Liquid cooling heat dissipation shell and liquid cooling power supply module

Abstract

A liquid cooling heat dissipation shell comprises an annular outer shell, a liquid cooling base, a liquid cooling cover plate, an upper cover plate and a lower cover plate. A bent groove is formed in the upper surface of the liquid cooling base, the liquid cooling cover plate covers the liquid cooling base and blocks the bent groove to form a liquid cooling flow channel, and a liquid inlet and a liquid outlet are formed in the annular shell; a plurality of first shunting ribs are arranged on the bottom surface of the bent groove, a first arc-shaped guide rib is arranged at the turning position of the liquid cooling flow channel, at least one torrent area is formed on the bent groove, and a first partition plate and at least one drainage boss are arranged in the torrent area on the bottom surface of the bent groove; the length direction of the drainage boss is perpendicular to the cooling liquid flowing direction of the area where the drainage boss is located. A cover plate groove corresponding to the torrent area is formed in the lower surface of the liquid cooling cover plate, a plurality of second shunting ribs are arranged on the bottom face of the cover plate groove, the height of the second shunting ribs is smaller than the depth of the cover plate groove, a second partition plate corresponding to the first partition plate is arranged on the bottom face of the cover plate groove, and the lower surface of the second partition plate abuts against the upper surface of the first partition plate.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply devices, in particular to a liquid cooling heat dissipation housing and a liquid cooling power supply module. Background Art

[0002] The liquid-cooled power module is a power device that uses coolant as a cooling medium to cool the circuit board and its internal electrical components of the power module. It installs a liquid cooling plate on the shell, and circulates coolant into the liquid cooling channel of the liquid cooling plate. Through the heat transfer between the coolant and the liquid cooling plate, the heat generated by the circuit board and the electrical components during operation is further transferred out to avoid damage to the power module due to overheating, to ensure the normal use of the power module and to extend the service life of the power module. At present, the common liquid-cooled power modules on the market are mainly arranged by two liquid cooling plates opposite to each other in the shell, and a liquid cooling channel for the coolant to pass is formed between the two liquid cooling plates. The circuit board and the corresponding electrical components are attached to the outer surface of the liquid cooling plate through insulating materials such as thermal conductive pads, ceramic sheets or silicone cloth. Through the above insulating materials, heat conduction between the circuit board and the electrical components and the liquid cooling plate is achieved. Due to the layout requirements of the circuit boards and electrical components inside the power module, the liquid cooling plate often needs to be designed as a non-planar structure to increase the installation area of ​​the circuit boards and electrical components. In this way, it is difficult to keep the height of each part in the liquid cooling channel consistent. When the coolant flow is small and it is difficult to fill the entire liquid cooling channel, the inner side surface corresponding to the raised part of the liquid cooling plate is difficult to contact with the coolant. The two liquid cooling plates have a temperature difference due to the different contact areas with the coolant, which makes the heat dissipation effect of the circuit boards and electrical components outside the two liquid cooling plates different, making it difficult to achieve comprehensive heat dissipation of the power module. Furthermore, affected by the installation position and diameter of the liquid inlet and outlet pipes, the coolant often flows along a narrow path after entering the liquid cooling channel. It is difficult for the coolant to cover the entire surface of the liquid cooling plate, resulting in different temperatures at different parts of the liquid cooling plate, further affecting the heat dissipation effect of the power module. Utility Model Content

[0003] Based on this, it is necessary to provide a liquid-cooled heat dissipation housing and a liquid-cooled power supply module with an increased cooling area and good heat dissipation effect in order to address the above-mentioned deficiencies.

[0004] A liquid-cooled heat dissipation housing comprises an annular shell, a liquid-cooled base received in an inner cavity of the annular shell and sealed and fixed to the inner surface of the annular shell, a liquid-cooled cover plate located above the liquid-cooled base and sealed and fixed to the inner surface of the annular shell, an upper cover plate fixed at an upper opening of the annular shell, and a lower cover plate fixed at a lower opening of the annular shell, wherein the annular shell, the liquid-cooled cover plate and the upper cover plate together enclose an upper sealed cavity for accommodating a first circuit board assembly, and the annular shell, the liquid-cooled base and the lower cover plate together enclose a lower sealed cavity for accommodating a second circuit board assembly;

[0005] The upper surface of the liquid-cooling base is provided with a curved groove, the liquid-cooling cover plate is covered on the liquid-cooling base and blocks the curved groove to form a liquid-cooling flow channel for accommodating the cooling liquid, and the annular shell is provided with a liquid inlet connected to one end of the liquid-cooling flow channel and a liquid outlet connected to the other end of the liquid-cooling flow channel; a plurality of first diversion ribs are arranged in parallel and at intervals on the groove bottom surface of the curved groove, a first arc-shaped guide rib is arranged on the groove bottom surface of the curved groove at the turning point of the liquid-cooling flow channel, at least one rapid flow area is formed on the curved groove, and a first partition plate and at least one drainage boss are arranged in the rapid flow area along the extension direction of the curved groove on the groove bottom surface of the curved groove, and the length direction of the drainage boss is perpendicular to the flow direction of the cooling liquid in the area where it is located;

[0006] The upper surface of the liquid-cooled cover plate is raised so that the lower surface of the liquid-cooled cover plate forms a cover plate groove corresponding to the rapid flow area. A plurality of second diverter ribs extending along the length direction of the cover plate groove are arranged in parallel and spaced apart on the bottom surface of the cover plate groove. The height of the second diverter ribs is less than the depth of the cover plate groove. A second partition plate corresponding to the first partition plate is also arranged on the bottom surface of the cover plate groove. The lower surface of the second partition plate abuts against the upper surface of the first partition plate.

[0007] In one embodiment, the annular shell includes a left side plate and a right side plate that are relatively arranged, a front side plate fixedly connected to the front side surfaces of the left side plate and the right side plate, and a rear side plate fixedly connected to the rear side surfaces of the left side plate and the right side plate, and the liquid inlet and the liquid outlet are opened on the front side plate, the bottom surface of the groove at one end of the curved groove is recessed and forms a first opening connected to the liquid inlet, and the bottom surface of the groove at the other end of the curved groove is recessed and forms a second opening connected to the liquid outlet.

[0008] In one of the embodiments, a rectangular liquid-conducting groove is provided on the upper surface of the liquid-cooling base, and a first mounting ridge, a second mounting ridge, and a third mounting ridge located between the first mounting ridge and the second mounting ridge are arranged at intervals on the bottom surface of the rectangular liquid-conducting groove, which extend in the front-to-rear direction of the rectangular liquid-conducting groove and have lengths less than the distance between the front wall and the rear wall of the rectangular liquid-conducting groove. The first mounting ridge and the second mounting ridge are connected to the front wall of the rectangular liquid-conducting groove, and the third mounting ridge is connected to the rear wall of the rectangular liquid-conducting groove. The first mounting ridge, the second mounting ridge, and the third mounting ridge jointly separate the rectangular liquid-conducting groove to form the curved groove of the bow-shaped structure. The rapid flow area is formed between the first mounting ridge and the second mounting ridge, a side of the first mounting ridge facing away from the third mounting ridge forms a liquid inlet area connected to the liquid inlet, and a side of the second mounting ridge facing away from the third mounting ridge forms a liquid outlet area connected to the liquid outlet;

[0009] The lower surface of the liquid cooling cover plate is provided with a first mounting portion corresponding to the first mounting protrusion, a second mounting portion corresponding to the second mounting protrusion and a third mounting portion corresponding to the third mounting protrusion, and a cover plate groove is respectively provided between the first mounting portion and the third mounting portion and between the second mounting portion and the third mounting portion.

[0010] In one embodiment, positioning grooves are respectively formed on the first mounting protrusion, the second mounting protrusion and the third mounting protrusion, and positioning columns for correspondingly inserting into the positioning grooves are respectively formed on the first mounting portion, the second mounting portion and the third mounting portion.

[0011] In one embodiment, a plurality of first partition plates are equidistantly arranged between the first mounting ridge and the third mounting ridge and between the second mounting ridge and the third mounting ridge, and the first partition plates extend along the front-to-back direction of the rectangular liquid guiding groove; or

[0012] A first partition plate is respectively arranged in the middle between the first mounting protrusion and the third mounting protrusion and in the middle between the second mounting protrusion and the third mounting protrusion, and the first partition plate extends along the front-rear direction of the rectangular liquid guiding groove.

[0013] In one embodiment, a plurality of circular reinforcement columns are arranged at intervals on the first partition plate, a plurality of first arc-shaped protrusions are arranged at intervals on one side of the second partition plate, and a plurality of second arc-shaped protrusions corresponding to the first arc-shaped protrusions are arranged at intervals on the other side of the second partition plate, the first arc-shaped protrusions and the second arc-shaped protrusions extend from the bottom surface of the cover plate groove toward the groove opening of the cover plate groove, and the heights of the first arc-shaped protrusions and the second arc-shaped protrusions are less than the height of the second partition plate.

[0014] In one of the embodiments, a plurality of third diversion ribs extending along the front-to-rear direction of the rectangular liquid guide groove are respectively arranged in parallel at positions corresponding to the liquid inlet area and the liquid outlet area on the lower surface of the liquid cooling cover plate; a second arc guide rib corresponding to the first arc guide rib is respectively arranged at areas corresponding to the end of the first mounting protrusion and the end of the second mounting protrusion on the lower surface of the liquid cooling cover plate.

[0015] In one embodiment, the distance from the lower surface of the third diverter rib to the upper surface of the first diverter rib is greater than zero, and the distance from the lower surface of the second arc-shaped guide rib to the upper surface of the first arc-shaped guide rib is greater than zero.

[0016] In one of the embodiments, the ratio of the height of the second diverter rib to the depth of the cover plate groove is between 1:5 and 1:2.

[0017] The utility model also discloses a liquid-cooled power supply module, which comprises a first circuit board assembly, a second circuit board assembly and the above-mentioned liquid-cooled heat dissipation housing.

[0018] In the implementation of the liquid-cooled heat dissipation housing and the liquid-cooled power supply module of the utility model, a torrent area is set on the liquid-cooled base corresponding to the cover groove area of ​​the liquid-cooled cover plate. When the coolant flows to the drainage boss, the coolant is blocked by the drainage boss and splashes on the bottom surface and inner side surface of the cover groove. In addition, by setting a first partition plate on the liquid-cooled base and a second partition plate in the cover groove, the coolant in the torrent area is diverted, so that the coolant can fully contact the inner surface of the cover groove. In this way, even if the coolant flow rate is small and fails to fill the entire cover groove, the coolant can still contact the inner surface of the cover groove. The upper surface of the liquid-cooled base and the inner surface of the cover groove are in full contact; by arranging the first diversion rib in the curved groove, the diversion of the coolant in the liquid-cooled channel is achieved, so that the coolant is divided into several small streams and flows along the area between adjacent first diversion ribs, and the width of the coolant flow area in the liquid-cooled channel is increased, thereby increasing the contact area between the coolant and the liquid-cooled base and the liquid-cooled cover, and the coolant is evenly in contact with various parts of the liquid-cooled base and the liquid-cooled cover, so that the temperature of the liquid-cooled base and the liquid-cooled cover tends to be consistent, thereby improving the heat dissipation efficiency and heat dissipation effect of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic structural diagram of a liquid cooling heat dissipation housing in one embodiment of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of a liquid cooling and heat dissipation housing after removing the upper cover plate and the lower cover plate in one embodiment of the utility model;

[0021] Figure 3 It is a schematic cross-sectional structure diagram of a liquid cooling and heat dissipation housing in one embodiment of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the liquid cooling base and the annular housing in one embodiment of the utility model;

[0023] Figure 5 It is a top view of the cooperation between the liquid cooling base and the annular housing in one embodiment of the utility model;

[0024] Figure 6 This is a schematic structural diagram of a liquid cooling cover plate in one embodiment of the utility model;

[0025] Figure 7 It is a top view of a liquid cooling cover plate in one embodiment of the utility model. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0027] Please combine Figure 1-7The utility model discloses a liquid cooling heat dissipation housing, which includes an annular shell 100, a liquid cooling base 200 received in the inner cavity of the annular shell 100 and sealed and fixed to the inner surface of the annular shell 100, a liquid cooling cover plate 300 located above the liquid cooling base 200 and sealed and fixed to the inner surface of the annular shell 100, an upper cover plate 400 fixed at the upper opening of the annular shell 100, and a lower cover plate 500 fixed at the lower opening of the annular shell 100. The annular shell 100, the liquid cooling cover plate 300 and the upper cover plate 400 together enclose an upper sealed cavity for accommodating a first circuit board assembly, and the annular shell 100, the liquid cooling base 200 and the lower cover plate 500 together enclose a lower sealed cavity for accommodating a second circuit board assembly. In this embodiment, the liquid cooling base 200 can be screwed to the annular shell 100, and a sealant is provided at the connection between the two, or the liquid cooling base 200 and the annular shell 100 can be integrally formed. A curved groove 210 is provided on the upper surface of the liquid cooling base 200, and a liquid cooling cover plate 300 is covered on the liquid cooling base 200 and blocks the curved groove 210 to form a liquid cooling channel 220 for accommodating cooling liquid. A liquid inlet 110 connected to one end of the liquid cooling channel 220 and a liquid outlet 120 connected to the other end of the liquid cooling channel 220 are provided on the annular shell 100. The liquid cooling channel 220 provides a liquid cooling space for circulating coolant. In this way, circulating coolant is introduced into the liquid cooling channel 220 through the liquid inlet 110, and the cooling in the liquid cooling channel 220 is discharged from the liquid outlet 120. When the coolant contacts the liquid cooling cover plate 300 and the liquid cooling base 200, the coolant exchanges heat with the liquid cooling cover plate 300 and the liquid cooling base 200 by heat conduction, so that the temperature of the liquid cooling cover plate 300 and the liquid cooling base 200 is reduced, so that the liquid cooling cover plate 300 exchanges heat with the air in the upper sealed cavity to achieve cooling of the first circuit board assembly in the upper sealed cavity, and at the same time, it is convenient for the liquid cooling base 200 to exchange heat with the air in the lower sealed cavity to achieve cooling of the second circuit board assembly in the lower sealed cavity. In this way, by continuously introducing circulating coolant into the liquid cooling channel 220, continuous heat dissipation of the circuit board assembly in the shell can be achieved. By opening a curved groove 210 on the liquid cooling base 200 and forming a liquid cooling channel 220 through the cooperation of the liquid cooling base 200 and the liquid cooling cover plate 300, the time that the coolant stays in the liquid cooling heat dissipation shell is extended. On the one hand, the contact time between the coolant and the liquid cooling heat dissipation shell is extended, and on the other hand, the contact area between the coolant and the liquid cooling heat dissipation shell is increased, which is beneficial to improving the heat dissipation effect of the liquid cooling heat dissipation shell on the circuit board assembly.

[0028] In this embodiment, a plurality of first flow-dividing ribs 211 are arranged in parallel and at intervals on the bottom surface of the curved groove 210, and a first arc-shaped guide rib 212 is arranged on the bottom surface of the curved groove 210 at the turning point of the liquid-cooling flow channel 220. By arranging the first flow-dividing rib 211 in the curved groove 210, when the liquid-cooling heat dissipation housing is laid flat and the liquid-cooling cover plate 300 is located above the liquid-cooling base 200, the cooling liquid entering the curved groove 210 is divided into a plurality of small streams by the plurality of first flow-dividing ribs 211, so that the cooling liquid can be spread on the bottom surface of the curved groove 210 and cover the entire cross-sectional width of the curved groove 210, so that the cooling liquid is in full contact with all parts of the curved groove 210. By arranging the first arc-shaped guide rib 212 at the turning point of the curved groove 210, the cooling liquid can be guided at the turning point of the curved groove 210 to reduce the retention of the cooling liquid at the turning point of the curved groove 210. At least one rapid flow area 213 is formed on the curved groove 210. The bottom surface of the curved groove 210 is provided with a first partition plate 214 and at least one diversion boss 215 arranged along the extension direction of the curved groove 210 in the rapid flow area 213. The length direction of the diversion boss 215 is perpendicular to the flow direction of the coolant in the area where it is located. The upper surface of the liquid cooling cover plate 300 is raised so that the lower surface of the liquid cooling cover plate 300 forms a cover plate groove 310 corresponding to the rapid flow area 213. The bottom surface of the cover plate groove 310 is parallelly and spaced apart to form a plurality of second diversion ribs 311 extending along the length direction of the cover plate groove 310. The height of the second diversion ribs 311 is less than the depth of the cover plate groove 310. The bottom surface of the cover plate groove 310 is also provided with a second partition plate 312 corresponding to the first partition plate 214. The lower surface of the second partition plate 312 abuts against the upper surface of the first partition plate 214.

[0029] In this embodiment, the length direction of the drainage boss 215 is defined to be perpendicular to the coolant flow direction in the area where it is located, and its purpose is to increase the resistance of the drainage boss 215 to the flow of the coolant, so that the coolant can splash when it flows to the drainage boss 215. Since the speed at which the coolant enters the liquid-cooled heat dissipation housing is relatively high, when the coolant flows to the drainage boss 215, the coolant will form a liquid flow that rises toward the bottom surface of the groove close to the cover plate groove 310 at the drainage boss 215 and flows along the inner surface of the cover plate groove 310 at a higher flow rate, so that the coolant contacts the bottom surface and inner side surface of the cover plate groove 310. In this way, even if the liquid-cooled heat dissipation housing is placed flat, the coolant can still cool down the circuit board assembly installed in the area corresponding to the cover plate groove 310 on the upper surface of the liquid-cooled cover plate 300, while ensuring the heat dissipation effect of the liquid-cooled heat dissipation housing, the heat dissipation area inside the liquid-cooled heat dissipation housing is increased. Similarly, in this embodiment, by setting a second diverter rib 311 in the cover plate groove 310, the coolant splashed to the bottom surface of the cover plate groove 310 can be diverted so that the coolant is fully in contact with the inner surface of the cover plate groove 310. By setting a first partition plate 214 in the torrent area 213 and setting a second partition plate 312 in the cover plate groove 310, the coolant entering the torrent area 213 can be divided into multiple independent streams. In this way, multiple streams of coolant flow through the torrent area 213 through independent channels respectively, which can further increase the contact area between the coolant and the cover plate groove 310. In addition, it should be noted that in this embodiment, by setting the first diverter rib 211, the second diverter rib 311, the diversion boss 215, the first arc-shaped guide rib 212, the first partition plate 214 and the second partition plate 312, the contact area between the coolant and the liquid-cooled heat dissipation shell is increased, thereby increasing the heat dissipation area of ​​the liquid-cooled heat dissipation shell and improving the heat dissipation effect of the liquid-cooled heat dissipation shell.

[0030] In one embodiment, the annular housing 100 includes a left side plate 130 and a right side plate 140 that are arranged opposite to each other, a front side plate 150 that is fixedly connected to the front side of the left side plate 130 and the right side plate 140, and a rear side plate 160 that is fixedly connected to the rear side of the left side plate 130 and the right side plate 140. The liquid inlet 110 and the liquid outlet 120 are opened on the front side plate 150. The left side plate 130, the right side plate 140, the front side plate 150 and the rear side plate 160 form a rectangular cavity, and the liquid cooling cover plate 300 and the liquid cooling base 200 are accommodated in the rectangular cavity. The inner walls of the left side plate 130, the right side plate 140, the front side plate 150 and the rear side plate 160 are respectively provided with a plurality of threaded tubes 170, which are used to provide a screw connection portion between the annular housing 100 and the upper cover plate 400 and the lower cover plate 500, and are also used as reinforcing ribs of each side plate to improve the mechanical strength of the annular housing 100. The bottom surface of the curved groove 210 at one end is recessed to form a first opening 216 connected to the liquid inlet 110, and the bottom surface of the curved groove 210 at the other end is recessed to form a second opening 217 connected to the liquid outlet 120. In this way, while meeting the liquid inlet demand of the liquid-cooling channel 220 with a smaller height, the coolant can enter the liquid-cooling channel 220 through the liquid inlet 110 at a larger flow rate to improve the heat dissipation effect.

[0031] Please further combine Figure 2-4A rectangular liquid guiding groove is provided on the upper surface of the liquid cooling base 200, and a first mounting ridge 220, a second mounting ridge 230 and a third mounting ridge 240 are arranged at intervals on the bottom surface of the rectangular liquid guiding groove, which extend along the front-to-back direction of the rectangular liquid guiding groove and have a length less than the distance between the front wall and the rear wall of the rectangular liquid guiding groove. The first mounting ridge 220 and the second mounting ridge 230 are connected to the front wall of the rectangular liquid guiding groove, and the third mounting ridge 240 is connected to the rear wall of the rectangular liquid guiding groove. The first mounting ridge 220, the second mounting ridge 230 and the third mounting ridge 240 jointly separate the rectangular liquid guiding groove to form a curved groove 210 with a bow-shaped structure. In this embodiment, the front-to-back direction of the rectangular liquid-conducting groove refers to the direction extending from the side of the rectangular liquid-conducting groove adjacent to the front side plate to the side of the rectangular liquid-conducting groove adjacent to the rear side plate, the front wall of the rectangular liquid-conducting groove refers to the inner wall of the rectangular liquid-conducting groove adjacent to the front side plate, and the rear wall of the rectangular liquid-conducting groove refers to the inner wall of the rectangular liquid-conducting groove adjacent to the rear side plate. A rapid flow area 213 is formed between the first mounting ridge 220 and the second mounting ridge 230, a side of the first mounting ridge 220 facing away from the third mounting ridge 240 forms a liquid inlet area 218 connected to the liquid inlet 110, and a side of the second mounting ridge 230 facing away from the third mounting ridge 240 forms a liquid outlet area 219 connected to the liquid outlet 120. The lower surface of the liquid cooling cover plate 300 is provided with a first mounting portion corresponding to the first mounting ridge 220, a second mounting portion corresponding to the second mounting ridge 230, and a third mounting portion corresponding to the third mounting ridge 240. When the liquid cooling base 200 and the liquid cooling cover plate 300 are assembled, the first mounting ridge 220 abuts against the first mounting portion, the second mounting ridge 230 abuts against the second mounting portion, and the third mounting ridge 240 abuts against the third mounting portion. A cover plate groove 310 is respectively provided between the first mounting portion and the third mounting portion and between the second mounting portion and the third mounting portion, that is, a cover plate groove 310 is respectively provided on both sides of the third mounting portion to cooperate with the rapid flow area 213 on the liquid cooling base 200.

[0032] Further, positioning grooves 250 are respectively provided on the first mounting convex strip 220, the second mounting convex strip 230 and the third mounting convex strip 240, and positioning posts 320 for correspondingly inserting into the positioning grooves 250 are respectively provided on the first mounting portion, the second mounting portion and the third mounting portion. Preferably, in the present embodiment, a plurality of positioning grooves 250 are respectively provided on the first mounting convex strip 220, the second mounting convex strip 230 and the third mounting convex strip 240 at intervals, and the positioning grooves 250 are stepped grooves, including a first groove body and a second groove body located below the first groove body and connected to the first groove body, the first groove body is a circular groove, and the second groove body is a circular groove, an elliptical groove or a groove body with a runway-shaped cross section, the outer contour shape of the positioning post 320 is adapted to the inner contour shape of the corresponding positioning groove 250, and the size of the first groove body needs to satisfy that the end of the positioning post 320 can be inserted into the second groove body. By cooperating with the positioning groove 250 and the positioning column 320, the liquid cooling cover plate 300 and the liquid cooling base 200 can be pre-positioned to prevent the two from shaking during the assembly process with the annular shell 100, thereby reducing the difficulty of assembling the liquid cooling heat dissipation shell.

[0033] It should be noted that, in this embodiment, the number of the second partition plates 312 is the same as the number of the first partition plates 214, and the two are arranged at the same position to achieve the separation of the liquid cooling channel 220. In one embodiment, a plurality of first partition plates 214 are equidistantly arranged between the first mounting ridge 220 and the third mounting ridge 240 and between the second mounting ridge 230 and the third mounting ridge 240, respectively, and the first partition plates 214 extend along the front-to-back direction of the rectangular liquid guide groove, so that the rapid flow area 213 in the liquid cooling channel 220 can be divided into a plurality of independent channels, so that the coolant is diverted in each independent channel. In another embodiment, a first partition plate 214 is respectively provided in the middle portion between the first mounting protrusion 220 and the third mounting protrusion 240 and in the middle portion between the second mounting protrusion 230 and the third mounting protrusion 240. The first partition plate 214 extends along the front-to-back direction of the rectangular liquid guide groove so as to divide the area between the first mounting protrusion 220 and the third mounting protrusion 240 and the area between the second mounting protrusion 230 and the third mounting protrusion 240 into two respectively, so as to realize the diversion of the cooling liquid in the rapid flow area 213.

[0034] A plurality of circular reinforcing columns 2141 are arranged at intervals on the first partition plate 214, a plurality of first arcuate convex portions 3121 are arranged at intervals on one side of the second partition plate 312, and a plurality of second arcuate convex portions 3122 corresponding to the first arcuate convex portions are arranged at intervals on the other side of the second partition plate 312, the first arcuate convex portions 3121 and the second arcuate convex portions 3122 extend from the bottom surface of the groove of the cover plate groove 310 to the notch direction of the cover plate groove 310, and the heights of the first arcuate convex portions 3121 and the second arcuate convex portions 3122 are less than the height of the second partition plate 312. By arranging the circular reinforcing columns 2141 on the first partition plate 214 and the first arcuate convex portions 3121 and the second arcuate convex portions 3122 on the second partition plate 312, the mechanical strength of the first partition plate 214 and the second partition plate 312 can be improved, and the two can be prevented from being damaged by the impact of the coolant or the external extrusion force, so as to extend the service life of the liquid cooling heat dissipation housing. Similarly, the provision of the circular reinforcing column 2141, the first arc-shaped protrusion 3121 and the second arc-shaped protrusion 3122 also increases the heat dissipation area of ​​the liquid cooling base 200 and the liquid cooling cover plate 300, which is beneficial to further improve the heat dissipation effect of the liquid cooling heat dissipation housing.

[0035] The lower surface of the liquid-cooled cover plate 300 is provided with a plurality of third diverter ribs 330 extending in parallel along the front-rear direction of the rectangular liquid guide groove at the positions corresponding to the liquid inlet area 218 and the liquid outlet area 219; the lower surface of the liquid-cooled cover plate 300 is provided with second arc-shaped guide ribs 340 corresponding to the first arc-shaped guide ribs 212 at the areas corresponding to the ends of the first mounting convex strips 220 and the second mounting convex strips 230. By providing the third diverter ribs 330, the diversion of the coolant when flowing on the lower surface of the liquid-cooled cover plate 300 can be achieved, so as to increase the width of the coolant flowing on the lower surface of the liquid-cooled cover plate 300, thereby increasing the contact area between the coolant and the liquid-cooled cover plate 300; the second arc-shaped guide ribs 340 are used to guide the coolant flowing to the lower surface of the liquid-cooled cover plate 300, so as to reduce the retention of the coolant at the turning part of the lower surface of the liquid-cooled cover plate 300. In addition, the provision of the third diversion rib 330 and the second arc-shaped guide rib 340 further increases the heat dissipation area of ​​the liquid-cooled cover plate 300, so that the liquid-cooled cover plate 300 can quickly exchange heat with the coolant, and facilitates the heat exchange between the liquid-cooled cover plate 300 and the circuit board assembly, thereby achieving the purpose of improving the heat dissipation efficiency of the liquid-cooled heat dissipation housing.

[0036] It should be noted that, in this embodiment, the distance from the lower surface of the second diverter rib 311 to the upper surface of the first diverter rib 211 is greater than zero, the distance from the lower surface of the third diverter rib 330 to the upper surface of the first diverter rib 211 is greater than zero, and the distance from the lower surface of the second arc-shaped guide rib 340 to the upper surface of the first arc-shaped guide rib 212 is greater than zero. Furthermore, the ratio of the height of the second diverter rib 311 to the depth of the cover plate groove 310 is between 1:5 and 1:2. Preferably, the height of the second diverter rib 311 is half the depth of the cover plate groove 310. In this way, when the coolant flows in the liquid-cooling channel 220, on the one hand, it can be divided into several small streams through the first diverter rib 211, the second diverter rib 311, the third diverter rib 330, the first arc-shaped guide rib 212 and the second arc-shaped guide rib 340. On the other hand, the coolant in the liquid-cooling channel 220 can also perform heat exchange between the ribs of the liquid-cooling cover plate 300 and the ribs of the liquid-cooling base 200, thereby achieving rapid cooling of the circuit board assembly and making the temperatures of the circuit board assemblies after cooling by the coolant as consistent as possible.

[0037] In one embodiment, an annular boss is provided on the upper surface of the liquid cooling base 200, and the curved groove 210 is located in the inner ring of the annular boss. The inner contour shape of the annular boss is adapted to the outer contour shape of the curved groove 210, and a step is formed between the inner side surface of the annular boss and the notch of the curved groove 210; a limiting portion is provided on the edge of the lower surface of the liquid cooling cover plate 300, which is concavely matched with the step and sealedly connected. In this way, the sealing match and positioning of the liquid cooling cover plate 300 and the liquid cooling base 200 can be achieved through the cooperation of the limiting portion and the step.

[0038] In addition, the connection parts of the annular shell 100 and the liquid cooling base 200, the connection parts of the annular shell 100 and the liquid cooling cover plate 300, the connection parts of the annular shell 100 and the upper cover plate 400, and the connection parts of the annular shell 100 and the lower cover plate 500 are all provided with sealing silicone, which can be sealed by providing a dispensing sealing groove at the corresponding matching parts and injecting the sealing silicone into the dispensing sealing groove. In other embodiments, the connection parts of the annular shell 100 and the liquid cooling base 200, the connection parts of the annular shell 100 and the liquid cooling cover plate 300, the connection parts of the annular shell 100 and the upper cover plate 400, and the connection parts of the annular shell 100 and the lower cover plate 500 are fixed by friction welding, so as to separate the coolant between the liquid cooling cover plate 300 and the liquid cooling base 200 from the electrical components. The upper cover plate 400, the lower cover plate 500, the annular shell, the liquid cooling base 200, and the liquid cooling cover plate 300 are made of metal with good heat dissipation, such as aluminum alloy. The liquid-cooled heat dissipation housing of the present invention can be applied to various modules that require heat dissipation and cooling, including but not limited to power modules, integrated circuit modules, and the like.

[0039] The utility model also discloses a liquid-cooled power supply module, which includes a first circuit board assembly, a second circuit board assembly and the above-mentioned liquid-cooled heat dissipation housing, wherein the first circuit board assembly can be an output DC / DC circuit board assembly fixed on the upper surface of the lower cover plate 500, and the electronic components of the output DC / DC circuit board assembly include a first MOS tube group, a transformer, an inductor and an output capacitor attached to the lower surface of the liquid-cooled base 200. The second circuit board assembly is an input PFC circuit board assembly, and the input PFC circuit board assembly includes an input PFC inductor, an input common-mode inductor, a second MOS tube group, a fuse and an input capacitor fixed on the upper surface of the liquid-cooled cover plate 300. The front side plate 150 of the annular housing 100 is also provided with an input terminal, an output terminal and a breathable valve, the input terminal is electrically connected to the input PFC circuit board assembly, the output terminal is electrically connected to the output DC / DC circuit board assembly, and the breathable valve is arranged near the liquid inlet 110 and the liquid outlet 120. Of course, depending on the functions and design requirements of the liquid-cooled power module, the first circuit board assembly and the second circuit board assembly may also be other circuit board assemblies, and the electrical components and arrangements contained in the two may be adjusted as needed. As long as the first circuit board assembly and the second circuit board assembly can achieve heat dissipation through contact with the liquid-cooled cover plate 300 and the liquid-cooled base 200, no further details will be given here.

[0040] The above-mentioned liquid-cooled heat dissipation housing and liquid-cooled power supply module are provided with a torrent area 213 on the liquid-cooled base 200 corresponding to the cover groove 310 area of ​​the liquid-cooled cover 300. When the coolant flows to the drainage boss 215, the coolant is blocked by the drainage boss 215 and splashes on the bottom surface and inner side surface of the cover groove 310. In addition, by providing a first partition plate 214 on the liquid-cooled base 200 and providing a second partition plate 312 in the cover groove 310, the coolant in the torrent area 213 is diverted, so that the coolant can fully contact the inner surface of the cover groove 310. In this way, even if the coolant flow rate is small and fails to fill the entire cover groove 310, the coolant can still The first diverter rib 211 is provided in the curved groove 210 to realize the diversion of the coolant in the liquid-cooling channel, so that the coolant is divided into several small streams and flows along the area between adjacent first diverter ribs 211. The width of the coolant flow area in the liquid-cooling channel is increased, thereby increasing the contact area between the coolant and the liquid-cooling base 200 and the liquid-cooling cover 300. The coolant is evenly in contact with various parts of the liquid-cooling base 200 and the liquid-cooling cover 300, so that the temperature on the liquid-cooling base 200 and the liquid-cooling cover 300 tends to be consistent, thereby improving the heat dissipation efficiency and heat dissipation effect of the power module.

[0041] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A liquid-cooled heat dissipation housing, comprising an annular shell, a liquid-cooled base received in an inner cavity of the annular shell and sealed and fixed to an inner surface of the annular shell, a liquid-cooled cover plate located above the liquid-cooled base and sealed and fixed to an inner surface of the annular shell, an upper cover plate fixed at an upper opening of the annular shell, and a lower cover plate fixed at a lower opening of the annular shell, wherein the annular shell, the liquid-cooled cover plate and the upper cover plate together form an upper sealed cavity for accommodating a first circuit board assembly, and the annular shell, the liquid-cooled base and the lower cover plate together form a lower sealed cavity for accommodating a second circuit board assembly; characterized in that: The upper surface of the liquid-cooling base is provided with a curved groove, the liquid-cooling cover plate is covered on the liquid-cooling base and blocks the curved groove to form a liquid-cooling flow channel for accommodating the cooling liquid, and the annular shell is provided with a liquid inlet connected to one end of the liquid-cooling flow channel and a liquid outlet connected to the other end of the liquid-cooling flow channel; a plurality of first diversion ribs are arranged in parallel and at intervals on the groove bottom surface of the curved groove, a first arc-shaped guide rib is arranged on the groove bottom surface of the curved groove at the turning point of the liquid-cooling flow channel, at least one rapid flow area is formed on the curved groove, and a first partition plate and at least one drainage boss are arranged in the rapid flow area along the extension direction of the curved groove on the groove bottom surface of the curved groove, and the length direction of the drainage boss is perpendicular to the flow direction of the cooling liquid in the area where it is located; The upper surface of the liquid-cooled cover plate is raised so that the lower surface of the liquid-cooled cover plate forms a cover plate groove corresponding to the rapid flow area. A plurality of second diverter ribs extending along the length direction of the cover plate groove are arranged in parallel and spaced apart on the bottom surface of the cover plate groove. The height of the second diverter ribs is less than the depth of the cover plate groove. A second partition plate corresponding to the first partition plate is also arranged on the bottom surface of the cover plate groove. The lower surface of the second partition plate abuts against the upper surface of the first partition plate.

2. The liquid cooling heat dissipation housing according to claim 1, characterized in that: The annular shell includes a left side plate and a right side plate arranged opposite to each other, a front side plate fixedly connected to the front side surfaces of the left side plate and the right side plate, and a rear side plate fixedly connected to the rear side surfaces of the left side plate and the right side plate. The liquid inlet and the liquid outlet are opened on the front side plate, the bottom surface of the groove at one end of the curved groove is recessed to form a first opening connected to the liquid inlet, and the bottom surface of the groove at the other end of the curved groove is recessed to form a second opening connected to the liquid outlet.

3. The liquid cooling heat dissipation housing according to claim 2, characterized in that: A rectangular liquid guide groove is provided on the upper surface of the liquid cooling base, and a first mounting ridge, a second mounting ridge, and a third mounting ridge located between the first mounting ridge and the second mounting ridge are arranged at intervals on the bottom surface of the rectangular liquid guide groove, extending along the front-to-back direction of the rectangular liquid guide groove and having a length less than the distance between the front wall and the rear wall of the rectangular liquid guide groove. The first mounting ridge and the second mounting ridge are connected to the front wall of the rectangular liquid guide groove, and the third mounting ridge is connected to the rear wall of the rectangular liquid guide groove. The first mounting ridge, the second mounting ridge, and the third mounting ridge jointly separate the rectangular liquid guide groove to form the curved groove of the bow-shaped structure, and the rapid flow area is formed between the first mounting ridge and the second mounting ridge. A side of the first mounting ridge facing away from the third mounting ridge forms a liquid inlet area connected to the liquid inlet, and a side of the second mounting ridge facing away from the third mounting ridge forms a liquid outlet area connected to the liquid outlet; The lower surface of the liquid cooling cover plate is provided with a first mounting portion corresponding to the first mounting protrusion, a second mounting portion corresponding to the second mounting protrusion and a third mounting portion corresponding to the third mounting protrusion, and a cover plate groove is respectively provided between the first mounting portion and the third mounting portion and between the second mounting portion and the third mounting portion.

4. The liquid cooling heat dissipation housing according to claim 3, characterized in that: Positioning grooves are respectively formed on the first mounting protrusion, the second mounting protrusion and the third mounting protrusion, and positioning columns for correspondingly inserting into the positioning grooves are respectively formed on the first mounting portion, the second mounting portion and the third mounting portion.

5. The liquid cooling heat dissipation housing according to claim 3, characterized in that: A plurality of first partition plates are equidistantly arranged between the first mounting convex strip and the third mounting convex strip, and between the second mounting convex strip and the third mounting convex strip, and the first partition plates extend along the front-to-back direction of the rectangular liquid guiding groove; or A first partition plate is respectively arranged in the middle between the first mounting protrusion and the third mounting protrusion and in the middle between the second mounting protrusion and the third mounting protrusion, and the first partition plate extends along the front-rear direction of the rectangular liquid guiding groove.

6. The liquid cooling heat dissipation housing according to claim 1, characterized in that: A plurality of circular reinforcement columns are arranged at intervals on the first partition plate, a plurality of first arc-shaped protrusions are arranged at intervals on one side of the second partition plate, and a plurality of second arc-shaped protrusions corresponding to the first arc-shaped protrusions are arranged at intervals on the other side of the second partition plate, the first arc-shaped protrusions and the second arc-shaped protrusions extend from the bottom surface of the cover plate groove toward the groove opening of the cover plate groove, and the heights of the first arc-shaped protrusions and the second arc-shaped protrusions are less than the height of the second partition plate.

7. The liquid cooling heat dissipation housing according to claim 3, characterized in that: The lower surface of the liquid cooling cover plate is provided with a plurality of third diversion ribs extending in parallel along the front-to-rear direction of the rectangular liquid guide groove at positions corresponding to the liquid inlet area and the liquid outlet area; the lower surface of the liquid cooling cover plate is provided with second arc guide ribs corresponding to the first arc guide ribs at areas corresponding to the end of the first mounting protrusion and the end of the second mounting protrusion.

8. The liquid cooling heat dissipation housing according to claim 7, characterized in that: The distance from the lower surface of the third diverter rib to the upper surface of the first diverter rib is greater than zero, and the distance from the lower surface of the second arc-shaped guide rib to the upper surface of the first arc-shaped guide rib is greater than zero.

9. The liquid cooling heat dissipation housing according to claim 1, characterized in that: The ratio of the height of the second diverter rib to the depth of the cover plate groove is between 1:5 and 1:

2.

10. A liquid-cooled power module, characterized in that: It comprises a first circuit board assembly, a second circuit board assembly and the liquid cooling heat dissipation housing according to any one of claims 1 to 9.

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