Wafer stage assembly

Abstract

The utility model discloses a wafer carrying table assembly, which comprises a wafer carrying table, a heating sheet and a shielding sheet, the wafer carrying table is provided with an adsorption hole for adsorbing a wafer, the heating sheet is arranged below the wafer carrying table, the shielding sheet is arranged above the heating sheet, the shielding sheet can conduct electricity, and the shielding sheet can shield a magnetic field generated by the heating sheet and shield electromagnetic noise. And the influence of a magnetic field generated by the heating sheet on subsequent wafer processing procedures is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer carriers, in particular to a wafer carrier assembly. Background Art

[0002] In the technical field of wafer carriers, it is necessary to complete various tests on wafers by customers on wafer carriers, including 200°C high temperature tests. Existing wafer carriers are usually equipped with heating plates. When the heating plates are heated, the coils inside them are energized to generate magnetic fields. The magnetic fields will cause electromagnetic noise, affecting the subsequent processing steps of the wafers. Utility Model Content

[0003] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a wafer stage assembly that can shield the magnetic field generated by the heating plate, shield electromagnetic noise, and play an electromagnetic shielding effect, thereby preventing the magnetic field generated by the heating plate from affecting subsequent processing steps of the wafer.

[0004] According to an embodiment of the utility model, the wafer carrier assembly includes: a wafer stage, provided with adsorption holes for adsorbing wafers, the bottom of the wafer stage is provided with an air duct connected to the adsorption holes, and the air duct is used to connect to a vacuum pump; a heating plate, provided below the wafer stage; a shielding plate, located above the heating plate, and the shielding plate is conductive. According to some embodiments of the utility model, there are multiple adsorption holes, and the multiple adsorption holes are arranged along the circumference of the wafer stage, and the air duct includes a circumferential section, and the circumferential section extends along the circumference of the wafer stage, and the circumferential section is connected to the multiple adsorption holes.

[0005] According to the wafer carrier assembly of the embodiment of the utility model, at least the following beneficial effects are achieved: the wafer stage uses adsorption holes to fix the wafer. When the vacuum equipment is evacuated, the adsorption holes can generate suction to adsorb the wafer. No other fastening parts are needed to fix the wafer, so that the surface of the wafer stage is relatively flat, and the flatness can be improved. During high-temperature testing, the coil in the heating plate is energized to generate heat and generate a magnetic field. Since the shielding plate is conductive and is located between the insulating disk and the heating plate, the shielding plate can shield the magnetic field generated by the heating plate, shield electromagnetic noise, and achieve the effect of electromagnetic shielding, thereby preventing the magnetic field generated by the heating plate from affecting subsequent processing steps of the wafer.

[0006] According to some embodiments of the utility model, the plurality of adsorption holes are arranged radially along the wafer support platform, the air channel includes a radial section, the radial section is connected to the circumferential section, and the radial section is connected to the plurality of adsorption holes.

[0007] According to some embodiments of the utility model, the wafer carrier assembly includes an insulating disk, which is arranged between the wafer support table and the heating plate, the air duct is arranged at the bottom of the wafer support table, the air duct is defined between the wafer support table and the insulating disk, and the shielding plate is located between the insulating disk and the heating plate.

[0008] According to some embodiments of the present utility model, a groove is provided at the bottom of the insulating disk, and the groove is used to accommodate the heating plate and the shielding plate.

[0009] According to some embodiments of the present invention, the wafer carrier assembly includes a temperature sensor, the insulating disk is provided with a mounting groove, and the temperature sensor is installed in the mounting groove.

[0010] According to some embodiments of the utility model, the wafer carrier assembly includes a mounting plate and a thermal insulation column, the mounting plate is located below the insulating disk, the thermal insulation column is located between the insulating disk and the mounting plate, a protrusion is provided at the bottom of the insulating disk, the shielding plate is provided with a first through hole, the heating plate is provided with a second through hole, the protrusion cooperates with the first through hole and the second through hole, and the thermal insulation column abuts against the protrusion.

[0011] According to some embodiments of the utility model, the mounting plate is connected to the raised portion via a fastener, and the thermal insulation column is provided with a third through hole for avoiding the fastener.

[0012] According to some embodiments of the utility model, the mounting plate is provided with a wire crimping assembly for crimping the wires, the wire crimping assembly comprising a first wire crimping block and a second wire crimping block, the first wire crimping block is connected to the mounting plate, the second wire crimping block is located above the first wire crimping block, and the second wire crimping block is connected to the first wire crimping block via a fastener.

[0013] According to some embodiments of the present invention, the wafer carrier assembly includes a locking plate, which is located below the shielding plate and is connected to the insulating disk via a fastener.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0016] Figure 1 It is a schematic diagram of the structure of a wafer stage assembly of some embodiments of the utility model;

[0017] Figure 2It is a cross-sectional view of a wafer stage assembly according to some embodiments of the present invention;

[0018] Figure 3 It is a front view of a wafer stage assembly according to some embodiments of the present invention;

[0019] Figure 4 It is a cross-sectional view of a wafer stage assembly of some embodiments of the utility model (with the wafer stage hidden);

[0020] Figure 5 It is a schematic diagram of the structure of the insulating disk and the temperature sensor of the wafer stage assembly in some embodiments of the utility model;

[0021] Figure 6 It is a structural schematic diagram of the air passage of the wafer stage of the wafer stage assembly in some embodiments of the utility model;

[0022] Figure 7 A cross-sectional view of a wafer stage of a wafer stage assembly according to some embodiments of the present invention;

[0023] Figure 8 sectional views of the wafer stage of the wafer stage assembly according to some embodiments of the present invention.

[0024] Reference numerals:

[0025] Wafer stage assembly 1000;

[0026] The wafer support table 100, the adsorption hole 110, the air channel 120, the circumferential section 121, the radial section 122, the air extraction hole 130, and the air nozzle 140;

[0027] Insulating disk 200, groove 210, temperature sensor 220, mounting slot 230, protrusion 240, threaded hole 241;

[0028] The heating plate 300 and the second through hole 310;

[0029] Shielding sheet 400, first through hole 410;

[0030] The mounting plate 500, the wire pressing assembly 510, the first wire pressing block 511, the second wire pressing block 512, and the fastening hole 520;

[0031] Heat-insulating column 600, third through hole 610;

[0032] Locking piece 700 and fourth through hole 710 . DETAILED DESCRIPTION

[0033] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] Reference Figure 1 As shown in FIG. 1 , a wafer stage assembly 1000 according to an embodiment of the present invention is shown. The wafer stage assembly 1000 includes a wafer stage 100, a heating plate 300 and a shielding plate 400. Figure 1 and Figure 6 As shown, the wafer stage 100 is used to carry the wafer. The wafer stage 100 is provided with an adsorption hole 110 for adsorbing the wafer. The bottom of the wafer stage 100 is provided with an air channel 120 connected with the adsorption hole 110. The air channel 120 can also be understood as a trough structure. The wafer stage 100 is provided with an exhaust hole 130 for connecting with a vacuum pumping device. The exhaust hole 130 is provided with an air nozzle 140. The air nozzle 140 is connected with the vacuum pumping device, and the exhaust hole 130 is connected with the air channel 120. Figure 2 and Figure 4 As shown, the heating plate 300 is disposed below the plate support platform 100 , and the shielding plate 400 is located above the heating plate 300 . The shielding plate 400 is conductive and can be made of metal material.

[0035] It should be noted that in the wafer stage assembly 1000 of the present embodiment, the wafer stage 100 uses the adsorption hole 110 to fix the wafer. When the vacuum device is evacuated, the adsorption hole 110 can generate suction to adsorb the wafer. No other fastening parts are needed to fix the wafer, so that the surface of the wafer stage 100 is relatively flat, which can improve the flatness. The fastening parts will expand due to heat, and the expansion coefficient of the fastening parts is different from the expansion coefficient of the wafer stage 100, which will cause the flatness to be not good enough. The wafer stage assembly 1000 of the present embodiment will not cause the flatness to change due to the different expansion coefficients. Further, during the high temperature test, the coil in the heating plate 300 is energized to generate heat and generate a magnetic field. Since the shielding plate 400 is conductive and the shielding plate 400 is located between the insulating disk 200 and the heating plate 300, the shielding plate 400 can shield the magnetic field generated by the heating plate 300, shield electromagnetic noise, and play an electromagnetic shielding effect, thereby preventing the electromagnetic noise generated by the heating plate 300 from affecting the subsequent processing steps of the wafer.

[0036] Reference Figure 6As shown, according to some embodiments of the present invention, a plurality of adsorption holes 110 are provided, and the plurality of adsorption holes 110 are arranged along the circumference of the wafer stage 100. The air channel 120 includes a circumferential section 121, and the circumferential section 121 extends along the circumference. The circumferential section 121 is annular, and may be a circular ring. The circumferential section 121 extends along the circumference of the wafer stage 100, and the circumferential section 121 is connected to the plurality of adsorption holes 110. In some embodiments, the air channel 120 may also include multiple circumferential sections 121, so as to increase the volume of the air channel 120 and adsorb more wafers. Specifically, the diameter of each circumferential section 121 is different, and the diameters of the multiple circumferential sections 121 gradually increase radially outward, so as to make full use of the space of the wafer stage 100.

[0037] Reference Figure 1 As shown, according to some embodiments of the present invention, a plurality of adsorption holes 110 are arranged along the radial direction of the wafer stage 100, and the air channel 120 includes a radial section 122, the radial section 122 is connected to the circumferential section 121, the radial section 122 extends along the radial direction of the circumferential section 121, and the radial section 122 is connected to a plurality of adsorption holes 110, so that the number of adsorption holes 110 can be increased to achieve adsorption of more wafers. In some embodiments, the air channel 120 includes multiple radial sections 122, and the multiple radial sections 122 are arranged at intervals along the circumference of the circumferential section 121, so that the air channel 120 is a radial structure as a whole, and the spatial position of the wafer stage 100 can be fully utilized.

[0038] Reference Figure 2 and Figure 4 As shown, according to some embodiments of the present invention, the wafer stage assembly 1000 includes an insulating disk 200, which is made of insulating material. The insulating disk 200 is disposed between the wafer stage 100 and the heating plate 300, and the shielding plate 400 is located between the insulating disk 200 and the heating plate 300. The insulating disk 200 can play an insulating role to prevent leakage and avoid affecting the subsequent processing steps of the wafer. Figure 1 and Figure 6 As shown, the above-mentioned air passage 120 is defined between the wafer table 100 and the insulating disk 200. When the vacuum device is evacuated, the wafer table 100 and the insulating disk 200 are tightly attached together due to the negative pressure.

[0039] Reference Figure 5 As shown, according to some embodiments of the utility model, a groove 210 is provided at the bottom of the insulating disk 200. The groove 210 can be formed by a material removal processing method. The shape of the groove 210 is circular, which is adapted to the shapes of the heating plate 300 and the shielding plate 400. The groove 210 is used to accommodate the heating plate 300 and the shielding plate 400, which can reduce the height of the wafer carrier assembly 1000 and the overall size of the wafer carrier assembly 1000. The installation height is relatively low, and the heating plate 300 and the shielding plate 400 are prevented from being exposed, thereby playing a protective role.

[0040] In some embodiments, the insulating disk 200 is made of a ceramic material with high insulation and high thermal conductivity, and the material has high machinability, which can ensure a fast heating speed, low leakage, and high flatness.

[0041] Reference Figure 5 As shown, according to some embodiments of the present invention, the wafer stage assembly 1000 includes a temperature sensor 220, and the insulating disk 200 is provided with a mounting groove 230. The temperature sensor 220 is installed in the mounting groove 230, which can reduce the space occupied by the temperature sensor 220 and prevent the temperature sensor 220 from protruding from the outside of the insulating disk 200. The temperature sensor 220 can be used to detect the temperature of the insulating disk 200, play a monitoring role, and ensure that the temperature meets the requirements. Specifically, the temperature sensor 220 extends along the radial direction of the insulating disk 200, and the mounting groove 230 extends along the radial direction of the insulating disk 200, which can reduce the space occupied by the temperature sensor 220, reduce the overall space occupied by the wafer stage assembly 1000, reduce the overall size of the wafer stage assembly 1000, and have a lower installation height.

[0042] Reference Figures 2 to 4 As shown, according to some embodiments of the present invention, the wafer carrier assembly 1000 includes a mounting plate 500 and a thermal insulation column 600. The mounting plate 500 can be understood as a bottom plate, which plays a role in installation and fixing. The mounting plate 500 is located below the insulating disk 200, and the thermal insulation column 600 is located between the insulating disk 200 and the mounting plate 500, thereby separating the insulating disk 200 from the mounting plate 500. The insulating disk 200 is not in contact with the mounting plate 500, which can also be understood as heat insulation through air. The thermal insulation column 600 also plays a role in heat insulation. The heat of the insulating disk 200 is not easily conducted to the mounting plate 500, and the heat is not easily dissipated downward, and it is not easy to affect the temperature of other components. The bottom of the insulating disk 200 is provided with a protrusion 240, the protrusion 240 extends downward, the shielding sheet 400 is provided with a first through hole 410, the heating sheet 300 is provided with a second through hole 310, the first through hole 410 and the second through hole 310 are used to avoid the protrusion 240, and the upper end of the heat insulating column 600 is in contact with the protrusion 240. It should be noted that the heat insulating column 600 can be made of a material with a low thermal conductivity, such as rock wool, benzene board, foam plastic, etc., to improve the heat insulation effect.

[0043] Reference Figure 5 As shown, according to some embodiments of the utility model, the mounting plate 500 is provided with a fastening hole 520, and the mounting plate 500 is connected to the protrusion 240 by a fastener, and the fastener locks the mounting plate 500 and the insulating disk 200, and the insulation column 600 is provided with a third through hole 610 for avoiding the fastener, and the fastener is passed through the fastening hole 520, and the fastener can specifically be a bolt, and the protrusion 240 is provided with a threaded hole 241, and the bolt is threadedly connected to the threaded hole 241.

[0044] Reference Figure 2 and Figure 4 As shown, according to some embodiments of the utility model, the wafer carrier assembly 1000 includes a locking plate 700, and the locking plate 700 is provided with a fourth through hole 710 for avoiding the thermal insulation column 600. The locking plate 700 is located below the shielding plate 400. The locking plate 700 is connected to the insulating disk 200 through a fastener. The locking plate 700 is used to lock the heating plate 300 and the shielding plate 400 to the bottom of the insulating disk 200 to prevent the heating plate 300 and the shielding plate 400 from falling.

[0045] Reference Figure 2 As shown, according to some embodiments of the utility model, the mounting plate 500 is provided with a wire pressing assembly 510 for pressing the wire, and the wire can be connected to the heating plate 300. The wire pressing assembly 510 includes a first wire pressing block 511 and a second wire pressing block 512. The first wire pressing block 511 is connected to the mounting plate 500, and the second wire pressing block 512 is located above the first wire pressing block 511. The second wire pressing block 512 is connected to the first wire pressing block 511 through a fastener, and the fastener can be a bolt. The wire pressing assembly 510 can play a role in fixing the wire.

[0046] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, inside, outside, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0048] In the description of the utility model, if there is a description of first or second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0049] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0050] In the description of the utility model, if there is a description of first or second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0051] The embodiments of the utility model are described in detail above in conjunction with the accompanying drawings. Finally, it should be explained that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model is described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A wafer stage assembly, characterized in that: include: The wafer stage is provided with an adsorption hole for adsorbing the wafer, and the wafer stage is provided with an air channel connected with the adsorption hole, and the air channel is used to connect with the vacuum pumping equipment; A heating plate is arranged below the plate-carrying platform; The shielding sheet is located above the heating sheet and is electrically conductive.

2. The wafer stage assembly according to claim 1, characterized in that: There are a plurality of adsorption holes, which are arranged along the circumference of the wafer support platform. The air channel includes a circumferential section, which extends along the circumference of the wafer support platform, and the circumferential section is connected to the plurality of adsorption holes.

3. The wafer stage assembly according to claim 2, characterized in that: The plurality of adsorption holes are arranged along the radial direction of the wafer stage, the air channel comprises a radial section, the radial section is connected with the circumferential section, and the radial section is connected with the plurality of adsorption holes.

4. The wafer stage assembly according to claim 1, characterized in that: The wafer carrier assembly includes an insulating disk, which is arranged between the wafer support table and the heating plate. The shielding plate is located between the insulating disk and the heating plate. The air channel is arranged at the bottom of the wafer support table, and the air channel is defined between the wafer support table and the insulating disk.

5. The wafer stage assembly according to claim 4, characterized in that: A groove is provided at the bottom of the insulating disk, and the groove is used to accommodate the heating plate and the shielding plate.

6. The wafer stage assembly according to claim 4, characterized in that: The wafer carrier assembly includes a temperature sensor. The insulating disk is provided with a mounting groove, and the temperature sensor is mounted in the mounting groove.

7. The wafer stage assembly according to claim 4, characterized in that: The wafer carrier assembly includes a mounting plate and a thermal insulation column, the mounting plate is located below the insulating disk, the thermal insulation column is located between the insulating disk and the mounting plate, a protrusion is provided at the bottom of the insulating disk, the shielding plate is provided with a first through hole, the heating plate is provided with a second through hole, the protrusion cooperates with the first through hole and the second through hole, and the thermal insulation column abuts against the protrusion.

8. The wafer stage assembly according to claim 7, characterized in that: The mounting plate is connected to the raised portion via a fastener, and the heat-insulating column is provided with a third through hole for avoiding the fastener.

9. The wafer stage assembly according to claim 7, characterized in that: The mounting plate is provided with a wire crimping assembly for crimping the wires, the wire crimping assembly comprising a first wire crimping block and a second wire crimping block, the first wire crimping block is connected to the mounting plate, the second wire crimping block is located above the first wire crimping block, and the second wire crimping block is connected to the first wire crimping block via a fastener.

10. The wafer stage assembly according to claim 4, characterized in that: The wafer carrier assembly includes a locking plate, which is located below the shielding plate and is connected to the insulating disk via a fastener.

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