High-frequency high-power waveguide link heat dissipation support

Abstract

The utility model relates to the technical field of waveguide link heat dissipation supports, in particular to a high-frequency and high-power waveguide link heat dissipation support which comprises a supporting plate, a first U-shaped groove is formed in the supporting plate, a connecting plate is fixedly connected to the right side of the supporting plate, a plurality of long kidney-shaped holes are formed in the surface of the supporting plate, and the first U-shaped groove is formed in the supporting plate. The long kidney-shaped holes are arranged at equal intervals. One side of the heat dissipation support is connected with a test link through screws, the other side of the heat dissipation support is fixed to a vacuum tank cold plate, the connecting end of the heat dissipation support and the test link is flush with the link, the whole support can support the test link, stress at the long cabin penetrating position of the link in the direct connection process of a traditional test link is effectively reduced, and the reliability of the test link is improved. The test link adopting the heat dissipation support can timely conduct instantaneous heat at the turning position and the direct connection position of the waveguide connector to a vacuum tank cold plate through the heat dissipation support, and then the heat is brought out of a vacuum tank through silicone oil, so that the surface temperature of the waveguide connector is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of waveguide link heat dissipation brackets, in particular to a high-frequency and high-power waveguide link heat dissipation bracket. Background Art

[0002] The existing technology mainly focuses on DUT design, tests the function / performance of DUT in a vacuum environment, places DUT in a vacuum test device (vacuum tank), uses different transmission lines to transmit the signal to DUT through the sealed pressure window at the input end, and uses transmission lines to transmit the DUT output signal through the sealed pressure window at the output end to the test instrument, so as to realize the simulated product vacuum environment test;

[0003] Problems and shortcomings of the existing technology:

[0004] 1. In the high-frequency and high-power product test link, the waveguide connector used cannot directly contact the cold plate of the test equipment, and the heat generated can only be dissipated through thermal radiation. However, the waveguide connector used in the high-frequency product test link has a small area that can participate in thermal radiation, and the heat on the surface of the waveguide connector cannot be dissipated in time;

[0005] 2. When temperature-sensitive products are subjected to high-power tests, the heat generated by the waveguide connector is not dissipated in time and is transmitted to the product end through the waveguide connector, which can easily cause product damage or even burning. Utility Model Content

[0006] The purpose of the utility model is to provide a high-frequency and high-power waveguide link heat dissipation bracket, which has the advantages of reducing the heat of the test link, optimizing the product standing wave ratio and insertion loss in a high temperature environment, protecting the product, and reducing the risk of high-frequency and high-power product testing. It solves the problem that the heat generated in the high-frequency and high-power product test link cannot be dissipated in time, causing product damage or even burning.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a high-frequency and high-power waveguide link heat dissipation bracket, comprising a support plate, a first U-shaped groove is opened inside the support plate, a connecting plate is fixedly connected to the right side of the support plate, and a long waist hole is opened on the surface of the support plate.

[0008] Preferably, there are several long waist holes, and the long waist holes are arranged at equal distances.

[0009] Preferably, a baffle is provided on the surface of the support plate, and a second U-shaped groove is opened on the surface of the baffle.

[0010] Preferably, the surface of the baffle is provided with circular holes, the number of the circular holes is several, and the circular holes are arranged at equal distances.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0012] 1. One side of the heat dissipation bracket of the utility model is connected to the test link by screws, and the other side is fixed to the cold plate of the vacuum tank, flush with the test link connection end and the link. The entire bracket can support the test link and effectively reduce the stress at the longer penetration position of the link during the direct connection of the traditional test link.

[0013] 2. The utility model reduces the heat of the test link: the vacuum tank adopts two heat conduction methods: heat radiation and heat conduction. The heat conduction efficiency is much greater than the heat radiation efficiency under the vacuum state. Compared with the traditional test link, the test link using the heat dissipation bracket can transfer the instantaneous heat at the turning point and the direct connection point of the waveguide connector to the vacuum tank cold plate in time through the heat dissipation bracket, and then bring the heat out of the vacuum tank through the silicone oil, thereby reducing the surface temperature of the waveguide connector, so that it is always in a balanced state. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 This is a side view of the structure of the utility model;

[0016] Figure 3 It is a schematic diagram of the support plate and baffle of the utility model.

[0017] In the figure: 1. support plate; 2. first U-shaped groove; 3. connecting plate; 4. long waist hole; 5. baffle; 6. second U-shaped groove; 7. round hole. DETAILED DESCRIPTION

[0018] See also Figure 1 and Figure 2 A high-frequency and high-power waveguide link heat dissipation bracket includes a support plate 1. A first U-shaped groove 2 is provided inside the support plate 1. By providing the first U-shaped groove 2, it is convenient to connect with a waveguide connector and the installation is convenient. A connecting plate 3 is fixedly connected to the right side of the support plate 1, and a long waist hole 4 is provided on the surface of the support plate 1.

[0019] See also Figure 1 There are several long waist holes 4, which are arranged at equal distances. By setting the long waist holes 4, they can cooperate with screws to facilitate positioning and installation of the support plate 1.

[0020] See also Figure 3 A baffle 5 is provided on the surface of the support plate 1, and a second U-shaped groove 6 is opened on the surface of the baffle 5. By setting the baffle 5, it can fit with the flange surface of the waveguide connector, which is convenient for connection with the flange surface of the waveguide connector and enhances the stability of the device.

[0021] See also Figure 3The baffle plate 5 has a plurality of circular holes 7 on its surface, and the circular holes 7 are arranged at equal distances.

[0022] When in use, one side of the heat dissipation bracket is connected to the test link with screws, and the other side is fixed to the cold plate of the vacuum tank, flush with the test link connection end. The entire bracket can support the test link, effectively reducing the stress at the longer cabin penetration position of the link during the direct connection of the traditional test link.

[0023] Optimize product standing wave ratio and insertion loss in high temperature environment: The link will also affect the product test accuracy during the test process. In actual tests, the test link becomes extremely important for the test data of passive products. When conducting high-power tests, excessive heat in the test link will cause the link standing wave ratio and insertion loss parameters to deteriorate. Using a heat dissipation bracket to conduct the heat of the waveguide connector in time can keep the test link standing wave ratio and insertion loss parameters in a small and balanced state, thereby keeping the product's standing wave ratio and insertion loss parameters in a small and balanced state.

[0024] Protect the silver plating of the waveguide accessory cavity to prevent damage to the accessories: In the simulated vacuum environment test of high-frequency and high-power products, waveguide connectors must be used for link connection. The inside of the waveguide connector is silver-plated. When the power is continuously high, the surface temperature of the waveguide connector of the traditional test link can reach 180°C or even higher, which can easily cause the silver plating of the waveguide connector cavity to fall off in a vacuum environment. The installation of a heat dissipation bracket can reduce the risk of the silver plating of the waveguide connector cavity falling off and protect the waveguide connector.

[0025] Protect products and reduce the risk of high-frequency and high-power product testing: simulate abnormal product release in a vacuum environment, and analyze it mainly from two aspects: the product itself and the test link. During the high-frequency and high-power product testing, use a heat dissipation bracket to dissipate the heat of the test link in time, reducing the risk of heat from the test link being transmitted to the product, better simulating the actual working state of the product, and making the product power threshold more accurate.

[0026] The high-frequency and high-power waveguide link heat dissipation bracket also has the following advantages:

[0027] 1. It can meet the testing requirements of products with the same caliber but different heights: the heat dissipation bracket is processed by a milling machine, and each position does not need to be reassembled. The design height of the bracket is consistent with the height from the cold plate of the vacuum tank to the through-cabin. The through-hole method is used in the middle for installation with the waveguide connector, and an adjustable position is reserved to facilitate the use of products of different heights.

[0028] 2. The production process is convenient and easy to process: the heat dissipation bracket has a simple structure and is processed using a milling machine, with a processing time of less than 0.5h.

[0029] 3. Low cost, convenient for mass production according to actual needs: The cost is mainly composed of material cost and processing cost. The size of the heat dissipation bracket is continuously determined according to different equipment and waveguide connectors, and aluminum is used for processing, so the material cost is relatively low. Large parts can be made into basic styles by wire cutting and then fine-processed, and the production process does not require complicated processes.

[0030] 4. Easy to install in the test equipment: During the installation of the heat dissipation bracket, use screws to connect with the waveguide connector, and use crimping to fix the heat dissipation bracket on the vacuum tank cold plate. It is simple to use and easy to operate.

[0031] 5. Small size, light weight, easy to take and store: The size of the heat dissipation bracket depends on the height of the vacuum tank through the cabin and the cold plate. The diameter of the existing vacuum tank on the market is basically 1m, and the height difference between the cold plate and the through cabin is about 25cm. The heat dissipation bracket is 30cm high, 12cm long, and 8cm wide. The volume is small, and the density of pure aluminum is 2.7g / cm 3 , about 1 / 3 lighter than iron.

[0032] 6. Good heat dissipation effect: Test verification: When the product with BJ400 waveguide port is subjected to power test, the test frequency is 37.5~39.5GHz, the continuous wave power is 60W, and the BJ400 waveguide connector is used in the test link. The surface temperature of the waveguide connector is reduced by 60℃ when the heat dissipation bracket is used compared with that without the heat dissipation bracket, and the heat dissipation effect is considerable.

[0033] In summary: the high-frequency and high-power waveguide link heat dissipation bracket, through the support plate 1, the first U-shaped groove 2, the connecting plate 3 and the long waist hole 4, solves the problem that the heat generated by the high-frequency and high-power product test link cannot be dissipated in time, causing product damage or even burning.

Claims

1. A high-frequency and high-power waveguide link heat dissipation support, comprising a support plate (1), characterized in that: A first U-shaped groove (2) is provided inside the support plate (1), a connecting plate (3) is fixedly connected to the right side of the support plate (1), and a long waist hole (4) is provided on the surface of the support plate (1).

2. The high-frequency and high-power waveguide link heat dissipation bracket according to claim 1, characterized in that: The number of the long waist holes (4) is several, and the long waist holes (4) are arranged at equal distances.

3. The high-frequency and high-power waveguide link heat dissipation bracket according to claim 1, characterized in that: A baffle (5) is provided on the surface of the support plate (1), and a second U-shaped groove (6) is opened on the surface of the baffle (5).

4. The high-frequency and high-power waveguide link heat dissipation bracket according to claim 3, characterized in that: The surface of the baffle (5) is provided with circular holes (7), the number of the circular holes (7) is several, and the circular holes (7) are arranged at equal distances.

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