Anti-falling mechanism for chip capacitor sorting equipment
By designing an anti-drop mechanism for chip capacitor sorting equipment, using a combination of chutes, balls, sliders and collection boxes, combined with a buffer device connected to damping, buffer springs and cushion pads, the problem of chip capacitors being sorted during sorting is solved. The problem of falling and damage during picking is eliminated, and the work efficiency and capacitor protection are improved.
Patent Information
- Application Number
- CN202421067112.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-05-16
AI Technical Summary
The existing chip capacitor sorting equipment is susceptible to the vibration of the equipment during the sorting process, causing the chip capacitor to fall, and the existing technology relies on manual pickup, which is time-consuming and labor-consuming, and may lead to damage to the chip capacitor.
An anti-falling mechanism is designed, including the main body of the sorting equipment, chute, balls, slider and collection box. The collection box is installed on both sides of the sorting equipment by using the cooperation of the chute and the slider, and is connected by damping, The buffer spring, support plate and buffer pad buffer the chip capacitor from falling in the collection box to prevent damage.
It effectively prevents chip capacitors from falling during the sorting process, reduces the need for manual picking, improves work efficiency, and protects chip capacitors through buffer devices to avoid damage.
Smart Images
Figure CN222369706U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip capacitor sorting equipment, in particular to an anti-drop mechanism for chip capacitor sorting equipment. Background Art
[0002] Chip capacitors are a type of capacitor material. The full name of chip capacitors is: multi-layer (laminated, stacked) chip ceramic capacitors, also known as chip capacitors, chip capacitance, there are two ways to express chip capacitors, one is expressed in inches, and the other is expressed in millimeters. Chip capacitors are made of ceramic dielectric diaphragms with printed electrodes (inner electrodes) stacked in a staggered manner, and then sintered at a high temperature to form a ceramic chip. A metal layer (outer electrode) is then sealed at both ends of the chip to form a structure similar to a monolith, so it is also called a monolithic capacitor. After the chip capacitors are made, they need to be sorted by machines, but in the process of sorting the chip capacitors by the equipment, some chip capacitors will fall off, so it is necessary to design a chip capacitor anti-drop mechanism.
[0003] The prior art has the following problems:
[0004] 1. When the existing equipment is sorting the chip capacitors, some of the chip capacitors may fall due to the vibration of the equipment. The existing technology uses manual methods to pick up the fallen chip capacitors. This operation method is not only time-consuming and labor-intensive in actual use, but also increases the manpower output;
[0005] 2. When existing chip capacitors fall, they are affected by the force and may be damaged, thereby affecting the normal use of the chip capacitors. Therefore, an anti-drop mechanism for chip capacitor sorting equipment is proposed. Utility Model Content
[0006] In view of the deficiencies in the prior art, the utility model provides an anti-drop mechanism for chip capacitor sorting equipment, which solves the problem that chip capacitors currently fall during the sorting process.
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an anti-drop mechanism for chip capacitor sorting equipment, comprising a sorting equipment body, a leg is arranged at the bottom end of the sorting equipment body, a slide groove is arranged on the inner wall of one side of the sorting equipment body, a ball is arranged on the inner wall of the bottom end of the slide groove, a slider is arranged inside the slide groove, a collection box is arranged at one end of the slider, a connection damping is arranged inside the collection box, a buffer spring is arranged on one side of the connection damping, a support plate is arranged on the top of the buffer spring, a buffer pad is arranged on the upper surface of the support plate, and a support block is arranged on one side of the collection box.
[0008] As a preferred technical solution of the utility model, the number of the balls is several groups, the balls are equidistantly embedded in the inner wall of the slide groove, and the balls are movably connected to the slide groove.
[0009] As a preferred technical solution of the utility model, the shape of the slider is convex, the slider is slidably connected to the slide groove, and one side of the slider is fixedly connected to the inner side of the collection box.
[0010] As a preferred technical solution of the utility model, one end of the connection damper is fixedly connected to the inner wall of the collection box, and the other end of the connection damper is fixedly connected to the lower surface of the support plate.
[0011] As a preferred technical solution of the utility model, the number of the buffer springs is several groups, the buffer springs are symmetrically installed on both sides of the connection damping, one end of the buffer spring is fixedly connected to the inner wall of the collection box, and the other end of the buffer spring is fixedly connected to the lower surface of the support plate.
[0012] As a preferred technical solution of the utility model, the buffer pad is made of silica gel, and the buffer pad is fixedly mounted on the upper surface of the support plate.
[0013] As a preferred technical solution of the utility model, the support block is cylindrical in shape, the support block is made of rubber, and the support block is fixedly installed on the inner side of the collection box.
[0014] Compared with the prior art, the utility model provides an anti-drop mechanism for chip capacitor sorting equipment, which has the following beneficial effects:
[0015] 1. The anti-drop mechanism for chip capacitor sorting equipment is provided with a slide groove, a ball bearing, a slider and a collection box. When the main body of the sorting equipment is in use, the collection box can be installed on both sides of the main body of the sorting equipment by using the cooperation of the slide groove and the slider. The collection box can prevent the chip capacitor from falling, thereby avoiding the need to manually pick up the chip capacitor. In this way, the manpower output is reduced, thereby improving the work efficiency. When the slider is in use, the ball bearing can reduce the friction between the slider and the slide groove, thereby facilitating the movement of the slider.
[0016] 2. This anti-drop mechanism for chip capacitor sorting equipment is equipped with connection damping, buffer springs, support plates and buffer pads. When the chip capacitor falls into the collection box, the buffer springs can be used to buffer the force generated when the chip capacitor falls. The connection damping can improve the stability of the buffer springs and avoid rebound of the buffer springs during use. Then, the buffer pads arranged on the upper surface of the support plate can improve the protection of the capacitor chips and avoid damage to the chip capacitors. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the overall appearance structure of the utility model;
[0018] Figure 2 This is a schematic diagram of the overall planar structure of the utility model;
[0019] Figure 3 This is a schematic diagram of the planar structure of the slideway and the slider of the utility model;
[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of the slider of the utility model;
[0021] Figure 5 It is a schematic diagram of the planar structure of the connection damping and buffer spring of the utility model.
[0022] In the figure: 1. Sorting equipment body; 2. Support legs; 3. Slide chute; 4. Ball bearing; 5. Slider; 6. Collection box; 7. Connection damping; 8. Buffer spring; 9. Support plate; 10. Buffer pad; 11. Support block. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] See also Figure 1-5 In this embodiment: an anti-drop mechanism for a chip capacitor sorting device comprises a sorting device body 1, a leg 2 is arranged at the bottom end of the sorting device body 1, a slide groove 3 is arranged on the inner wall of one side of the sorting device body 1, a ball 4 is arranged on the inner wall of the bottom end of the slide groove 3, a slider 5 is arranged inside the slide groove 3, a collection box 6 is arranged at one end of the slider 5, a connection damper 7 is arranged inside the collection box 6, a buffer spring 8 is arranged on one side of the connection damper 7, a support plate 9 is arranged on the top of the buffer spring 8, a buffer pad 10 is arranged on the upper surface of the support plate 9, and a support block 11 is arranged on one side of the collection box 6.
[0025] In this embodiment, the number of balls 4 is several groups, and the balls 4 are equidistantly embedded in the inner wall of the slide groove 3. The balls 4 are movably connected to the slide groove 3. The balls 4 can reduce the friction between the slider 5 and the slide groove 3, thereby facilitating the movement of the slider 5; the shape of the slider 5 is convex, and the slider 5 is slidably connected to the slide groove 3. One side of the slider 5 is fixedly connected to the inner side of the collecting box 6. By utilizing the cooperation between the slide groove 3 and the slider 5, the collecting box 6 can be installed on both sides of the sorting device body 1. The collecting box 6 can prevent the chip capacitor from falling, thereby avoiding the need to manually pick up the chip capacitor. In this way, the manpower output is reduced, thereby improving the work efficiency; one end of the connecting damper 7 is fixedly connected to the inner wall of the collecting box 6, and the other end of the connecting damper 7 is fixedly connected to the lower surface of the support plate 9. The connecting damper 7 can improve the use of the buffer spring 8 Stability, to avoid the rebound of the buffer spring 8 when in use; the number of buffer springs 8 is several groups, and the buffer springs 8 are symmetrically installed on both sides of the connection damping 7, one end of the buffer spring 8 is fixedly connected to the inner wall of the collection box 6, and the other end of the buffer spring 8 is fixedly connected to the lower surface of the support plate 9. The buffer spring 8 can be used to buffer the force generated when the chip capacitor falls; the buffer pad 10 is made of silicone, and the buffer pad 10 is fixedly installed on the upper surface of the support plate 9. The buffer pad 10 set on the upper surface of the support plate 9 can improve the protection of the capacitor patch and avoid damage to the chip capacitor; the support block 11 is cylindrical in shape, and the support block 11 is made of rubber. The support block 11 is fixedly installed on the inner side of the collection box 6, and the support block 11 can be used to support the inner side of the collection box 6, thereby improving the stability of the collection box 6 when used.
[0026] The working principle and use process of the utility model are as follows: when the operator uses the sorting device body 1, the collection box 6 can be installed on both sides of the sorting device body 1 by utilizing the cooperation of the slide 3 and the slider 5. The collection box 6 can be used to prevent the chip capacitor from falling, thereby avoiding the need to manually pick up the chip capacitor. In this way, the manpower output is reduced, thereby improving the work efficiency. When the slider 5 is in use, the ball 4 can be used to reduce the friction between the slider 5 and the slide 3, thereby facilitating the movement of the slider 5. Then, during the sorting process of the sorting device body 1, if a chip capacitor falls into the collection box 6, the buffer spring 8 can be used to buffer the force generated when the chip capacitor falls, and the connection damping 7 can be used to improve the stability of the buffer spring 8 to avoid the rebound of the buffer spring 8 during use. Then, the buffer pad 10 arranged on the upper surface of the support plate 9 can be used to improve the protection of the capacitor patch to avoid damage to the chip capacitor.
[0027] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. An anti-drop mechanism for a chip capacitor sorting device, comprising a sorting device body (1), characterized in that: A supporting leg (2) is arranged at the bottom end of the main body (1) of the sorting device, a slide groove (3) is arranged on the inner wall of one side of the main body (1), a ball bearing (4) is arranged on the inner wall of the bottom end of the slide groove (3), a slider (5) is arranged inside the slide groove (3), a collection box (6) is arranged at one end of the slider (5), a connection damper (7) is arranged inside the collection box (6), a buffer spring (8) is arranged on one side of the connection damper (7), a support plate (9) is arranged on the top end of the buffer spring (8), a buffer pad (10) is arranged on the upper surface of the support plate (9), and a support block (11) is arranged on one side of the collection box (6).
2. The anti-drop mechanism for chip capacitor sorting equipment according to claim 1, characterized in that: The number of the balls (4) is several groups, the balls (4) are equidistantly embedded in the inner wall of the slide groove (3), and the balls (4) are movably connected to the slide groove (3).
3. The anti-drop mechanism for chip capacitor sorting equipment according to claim 1, characterized in that: The shape of the slider (5) is convex, the slider (5) is slidably connected to the slide groove (3), and one side of the slider (5) is fixedly connected to the inner side of the collection box (6).
4. The anti-drop mechanism for chip capacitor sorting equipment according to claim 1, characterized in that: One end of the connection damper (7) is fixedly connected to the inner wall of the collection box (6), and the other end of the connection damper (7) is fixedly connected to the lower surface of the support plate (9).
5. The anti-drop mechanism for chip capacitor sorting equipment according to claim 1, characterized in that: The buffer springs (8) are provided in a plurality of groups. The buffer springs (8) are symmetrically mounted on both sides of the connecting damper (7). One end of the buffer spring (8) is fixedly connected to the inner wall of the collecting box (6), and the other end of the buffer spring (8) is fixedly connected to the lower surface of the supporting plate (9).
6. The anti-drop mechanism for chip capacitor sorting equipment according to claim 1, characterized in that: The buffer pad (10) is made of silica gel and is fixedly mounted on the upper surface of the support plate (9).
7. The anti-drop mechanism for chip capacitor sorting equipment according to claim 1, characterized in that: The support block (11) is cylindrical in shape and is made of rubber. The support block (11) is fixedly mounted on the inner side of the collection box (6).