Packaging device of optical transceiver module

Abstract

The utility model relates to a packaging device of an optical transceiver module. The packaging device of the optical transceiver module comprises an optical transmitter, a first optical fiber, a second optical fiber, a connector and a converter, one end of the connector is connected with the light emitter through a first optical fiber, and the other end of the connector is connected with the converter through a second optical fiber; the light emitter transmits the output laser beam to the converter through the first optical fiber, the connector and the second optical fiber in sequence for photoelectric conversion to obtain an electric signal corresponding to the laser beam; the light emitter comprises a laser, a lens and an isolator; the lens is arranged on a light path between the laser and the isolator; the laser enables output laser beams to sequentially pass through the lens and the isolator to be subjected to convergence and one-way light transmission, and the converged and transmitted laser beams are transmitted to the first optical fiber. The packaging structure of the optical transceiver module can be simplified, so that the cost and the power consumption of the optical module can be reduced, and the packaging efficiency of the optical transceiver module is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a packaging device for an optical transceiver module. Background Art

[0002] With the development of communication technology, optical transceiver modules have been developed, which are used to realize the conversion of optical and electrical signals. The optical transceiver module includes a transmitting end and a receiving end. The transmitting end is used to convert electrical signals into optical signals, and the receiving end is used to convert optical signals into electrical signals.

[0003] However, the optical path structure and power supply structure in the current optical transceiver module are relatively complex. Therefore, the packaging device of the current optical transceiver module has the problem of complex structure. Utility Model Content

[0004] Based on this, it is necessary to provide a packaging device for an optical transceiver module that can simplify the packaging structure of the optical transceiver module in order to solve the above technical problems.

[0005] In a first aspect, the present application provides a packaging device for an optical transceiver module, the device comprising: an optical transmitter, a first optical fiber, a second optical fiber, a connector, and a converter; one end of the connector is connected to the optical transmitter through the first optical fiber, and the other end of the connector is connected to the converter through the second optical fiber; the optical transmitter transmits the output laser beam to the converter through the first optical fiber, the connector, and the second optical fiber in sequence for photoelectric conversion to obtain an electrical signal corresponding to the laser beam;

[0006] The optical transmitter includes: a laser, a lens, and an isolator; the lens is arranged on the optical path between the laser and the isolator; the laser converges and unidirectionally transmits the output laser light beam through the lens and the isolator in sequence, and transmits the converged and transmitted laser light beam to the first optical fiber.

[0007] In one embodiment, the laser comprises an edge emitting laser chip.

[0008] In one of the embodiments, the light emitter further includes: a lens substrate; the lens substrate is disposed at the bottom of the lens.

[0009] In one of the embodiments, the optical transmitter further includes: a backlight detection chip; the backlight detection chip is arranged at a preset position on the reverse optical path of the laser.

[0010] In one of the embodiments, the optical transmitter further includes: a laser carrier; the backlight detection chip and the laser are both disposed on the laser carrier.

[0011] In one of the embodiments, the optical transmitter further includes: a semiconductor cooler and / or a thermistor; the laser carrier and the lens are both arranged on the upper surface of the semiconductor cooler; and the thermistor is arranged on the side surface of the laser carrier.

[0012] In one embodiment, the light emitter further comprises: a tungsten copper base; and the semiconductor cooler is arranged on the upper surface of the tungsten copper base.

[0013] In one embodiment, the converter includes: a photodetector array and a transimpedance amplifier; the photodetector array and the transimpedance amplifier are connected by a gold wire; the photodetector array performs photoelectric conversion on the laser light beam transmitted by the second optical fiber; and the transimpedance amplifier amplifies the electrical signal converted by the photodetector array.

[0014] In one embodiment, the device further includes: a first cover plate and a second cover plate; the first cover plate is disposed at the first end of the first optical fiber; the first end is close to the optical transmitter; the second cover plate is disposed at the second end of the second optical fiber; the second end is close to the converter.

[0015] In one of the embodiments, the device further comprises: a circuit board; the light emitter and the converter are arranged on the circuit board.

[0016] The packaging device of the optical transceiver module mentioned above includes: an optical transmitter, a first optical fiber, a second optical fiber, a connector and a converter; one end of the connector is connected to the optical transmitter through the first optical fiber, and the other end of the connector is connected to the converter through the second optical fiber; the optical transmitter transmits the output laser beam to the converter through the first optical fiber, the connector and the second optical fiber in sequence for photoelectric conversion to obtain an electrical signal corresponding to the laser beam; the optical transmitter includes: a laser, a lens and an isolator; the lens is arranged on the optical path between the laser and the isolator; the laser converges and transmits the output laser beam through the lens and the isolator in sequence, and transmits the converged and transmitted laser beam to the first optical fiber. The present application can form a packaging device of the optical transceiver module only through the optical transmitter, the first optical fiber, the second optical fiber, the connector and the converter to realize the function of photoelectric conversion. The packaging device of the optical transceiver module mentioned above does not need to couple multiple optical components, thereby simplifying the packaging structure of the optical transceiver module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 is a schematic structural diagram of a packaging device for an optical transceiver module in one embodiment;

[0019] Figure 2 is a schematic structural diagram of a light transmitter in one embodiment;

[0020] Figure 3 FIG. 4 is a schematic diagram of the structure of a converter in an embodiment.

[0021] Description of reference numerals:

[0022] Optical transmitter: 1; converter: 2; tungsten copper base: 101; semiconductor refrigerator: 102; carrier ceramic substrate: 103; laser carrier: 104; backlight detection chip: 105; thermistor: 106; laser: 107; lens: 108; lens substrate: 109; isolator: 110; first cover plate: 111; transimpedance amplifier: 201; optical detector array: 202; second cover plate: 203; circuit board: 301; second optical fiber: 302; first optical fiber: 303; connector: 304. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0030] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0031] With the development of communication technology, optical transceiver modules have been produced. Optical transceiver modules are referred to as optical modules. Optical transceiver modules are used to realize the conversion of photoelectric signals. The optical transceiver module includes a transmitting end and a receiving end. The transmitting end is used to convert electrical signals into optical signals, and the receiving end is used to convert optical signals into electrical signals. Exemplarily, the transmitting end can input an electrical signal of a certain code rate to the internal driver chip. After being processed by the internal driver chip, it can drive the semiconductor laser (LD) or light emitting diode (LED) to emit a modulated optical signal of a corresponding rate, and the driver chip is pre-set with an automatic optical power control circuit to keep the output optical signal power stable; the receiving end can input an optical signal of a certain code rate to the receiving end, and then the optical detection diode converts the optical signal into an electrical signal, and then outputs an electrical signal of the corresponding code rate after being processed by the preamplifier.

[0032] However, the optical path structure in the current optical transceiver module requires a large number of optical components to be coupled, and the hardware power supply structure for powering the laser in the current optical transceiver module is relatively complex, resulting in relatively higher power consumption of the laser. Therefore, the packaging device of the current optical transceiver module has a complex structure.

[0033] Based on this, the present application provides a packaging device for an optical transceiver module that can simplify the packaging structure of the optical transceiver module.

[0034] In one embodiment, a packaging device for an optical transceiver module is provided, such as Figure 1As shown, the packaging device of the optical transceiver module includes: an optical transmitter 1, a first optical fiber 303, a second optical fiber 302, a connector 304 and a converter 2; one end of the connector 304 is connected to the optical transmitter 1 through the first optical fiber 303, and the other end of the connector 304 is connected to the converter 2 through the second optical fiber 302; the optical transmitter 1 transmits the output laser beam to the converter 2 through the first optical fiber 303, the connector 304 and the second optical fiber 302 in sequence for photoelectric conversion to obtain an electrical signal corresponding to the laser beam.

[0035] The optical transmitter 1 is used to emit a laser beam; the first optical fiber 303, the second optical fiber 302 and the connector 304 are used to transmit the optical signal corresponding to the laser beam, and the connector 304 may include but is not limited to the MPO12 connector. The connector 304 is provided with a jumper, and the optical signal in the first optical fiber 303 can be transmitted to the second optical fiber 302 through the jumper; the converter 2 is used to receive the optical signal corresponding to the laser beam and convert the optical signal into an electrical signal. Exemplary, Figure 1 The first optical fiber 303 and the second optical fiber 302 are both four-core optical fiber arrays. Of course, the embodiment of the present application does not limit the number of cores of the first optical fiber 303 and the second optical fiber 302. In the embodiment of the present application, the optical transmitter 1 can transmit the output laser beam to the connector 304 through the first optical fiber 303, and then transmit the laser beam in the connector 304 to the converter 2 through the second optical fiber 302, so that the laser beam can be photoelectrically converted by the converter 2 to obtain an electrical signal corresponding to the laser beam.

[0036] In the packaging device of the optical transceiver module, the packaging device of the optical transceiver module includes: an optical transmitter, a first optical fiber, a second optical fiber, a connector and a converter; one end of the connector is connected to the optical transmitter through the first optical fiber, and the other end of the connector is connected to the converter through the second optical fiber; the optical transmitter transmits the output laser light beam to the converter through the first optical fiber, the connector and the second optical fiber in sequence for photoelectric conversion to obtain an electrical signal corresponding to the laser light beam. The present application can form a packaging device of the optical transceiver module and realize the function of photoelectric conversion only through an optical transmitter, a first optical fiber, a second optical fiber, a connector and a converter. The packaging device of the optical transceiver module does not need to couple multiple optical components, thereby simplifying the packaging structure of the optical transceiver module.

[0037] In one embodiment, the optical transmitter includes: a laser, a lens, and an isolator; the lens is arranged on the optical path between the laser and the isolator; the laser converges and unidirectionally transmits the output laser light beam through the lens and the isolator in sequence, and transmits the converged and transmitted laser light beam to the first optical fiber.

[0038] The laser may include but is not limited to edge-emitting laser chips such as DFB lasers (Distributed Feedback Lasers). The direction of the laser beam emitted by the edge-emitting laser chip is parallel to the direction of the circuit board, that is, the laser beam emitted by the edge-emitting laser chip is emitted horizontally, and the laser is used to emit divergent light at a certain angle parallel to the direction of the circuit board. The lens may be a glass lens, and the lens is used to couple the divergent light emitted by the laser into convergent light. The isolator is used to prevent the convergent light from being reflected back to the laser, causing damage to the laser.

[0039] In the present application embodiment, Figure 2 As shown, Figure 2 1 is a schematic diagram of the structure of an optical transmitter in an embodiment. The optical transmitter 1 includes: a laser 107, a lens 108, and an isolator 110. The lens 108 is arranged on the optical path between the laser 107 and the isolator 110. The laser 107 can output a laser beam, and the output laser beam is converged through the lens 108 to obtain a converged laser beam, and then the converged laser beam is transmitted through the isolator 110 for unidirectional light transmission, and the converged and transmitted laser beam is transmitted to the first optical fiber.

[0040] In one embodiment, the light emitter further includes: a lens substrate; the lens substrate is disposed at the bottom of the lens.

[0041] In one of the embodiments, the light transmitter further includes: a backlight detection chip; the backlight detection chip is arranged at a preset position on the reverse light path of the laser.

[0042] In one of the embodiments, the optical transmitter further includes: a laser carrier; the backlight detection chip and the laser are both arranged on the laser carrier.

[0043] In one embodiment, the optical transmitter further includes: a semiconductor cooler and / or a thermistor; the laser carrier and the lens are both arranged on the upper surface of the semiconductor cooler; and the thermistor is arranged on the side surface of the laser carrier.

[0044] In one embodiment, the light emitter further includes: a tungsten copper base; and a semiconductor cooler disposed on the upper surface of the tungsten copper base.

[0045] In the present application embodiment, combined Figure 2As shown, the optical transmitter further includes a lens substrate 109, which is disposed at the bottom of the lens 108. The lens substrate 109 is used to ensure that the lens 108 is disposed on the optical path between the laser 107 and the isolator 110. The optical transmitter further includes a backlight detection chip 105, which is disposed at a preset position on the reverse optical path of the laser, that is, the backlight detection chip 105 is disposed in the reverse direction of the optical path of the laser 107. The preset position can be set according to actual needs. The embodiment of the present application does not limit the preset position. The backlight detection chip 105 is used to monitor whether the laser 107 fails. If the backlight detection chip 105 detects that the laser 107 fails, the user can be prompted to replace the laser 107 in time.

[0046] In addition, the optical transmitter further includes a laser carrier 104, and the backlight detection chip 105 and the laser 107 are both arranged on the laser carrier 104. The optical transmitter further includes a semiconductor refrigerator 102 and / or a thermistor 106; the laser carrier 104 and the lens 108 are both arranged on the upper surface of the semiconductor refrigerator 102, and the thermistor 106 is arranged on the side surface of the laser carrier 104. The semiconductor refrigerator 102 and / or the thermistor 106 are used to dissipate heat for the optical transmitter. The optical transmitter further includes a tungsten copper base 101, and the semiconductor refrigerator 102 is arranged on the upper surface of the tungsten copper base 101.

[0047] In this embodiment, the optical transmitter includes a laser, a lens, and an isolator; the lens is disposed on the optical path between the laser and the isolator. The laser can converge and transmit the output laser light beam through the lens and the isolator in sequence, thereby directly transmitting the converged and transmitted laser light beam to the first optical fiber, without using multiple lenses for light reflection and coupling, and can simplify the packaging structure of the optical transceiver module.

[0048] In one embodiment, the converter includes: a photodetector array and a transimpedance amplifier; the photodetector array and the transimpedance amplifier are connected by a gold wire; the photodetector array performs photoelectric conversion on the laser light beam transmitted by the second optical fiber; and the transimpedance amplifier amplifies the electrical signal converted by the photodetector array.

[0049] The photodetector array is used to convert the optical signal corresponding to the laser beam into an electrical signal, and the transimpedance amplifier is used to amplify the electrical signal.

[0050] In the present application embodiment, Figure 3 As shown, Figure 3Schematic diagram of the structure of a converter in one embodiment. Converter 2 includes a photodetector array 202 and a transimpedance amplifier 201, and the photodetector array 202 and the transimpedance amplifier 201 are connected by a gold wire. The xWDM4 optical signal can enter the second optical fiber 302 through the MPO12 jumper in the connector 304, so that the xWDM4 optical signal is reflected to the photosensitive surface of the photodetector array 202 through the second optical fiber 302, and the optical signal (i.e., the laser beam transmitted by the second optical fiber) is converted into an electrical signal through the photodetector array 202, and then the electrical signal is transmitted to the transimpedance amplifier 201 through the gold wire, so that the transimpedance amplifier 201 amplifies the electrical signal corresponding to the laser beam obtained after the conversion of the photodetector array 202.

[0051] In this embodiment, the converter includes a photodetector array and a transimpedance amplifier; the photodetector array and the transimpedance amplifier are connected by a gold wire; the laser light beam transmitted by the second optical fiber is photoelectrically converted by the photodetector array, and the transimpedance amplifier amplifies the electrical signal converted by the photodetector array, so that the amplified electrical signal corresponding to the laser light beam can be accurately obtained.

[0052] In one embodiment, the packaging device of the above-mentioned optical transceiver module also includes: a first cover plate and a second cover plate; the first cover plate is arranged at the first end of the first optical fiber; the first end is close to the optical transmitter; the second cover plate is arranged at the second end of the second optical fiber; the second end is close to the converter.

[0053] In the present application embodiment, combined Figure 1 As shown, the packaging device of the optical transceiver module further includes a first cover plate 111 and a second cover plate 203, wherein the first cover plate 111 is disposed at the first end of the first optical fiber 303, the first end being close to the optical transmitter 1; the second cover plate 203 is disposed at the second end of the second optical fiber 302, the second end being close to the converter 2. Generally, the first cover plate 111 and the first optical fiber 303 together constitute a first optical fiber array assembly, which is an optical fiber array assembly at the light transmitting (TX, transport) end; the second cover plate 203 and the second optical fiber 302 together constitute a second optical fiber array assembly, which is an optical fiber array assembly at the light receiving (RX, receive) end.

[0054] In one embodiment, in combination Figure 1 As shown, the packaging device of the optical transceiver module further includes: a circuit board 301 ; the optical transmitter 1 and the converter 2 are arranged on the circuit board 301 .

[0055] The circuit board may include but is not limited to a PCB board, a PCBA (Printed Circuit Board Assembly) board, etc. Figure 1As shown, four lasers of the same wavelength are bonded to the lower end of the circuit board 301, and the converter 2 is bonded to the upper end of the circuit board 301. The transimpedance amplifier 201 and the pads of the circuit board 301 are connected by gold wires. Based on this, the transimpedance amplifier 201 can transmit the amplified electrical signal corresponding to the laser beam to the circuit board 301, and then transmit the electrical signal to the back-end hardware circuit of the optical module through the circuit board 301.

[0056] In an optional embodiment, the packaging device of the optical transceiver module includes an optical transmitter 1, a first optical fiber 303, a second optical fiber 302, a first cover plate 111, a second cover plate 203, a circuit board 301, a connector 304 and a converter 2, wherein the optical transmitter 1 includes a tungsten copper base 101, a semiconductor refrigerator 102, a carrier ceramic substrate 103, a laser carrier 104, a backlight detection chip 105, a thermistor 106, a laser 107, a lens 108, a lens substrate 109, and an isolator 110, and the converter 2 includes a transimpedance amplifier 201 and a photodetector array 202. The specific connection relationship of each component can be referred to the above embodiment and the drawings, and the embodiment of the present application will not be repeated here.

[0057] In the embodiment of the present application, the laser 107 can emit a laser beam at a certain angle in a direction parallel to the circuit board, and converge the output laser beam through the lens 108 to obtain a converged laser beam, and then transmit the converged laser beam through the isolator 110 for unidirectional light transmission, and transmit the converged and transmitted laser beam to the first optical fiber 301. The laser beam is transmitted to the connector 304 through the first optical fiber 303. Since a jumper is provided in the connector 304, the optical signal in the first optical fiber 303 can be transmitted to the second optical fiber 302 through the jumper, and then the optical signal is reflected to the photosensitive surface of the optical detector array 202 through the second optical fiber 302, and the optical signal (i.e., the laser beam transmitted by the second optical fiber) is converted into an electrical signal through the optical detector array 202, and then the electrical signal is transmitted to the transimpedance amplifier 201 through the gold wire, so that the transimpedance amplifier 201 amplifies the electrical signal corresponding to the laser beam obtained after the conversion of the optical detector array 202. In addition, since the transimpedance amplifier 201 and the pads of the circuit board 301 are connected by gold wire, the transimpedance amplifier 201 can transmit the amplified electrical signal corresponding to the laser beam to the circuit board 301, and then transmit the electrical signal to the back-end hardware circuit of the optical module through the circuit board 301.

[0058] Exemplarily, the backlight detection chip can adopt the side light receiving surface, the light receiving surface is 240X110um, and the responsivity range is 0.3~0.5A / W. The laser can adopt EML laser with a wavelength of 1310nm and an operating voltage of 1.3~2.0V. The lens can adopt an aspheric biconvex lens. The lens substrate can adopt aluminum nitride ceramic. The isolator can adopt a four-channel array isolator with a central wavelength of 1310nm±20nm, CA≥0.5mm, and isolation ≥30dB@1310nm 25℃. The first cover plate and the first optical fiber together constitute the first optical fiber array assembly. The first optical fiber array assembly can adopt a 12-core MT assembly. The first optical fiber can adopt a B3 optical fiber. The end of the optical fiber needs to be polished to 4° to prevent light reflection. The second cover plate and the second optical fiber together constitute the second optical fiber array assembly. The second optical fiber array assembly can also adopt a 12-core MT assembly. The second optical fiber can adopt a B3 optical fiber. The end of the optical fiber needs to be polished to 42.5°. The photodetector array can use a four-channel silicon germanium detector with a responsivity range of 0.7 to 0.8A / W, an array channel spacing of 750um, a transimpedance amplifier can use a silicon germanium amplifier, a working power supply voltage of 3.3V, a PD power supply output voltage of 3.3V, and a received signal strength indicator of 1:4. The circuit board can use an xWDM4 circuit board (PCBA board) with integrated transceiver.

[0059] In addition, it should be noted that, optionally, first, the material of the tungsten copper base may include but is not limited to tungsten copper, Kovar alloy, etc., and the fixing method of the tungsten copper base and the circuit board may include but is not limited to glue bonding, screw fixing, etc. Second, the connection method between the laser and the laser carrier can be silver glue bonding or eutectic welding. Third, the material of the lens substrate and the tungsten copper base, as well as the optical fiber array assembly, needs to meet the thermal expansion coefficient matching, and its material includes but is not limited to Kovar alloy, tungsten copper alloy, optical glass, aluminum nitride ceramic, alumina ceramic, etc. Fourth, the isolator can choose 4 separate isolators, or a 4-channel array isolator.

[0060] In the packaging device of the optical transceiver module, the packaging device of the optical transceiver module includes: an optical transmitter, a first optical fiber, a second optical fiber, a connector and a converter; one end of the connector is connected to the optical transmitter through the first optical fiber, and the other end of the connector is connected to the converter through the second optical fiber; the optical transmitter transmits the output laser beam to the converter through the first optical fiber, the connector and the second optical fiber in sequence for photoelectric conversion to obtain an electrical signal corresponding to the laser beam. The present application can form a packaging device of the optical transceiver module and realize the function of photoelectric conversion only through an optical transmitter, a first optical fiber, a second optical fiber, a connector and a converter. The packaging device of the optical transceiver module does not need to couple multiple optical components, and the optical structure is more concise. It can also simplify the design of the power supply circuit for the laser on the circuit board, thereby simplifying the packaging structure of the optical transceiver module, and further, it can reduce the cost and power consumption of the optical module and improve the packaging efficiency of the optical transceiver module.

[0061] In one embodiment, a packaging method for a silicon light source is provided, including an optical packaging process method for a transmitting end and an optical packaging process method for a receiving end.

[0062] The optical packaging process method of the transmitting end includes:

[0063] Step 1: Bond the tungsten copper base 101 to the circuit board 301 by epoxy resin glue; illustratively, the curing parameter of the epoxy resin glue is a baking temperature of 150° C. @ 60 min;

[0064] Step 2: welding the laser 107 to the laser carrier 104 by eutectic welding. For example, the eutectic pressure of the eutectic welding equipment is less than 0.3N.

[0065] Step 3, bonding the backlight detection chip 105 to the laser carrier 104 by silver glue. Exemplarily, the curing parameters of the silver glue are baking temperature 150° C. @ 60 min;

[0066] Step 4, bonding the components formed in steps 2 and 3 to the carrier ceramic substrate 103 by silver glue to form a four-channel array component. Exemplarily, the curing parameters of the silver glue are a baking temperature of 125° C. @ 150 min;

[0067] Step 5, bonding the array assembly, thermistor 106 and lens substrate 109 formed in step 4 to the semiconductor refrigerator 102 by silver glue to form an assembly. Exemplarily, the curing parameter of the silver glue is a baking temperature of 125°C @ 150min;

[0068] Step 6: Bond the components of step 5 and the isolator 110 to the tungsten copper base 101 by silver glue. Exemplarily, the curing parameters of the silver glue are a baking temperature of 125° C. @ 150 min.

[0069] Step 7: Couple the first optical fiber array assembly and bond it to the tungsten copper base 101 by UV glue. Exemplarily, the curing parameters of the UV glue are UV irradiation for 300 seconds and baking temperature of 110° C. @ 60 minutes.

[0070] Step 8: Couple the lens 108 and bond it to the lens substrate 109 by UV glue. For example, the curing parameters of the UV glue are UV irradiation for 300 seconds and baking temperature of 110° C. @ 120 minutes.

[0071] Step 9: Bond the sealing cover to the circuit board 301 by UV glue. Exemplarily, the curing parameter of the UV glue is UV irradiation for 100 seconds.

[0072] The optical packaging process method of the receiving end includes:

[0073] Step 1: Bond the transimpedance amplifier 201 to the circuit board 301 by silver glue. Exemplarily, the curing parameter of the silver glue is a baking temperature of 125° C. @ 150 min.

[0074] Step 2: Bond the photodetector array 202 to the circuit board 301 by silver glue. For example, the curing parameters of the silver glue are a baking temperature of 125° C. @ 150 min.

[0075] Step 3: After coupling, the second optical fiber array assembly is bonded to the circuit board 301 by UV glue. Exemplarily, the curing parameters of the UV glue are UV irradiation for 300 seconds and baking temperature of 110° C. @ 120 minutes.

[0076] Step 4: Bond the sealing cover to the circuit board 301 by UV glue. Exemplarily, the curing parameter of the UV glue is UV irradiation for 100 seconds.

[0077] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A packaging device for an optical transceiver module, It is characterized in that The device comprises: an optical transmitter, a first optical fiber, a second optical fiber, a connector and a converter; one end of the connector is connected to the optical transmitter through the first optical fiber, and the other end of the connector is connected to the converter through the second optical fiber; the optical transmitter transmits the output laser beam to the converter through the first optical fiber, the connector and the second optical fiber in sequence for photoelectric conversion to obtain an electrical signal corresponding to the laser beam; The optical transmitter includes: a laser, a lens, and an isolator; the lens is arranged on the optical path between the laser and the isolator; the laser converges and unidirectionally transmits the output laser light beam through the lens and the isolator in sequence, and transmits the converged and transmitted laser light beam to the first optical fiber.

2. The device according to claim 1, It is characterized in that The laser comprises an edge emitting laser chip.

3. The device according to claim 1, It is characterized in that The light emitter further comprises: a lens substrate; the lens substrate is arranged at the bottom of the lens.

4. The device according to claim 1, It is characterized in that The optical transmitter further comprises: a backlight detection chip; the backlight detection chip is arranged at a preset position on the reverse optical path of the laser.

5. The device according to claim 4, It is characterized in that The optical transmitter further comprises: a laser carrier; the backlight detection chip and the laser are both arranged on the laser carrier.

6. The device according to claim 5, It is characterized in that The optical transmitter further comprises: a semiconductor refrigerator and / or a thermistor; the laser carrier and the lens are both arranged on the upper surface of the semiconductor refrigerator; and the thermistor is arranged on the side surface of the laser carrier.

7. The device according to claim 6, It is characterized in that The optical transmitter further comprises: a tungsten copper base; and the semiconductor refrigerator is arranged on the upper surface of the tungsten copper base.

8. The device according to claim 1, It is characterized in that The converter includes: a photodetector array and a transimpedance amplifier; the photodetector array and the transimpedance amplifier are connected by a gold wire; the photodetector array performs photoelectric conversion on the laser light beam transmitted by the second optical fiber; and the transimpedance amplifier performs signal amplification on the electrical signal converted by the photodetector array.

9. The device according to claim 1, It is characterized in that The device further comprises: a first cover plate and a second cover plate; the first cover plate is arranged at the first end of the first optical fiber; the first end is close to the optical transmitter; the second cover plate is arranged at the second end of the second optical fiber; the second end is close to the converter.

10. The device according to any one of claims 1 to 9, It is characterized in that The device further comprises: a circuit board; the light emitter and the converter are arranged on the circuit board.

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