Cooling fin of COME pinch plate based on ATCA board card architecture

Abstract

The utility model relates to a cooling fin of a COME pinch plate based on an ATCA board card framework, which is characterized in that a cooling fin base body is a step-type long strip, a part with a large thickness is a first cooling fin base body, a part with a small thickness is a second cooling fin base body, a first cooling fin is arranged on the first cooling fin base body, a second cooling fin is arranged on the second cooling fin base body, and the first cooling fin base body and the second cooling fin base body are integrally formed. A first boss is arranged on the lower end face of the second cooling fin base body. A second boss is arranged on the lower end face of the radiating fin base body at the joint of the first radiating fin base body and the second radiating fin base body, and the upper ends of the first radiating fins are flush with the upper ends of the second radiating fins. According to the utility model, a lengthening and height reducing mode is adopted to replace the original radiating fin, and the heat conduction pipe is embedded in the radiating fin, so that the heat of the chip is more efficiently conducted to the radiating fin and then is taken away by air. It is ensured that the height of the COME pinch plate meets the requirements of an ATCA board card and can meet the heat dissipation requirements of the COME pinch plate; the heat dissipation effect is relatively good, and the temperature of the chip is reduced.

Description

Technical Field

[0001] The utility model relates to a heat sink structure, in particular to a heat sink of a COME buckle board based on an ATCA board architecture. Background Art

[0002] At present, for the vertical plug-in communication chassis of ATCA architecture, the general system heat dissipation air duct is to take in cold air from the bottom of the front of the chassis, and enter each board area through the suction effect of the fan module, and take away the heat generated by each board from the top of the back of the chassis. For each vertical plug-in service board or switch board, the key or important chips on it generate relatively high heat when working. How to effectively remove the heat from the chip and reduce the temperature of the chip is particularly important. For ATCA boards, when they carry FPGA chips and COME boards, the key or important chips on the COME boards generate relatively high heat when working, and heat dissipation design is required.

[0003] In the prior art, the length of the COME gusset plate heat sink is 125mm, the height of the heat sink fin is 19mm, and the total height after adding the base and the boss is 29.5mm. It needs to be equipped with an independent fan for forced air cooling. However, the height limit of the ATCA board is 21mm. The existing COME gusset plate heat sink cannot be directly adapted to the ATCA board. If the height of the existing heat sink is simply reduced, the height of the heat sink fin must be reduced by at least 8mm, and the heat dissipation effect is greatly reduced, which cannot meet the heat dissipation requirements.

[0004] In view of the above problems, how to solve the structure of the heat sink on the COME buckle plate so as to reduce the chip temperature becomes a technical problem that the utility model needs to solve. Summary of the invention

[0005] In order to solve the above technical problems, the utility model provides a heat sink of a COME gusset plate based on an ATCA board architecture, which divides a base into two parts with different thicknesses, reduces the height of the heat sink ribs, and extends the length of the base, thereby expanding the heat dissipation area of ​​the heat sink ribs, ensuring that the overall height of the heat sink meets the requirements of the ATCA architecture, and can be well attached to the chip, so that the heat of the chip is brought to the heat sink in time, and the heat is taken away through the heat dissipation duct of the ATCA chassis system, so that the temperature rise of the chip is reduced.

[0006] The technical solution of the utility model is a heat sink of a COME buckle board based on an ATCA board architecture, comprising a heat sink base and heat sink ribs, the heat sink base comprising a first heat sink base and a second heat sink base, the heat sink ribs comprising a first heat sink rib and a second heat sink rib, the heat sink base is a stepped long strip, the portion with a large thickness is the first heat sink base, and the portion with a small thickness is the second heat sink base, the first heat sink rib is arranged on the first heat sink base, the second heat sink rib is arranged on the second heat sink base, a first boss is arranged on the lower end surface of the second heat sink base, and the shape and size of the first boss match the shape and size of the first chip; a second boss is arranged on the lower end surface of the heat sink base at the junction of the first heat sink base and the second heat sink base, and the shape and size of the second boss match the shape and size of the second chip; the upper ends of the first heat sink rib and the second heat sink rib are flush; a first heat pipe is arranged on the left side of the second heat sink base, and a second heat pipe is arranged on the right side of the second heat sink base, one side of the second heat pipe is embedded in the first boss, and the other side is embedded in the second boss.

[0007] In the above technical solution, the length of the heat sink base is 216mm, the length of the first heat sink base is 62.3mm, and the height is 7mm; the length of the second heat sink base is 153.7mm, and the height is 2.5mm; the height of the first heat sink fin is 3.5mm, and the height of the second heat sink fin is 6.5mm.

[0008] Preferably, the heat sink base and the heat sink fins are an integral unit and are made of red copper; the first heat conducting pipe and the second heat conducting pipe are made of red copper.

[0009] The beneficial effects of the utility model are as follows: since the height of the heat dissipation fins is greatly reduced, the utility model can be applied to the limited space height of the ATCA architecture, and since the length of the base is extended, the heat dissipation area of ​​the heat dissipation fins is increased. At the same time, since the heat pipe is embedded in the base, the influence of the reduction of the heat dissipation fin height on the heat dissipation effect is fully compensated, which not only ensures that the key chip of COME is effectively cooled, but also meets the height limit requirement of the ATCA panel. Therefore, the heat dissipation efficiency of the heat sink of the utility model is better than that of the original COME heat sink, the chip temperature is lower, and the performance of the chip is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a front view of the heat sink structure of the utility model;

[0011] Figure 2 for Figure 1 A bottom view of the heat sink structure shown;

[0012] Figure 3 for Figure 2 Sectional view of the view;

[0013] Figure 4 This is the front view of the utility model installed on the COME gusset plate;

[0014] Figure 5 This is a front cross-sectional view of the utility model installed on a COME gusset plate. DETAILED DESCRIPTION

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0016] like Figures 1 to 5 As shown, a heat sink of a COME gusset based on an ATCA board architecture comprises a heat sink substrate 10, a heat sink fin 20, a first heat pipe 51 and a second heat pipe 52. The heat sink substrate 10, the heat sink fin 20, the heat pipe 51 and the heat pipe 52 are all made of copper. A copper strip with a thickness of 14 mm and a length of 216 mm is processed. First, nine assembly circular bosses 60 are processed on one end face of the copper strip according to the structure of the ATCA tray, and the center is a through hole with a diameter of 2.7. Then, a second boss 32 with a slightly larger shape and size and a height of 2 mm is processed according to the shape and position of the second chip 102, and the center of the second boss 32 is 62.3 mm away from the end head; the first boss 31 with a slightly larger shape and size and a height of 2 mm is processed according to the shape and position of the first chip 101;

[0017] A first heat dissipation fin 21 with a height of 3.5 mm is processed within a length of 62.3 mm at one end of the unprocessed end surface with the second boss 32, and a second heat dissipation fin 22 with a height of 6 mm is processed in the remaining 153.7 mm portion. The first heat dissipation fin 21 and the second heat dissipation fin 22 form a heat dissipation fin 20, and the unprocessed portion below the heat dissipation fin 20 is a heat dissipation fin substrate 10; below the first heat dissipation fin 21 is a first heat dissipation fin substrate 11, and below the second heat dissipation fin 22 is a second heat dissipation fin substrate 12;

[0018] A heat pipe 51 is embedded on the left side of the second heat sink base 12 , and a second heat pipe 52 is embedded on the right side of the second heat sink base 12 . One side of the second heat pipe 52 is embedded in the first boss 31 , and the other side is embedded in the second boss 32 .

[0019] The total length of the heat sink of the utility model is 101mm longer than that of the prior art heat sink, and the total height is 19mm lower than that of the prior art heat sink, which is almost one-third of the original height, and is sufficient to be used on the COME buckle board of the ATCA board architecture with a height of 21mm.

[0020] During assembly, the heat sink of the utility model is assembled on the ATCA tray through the two diagonal studs 40 of the boss 32 and the nine assembly circular bosses 60 under the base 10, and two screws 9 are screwed to the two studs 40 at the bottom of the COME PCB board 110 to fix the PCB board and the heat sink of the utility model together. At this time, the distance between the boss 32 and the corresponding second chip 102 is 0.2mm, the distance between the boss 31 and the corresponding first chip 101 is 0.6mm, and the distance between the COME buckle board memory bar 103 and the first heat sink base 11 is 0.6mm. The gap between the second boss 32 and the second chip 102 is filled with thermal grease 7, and the gap between the first boss 31 and the first chip 101, and the gap between the memory bar 103 and the first heat sink substrate 11 are filled with a 1mm thick thermal rubber pad 8. The second boss 32, the thermal grease 7 and the second chip 102 are closely attached to each other through the pre-tightening force of the screw 9 and the stud 40, and the first boss 31, the thermal rubber pad 8 and the first chip 101 are closely attached to ensure the heat dissipation effect. The heat on the first chip 101 and the second chip 102 is quickly distributed to the surface of the heat sink through the first heat pipe 51 and the second heat pipe 52 to achieve the purpose of efficient heat dissipation.

[0021] Five single-headed hexagonal copper pillars 13 and four single-headed hexagonal copper pillars 14 are screwed on the ATCA panel tray 15. After the PCB board 110 of the COME is fixed to the heat sink of the utility model, it is screwed to the hexagonal copper pillars 13 and the hexagonal copper pillars 14 on the ATCA PCB board by nine screws 16, so as to achieve overall installation and fixation.

[0022] The above description is only a specific implementation method of the present utility model, and designers can optimize or improve it according to the inspiration of the above examples without deviating from the technical solution.

Claims

1. A heat sink for a COME gusset plate based on an ATCA board architecture, comprising a heat sink base (10) and heat dissipation ribs (20), characterized in that: The heat sink substrate (10) comprises a first heat sink substrate (11) and a second heat sink substrate (12); the heat sink fins (20) comprise a first heat sink fin (21) and a second heat sink fin (22); the heat sink substrate (10) is a stepped strip, the portion with a larger thickness is the first heat sink substrate (11), and the portion with a smaller thickness is the second heat sink substrate (12); the first heat sink fin (21) is arranged on the first heat sink substrate (11), the second heat sink fin (22) is arranged on the second heat sink substrate (12), and a first boss (31) is arranged on the lower end surface of the second heat sink substrate (12); the shape and size of the first boss (31) are The shape and size of the heat sink substrate (10) match the shape and size of the first chip (101); a second boss (32) is arranged on the lower end surface of the heat sink substrate (10) at the junction of the first heat sink substrate (11) and the second heat sink substrate (12); the shape and size of the second boss (32) match the shape and size of the second chip (102); the upper ends of the first heat sink fin (21) and the second heat sink fin (22) are flush; a first heat conducting pipe (51) is arranged at the lower left of the second heat sink substrate (12), and a second heat conducting pipe (52) is arranged at the lower right of the second heat sink substrate (12); one side of the second heat conducting pipe (52) is embedded in the first boss (31), and the other side is embedded in the second boss (32).

2. The heat sink of a COME pinch board based on an ATCA board architecture as claimed in claim 1, characterized in that: The heat sink base (10) has a length of 216 mm, the first heat sink base (11) has a length of 62.3 mm and a height of 7 mm; the second heat sink base (12) has a length of 153.7 mm and a height of 205 mm; the first heat sink fin (21) has a height of 3.5 mm, and the second heat sink fin (22) has a height of 6.5 mm.

3. The heat sink of a COME gusset board based on an ATCA board architecture as claimed in claim 1, characterized in that: The heat sink base (10) and the heat sink fins (20) are an integral unit and are made of red copper; the first heat conducting pipe (51) and the second heat conducting pipe (52) are made of red copper.

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