Power module and vehicle

Abstract

The utility model discloses a power module and a vehicle. The power module comprises a heat radiation base plate, a circuit board, a power semiconductor chip and a housing. The number of the circuit boards is six, and the six circuit boards are arranged on one side of the heat dissipation bottom plate in the thickness direction at intervals. A power semiconductor chip is arranged on one side, deviating from the heat dissipation bottom plate, of each circuit board; the shell is an insulating part and comprises a shell body, and the shell body and the circuit boards are arranged on the same side in the thickness direction of the heat dissipation bottom plate and surround the six circuit boards. According to the power module, the power module is stable and reliable, the power density is high, the size can be effectively reduced, the cost is reduced, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, in particular to a power module and a vehicle. Background Art

[0002] In the related technologies, with the rapid development of the electric vehicle industry, the application and requirements for dual-motor control of hybrid vehicles are also increasing. The power module is a device used to control and manage power transmission and is widely used in vehicle electrification systems. In the vehicle, the power module can control and adjust the power output of the drive motor and generator to realize the operation and power generation functions of the vehicle. At present, for the dual-motor control application scenario, two three-phase full-bridge inverter power modules are required. Each three-phase full-bridge inverter power module requires an independent cooling and sealing installation structure. The repeated shells between the power modules also take up a certain amount of space, which makes it difficult to reduce the size and cost of the power module. In addition, the thermal steady-state temperature difference between different phases is obvious, which leads to the attenuation of the service life of the power semiconductor chip. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a power module, which is stable and reliable and has high power density, and can effectively reduce size, reduce cost and extend service life.

[0004] The utility model also provides a vehicle, which comprises the power module mentioned above.

[0005] The power module according to the embodiment of the utility model comprises: a heat dissipation base plate, a circuit board, a power semiconductor chip and a shell. There are six circuit boards, which are arranged at intervals on one side of the heat dissipation base plate in the thickness direction; the power semiconductor chip is arranged on the side of each circuit board away from the heat dissipation base plate; the shell is an insulating member and comprises a shell body, which is arranged on the same side of the heat dissipation base plate in the thickness direction as the circuit board and surrounds the six circuit boards.

[0006] According to the power module of the embodiment of the utility model, by arranging six circuit boards with power semiconductor chips on a heat dissipation base plate and arranging them in a housing, the performance and reliability of the power module can be guaranteed and the power density can be improved, while the installation structure and the volume occupied by the power module can be saved, thereby reducing the size and manufacturing cost of the power module. In addition, the power module can be applied to the application scenario of dual motor control and optimize the junction temperature difference between different phases, thereby protecting and extending the service life of the power module.

[0007] According to some embodiments of the utility model, the circuit board includes: a substrate, a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are respectively arranged on both sides of the substrate in the thickness direction, the first conductive layer is located on the side of the substrate away from the heat dissipation base plate, the power semiconductor chip is connected to the first conductive layer, and the second conductive layer is connected to the heat dissipation base plate.

[0008] In some embodiments of the present invention, the substrate is a ceramic plate; and / or at least one of the first conductive layer and the second conductive layer is a copper piece or a copper alloy piece.

[0009] According to some embodiments of the utility model, the heat dissipation base plate includes: a plate body and fins, the circuit board and the shell are connected to the plate body and are located on one side of the plate body in the thickness direction; the fins are arranged on the side of the plate body away from the circuit board.

[0010] In some embodiments of the utility model, the fins are pin fins or sheet fins; and / or, the fins are multiple groups separated from each other, the multiple groups correspond one-to-one to the multiple circuit boards, and the circuit boards and the fins of the corresponding groups are relatively arranged in the thickness direction of the board body.

[0011] According to some embodiments of the utility model, the shell further includes: a plurality of dividing ribs, the dividing ribs being arranged in the shell body and used to divide the space inside the shell body into six spaced-apart sub-spaces, and the six circuit boards being respectively arranged in the six sub-spaces; and / or the heat dissipation base plate is a copper part, a copper alloy part, an aluminum part or an aluminum alloy part; and / or the shell is a plastic or nylon part, and / or each of the circuit boards is connected to an AC output terminal, one end of the AC output terminal extending out of the shell; and / or each of the circuit boards is connected to a drive terminal; and / or each of the circuit boards is connected to a plurality of spaced-apart DC terminals.

[0012] According to some embodiments of the present invention, the power module further includes a cover plate, which is disposed on a side of the housing facing away from the heat dissipation base plate.

[0013] According to some embodiments of the present invention, the power module further includes a temperature sensor, which is disposed on the power semiconductor chip and is used to detect the temperature of the power semiconductor chip.

[0014] According to some embodiments of the present invention, six circuit boards are arranged at intervals along the length direction of the heat dissipation base plate.

[0015] The vehicle according to an embodiment of the utility model includes: a drive motor, a generator and the above-mentioned power module, wherein three of the circuit boards and the power semiconductor chips thereon are used to control the operation of the drive motor, and another three of the circuit boards and the power semiconductor chips thereon are used to control the operation of the generator.

[0016] According to the vehicle of the embodiment of the utility model, by setting the power module so that three of the circuit boards and the power semiconductor chips thereon control the operation of the drive motor, and the other three circuit boards and the power semiconductor chips thereon control the operation of the generator, it is possible to achieve precise control of the power system of the electric vehicle or hybrid vehicle, and one power module can meet the needs of dual motor control, while improving the power density, it can also save the sealed installation structure of the power module, reduce the size and manufacturing cost of the power module, and then reduce the size and cost of the motor controller of the drive motor and the generator, thereby reducing the cost of the vehicle. In addition, the power module can be suitable for the application scenario of dual motor control and optimize the junction temperature difference between different phases, which is conducive to protecting and extending the service life of the power module, and also helps to improve the safety and reliability of the vehicle.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a three-dimensional diagram of a power module according to an embodiment of the utility model;

[0020] Figure 2 is a cross-sectional view of a power module according to an embodiment of the utility model;

[0021] Figure 3 is a bottom view of a power module according to an embodiment of the utility model;

[0022] Figure 4 is a circuit diagram of a power module according to an embodiment of the utility model.

[0023] Reference numerals:

[0024] 100. Power module;

[0025] 1. Heat dissipation base plate; 11. Plate body; 12. Fins;

[0026] 2. Circuit board; 21. Base plate; 22. First conductive layer; 23. Second conductive layer;

[0027] 3. Power semiconductor chips;

[0028] 4. Shell; 41. Shell body; 42. Splitting ribs;

[0029] 5. AC output terminal;

[0030] 6. DC terminal;

[0031] 7. Driving terminal;

[0032] 8. Cover plate. DETAILED DESCRIPTION

[0033] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Reference below Figure 1-Figure 4 A power module 100 according to an embodiment of the present invention is described.

[0037] like Figure 1 and Figure 2As shown, the power module 100 according to the embodiment of the utility model includes a heat dissipation base plate 1, a circuit board 2, a power semiconductor chip 3 and a housing 4.

[0038] Specifically, Figure 1 and Figure 2 As shown, there is one heat dissipation base plate 1 and six circuit boards 2. The six circuit boards 2 are arranged at intervals on one side of the thickness direction of the heat dissipation base plate 1. The heat dissipation base plate 1 is preferably made of a material with high thermal conductivity such as copper, copper alloy, aluminum, aluminum alloy, etc., which can ensure that the power module 100 has good heat dissipation performance in high-power applications. The circuit board 2 is preferably a DBC substrate for electrical connection. The circuit board 2 can be fixed to the same heat dissipation base plate 1 by welding. The six circuit boards 2 are independent of each other and integrated on a heat dissipation base plate 1, which saves space without affecting the function, is conducive to reducing the volume of the power module 100, and further reduces the consumables cost of the power module 100.

[0039] Furthermore, a power semiconductor chip 3 is provided on the side of each circuit board 2 facing away from the heat dissipation base plate 1. The power semiconductor chip 3 is the core component of the power module 100 and is responsible for controlling and conducting power. The power semiconductor chip 3 can be a switching power semiconductor element such as an IGBT (Insulate-Gate Bipolar Transistor), a SIC-MOSFET (Silicon Carbide Transistor), a diode, etc., and can convert direct current and alternating current by switching the switch. There are one or more power semiconductor chips 3 on each of the six circuit boards 2, wherein three circuit boards 2 and the power semiconductor chips 3 thereon can constitute a three-phase full-bridge power module 100 unit. For example, the three circuit boards 2 on the left and the power semiconductor chips 3 thereon constitute the three-phase full-bridge power module 100 unit, which can be used to control the operation of the drive motor, and the three circuit boards 2 on the right and the power semiconductor chips 3 thereon constitute the three-phase full-bridge power module 100 unit, which can be used to control the operation of the generator. Thus, two three-phase full-bridge power module 100 units can be integrated on a heat dissipation base plate 1 to form a power module 100, which is convenient for partitioning and integrating different power segments of the power module 100, thereby meeting the control requirements of the power module 100 for the dual motors. While improving the power density, the sealed installation structure of the power module 100 can also be saved, thereby reducing the size and manufacturing cost of the power module 100. In addition, integrating two three-phase full-bridge power module 100 units into one power module 100 can avoid the phenomenon of obvious thermal steady-state temperature differences between different phases, which is conducive to protecting and extending the service life of the power module 100.

[0040] Furthermore, the shell 4 is an insulating member and includes a shell body 41. The shell body 41 and the circuit board 2 are arranged on the same side of the heat dissipation base plate 1 in the thickness direction and are arranged around the six circuit boards 2. The shell 4, as the outer protective layer of the power module 100, can be made of insulating materials such as plastic or nylon, and can provide electrical isolation and mechanical protection, thereby ensuring the safety performance and reliability of the power module 100. The shell 4 is arranged around the six circuit boards 2, and there is no need to separately set up an independent shell 4 for each circuit board 2 and the power semiconductor chip 3 thereon, which saves the volume occupied by the required structural parts and the shell 4, and can effectively reduce the size and production cost of the power module 100.

[0041] According to the power module 100 of the embodiment of the utility model, by arranging six circuit boards 2 with power semiconductor chips 3 at intervals on a heat dissipation base plate 1 and arranging them in a housing 4, the performance and reliability of the power module 100 can be guaranteed and the power density can be improved, while the installation structure and the volume occupied by the power module 100 can be saved, thereby reducing the size and manufacturing cost of the power module 100. In addition, the power module 100 can be applied to the application scenario of dual motor control and optimize the junction temperature difference between different phases, thereby protecting and extending the service life of the power module 100.

[0042] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the circuit board 2 includes: a substrate 21, a first conductive layer 22 and a second conductive layer 23, the first conductive layer 22 and the second conductive layer 23 are respectively arranged on both sides of the substrate 21 in the thickness direction, the first conductive layer 22 is located on the side of the substrate 21 away from the heat dissipation base plate 1, wherein the power semiconductor chip 3 is connected to the first conductive layer 22, the side of the power semiconductor chip 3 close to the first conductive layer 22 can be connected to the first conductive layer 22 by welding, and the side of the power semiconductor chip 3 away from the first conductive layer 22 can be connected to the first conductive layer 22 by a metal conductive wire, a conductive metal block, etc., and the first conductive layer 22 has a circuit network, which can realize the electrical connection between the power semiconductor chip 3 and the circuit network to ensure the performance of the power module 100. The second conductive layer 23 is connected to the heat dissipation base plate 1, which plays a fixing role and can provide a heat dissipation path. The second conductive layer 23 and the heat dissipation base plate 1 can be connected by bonding using solder, bonding using metal nanoparticles, bonding based on metal diffusion, or bonding based on ultrasonic waves. The power semiconductor chip 3 generates heat during operation, and the heat is conducted to the heat dissipation base plate 1 through the first conductive layer 22 , the substrate 21 and the second conductive layer 23 of the circuit board 2 . The heat dissipation base plate 1 conducts the heat away by contacting with the medium, thereby ensuring the heat dissipation performance of the power module 100 .

[0043] In some embodiments of the present invention, Figure 2As shown, the substrate 21 is a ceramic plate, and the ceramic plate material has excellent insulation performance and thermal conductivity, which can improve the insulation capacity and heat dissipation effect of the power module 100. In addition, at least one of the first conductive layer 22 and the second conductive layer 23 is a copper piece or a copper alloy piece. It is convenient to connect the second conductive layer 23 to the heat dissipation base plate 1 by welding or the like. The copper piece or the copper alloy piece has good electrical conductivity, which can improve the conduction efficiency of the circuit, thereby ensuring the performance of the power module 100.

[0044] In some embodiments of the present invention, Figure 2 and Figure 3 As shown, the heat dissipation base plate 1 includes: a plate body 11 and fins 12, and the circuit board 2 and the housing 4 are connected to the plate body 11 and are located on one side of the thickness direction of the plate body 11; thereby, the protection effect of the housing 4 on the circuit board 2 and the power semiconductor chip 3 on the circuit board 2 can be ensured, and the structure is reasonably arranged. The fins 12 are arranged on the side of the plate body 11 away from the circuit board 2, and the heat of the power semiconductor chip 3 and the circuit board 2 can be conducted to the fins 12 through the plate body 11. The fins 12 can improve the heat dissipation effect by increasing the heat dissipation surface area, keep the temperature of the power semiconductor chip 3 within a reasonable range, and improve the stability and reliability of the power module 100.

[0045] In some embodiments of the present invention, Figure 2 and Figure 3 As shown, the fins 12 are pin fins or sheet fins, which can increase the heat dissipation surface area. The use of thin sheet heat dissipation fins 12 can better improve the heat dissipation efficiency and is more conducive to reducing the temperature of the power module 100. At the same time, the phase temperature difference can be reduced, thereby protecting the service life of the power module 100. Among them, the fins 12 are spaced apart in multiple groups, and the multiple groups correspond to multiple circuit boards 2 one by one. The circuit boards 2 and the fins 12 of the corresponding groups are arranged relatively in the thickness direction of the board body 11. The thin sheet fins are arranged side by side with multiple teeth and the power semiconductor chips 3 are locally dissipated in groups. The fins 12 are not arranged in the intermediate interval area, which can reduce the local flow resistance, enhance the heat dissipation effect, and improve the heat transfer coefficient of the heat dissipation base plate 1, thereby ensuring the performance and stability of the power module 100.

[0046] In some embodiments of the present invention, Figure 1As shown, the shell 4 also includes a plurality of dividing ribs 42, which are arranged in the shell body 41 and are used to divide the space in the shell body 41 into six spaced sub-spaces. The six circuit boards 2 are respectively arranged in the six sub-spaces, which can ensure that each circuit board 2 has an independent space to avoid interference. The dividing ribs 42 can provide good electrical isolation and structural support, thereby improving the electrical isolation and structural strength inside the power module 100. In addition, silicone gel needs to be poured into the shell 4 during assembly, and the presence of the dividing ribs 42 also plays a role in blocking the colloid, thereby ensuring the performance and stability of the power module 100.

[0047] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the heat dissipation base plate 1 is a copper part, a copper alloy part, an aluminum part or an aluminum alloy part. The heat dissipation base plate 1 is set to a material with high thermal conductivity, which can ensure that the power module 100 has good heat dissipation performance in high-power applications. Furthermore, the shell 4 is a plastic or nylon part. Plastic and nylon are insulating materials, which is conducive to the shell 4 to play the role of electrical isolation and mechanical protection.

[0048] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, each circuit board 2 is connected to an AC output terminal 5, one end of the AC output terminal 5 extends out of the housing 4, and is used to connect to the three-phase output terminal and connect to equipment such as motors. Each circuit board 2 is connected to multiple spaced DC terminals 6, which are used to connect the DC power supply in the circuit to the equipment. The number of DC terminals 6 can be selected according to the power requirements of the specific embodiment. Among them, the AC output terminal 5 and the multiple DC terminals 6 are fixed to the housing 4 by injection molding or screw connection. In addition, each circuit board 2 is connected to a drive terminal 7 for controlling the working state of the power semiconductor chip 3. For example, the DC terminal 6 is connected to the bus capacitor, and the drive terminal 7 is connected to the control component for communication. After receiving the drive signal of the control component, the drive terminal 7 controls the power semiconductor chip 3 to work, and then the power module 100 drives the motor to work through the AC output terminal 5.

[0049] In some embodiments of the present invention, Figure 2 As shown, the power module 100 also includes a cover plate 8, which is arranged on the side of the shell 4 away from the heat dissipation base plate 1 to prevent foreign matter from entering the shell 4 and causing damage or short circuit to the power semiconductor chip 3 and the circuit board 2, that is, protecting the internal circuit of the power module 100 from interference and damage from the external environment, thereby ensuring the stability and reliability of the power module 100.

[0050] In some embodiments of the utility model, the power module 100 also includes a temperature sensor, which is arranged on the power semiconductor chip 3 and is used to detect the temperature of the power semiconductor chip 3. By real-time monitoring the temperature of the power semiconductor chip 3, it can be ensured that the power semiconductor chip 3 operates within a safe temperature range. When overheating is detected, corresponding measures can be taken in time, such as adjusting the workload or triggering a fault protection mechanism, to prevent the power semiconductor chip 3 from overheating and damage, thereby ensuring the reliability and life of the power module 100.

[0051] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, six circuit boards 2 are arranged at intervals along the length direction of the heat dissipation base plate 1, which is convenient for connecting the circuit board 2 with the power semiconductor chip 3, and also leaves space for the connection between other components such as the power semiconductor chip 3, which can avoid interference between the circuit boards 2, thereby improving the stability and reliability of the power module 100. Among them, the three circuit boards 2 on the left and the power semiconductor chips 3 thereon can be used to control the operation of the drive motor, and the three circuit boards 2 on the right and the power semiconductor chips 3 thereon can be used to control the operation of the generator. It is convenient to partition and integrate the power module 100 in different power segments, thereby realizing the control of the dual motors by the power module 100.

[0052] A vehicle according to an embodiment of the present invention is described below.

[0053] The vehicle according to the embodiment of the present utility model includes: a driving motor, a generator and the above-mentioned power module 100 .

[0054] Specifically, Figure 1 and Figure 2As shown, the power module 100 has one heat dissipation base plate 1 and six circuit boards 2. The six circuit boards 2 are arranged at intervals on one side of the thickness direction of a heat dissipation base plate 1. Three circuit boards 2 and the power semiconductor chips 3 thereon are used to control the operation of the drive motor, and the other three circuit boards 2 and the power semiconductor chips 3 thereon are used to control the operation of the generator. Among them, the power semiconductor chip 3 can be a switching power semiconductor element such as IGBT (Insulate-Gate Bipolar Transistor), SiC-MOSFET (Silicon Carbide Transistor), diode, etc. The direct current required by the vehicle battery can be converted into the alternating current required by the drive motor and the generator by switching the switch, and vice versa. Three of the circuit boards 2 used to control the operation of the drive motor and the power semiconductor chips 3 thereon can constitute a three-phase full-bridge power module 100 unit, and the other three circuit boards 2 used to control the operation of the generator and the power semiconductor chips 3 thereon can constitute another three-phase full-bridge power module 100 unit, which is convenient for partitioning and integrating the power module 100 in different power segments, thereby realizing the control of the dual motors by the power module 100. That is, the power module 100 that integrates two three-phase full-bridge power module 100 units can realize precise control of the power system of electric vehicles or hybrid vehicles, meet the needs of dual-motor control, improve power density, and save the sealed installation structure of the power module 100, reduce the size and manufacturing cost of the power module 100, and thus reduce the size and cost of the motor controller of the drive motor and generator. In addition, integrating two three-phase full-bridge power module 100 units into one power module 100 can avoid the phenomenon of obvious thermal steady-state temperature differences between different phases, which is beneficial to protect and extend the service life of the power module 100. Through one power module 100, the operation of the drive motor and generator can be effectively controlled, thereby improving the performance and efficiency of the vehicle. At the same time, the stability and reliability of the power module 100 also help to improve the safety and reliability of the vehicle.

[0055] According to the vehicle of the embodiment of the utility model, by setting the power module 100 so that three of the circuit boards 2 and the power semiconductor chips 3 thereon control the operation of the drive motor, and the other three circuit boards 2 and the power semiconductor chips 3 thereon control the operation of the generator, it is possible to achieve precise control of the power system of the electric vehicle or hybrid vehicle, and one power module 100 can meet the needs of dual motor control, while improving the power density, it can also save the sealed installation structure of the power module 100, reduce the size and manufacturing cost of the power module 100, and further reduce the size and cost of the motor controller of the drive motor and the generator, thereby reducing the cost of the vehicle. In addition, the power module 100 can be suitable for the application scenario of dual motor control and optimize the junction temperature difference between different phases, which is conducive to protecting and extending the service life of the power module 100, and also helps to improve the safety and reliability of the vehicle.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0057] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A power module, characterized in that: include: Heat dissipation base plate; Circuit boards, the number of the circuit boards being six, and the six circuit boards being arranged at intervals on one side of the heat dissipation base plate in the thickness direction; A power semiconductor chip, wherein the power semiconductor chip is disposed on a side of each circuit board facing away from the heat dissipation base plate; The shell is an insulating member and includes a shell body. The shell body and the circuit boards are arranged on the same side of the heat dissipation base plate in the thickness direction and surround the six circuit boards.

2. The power module according to claim 1, characterized in that: The circuit board comprises: substrate; A first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are respectively arranged on both sides of the substrate in a thickness direction, the first conductive layer is located on a side of the substrate away from the heat dissipation base plate, the power semiconductor chip is connected to the first conductive layer, and the second conductive layer is connected to the heat dissipation base plate.

3. The power module according to claim 2, characterized in that: The substrate is a ceramic plate; And / or, at least one of the first conductive layer and the second conductive layer is a copper member or a copper alloy member.

4. The power module according to claim 1, characterized in that: The heat dissipation base plate comprises: A board body, the circuit board and the housing are connected to the board body and are located on one side of the board body in a thickness direction; The fin is arranged on a side of the board body away from the circuit board.

5. The power module according to claim 4, characterized in that: The fins are pin fins or sheet fins; And / or, the fins are divided into a plurality of spaced-apart groups, the plurality of groups correspond one-to-one to the plurality of circuit boards, and the circuit boards and the fins of the corresponding groups are arranged relative to each other in the thickness direction of the board body.

6. The power module according to claim 1, characterized in that: The housing further comprises: a plurality of dividing ribs, the dividing ribs being arranged in the housing body and used to divide the space in the housing body into six spaced-apart sub-spaces, and the six circuit boards are respectively arranged in the six sub-spaces; And / or, the heat dissipation base plate is a copper part, a copper alloy part, an aluminum part or an aluminum alloy part; And / or, the housing is made of plastic or nylon, And / or, each of the circuit boards is connected to an AC output terminal, one end of the AC output terminal extending out of the housing; And / or, each of the circuit boards is connected to a driving terminal; And / or, each of the circuit boards is connected to a plurality of spaced-apart DC terminals.

7. The power module according to claim 1, characterized in that: Also includes: A cover plate is arranged on a side of the housing away from the heat dissipation bottom plate.

8. The power module according to claim 1, characterized in that: Also includes: A temperature sensor is disposed on the power semiconductor chip and is used to detect the temperature of the power semiconductor chip.

9. The power module according to claim 1, characterized in that: The six circuit boards are arranged at intervals along the length direction of the heat dissipation base plate.

10. A vehicle, characterized in that: include: Drive motor; dynamo; According to the power module according to any one of claims 1-9, three of the circuit boards and the power semiconductor chips thereon are used to control the operation of the drive motor, and another three of the circuit boards and the power semiconductor chips thereon are used to control the operation of the generator.

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