixedly connected to a fixing plate (202), the fixing plate (202) is fixedly sleeved on the surface of the conveying auger (205), and the fixing plate (202) is fixedly connected to the mounting frame (4).

6. A plastic packaging machine for battery chip processing according to claim 5, characterized in that: A first motor (206) is fixedly connected to the top of the conveying auger (205); an output shaft of the first motor (206) extends to the inner cavity of the conveying auger (205) and is fixedly connected to a spiral rod; a feeding pipe (207) is connected to the top of the surface of the conveying auger (205); a plurality of electric heating rings (204) are fixedly sleeved on the surface of the conveying auger (205); a temperature sensor (203) is fixedly installed on the right side of the conveying auger (205); a detection end of the temperature sensor (203) passes through the inner cavity of the conveying auger (205).

7. A plastic packaging machine for battery chip processing according to claim 6, characterized in that: The cleaning mechanism (3) comprises two brush plates (301) which are arranged opposite to each other. A cleaning tube (302) is provided on both the front and rear sides of the brush plate (301). The surface of the cleaning tube (302) is connected to a plurality of nozzles (303). A fixed sleeve (304) is fixedly provided on the surface of the cleaning tube (302). The fixed sleeve (304) is fixedly connected to the brush plate (301).

8. A plastic packaging machine for battery chip processing according to claim 7, characterized in that: The left side of the brush plate (301) is fixedly connected to a rotating rod (312), the bottom of the rotating rod (312) is rotatably connected to a base (305), the base (305) is fixedly connected to the surface of the support frame (103), a second motor (308) is fixedly mounted on the base (305), the output shaft of the second motor (308) is fixedly connected to a pinion (310), the top of the pinion (310) is rotatably connected to a support member (309), the support member (309) is fixedly mounted on the top of the base (305), the surface of the pinion (310) is meshed with a large gear (311), and the large gear (311) is fixedly sleeved on the surface of the rotating rod (312).

9. A plastic packaging machine for battery chip processing according to claim 8, characterized in that: The air inlet end of the cleaning tube (302) is connected to a hose (307), and the air inlet end of the hose (307) is connected to an air inlet pipe (306). A flange is provided at the bottom of the air inlet pipe (306), and the air inlet pipe (306) is fixedly connected to the surface of the base (305).

10. A plastic packaging method for battery chip processing, applicable to a plastic packaging machine for battery chip processing according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, placing the battery chip to be packaged at a designated position of the first plastic packaging mold (101), and checking whether the first plastic packaging mold (101) and the second plastic packaging mold (201) are clean and free of impurities; S2, closing the mold, starting the first air cylinder (104), so that the first plastic encapsulation mold (101) moves upward and closes with the second plastic encapsulation mold (201), ensuring good sealing between the first plastic encapsulation mold (101) and the second plastic encapsulation mold (201); S3, heating and plastic packaging material delivery, start the first motor (206), drive the screw rod in the delivery auger (205) to rotate, and deliver the plastic packaging material from the feeding pipe (207) into the delivery auger (205), the electric heating ring (204) heats the plastic packaging material in the delivery auger (205) to make it reach a suitable melting state, and the temperature sensor (203) monitors the temperature in the delivery auger (205) to ensure that the temperature is within the set range: S4, injecting the plastic encapsulation material, the molten plastic encapsulation material is transported to the injection port of the second plastic encapsulation mold (201) through the transporting auger (205), and then injected into the cavity formed between the first plastic encapsulation mold (101) and the second plastic encapsulation mold (201), and covers the battery chip to perform plastic encapsulation on the battery chip. After the plastic encapsulation is completed, the first liquid cooling connection nozzle (107) and the second liquid cooling connection nozzle (208) are connected to the cooling liquid to cool the first plastic encapsulation mold (101) and the second plastic encapsulation mold (201), so that the plastic encapsulation material is quickly solidified; S5, demoulding, the first air cylinder (104) is started to move the first plastic encapsulation mold (101) downward to separate from the second plastic encapsulation mold (201), the second air cylinder (108) is started to push the demoulding plate (109) upward, and the ejector rod (106) ejects the solidified plastic encapsulation battery chip from the first plastic encapsulation mold (101); S6, cleaning the mold, starting the second motor (308), the second motor (308) drives the small gear (310) to rotate, the small gear (310) is transmitted through the large gear (311), so that the rotating rod (312) rotates, the rotating rod (312) rotates and drives the brush plate (301) to rotate, the brush on the brush plate (301) cleans the surface of the first plastic encapsulation mold (101) and the second plastic encapsulation mold (201), the cleaning pipe (302) is connected to the external compressed air through the hose (307) and the air inlet pipe (306), and the compressed air is sprayed out through the nozzle (303) to further clean the residue on the mold.

Images