Crimping test device

Abstract

The utility model relates to a crimping test device which comprises a base assembly, a turnover assembly and a limiting piece, the base assembly is used for bearing a to-be-tested product, the turnover assembly is rotatably connected to the base assembly so as to cover the base assembly or be opened relative to the base assembly, and the turnover assembly comprises a substrate and a substrate connector; the substrate connector is used for being connected with a connector of a to-be-tested product in a pressing mode so that the substrate and the to-be-tested product can be communicated with each other. The limiting sheet is connected to the substrate, is spaced from the substrate connector, and is used for abutting against a connector of a to-be-tested product when the substrate connector and the connector of the to-be-tested product are mutually crimped, so as to limit the crimping depth of the connector of the to-be-tested product crimped to the substrate connector; therefore, the contact area between the connector of the to-be-tested product and the substrate connector can be reduced, the abrasion between the connector of the to-be-tested product and the substrate connector can be reduced under the condition of repeated plugging, and the service life of the connector of the to-be-tested product or the substrate connector can be prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of electronic product testing, and in particular to a crimping test device. Background Art

[0002] With the development of science and technology, electronic products are constantly updated, their manufacturing processes are becoming more complex, their structural designs are becoming more sophisticated, and their functions are becoming more comprehensive. In view of this, ensuring the performance and quality of electronic products is a crucial link in the production process of electronic products. Usually, electronic products need to be tested for various performance parameters before leaving the factory. Generally, the connector of the product to be tested and the connector of the test device are crimped together to make the product to be tested conductive, so as to receive feedback information from the product to be tested to confirm whether there are any defects in the product to be tested.

[0003] However, in the prior art, when the product to be tested is subjected to a crimping continuity test, the connector of the product to be tested and the connector of the testing device are fully crimped. Since full-contact crimping requires that the connector of the product to be tested and the connector of the testing device are in full contact, the connector of the product to be tested and the connector of the testing device need to have a large contact area. In the case of repeated plugging and unplugging, fatigue failure of the spring clips on the connector and wear of the plating on the connector are likely to occur, resulting in frequent replacement of the connector at a later stage. In addition, the processing accuracy requirements for both the connector of the product to be tested and the connector of the testing device are relatively high, which makes the production and maintenance costs of the testing device relatively high. Utility Model Content

[0004] Based on this, the purpose of the present application is to provide a crimping test device to solve the problem in the prior art that the connector of the product to be tested and the connector of the test device are in full contact, resulting in high production and maintenance costs of the test device.

[0005] According to one aspect of the present application, a crimping test device is provided, comprising:

[0006] A base assembly, used to carry the product to be tested;

[0007] A flip assembly is rotatably connected to the base assembly so as to cover the base assembly or to be opened relative to the base assembly. The flip assembly includes a substrate and a substrate connector provided on the substrate. The substrate connector is used to press-fit with a connector of the product to be tested when the flip assembly covers the base assembly so as to make the substrate and the product to be tested conduct to each other.

[0008] A limit plate is arranged on the substrate on the same side as the substrate connector and is spaced apart from the substrate connector. The limit plate is used to abut against the connector of the product to be tested when the substrate connector and the connector of the product to be tested are crimped together to limit the crimping depth of the connector of the product to be tested on the substrate connector.

[0009] In one embodiment, the connector of the product to be tested includes a main body and a plug arranged on one side of the main body, and the limiting plate is provided with through holes penetrating through two opposite sides of the main body; the through holes are used for allowing the plug to pass through when the flip component is covered on the base component to be plugged into the substrate connector, and when the plug is plugged into the substrate connector, the limiting plate abuts against the main body.

[0010] In one of the embodiments, the limiting piece and the base plate are connected to each other via a first elastic member, and when the flip assembly covers the base assembly, the first elastic member is compressed and produces a recoverable deformation.

[0011] In one embodiment, the flip assembly further comprises a flap rotatably connected to the base assembly, the flap is provided with an avoidance groove running through two opposite sides thereof, the substrate is arranged on a side of the flap facing away from the base assembly, and the limiting plate is accommodated in the avoidance groove.

[0012] In one of the embodiments, the flip assembly further includes a substrate protection plate, and the substrate protection plate is disposed on a side of the substrate facing away from the substrate connector.

[0013] In one embodiment, the base assembly includes a base and a support plate, and the support plate is connected to one side of the support plate through a second elastic member; when the flip assembly covers the base assembly, the support plate is abutted by the limiting plate, so that the second elastic member is compressed and produces a recoverable deformation.

[0014] In one embodiment, the flip assembly is rotatably connected to the base assembly via a rotating shaft, the base assembly is provided with a mounting hole extending along a first direction, the rotating shaft is movably inserted into the mounting hole, and in a second direction perpendicular to the first direction, the diameter of the mounting hole is larger than the diameter of the rotating shaft, so that when the flip assembly covers the base assembly, the rotating shaft can move in the mounting hole along the second direction to drive the flip assembly to approach the base assembly along the second direction.

[0015] In one embodiment, a torsion spring is sleeved on the outer circumference of the rotating shaft, and the flip assembly is connected to the torsion spring. The torsion spring is configured to provide an elastic force to support the rotating shaft in the second direction, and the elastic force is used to prevent the flip assembly from approaching the base assembly along the second direction when the flip assembly is opened relative to the base assembly.

[0016] In one embodiment, a telescopic column is movably provided on one side of the base assembly, and the telescopic column is configured to abut against the flip assembly when the flip assembly covers the base assembly, and can be retracted into the base assembly when the flip assembly approaches the base assembly along the second direction.

[0017] In one of the embodiments, the base assembly has a buckle, and when the flip assembly is covered on the base assembly and when the substrate connector is crimped onto the connector of the product to be tested, the buckle can snap on and fix the flip assembly.

[0018] The above-mentioned crimping test device is provided with a limit plate spaced apart from the substrate connector on one side of the substrate connector provided on the substrate of the flip assembly, so that when the flip assembly is rotated relative to the base assembly to the position where the flip assembly covers the base assembly so that the substrate connector and the connector of the product to be tested are crimped to each other, the limit plate and the connector of the product to be tested abut against each other, thereby limiting the crimping depth of the connector of the product to be tested on the substrate connector. In this way, the connector of the product to be tested and the substrate connector are semi-contact crimped, which can reduce the contact area between the connector of the product to be tested and the substrate connector compared to the full-contact crimping method of the prior art in which the connector of the product to be tested and the substrate connector are fully contacted, thereby reducing the wear of the connector of the product to be tested and the substrate connector in the case of repeated plugging and unplugging, thereby extending the life of the connector of the product to be tested or the substrate connector. In addition, in the semi-contact crimping method, the crimping structure between the connector of the product to be tested and the substrate connector is achieved by making the gold finger part of the connector itself directly contact to achieve crimping conduction, rather than using a probe or blade needle crimping contact method. Therefore, there is no need to use a probe for crimping, which can reduce the dependence on processing accuracy, and further reduce the production and maintenance costs of the crimping test device. Furthermore, since there is no need to use a probe for crimping, the impedance problem of the probe or blade needle itself can be avoided, solving the problem that the crimping test device itself has a certain impedance when in use, which interferes with the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG. 1 is an axial side view of a crimping test device provided in one embodiment of the present application.

[0020] FIG. 2 is an exploded view of a flip assembly in a crimping test device provided in an embodiment of the present application.

[0021] Figure 3 An exploded view of a base assembly in a crimping test device provided in one embodiment of the present application.

[0022] Figure 4 This is an enlarged schematic diagram of area A in Figure 1.

[0023] Figure 5 This is an enlarged schematic diagram of area B in Figure 2.

[0024] Figure 6 for Figure 3 Enlarged schematic diagram of area C in the middle.

[0025] Figure 7 A schematic diagram of a crimping test device provided in an embodiment of the present application when the flip assembly is opened relative to the base assembly.

[0026] Figure 8 This is a schematic diagram of the flip assembly covering the base assembly in the crimping test device provided in one embodiment of the present application (before vertical crimping).

[0027] Fig. 9 This is a schematic diagram of the flip assembly covering the base assembly in the crimping test device provided in one embodiment of the present application (after vertical crimping).

[0028] Description of reference numerals:

[0029] 10. Crimping test device; 100. Base assembly; 110. Base; 111. Mounting hole; 112. Buckle; 120. Support plate; 121. Accommodating groove; 130. Second elastic member; 140. Equal height limit screw; 200. Flip assembly; 210. Base plate; 220. Flip cover; 221. Avoidance groove; 230. Base plate protection plate; 300. Limiting piece; 301. Through hole; 400. First elastic member; 500. Rotating shaft; 600. Torsion spring; 700. Telescopic column; 80. Product to be tested; 81. Connector; 81a. Body; 81b. Plug. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0036] The present application provides a crimping test device, which is used to crimp with a connector of a product to be tested to perform a continuity test on the product to be tested, thereby being able to detect whether the product to be tested is defective before it leaves the factory.

[0037] The structure of the crimping test device in the present application is described below by taking the test object of the crimping test device as 3C electronic products as an example. It can be understood that in other embodiments, the crimping test device of the present application is not limited to crimping test only 3C electronic products, but can also be used for crimping test of any electronic products, which is not limited here.

[0038] Refer to Figure 1, which shows a schematic diagram of a crimping test device 10 provided in an embodiment of the present application. The crimping test device 10 provided in an embodiment of the present application includes a base assembly 100 and a flip assembly 200. The base assembly 100 is used to carry a product to be tested 80. The flip assembly 200 is rotatably connected to the base assembly 100 so as to be able to cover the base assembly 100 or open relative to the base assembly 100. When the flip assembly 200 covers the base assembly 100, the flip assembly 200 can be crimped to the product to be tested 80 carried on the base assembly 100 so that the product to be tested 80 is turned on. When the product to be tested 80 is turned on, people can obtain information fed back by the product to be tested 80, thereby confirming whether the product to be tested 80 is defective.

[0039] Referring to FIG. 2 , in one embodiment, the flip assembly 200 includes a substrate 210 and a substrate connector (not shown in the figure), wherein the substrate 210 is a PCB circuit board, which is used to conduct with the product to be tested 80 when the product to be tested 80 is pressed against the flip assembly 200, and the substrate connector is arranged on one side of the substrate 210 and is electrically connected with the substrate 210, and is used to connect with the product to be tested 80 when the flip assembly 200 is covered on the base assembly 100. Accordingly, the product to be tested 80 has a connector 81, and when the flip assembly 200 is covered on the base assembly 100, the product to be tested 80 is pressed against the substrate connector through its own connector 81, thereby achieving mutual conduction between the product to be tested 80 and the substrate 210.

[0040] In order to fix and install the substrate 210, the flip assembly 200 further includes a flip cover 220 made of a hard material, which is rotatably connected to the base assembly 100, and the substrate 210 is arranged on one side of the flip cover 220. Specifically, the substrate 210 is attached to the side of the flip cover 220 away from the base assembly 100, and the flip cover 220 is provided with an escape groove 221 running through the opposite sides of itself, and the substrate connector is accommodated in the escape groove 221. In this way, when the base assembly 100 carries the product 80 to be tested and the flip assembly 200 covers the base assembly 100, the substrate connector can be plugged with the connector 81 of the product 80 to be tested.

[0041] Please continue to refer to Figure 2. The flip assembly 200 also includes a substrate protection plate 230 which is also made of a hard material. The substrate protection plate 230 is attached to the side of the substrate 210 that is away from the flip cover 220. In this way, one side of the substrate 210 is attached to the substrate protection plate 230, and the other side is attached to the flip cover 220, so that both sides of the substrate 210 in its own thickness direction are covered by hard materials, so that the substrate 210 can be well protected and the substrate 210 is prevented from bending or being damaged under the action of external force.

[0042] Of course, it is understandable that the structure of the flip assembly 200 is not limited to the structure described in the above embodiment. The flip assembly 200 may not be provided with a flip cover 220, and the substrate 210 may be directly rotatably connected to the base assembly 100, or only the substrate 210 and the substrate protection plate 230 may be provided, and the substrate protection plate 230 may be rotatably connected to the base assembly 100. No limitation is made here, but it is obvious that the flip cover 220 and the substrate protection plate 230 are respectively provided on opposite sides of the substrate 210, which is obviously the best embodiment.

[0043] See Figure 1 and Figure 3 In one embodiment, the base assembly 100 includes a base 110 and a support plate 120 connected to one side of the base 110. The base 110 is rotatably connected to the flip cover 220 of the flip assembly 200. A receiving groove 121 is provided on the support plate 120. When the product 80 to be tested is carried on the base assembly 100, a part of the connector of the product 80 to be tested is received in the receiving groove 121, so that when the product 80 to be tested is placed on the support plate 120, only the connector 81 of the product 80 to be tested protrudes from the support plate 120, and the rest of the part is flush with or lower than the surface of the side of the support plate 120 away from the base 110, so that when the flip assembly 200 is covered on the base assembly 100, the flip assembly 200 and the base assembly 100 can fit tightly without a gap, and the loose covering can be prevented to ensure that the substrate connector and the connector 81 of the product 80 to be tested are stably connected.

[0044] Preferably, please continue to see Figure 3The support plate 120 is connected to the base 110 through the second elastic member 130 and the equal height limit screws 140. Specifically, the second elastic member 130 is a plurality of floating springs. In this way, the connection between the support plate 120 and the base 110 is a floating connection. When the flip assembly 200 covers the base assembly 100, the second elastic member 130 will produce a recoverable deformation under the abutment of the flip assembly 200, thereby generating an elastic force to lift the product to be tested 80, so as to ensure that the connector 81 of the product to be tested 80 is always in contact with the substrate connector, thereby ensuring that the connector 81 of the product to be tested 80 and the substrate connector have a more stable connection.

[0045] Further, as described in the background art, in the prior art, when the product to be tested 80 is subjected to a crimping continuity test, the connector 81 of the product to be tested 80 and the connector of the test device (i.e., the substrate connector) are fully contacted and crimped. Since the full contact crimping requires that the connector 81 of the product to be tested 80 and the connector of the test device are fully in contact, the connector 81 of the product to be tested 80 and the substrate connector need to have a large contact area. In the case of repeated plugging and unplugging, it is easy to cause fatigue failure of the spring on the connector and wear of the plating on the connector, which makes it easy to frequently replace the connector in the later stage. If the connector 81 of the product to be tested 80 and the substrate connector are a crimping structure in which the probe is connected to the gold finger part of the connector itself, since the probe is long and thin, in order to ensure that the probe can be accurately crimped to the corresponding gold finger, the processing accuracy of the probe and the gold finger will be high, making the production and maintenance costs of the crimping test device 10 high, and precisely because the length of the probe is long, the impedance of the probe itself is large, which will also cause certain interference to the test during the test.

[0046] In order to solve the above problems, the inventor of the present application has thought that the connector 81 of the product to be tested 80 and the substrate connector can be changed from a full-contact crimping method to a semi-contact crimping method, that is, the crimping depth of the connector 81 of the product to be tested 80 and the substrate connector can be controlled, so that the contact area between the connector 81 of the product to be tested 80 and the substrate connector can be reduced, so that when the connector 81 of the product to be tested 80 and the substrate connector are repeatedly plugged and unplugged, the wear between the two can be reduced, and in the semi-contact crimping method, the connector 81 of the product to be tested 80 and the substrate connector are crimped and connected by making the gold finger part of the connector itself directly contact, rather than using a probe or blade needle crimping contact method. Therefore, there is no need to use a probe crimping, so that the dependence on processing accuracy can be reduced. And then the production and maintenance costs of the crimping test device 10 can be reduced. Further, since there is no need to use a probe or blade needle for crimping, the impedance problem of the probe or blade needle itself can be avoided, and the problem that the impedance of the probe or blade needle itself has a certain influence on the test when the crimping test device 10 is used is solved.

[0047] Based on this, referring to Figures 1 and 2, the inventor of the present application has set a limit plate 300 to achieve semi-contact crimping between the connector 81 of the product to be tested 80 and the substrate connector. In a specific implementation, the limit plate 300 is arranged on the substrate 210 on the same side as the substrate connector, and the limit plate 300 is spaced apart from the substrate connector. When the substrate connector and the connector 81 of the product to be tested 80 are crimped to each other, the limit plate 300 abuts against the connector 81 of the product to be tested 80. At this time, the limit plate 300 is just clamped between the product to be tested 80 and the substrate connector, thereby limiting the crimping depth of the connector 81 of the product to be tested 80 to the substrate connector.

[0048] Specifically, Figure 4 and Figure 5 As shown, the connector 81 of the product to be tested 80 includes a body 81a and a plug 81b arranged on one side of the body 81a. The limiting plate 300 is provided with through holes 301 penetrating through the opposite sides of itself. The through holes 301 are used for allowing the plug 81b to pass through when the flip assembly 200 is covered on the base assembly 100 to be plugged into the substrate connector. When the plug 81b is plugged into the substrate connector, the limiting plate 300 abuts against the body 81a.

[0049] In this arrangement, because the limit plate 300 blocks the connector 81 of the product to be tested 80, the connector 81 of the product to be tested 80 cannot be fully inserted into the substrate connector, but is partially inserted into the substrate connector, so that the connector 81 of the product to be tested 80 and the substrate connector are in a semi-contact crimping manner, thereby achieving the above-mentioned technical effects of reducing wear and reducing impedance interference, and further solving the problem of high production and maintenance costs of the crimping test device 10. In addition, by controlling the thickness of the limit plate 300, the crimping depth of the connector 81 of the product to be tested 80 and the substrate connector can be controlled, thereby ensuring that the connector 81 of the product to be tested 80 and the substrate connector are fully crimped without poor contact.

[0050] It is understandable that the limiting plate 300 can be of any shape as long as it is a thin sheet structure with a certain thickness, and the limiting plate 300 is not limited to having a through hole 301, but can also have grooves running through the opposite sides of itself, as long as the plug 81b of the connector 81 of the product to be tested 80 can pass through the limiting plate 300.

[0051] As a preferred implementation, see Figure 5The limiting piece 300 and the base plate 210 are connected to each other through a plurality of first elastic members 400. When the flip assembly 200 is covered on the base assembly 100, the limiting piece 300 is abutted by the connector 81 of the product to be tested 80 and the support plate 120 of the base assembly 100, so that the first elastic member 400 is compressed and produces a recoverable deformation.

[0052] In this way, the limiting plate 300 and the substrate 210 are also floatingly connected. Under the action of the first elastic member 400, the limiting plate 300 is pushed outward relative to the substrate 210 in a direction away from the substrate 210. Therefore, on the one hand, when the connector 81 of the product to be tested 80 is ready to be crimped with the substrate connector, the connector 81 of the product to be tested 80 will first contact the limiting plate 300 and pass through the through hole 301 of the limiting plate 300, thereby facilitating the initial positioning of the connector 81 of the product to be tested 80, and then facilitating the accurate insertion of the connector 81 of the product to be tested 80 into the substrate connector. On the other hand, when the flip assembly 200 is opened relative to the base assembly 100, because the limiting piece 300 is pushed outward in the direction away from the substrate 210 under the action of the first elastic member 400, the limiting piece 300 can give a reaction force to the connector 81 of the product to be tested 80 at this time, so that the substrate connector and the connector 81 of the product to be tested 80 can be smoothly separated, thereby preventing the substrate connector from lifting the connector 81 of the product to be tested 80 when the flip assembly 200 is opened relative to the base assembly 100.

[0053] In order to ensure that the substrate connector and the connector 81 of the product to be tested 80 can be crimped more stably and can further avoid wear, in a preferred embodiment, as shown in FIG. 1 , after the flip assembly 200 is covered on the base assembly 100, the flip assembly 200 can be slowly pressed down vertically relative to the base assembly 100 along the second direction shown in the figure (the Y direction shown in the figure), thereby avoiding sudden and violent contact between the substrate connector and the connector 81 of the product to be tested 80 when they are in contact, and thus the stability of the crimping contact can be further ensured.

[0054] Specifically, combined with Figure 1, Figure 3 and Figure 6As shown, the flip assembly 200 and the base assembly 100 are connected to each other through a rotating shaft 500 so that the two are rotatably connected. In the embodiment shown in the figure, the edge of the base 110 of the base assembly 100 is provided with a mounting hole 111 extending along a first direction (X direction as shown in the figure) perpendicular to the second direction. The rotating shaft 500 is connected to the flip cover 220 of the flip assembly 200 or penetrates the flip cover 220, and the rotating shaft 500 can be movably inserted into the mounting hole 111. The mounting hole 111 is a U-shaped hole or a waist hole, that is, in the second direction, the aperture of the mounting hole 111 is larger than the diameter of the rotating shaft 500, so that when the flip assembly 200 is covered on the base assembly 100, the rotating shaft 500 can move in the mounting hole 111 along the second direction, thereby being able to drive the flip assembly 200 to approach the base assembly 100 along the second direction, so that when the flip assembly 200 is covered on the base assembly 100, the substrate connector and the connector 81 of the product to be tested 80 can be vertically crimped.

[0055] Furthermore, a torsion spring 600 is sleeved on the outer circumference of the rotating shaft 500, and the flip assembly 200 is connected to the torsion spring 600. The torsion spring 600 is configured to provide an elastic force to support the rotating shaft 500 in the second direction. The elastic force is used to prevent the flip assembly 200 from approaching the base assembly 100 along the second direction when the flip assembly 200 is opened relative to the base assembly 100.

[0056] Thus, combining Figure 1 and Figure 7 As shown, in the initial state (i.e., when the flip assembly 200 is in an open state relative to the base assembly 100), the rotating shaft 500 is located at the top of the mounting hole 111 due to the upward elastic force of the torsion spring 600. When the flip assembly 200 is flipped to a position covering the base assembly 100, in combination with FIG. 1 and Figure 8 As shown, the substrate connector and the connector 81 of the product to be tested 80 are in contact with each other, so that the flip assembly 200 and the base assembly 100 are in a substantially parallel state. At this time, there is a certain distance M between the flip assembly 200 and the base assembly 100. Continue to press the flip assembly 200 downward. Fig. 9 As shown, the flip assembly 200 can move along the second direction toward the base assembly 100 until the substrate connector and the connector 81 of the product to be tested 80 are plugged into each other and the limiting piece 300 abuts against the connector 81 of the product to be tested 80. At this time, the distance between the flip assembly 200 and the base assembly 100 becomes N which is smaller than M. In this way, the substrate connector and the connector 81 of the product to be tested 80 can be slowly crimped vertically, avoiding the situation where the substrate connector and the connector 81 of the product to be tested 80 are in tilted contact, which causes unstable crimping or wear.

[0057] Please continue to refer to FIG. 1 . In order to further ensure the verticality of the flip assembly 200 relative to the base assembly 100 when it is vertically pressed down, a telescopic column 700 is movably provided on one side of the base assembly 100. The telescopic column 700 is configured to abut against the flip assembly 200 when the flip assembly 200 covers the base assembly 100, and can be retracted into the base assembly 100 when the flip assembly 200 moves along the second direction to approach the base assembly 100. In this way, when the flip assembly 200 covers the base assembly 100 but has not been pressed down, the flip assembly 200 and the telescopic column 700 are in contact with each other, and the flip assembly 200 is supported by the telescopic column 700, so that the flip assembly 200 and the base assembly 100 are parallel to each other. As described above, since the mounting hole 111 is a U-shaped hole or a waist hole, that is, in the second direction, the diameter of the mounting hole 111 is larger than the diameter of the rotating shaft 500, so that when the flip assembly 200 covers the base assembly 100, the rotating shaft 500 can move in the mounting hole 111 along the second direction, thereby driving the flip assembly 200 to be pressed down along the second direction and close to the base assembly 100. Therefore, in the process of the flip assembly 200 being pressed down relative to the base assembly 100 in the second direction, the telescopic column 700 can move relative to the base assembly 100 in the second direction under the downward pressure of the flip assembly 200 and retract into the base assembly 100, so that the flip assembly 200 can always remain parallel to the base assembly 100 while being pressed down, thereby ensuring the stability of the substrate connector and the connector 81 of the product to be tested 80 in the process of mutual crimping, and further avoiding the substrate connector and the connector 81 of the product to be tested 80 from being in oblique contact when in contact.

[0058] In addition, in order to prevent the substrate connector and the connector 81 of the product to be tested 80 from automatically disengaging after being crimped to each other, the base 110 of the base assembly 100 is further provided with a buckle 112, which is used to clamp and fix the flip assembly 200, specifically the cover plate of the flip assembly 200, when the flip assembly 200 is covered on the base assembly 100 and when the substrate connector is crimped to the connector 81 of the product to be tested 80. In this way, when the buckle 112 is clamped to the flip assembly 200, the flip assembly 200 can be firmly fixed to the base assembly 100, thereby resisting the elastic force generated by the torsion spring 600, and preventing the substrate connector and the connector 81 of the product to be tested 80 from automatically disengaging due to the elastic force.

[0059] It can be understood that the method of firmly fixing the flip component 200 to the base component 100 is not limited to the method of setting the buckle 112, but can also be a bonding or magnetic connection method, or a method of setting a suction cup to make the flip component 200 and the base component 100 adsorb to each other to prevent the substrate connector and the connector 81 of the product to be tested 80 from automatically detaching after being crimped together. No special limitation is made here.

[0060] It can be seen that the crimping test device 10 provided by the present application effectively solves the problem of low connector life by adopting a semi-contact vertical crimping method, and avoids the problem that the crimping test device 10 itself has a certain impedance when in use, which interferes with the test. At the same time, the precision requirements for the processed product are reduced, achieving the purpose of reducing the difficulty of processing, reducing costs, and making the test effect more stable.

[0061] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A crimping test device, characterized in that: include: A base assembly, used to carry the product to be tested; A flip assembly is rotatably connected to the base assembly so as to cover the base assembly or to be opened relative to the base assembly. The flip assembly includes a substrate and a substrate connector provided on the substrate. The substrate connector is used to press-fit with a connector of the product to be tested when the flip assembly covers the base assembly so as to make the substrate and the product to be tested conduct to each other. A limit plate is arranged on the substrate on the same side as the substrate connector and is spaced apart from the substrate connector. The limit plate is used to abut against the connector of the product to be tested when the substrate connector and the connector of the product to be tested are crimped together to limit the crimping depth of the connector of the product to be tested on the substrate connector.

2. The crimping test device according to claim 1, characterized in that: The connector of the product to be tested includes a body and a plug arranged on one side of the body, and the limiting plate is provided with through holes penetrating through two opposite sides of the body; the through holes are used for allowing the plug to pass through when the flip component is covered on the base component to be plugged into the substrate connector, and when the plug is plugged into the substrate connector, the limiting plate abuts against the body.

3. The crimping test device according to claim 1, characterized in that: The limiting piece and the base plate are connected to each other through a first elastic member. When the flip assembly covers the base assembly, the first elastic member is compressed and generates a restorable deformation.

4. The crimping test device according to claim 1, characterized in that: The flip assembly also includes a flip cover rotatably connected to the base assembly, the flip cover is provided with an avoidance groove running through two opposite sides of the flip cover, the base plate is arranged on a side of the flip cover away from the base assembly, and the base plate connector and the limit plate are accommodated in the avoidance groove.

5. The crimping test device according to claim 1 or 4, characterized in that: The flip assembly further includes a substrate protection plate, which is arranged on a side of the substrate facing away from the substrate connector.

6. The crimping test device according to claim 1, characterized in that: The base assembly includes a base and a support plate, and the support plate is connected to one side of the support plate through a second elastic member; when the flip assembly covers the base assembly, the support plate is abutted by the limiting plate, so that the second elastic member is compressed and produces a recoverable deformation.

7. The crimping test device according to claim 1, characterized in that: The flip assembly is rotatably connected to the base assembly via a rotating shaft. The base assembly is provided with a mounting hole extending along a first direction. The rotating shaft can be movably inserted into the mounting hole. In a second direction perpendicular to the first direction, the diameter of the mounting hole is larger than the diameter of the rotating shaft, so that when the flip assembly covers the base assembly, the rotating shaft can move in the mounting hole along the second direction to drive the flip assembly to approach the base assembly along the second direction.

8. The crimping test device according to claim 7, characterized in that: A torsion spring is sleeved on the outer circumference of the rotating shaft, and the flip assembly is connected to the torsion spring. The torsion spring is configured to provide an elastic force to support the rotating shaft in the second direction, and the elastic force is used to prevent the flip assembly from approaching the base assembly along the second direction when the flip assembly is opened relative to the base assembly.

9. The crimping test device according to claim 7 or 8, characterized in that: A telescopic column is movably provided on one side of the base assembly, and the telescopic column is configured to abut against the flip assembly when the flip assembly covers the base assembly, and can be retracted into the base assembly when the flip assembly moves along the second direction to approach the base assembly.

10. The crimping test device according to claim 1, characterized in that: The base component is provided with a buckle, and when the flip component is covered on the base component and when the substrate connector is crimped to the connector of the product to be tested, the buckle can be clamped and fixed to the flip component.

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