Mainboard punching device for mobile phone mainboard production

Abstract

The utility model relates to the technical field of punching devices, and discloses a mainboard punching device for mobile phone mainboard production. A placing plate is fixedly mounted at the top of a transverse plate A, and a fan is fixedly mounted at the bottom of the transverse plate A. Through the arrangement of the placing plate, the fan and other structures, a mainboard is adsorbed to the surface of the placing plate, and the mainboard is punched through the punching device. The mobile phone mainboard is placed at the top of the placing plate and completely covers the negative pressure groove and the stamping groove, the draught fan is started, the draught fan extracts air in the special-shaped groove and the negative pressure groove, a negative pressure state is generated in the negative pressure groove, the mainboard is firmly adsorbed to the top of the negative pressure groove, and the extracted air is exhausted through the air outlet, so that the situation that the mainboard is damaged when the mainboard is punched is avoided. Due to the fact that the middle of the main board is stressed, the middle of the main board is sunken, the flatness of the main board is changed, the attractiveness of the main board is improved, and the effect of preliminarily fixing the main board is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of punching devices, in particular to a motherboard punching device for producing mobile phone motherboards. Background Art

[0002] When a mobile phone motherboard is produced, after the motherboard is formed, it needs to be punched in order to fix the motherboard to the middle frame of the mobile phone. When punching holes, a punching device is needed.

[0003] There are some problems with the existing punching devices for mobile phone motherboards. When punching holes, the motherboard is punched, which will cause the motherboard around the punching position to deform. The motherboard is made of brittle material and cannot be used normally after deformation. The device for fixing the motherboard is generally clamped, and when the motherboard is punched, the motherboard will sag toward the middle, and clamping will promote the sag of the motherboard. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a motherboard punching device for producing mobile phone motherboards, which has the advantages of firm fixation and high yield rate, and solves the problems raised by the above-mentioned background technology.

[0005] The utility model provides the following technical solution: a motherboard punching device for producing mobile phone motherboards, comprising a horizontal plate A, a bottom array of the horizontal plate A is fixedly installed with supporting legs, a top array of the horizontal plate A is fixedly installed with a support frame, a horizontal plate B is fixedly installed on the top of the support frame, a cylinder is fixedly installed on the middle of the top of the horizontal plate B, a fixing sleeve is fixedly installed on the bottom of the horizontal plate B, the fixing sleeve is the output end of the cylinder, an inner ring of the fixing sleeve is provided with an arc groove, an internal sliding sleeve of the fixing sleeve is connected with an extrusion head, an outer ring of the extrusion head is provided with an arc protrusion, the arc protrusion is matched with the arc groove, a placing plate is fixedly installed on the middle of the top surface of the horizontal plate A, and a fan is fixedly installed on the bottom of the horizontal plate A.

[0006] Preferably, a bottom plate is fixedly installed at the bottom of the extrusion head, the outer ring of the extrusion head is located above the bottom plate and fixedly sleeved with a sliding sleeve, the outer ring of the sliding sleeve is in a circular ring shape and evenly fixedly installed with auxiliary legs, the outside of the auxiliary legs are fixedly installed with fastening screws, the fastening screws fix the auxiliary legs to the outer ring of the sliding sleeve, two springs are fixedly installed at the bottom of the auxiliary legs, and a soft plate is fixedly installed at the bottom of the springs, and the soft plate is made of soft silicone.

[0007] Preferably, a stamping groove is opened in the middle of the placement plate, a retaining groove is opened at the top of the placement plate on the outer circle of the stamping groove, a negative pressure groove is opened at the top of the placement plate between the stamping groove and the retaining groove, the negative pressure groove runs through the placement plate, and a fixing block is provided inside the negative pressure groove.

[0008] Preferably, a special-shaped groove is provided inside the transverse plate A below the placement plate, the special-shaped groove and the negative pressure groove are interconnected, a support is fixedly installed between the special-shaped groove and the placement plate, an air duct is fixedly connected between one side of the fan and the special-shaped groove, and an air outlet is provided on the other side of the fan.

[0009] Compared with the prior art, the utility model has the following beneficial effects:

[0010] 1. The motherboard punching device for the production of mobile phone motherboards realizes the absorption of the motherboard on the surface of the placement plate by setting a placement plate, a fan and other structures, and the mobile phone motherboard is placed on the top of the placement plate and completely covers the negative pressure groove and the punching groove. The fan is started to extract the air inside the special-shaped groove and the negative pressure groove, so that a negative pressure state is generated inside the negative pressure groove, so that the motherboard is firmly absorbed on the top of the negative pressure groove, and the extracted air is discharged from the air outlet. This effect is to avoid the mainboard from being dented in the middle part due to the force on the middle part of the mainboard when punching, so that the flatness of the mainboard changes, and the aesthetics of the mainboard is increased, which has the effect of initially fixing the mainboard.

[0011] 2. The motherboard punching device for the production of mobile phone motherboards realizes fixed stamping by setting up structures such as a cylinder, a fixing sleeve, and an extrusion head. The cylinder is started to make the extrusion head located on the inner circle of the placement plate slide downward until the soft board hits the upper surface of the motherboard, and the three soft boards are pressed against the upper surface of the motherboard, located on the outer circle of the stamping groove, and the extrusion head is continuously extended and retracted outward until the spring is pressed to the maximum contraction degree, so that the punch at the end of the bottom plate punches the mobile phone motherboard. The purpose of the soft board against the top of the motherboard is to avoid deformation of the material in the middle of the motherboard during punching, which causes damage to the motherboard. After the soft board is against the top of the motherboard, it will firmly squeeze the motherboard, and when the punch punches the motherboard, the position of the motherboard is guaranteed to be fixed, which has the effect of secondary fixing and stamping of the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 This is a cross-sectional view of the overall structure of the utility model;

[0014] Figure 3 This is a schematic diagram of the structure of the extrusion head of the utility model;

[0015] Figure 4 This is a cross-sectional view of the horizontal plate structure of the utility model.

[0016] In the figure: 1. horizontal plate A; 11. special-shaped groove; 12. pillar; 2. support leg; 3. support frame; 4. horizontal plate B; 5. cylinder; 6. fixing sleeve; 7. extrusion head; 71. bottom plate; 72. sliding sleeve; 73. auxiliary leg; 731. fastening screw; 74. spring; 75. soft plate; 8. placement plate; 81. stamping groove; 82. retention groove; 83. negative pressure groove; 9. fan; 91. air duct; 92. air outlet. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-Figure 2 A motherboard punching device for producing mobile phone motherboards comprises a horizontal plate A1, a bottom array of the horizontal plate A1 is fixedly installed with a support leg 2, a top array of the horizontal plate A1 is fixedly installed with a support frame 3, a top of the support frame 3 is fixedly installed with a horizontal plate B4, a cylinder 5 is fixedly installed in the middle of the top of the horizontal plate B4, a fixing sleeve 6 is fixedly installed at the bottom of the horizontal plate B4, the fixing sleeve 6 is the output end of the cylinder 5, an inner ring of the fixing sleeve 6 is provided with an arc groove, an internal sliding sleeve of the fixing sleeve 6 is connected with an extrusion head 7, an outer ring of the extrusion head 7 is provided with an arc protrusion, the arc protrusion is matched with the arc groove, a placing plate 8 is fixedly installed in the middle of the top surface of the horizontal plate A1, and a fan 9 is fixedly installed at the bottom of the horizontal plate A1.

[0019] See also Figure 1-Figure 3 A bottom plate 71 is fixedly installed at the bottom of the extrusion head 7. The outer ring of the extrusion head 7 is located above the bottom plate 71 and is fixedly sleeved with a sliding sleeve 72. The outer ring of the sliding sleeve 72 is annular and evenly fixed with auxiliary legs 73. Fastening screws 731 are fixedly installed on the outside of the auxiliary legs 73. The fastening screws 731 fix the auxiliary legs 73 to the outer ring of the sliding sleeve 72. Two springs 74 are fixedly installed at the bottom of the auxiliary legs 73. A soft board 75 is fixedly installed at the bottom of the spring 74. The soft board 75 is made of soft silicone to prevent the soft board 75 from pressing against the mobile phone motherboard and causing damage to the mobile phone motherboard.

[0020] See also Figure 1-Figure 4A stamping groove 81 is provided in the middle of the placement plate 8, a retaining groove 82 is provided at the top of the placement plate 8, which is located on the outer circle of the stamping groove 81; a negative pressure groove 83 is provided at the top of the placement plate 8, which is located between the stamping groove 81 and the retaining groove 82; the negative pressure groove 83 runs through the placement plate 8, and a fixing block is provided inside the negative pressure groove 83, so that the inner circle position and the outer circle position of the negative pressure groove 83 are relatively fixed; a special-shaped groove 11 is provided inside the transverse plate A1, which is located below the placement plate 8; the special-shaped groove 11 and the negative pressure groove 83 are interconnected; a pillar 12 is fixedly installed between the special-shaped groove 11 and the placement plate 8; an air duct 91 is fixedly connected between one side of the fan 9 and the special-shaped groove 11; and an air outlet 92 is provided on the other side of the fan 9.

[0021] See also Figure 1-Figure 4 , place the mobile phone motherboard on the top of the placement plate 8, and completely cover the negative pressure groove 83 and the punching groove 81, start the fan 9, and let the fan 9 extract the air inside the special-shaped groove 11 and the negative pressure groove 83, so that a negative pressure state is generated inside the negative pressure groove 83, so that the motherboard is firmly adsorbed on the top of the negative pressure groove 83, and the extracted air is discharged from the air outlet 92. This effect is to avoid the middle part of the motherboard from being dented due to the force applied to the middle part of the motherboard when punching holes, which changes the flatness of the motherboard and increases the aesthetics of the motherboard.

[0022] See also Figure 1-Figure 4 , start the cylinder 5, and make the extrusion head 7 located on the inner circle of the placement plate 8 slide downward until the soft board 75 hits the upper surface of the mainboard, and the three soft boards 75 are pressed against the upper surface of the mainboard, located at the outer circle of the stamping groove 81, and continue to retract the extrusion head 7 outward until the spring 74 is pressed to the maximum contraction degree, so that the punch at the end of the bottom plate 71 punches the mobile phone mainboard. The purpose of the soft board 75 hitting the top of the mainboard is to avoid deformation of the material in the middle of the mainboard during punching, which causes damage to the mainboard. After the soft board 75 hits the top of the mainboard, it will firmly squeeze the mainboard, and when the punch punches the mainboard, the position of the mainboard is guaranteed to be fixed.

[0023] Working principle: Place the mobile phone motherboard on the top of the placement plate 8, so that the motherboard completely covers the negative pressure groove 83 and the punching groove 81, start the fan 9, and let the fan 9 extract the air inside the negative pressure groove 83 and the special-shaped groove 11 through the air duct 91, so that the negative pressure groove 83 and the special-shaped groove 11 are in a negative pressure state, and the motherboard is located above the negative pressure groove 83, so that the motherboard is firmly adsorbed on the top of the negative pressure groove 83, and the extracted air is discharged from the air outlet 92. The fan 9 continuously extracts the negative pressure groove 83. This effect is to avoid the main board from being depressed in the middle part due to the force on the middle part of the main board when punching, which changes the flatness of the main board and increases the aesthetics of the main board. , then start the cylinder 5 to make the extrusion head 7 slide downward on the inner circle of the placement plate 8 until the soft board 75 hits the upper surface of the mainboard, and the three soft boards 75 are pressed against the upper surface of the mainboard, located at the outer circle of the stamping groove 81, the cylinder 5 continues to retract the extrusion head 7 outward until the spring 74 is pressed to the maximum contraction degree, so that the punch at the end of the bottom plate 71 punches the mobile phone mainboard. The purpose of the soft board 75 hitting the top of the mainboard is to avoid deformation of the material in the middle of the mainboard during punching, which causes damage to the mainboard. After the soft board 75 hits the top of the mainboard, it will firmly squeeze the mainboard, and when the punch punches the mainboard, the position of the mainboard is guaranteed to be fixed.

Claims

1. A motherboard punching device for producing mobile phone motherboards, comprising a horizontal plate A (1), characterized in that: The bottom array of the transverse plate A (1) is fixedly installed with a support frame (3), the top array of the transverse plate A (1) is fixedly installed with a support frame (3), the top of the support frame (3) is fixedly installed with a transverse plate B (4), the middle of the top of the transverse plate B (4) is fixedly installed with a cylinder (5), the bottom of the transverse plate B (4) is fixedly installed with a fixed sleeve (6), the fixed sleeve (6) is the output end of the cylinder (5), the inner ring of the fixed sleeve (6) is provided with an arc groove, the inner sliding sleeve of the fixed sleeve (6) is connected with an extrusion head (7), the outer ring of the extrusion head (7) is provided with an arc protrusion, and the arc protrusion is matched with the arc groove, a placement plate (8) is fixedly installed in the middle of the top surface of the transverse plate A (1), and a fan (9) is fixedly installed at the bottom of the transverse plate A (1).

2. A motherboard punching device for producing mobile phone motherboards according to claim 1, characterized in that: A bottom plate (71) is fixedly mounted on the bottom of the extrusion head (7); an outer ring of the extrusion head (7) is located above the bottom plate (71) and is fixedly sleeved with a sliding sleeve (72); the outer ring of the sliding sleeve (72) is in a circular ring shape and is evenly fixedly mounted with auxiliary legs (73); a fastening screw (731) is fixedly mounted on the outside of the auxiliary legs (73); the fastening screw (731) fixes the auxiliary legs (73) to the outer ring of the sliding sleeve (72); two springs (74) are fixedly mounted on the bottom of the auxiliary legs (73); a soft board (75) is fixedly mounted on the bottom of the spring (74); and the soft board (75) is made of soft silicone.

3. A motherboard punching device for producing mobile phone motherboards according to claim 2, characterized in that: A punching groove (81) is provided in the middle of the placement plate (8), a retaining groove (82) is provided at the top of the placement plate (8) and located on the outer ring of the punching groove (81), a negative pressure groove (83) is provided at the top of the placement plate (8) and located between the punching groove (81) and the retaining groove (82), the negative pressure groove (83) runs through the placement plate (8), and a fixing block is provided inside the negative pressure groove (83).

4. A motherboard punching device for producing mobile phone motherboards according to claim 3, characterized in that: A special-shaped groove (11) is provided inside the transverse plate A (1) and is located below the placement plate (8); the special-shaped groove (11) and the negative pressure groove (83) are interconnected; a support (12) is fixedly installed between the special-shaped groove (11) and the placement plate (8); an air duct (91) is fixedly connected between one side of the fan (9) and the special-shaped groove (11); and an air outlet (92) is provided on the other side of the fan (9).

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