Heat tube radiating device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FU ZHUN PRECISION IND SHENZHEN
- Publication Date
- 2007-03-21
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
【Technical field】
[0001] The invention relates to a heat dissipation device, in particular to a heat pipe heat dissipation device installed on an electronic component for heat dissipation. 【Background technique】
[0002] With the continuous development of the electronic industry, the operating speed and overall performance of electronic components (especially the central processing unit) are constantly improving. However, its calorific value has also increased. On the other hand, its volume has become smaller and smaller, and its heat generation has become more concentrated. This has made it impossible for the industry to use heat dissipation devices that only use metal entities for heat dissipation to meet the heat dissipation requirements of high-end electronic components.
[0003] For this reason, the industry has begun to use heat sinks with elements (such as heat pipes or boiling structures) that rely on the principle of phase change to transfer heat. The heat pipe is ...