Pigmented photoresist composition and cured matter thereof

A technology of photosensitive resin and composition, applied in optics, optomechanical equipment, and photosensitive materials for optomechanical equipment, etc., can solve the problems of reduced resolution, larger vignetting, and poor adhesion of substrates, etc. Achieve the effect of excellent resolution, good linearity and excellent adhesion

CN1892425AActive Publication Date: 2007-01-10TAIYO INK MFG
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2007-01-10
Patent Text Reader

Abstract

The invention provides an alkali developable colored photosensitive resin composition which ensures satisfactory surface curability and curing depth during exposure and can form a colored pattern excellent in resolution even when a thick colored pattern is formed by a photography process, and the cured material of the composition. The colored photosensitive resin composition contains (A) a carboxylic resin, (B) a photopolymerization initiator, (C) a photosensitive monomer and (D) a pigment, wherein the colored photosensitive resin composition contains (B-1) a phosphine oxide-based photo-radical polymerization initiator and (B-2) a photo-cationic polymerization initiator as the photopolymerization initiator (B) and contains (C-1) a cationic curable monomer as the photosensitive monomer (C).
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Description

technical field

[0001] The present invention relates to an alkali-developable colored photosensitive resin composition that can be patterned by photolithography and a cured product thereof, and more particularly, to an alkali-developable coloring photosensitive resin composition suitable for forming a plasma display panel (PDP), a field emission display ( Structural supports (referred to as spacers, ribs or partitions), electrode (conductor circuit) patterns, FED), liquid crystal display devices (LCD), fluorescent display devices, image transfer devices, printed wiring boards, hybrid integrated circuits, etc. A dielectric (resistance) pattern, a black matrix pattern, a colored pattern such as a solder resist, an alkali-developable colored photosensitive resin composition excellent in resolution and adhesion, and a cured product thereof. Background technique

[0002] Conventionally, as a method for forming a pattern of a colored photosensitive resin composition, a colored pho...

Examples

Embodiment 1～9 and comparative example 1～6

[0066] Each component was mixed in the ratio shown in Table 1, and after stirring, it disperse|distributed with the 3-roll mill, and obtained the colored photosensitive resin composition. In addition, details of each component shown in Table 1 and Table 2 are as follows.

[0067]

[0068] Carboxyl group-containing photosensitive polymer (A-2-1): Add 0.95 to 1.05 mol of acrylic acid to 1 epoxy equivalent of cresol novolak-type epoxy resin, and then add 0.6 mol of tetrahydrophthaloxyl Carboxyl group-containing photosensitive prepolymer obtained by acid anhydride

[0069] Carboxyl group-containing photosensitive polymer (A-2-2): Cycroma-P250 (a carboxyl group-containing photosensitive polymer produced by Daicel Chemical Co., Ltd.)

[0070]

[0071] TPO: 2,4,6-trimethylbenzoyldiphenylphosphine oxide (phosphine oxides)

[0072]

[0073] BMS: 4-benzoyl-4'-methyl diphenyl sulfide (manufactured by Nippon Kayaku Co., Ltd.)

[0074] Irugakiyua 907: 2-Methyl-1-[4-(methylthio)phe...