Radiating apparatus

A technology of heat dissipation device and heat dissipation fins, applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc. problem, to achieve the effect of improving heat dissipation efficiency

Inactive Publication Date: 2007-06-13
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method of installing the fan on the heat sink, once the size of the fan does not match the heat sink, for example, in the Balanced Technology Extended architecture (Balanced Technology Extended), the heat sink is in the shape of a very short and wide rectangular parallelepiped, while The fan can only be square or round, the fan cannot cover the entire radiator, and the airflow generated by the fan cannot evenly blow into the entire cooling fin channel
[0004] Another method is to install the fan on the top of the radiator, but this method increases the height of the entire radiator, which is not suitable for environments that require the height of the radiator

Method used

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  • Radiating apparatus
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Experimental program
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Embodiment Construction

[0016] Please refer to Fig. 1, Fig. 1 shows a heat dissipation device according to an embodiment of the present invention, the heat dissipation device is installed on a circuit board 10, and is used to dissipate heat to the heat-generating electronic components (not shown) on the circuit board 10, which includes a Radiator assembly, a wind deflector 50 installed on one side of the radiator assembly, a fan 70 blowing toward the radiator assembly, and a mounting bracket 60 for installing the fan 70 and the air deflector 50 on the radiator assembly . Wherein, the installation frame 60 is placed between the air guide cover 50 and the fan 70 .

[0017] Please refer to FIG. 2 and FIG. 3 at the same time, the heat sink assembly includes a first heat sink 20 and a second heat sink 30 installed on the first heat sink 20 through a pair of heat pipes 21 . The width of the first heat sink 20 is longer than its height, and it includes a base 22, a top plate 24 and a plurality of cooling f...

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Abstract

The invention is a radiator, comprising a bottom plate contacting an electronic component; plural radiating fins arranged on the bottom plate; an air guide cover, comprising an air inlet and an air outlet; a fan, mounted at the air inlet, where the inner diameter of the air outlet is greater than that of the air inlet, and the air outlet covers all the radiating fins; the air inlet and outlet form plural air flow channels, and the air flow the fan generates reaches all the radiating fins through the air flow channels and the enlarged air outlet. And the air guide cover has an air inlet and an enlarged air outlet so that the air guide cover can be completely covered on one side of the radiating fins, so as to make the air flow the fan generates reach the radiating fin. Thus, it can raise radiating efficiency.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a wind guide cover. 【Background technique】 [0002] With the rapid development of the electronic industry, the computing speed of the electronic components in the computer has been greatly increased, and the heat generated by it has also increased sharply. How to dissipate the heat of the electronic components to ensure their normal operation has always been a must for the industry. The problem. As we all know, the central processing unit installed on the motherboard is the core of the computer system. When the computer is running, the central processing unit generates heat. Excessive heat can prevent the CPU from functioning properly. In order to effectively dissipate the heat generated by the CPU during operation, a cooling device is usually installed on the CPU of the circuit board to dissipate the generated heat. [0003] The heat dissipation de...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): G06F1/20H05K7/20
Inventor杨波勇翁世勋陈俊吉
OwnerFU ZHUN PRECISION IND SHENZHEN