Multi-channel wafer automatic laminating machine

Abstract

The utility model provides a multichannel wafer automatic laminating machine, which is used for laminating a plurality of wafers on a magnet, and comprises a machine rack, a material table and a guide rail are arranged on the machine rack, and the material table is used for placing the wafers and the magnet to be laminated; the dispensing mechanism is arranged on the guide rail and is used for dispensing the magnet; the laminating mechanism is arranged on the guide rail and is used for laminating the wafer on the magnet; wherein the material table, the dispensing mechanism and the laminating mechanism are respectively provided with a plurality of visual identification cameras, and a needle aligning instrument is arranged on the material table and is used for detecting the dispensing height of the dispensing mechanism. The problems that in the prior art, manual assembly and dispensing are not uniform, and after multiple channels are attached, if one channel is poor in attachment, all channels need to be reworked for repeated attachment are solved.

Description

Technical Field

[0001] The utility model relates to the field of automation equipment, and more specifically, to a multi-channel wafer automatic bonding machine. Background Art

[0002] During the chip production process, the chip and the magnet need to be attached to each other. The current factory production technology requires manual chip assembly. After the magnetic block is placed, glue is first applied to the middle of the magnetic block groove, and then the chip is clamped with tweezers to be mounted on the magnetic block. After that, multiple chips are mounted on multiple channels of the magnet in sequence.

[0003] However, in the existing multi-channel chip bonding technology, the processes of dispensing glue on the magnet and bonding the chip to the magnet require manual operation. The manual assembly glue dispensing is uneven, not centered, and the bonding position is irregular. If one channel is poorly bonded after multiple channels are bonded, all of them need to be reworked and repeated, which is time-consuming and labor-intensive.

[0004] Therefore, the prior art has defects and shortcomings and needs further improvement and development. Utility Model Content

[0005] The utility model aims to provide a multi-channel wafer automatic bonding machine, which solves the problem of uneven dispensing in manual assembly in the prior art and the need for rework and repeated bonding if one channel is poorly bonded after bonding multiple channels.

[0006] To achieve the above purpose, the technical solution adopted by the utility model is: to provide a multi-channel wafer automatic bonding machine for bonding multiple wafers on a magnet, the multi-channel wafer automatic bonding machine comprises:

[0007] A machine frame, on which a material table and guide rails are arranged, and the material table is used to place the wafers and magnets to be bonded;

[0008] A glue dispensing mechanism, which is arranged on the guide rail and is used for dispensing glue on the magnet;

[0009] A laminating mechanism, which is arranged on the guide rail and is used to laminar the wafer onto the magnet;

[0010] Among them, a plurality of visual recognition cameras are respectively arranged on the material table, the dispensing mechanism and the bonding mechanism, and a needle alignment instrument is arranged on the material table, which is used to detect the dispensing height of the dispensing mechanism.

[0011] Optionally, the multi-channel wafer automatic bonding machine further includes a distance meter, which is disposed on the glue dispensing mechanism and is used to detect the distance from the glue dispensing mechanism to the magnet.

[0012] Optionally, the visual recognition camera includes:

[0013] A first visual recognition camera, which is arranged on the dispensing mechanism and is used to detect the position of the magnet to be dispensed;

[0014] A second visual recognition camera, which is disposed on the bonding mechanism and is used to detect the positions of the wafer and the magnet;

[0015] The third visual recognition camera is arranged on the material table and is used to detect the bonding surface size of the chip.

[0016] Optionally, the needle alignment instrument comprises:

[0017] A fixed seat, the fixed seat is arranged on the material table, and a through hole is arranged on the fixed seat;

[0018] A connecting column, which is passed through the through hole and fixedly connected to the fixing seat;

[0019] The sensor is mounted on the connecting column and is used to receive the contact signal of the dispensing machine.

[0020] Optionally, a guide rail is arranged on the machine frame along the X-axis direction, and the glue dispensing mechanism and the bonding mechanism are movably arranged on the guide rail.

[0021] Optionally, the dispensing mechanism includes:

[0022] A first Y-axis moving component, the first Y-axis moving component is arranged on the guide rail along the Y direction;

[0023] A first Z-axis moving component, which is arranged on the first Y-axis moving component along the Y direction and moves along the Y direction by being driven by the first Y-axis moving component;

[0024] The first connecting plate is arranged on the first Z-axis moving assembly and moves along the Z direction through the driving of the first Z-axis moving assembly.

[0025] Optionally, the glue dispensing mechanism also includes a glue dispensing device, which is connected to the first connecting plate and is used to dispense glue on the magnet.

[0026] Optionally, the dispensing device includes:

[0027] A motor, which is fixedly mounted on the first connecting plate;

[0028] A transmission belt, which is connected to the motor;

[0029] A transmission shaft, the transmission shaft is movably connected with a transmission belt;

[0030] The dispensing head is fixedly connected to the transmission shaft and rotates through the rotation of the transmission shaft.

[0031] Optionally, the fitting mechanism includes:

[0032] A second Y-axis moving assembly, the second Y-axis moving assembly is arranged on the guide rail along the Y direction;

[0033] A second Z-axis moving assembly, the second Z-axis moving assembly is arranged on the second Y-axis moving assembly along the Y direction and moves along the Y direction by being driven by the second Y-axis moving assembly;

[0034] The second connecting plate is arranged on the second Z-axis moving assembly and moves along the Z direction through the driving of the second Z-axis moving assembly.

[0035] Optionally, the bonding mechanism further comprises an adsorption device, which is connected to the second connecting plate and is used to absorb the wafer and bond it to the magnet.

[0036] The beneficial effects of a multi-channel wafer automatic bonding machine provided by the utility model are at least that: the glue dispensing mechanism automatically aligns and dispenses glue on the magnet, which reduces the manual operation time, can accurately control the glue dispensing amount and glue dispensing position, thereby improving production efficiency, and the application of multiple alignment detection devices can monitor the position of the wafer, magnet and adhesive in real time, ensure their precise alignment and bonding, improve the accuracy and consistency of bonding, and avoid bonding deviation. Compared with manual operation, the automatic bonding machine reduces labor costs and time costs, and reduces the possibility of human errors. This helps to improve product quality and consistency, and reduce unnecessary losses and repetitive work. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 It is a structural schematic diagram of a multi-channel wafer automatic bonding machine according to an embodiment of the present application;

[0039] Figure 2 is a structural schematic diagram of a multi-channel wafer automatic bonding machine from another perspective of an embodiment of the present application;

[0040] Figure 3 It is a structural schematic diagram of a dispensing mechanism in an embodiment of the present application;

[0041] Figure 4 This is an embodiment of the present application Figure 3 A magnified view of part A in FIG.

[0042] Figure 5 is a structural schematic diagram of a laminating mechanism according to an embodiment of the present application;

[0043] Figure 6 It is a structural schematic diagram of the needle alignment instrument according to an embodiment of the present application.

[0044] Among them, the reference numerals in the figure are:

[0045] 10. Machine frame; 110. Material table; 120. Guide rail; 20. Glue dispensing mechanism; 210. First Y-axis moving assembly; 220. First Z-axis moving assembly; 230. First connecting plate; 240. Glue dispensing device; 241. Motor; 242. Transmission belt; 243. Transmission shaft; 244. Glue dispensing head; 30. Laminating mechanism; 310. Second Y-axis moving assembly; 320. Second Z-axis moving assembly; 330. Second connecting plate; 340. Adsorption device; 40. Alignment detection device; 410. Visual recognition camera; 411. First visual recognition camera; 412. Second visual recognition camera; 413. Third visual recognition camera; 420. Needle alignment instrument; 421. Fixed seat; 422. Connecting column; 423. Sensor; 430. Rangefinder. DETAILED DESCRIPTION

[0046] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0047] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly or indirectly located on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the accompanying drawings and are only for the convenience of description and are not to be construed as limitations on the present technical solution. The terms "first" and "second" are only used for the convenience of description and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0048] like Figure 1 as well as Figure 2As shown, the utility model provides a multi-channel wafer automatic bonding machine, which is used to bond multiple wafers to a magnet. The multi-channel wafer automatic bonding machine includes a machine frame 10, a dispensing mechanism 20 and a bonding mechanism 30. The machine frame 10 is provided with a material table 110 and a guide rail 120. The material table 110 is used to place the wafers and magnets to be bonded. The material table 110 and the guide rail 120 are fixedly connected to the machine frame 10. The dispensing mechanism 20 is arranged on the guide rail 120 and is used to dispense glue on the magnet. There are multiple groove channels on the magnet. The dispensing machine dispenses glue on the multiple groove channels to ensure the accurate distribution of the adhesive. The bonding mechanism 30 is arranged on the guide rail 120 and is used to bond the wafer to the magnet. Among them, multiple alignment detection devices 40 are respectively arranged on the material table 110, the dispensing mechanism 20 and the bonding mechanism 30. Using multiple alignment detection devices 40, the positions of the wafers, magnets and adhesives can be monitored in real time during the entire bonding process to ensure their accurate alignment and bonding. This automatic laminating machine can improve production efficiency and laminating accuracy while reducing manual operation errors.

[0049] The working principle of this embodiment is: when the magnet and the chip need to be bonded together, first the magnet and the chip are manually placed on the material table 110, and then they can be automatically bonded through an automated machine. First, the alignment detection device 40 detects the position and distance of the magnet, and then the glue dispensing mechanism 20 dispenses glue at multiple locations on the multi-channel grooves of the magnet. After that, the alignment detection device 40 detects the position of the chip, and then the bonding mechanism 30 adsorbs the chip, and then moves the chip above the magnet, and aligns the chip and sticks it to the multi-channel grooves of the magnet, and then repeats this step multiple times.

[0050] The beneficial effects of a multi-channel wafer automatic bonding machine provided by this embodiment are at least that: the glue dispensing mechanism 20 automatically aligns and dispenses glue on the magnet, which reduces the manual operation time, can accurately control the glue dispensing amount and glue dispensing position, thereby improving production efficiency, and the application of multiple alignment detection devices 40 can monitor the position of the wafer, magnet and adhesive in real time to ensure their precise alignment and bonding, improve the accuracy and consistency of bonding, and avoid bonding deviation. Compared with manual operation, the automatic bonding machine reduces labor costs and time costs, and reduces the possibility of human errors. This helps to improve product quality and consistency, and reduce unnecessary losses and repetitive work.

[0051] like Figure 1 as well as Figure 2As shown, the alignment detection device 40 in this embodiment includes multiple visual recognition cameras 410, a needle alignment instrument 420 and a rangefinder 430. The multiple visual recognition cameras 410 are respectively fixed on the material table 110, the dispensing mechanism 20 and the bonding mechanism 30. The visual recognition camera 410 captures and analyzes the images of the wafer, magnet and adhesive to be bonded through image recognition technology. Using image processing algorithms, the camera can extract key features such as contours, edges and colors to achieve accurate detection and alignment of the positions of the wafer, magnet and adhesive. The needle alignment instrument 420 is arranged on the material table 110 and is used to detect the dispensing operation height of the dispensing mechanism 20. The needle alignment instrument 420 is used to detect the moving distance and force of the dispensing mechanism 20. When the needle alignment instrument 420 contacts the dispensing mechanism 20, the moving data of the dispensing mechanism 20 can be recorded, and the current dispensing operation height can be stored to improve the operation accuracy of the dispensing mechanism 20. The rangefinder 430 is arranged on the dispensing mechanism 20 and is used to detect the distance from the dispensing mechanism 20 to the magnet. By measuring the distance between the dispensing mechanism 20 and the magnet, the rangefinder 430 can provide real-time distance data. Ensure that the adhesive can be applied to the magnet at the correct distance to avoid excessive or insufficient dispensing.

[0052] like Figure 1 as well as Figure 2 As shown, the visual recognition camera 410 in this embodiment includes a first visual recognition camera 411, a second visual recognition camera 412 and a third visual recognition camera 413. The first recognition camera is arranged on the dispensing mechanism 20 and is used to detect the position of the magnet to be dispensed. The first recognition camera can use a feature recognition algorithm to identify the position and direction of the magnet to be dispensed to accurately locate the position of the magnet to be dispensed and ensure the accuracy of dispensing. The second visual recognition camera 412 is arranged on the bonding mechanism 30 and is used to detect the position of the wafer and the magnet. The second visual recognition camera 412 uses a feature recognition algorithm to analyze the image to achieve accurate detection of the position of the wafer and the magnet. This helps to ensure the precise alignment of the wafer and the magnet during the bonding process. The third visual recognition camera 413 is arranged on the material table 110 and is used to detect the bonding surface size of the wafer. The third visual recognition camera 413 uses feature recognition and edge detection algorithms to analyze the image and determine the size of the wafer bonding surface, which can ensure that the bonding surface size of the wafer meets the specified requirements, thereby ensuring the bonding quality and product performance.

[0053] like Figure 6As shown, the needle alignment instrument 420 in this embodiment includes a fixing seat 421, a connecting column 422 and a sensor 423. The fixing seat 421 is arranged on the material platform 110, and a through hole is arranged on the fixing seat. The fixing seat 421 is used to stably support the connecting column 422 and the sensor 423. The connecting column 422 is arranged on the fixing seat 421, and the connecting column 422 is penetrated in the through hole and fixedly connected to the fixing seat. The connecting column 422 is used to connect the fixing seat 421 and the sensor 423. The sensor 423 is sleeved on the connecting column 422 and is used to receive the contact signal of the glue dispenser. When the glue dispenser contacts the sensor 423 on the needle alignment instrument 420, the sensor 423 will generate a feedback signal to inform the glue dispenser that the predetermined height has been reached. Sensor 423 can sense the moving distance between the dispensing machine and the material table 110, that is, the operating moving height of the dispensing machine, thereby obtaining the preset operating distance of the dispensing machine, which can ensure that the adhesive can be evenly and accurately coated on the magnet, avoid too high or too low dispensing position, and improve the bonding quality and consistency.

[0054] like Figure 1 as well as Figure 2 As shown, the guide rail 120 in this embodiment is arranged on the machine frame 10 along the X-axis direction, and the glue dispensing mechanism 20 and the bonding mechanism 30 are movably arranged on the guide rail 120. The guide rail 120 is arranged relative to the material table 110. When glue dispensing is required, the glue dispensing mechanism 20 moves to the magnet placement on the material table 110 through the guide rail 120. When bonding is required, the glue dispensing mechanism 20 moves away, and the bonding mechanism 30 moves to the magnet placement on the material table 110 through the guide rail 120 for bonding. Through the movement of the guide rail 120, the glue dispensing mechanism 20 can be positioned at the magnet placement on the material table 110 to perform precise glue dispensing operations. This ensures that the adhesive can be evenly and accurately applied to the magnet, avoiding too high or too low glue dispensing positions. The bonding mechanism 30 can also be accurately positioned at the magnet placement on the material table 110 to bond the wafer to the magnet. This helps to ensure the precise alignment of the wafer and the magnet during the bonding process, and improves the accuracy and consistency of bonding.

[0055] like Figure 3As shown, the dispensing mechanism 20 in this embodiment includes a first Y-axis moving component 210, a first Z-axis moving component 220 and a first connecting plate 230. The first Y-axis moving component 210 is arranged on the guide rail 120 along the Y direction, the first Z-axis moving component 220 is arranged on the first Y-axis moving component 210 along the Y direction, and moves along the Y direction by driving the first Y-axis moving component 210. The first connecting plate 230 is arranged on the first Z-axis moving component 220, and moves along the Z direction by driving the first Z-axis moving component 220. The first Y-axis moving component 210, the first Z-axis moving component 220 and the first connecting plate 230 in the dispensing mechanism 20 realize the precise movement and adjustment of the dispensing mechanism 20 in the X-axis, Y-axis and Z-axis directions through the coordinated action of the guide rail 120 and the driving device, thereby ensuring the accuracy and consistency of the dispensing position.

[0056] like Figure 3 as well as Figure 4 As shown, the dispensing mechanism 20 in this embodiment further includes a dispensing device 240, which is connected to the first connecting plate 230 and is used to dispense glue on the magnet. The dispensing device 240 can precisely apply the adhesive to the designated position of the magnet by controlling the flow of the dispensing material. The dispensing device 240 can adapt to different dispensing requirements by adjusting the dispensing speed to ensure the efficiency and quality of dispensing.

[0057] like Figure 4 As shown, the dispensing device 240 in this embodiment includes a motor 241, a transmission belt 242, a transmission shaft 243 and a dispensing head 244. The motor 241 is fixedly arranged on the first connecting plate 230. The motor 241 is the power source of the dispensing device 240, and provides a rotational force by converting electrical energy into mechanical energy. The transmission belt 242 is connected to the motor 241, and the transmission shaft 243 is movably connected to the transmission belt 242. The transmission belt 242 transmits the rotational force of the motor 241 to the transmission shaft 243. The transmission belt 242 has the characteristics of flexibility and tensile resistance, and can effectively transmit force. The transmission shaft 243 is movably connected to the transmission belt 242, and the transmission shaft 243 carries the rotational movement of the dispensing head 244. The transmission shaft 243 rotates through the rotation of the transmission belt 242, and transmits the rotational force of the motor 241 to the dispensing head 244. The dispensing head 244 is fixedly connected to the transmission shaft 243 and rotates through the rotation of the transmission shaft 243. The adhesive can be evenly applied to the magnet by the rotation of the dispensing head 244. This ensures uniform dispensing and avoids insufficient or excessive local dispensing.

[0058] like Figure 5As shown, the laminating mechanism 30 in this embodiment includes a second Y-axis moving assembly 310, a second Z-axis moving assembly 320 and a second connecting plate 330. The second Y-axis moving assembly 310 is arranged on the guide rail 120 along the Y direction, the second Z-axis moving assembly 320 is arranged on the second Y-axis moving assembly 310 along the Y direction, and moves along the Y direction by driving the second Y-axis moving assembly 310, and the second connecting plate 330 is arranged on the second Z-axis moving assembly 320, and moves along the Z direction by driving the second Z-axis moving assembly 320. The second Y-axis moving assembly 310, the second Z-axis moving assembly 320 and the second connecting plate 330 in the laminating mechanism 30 realize the precise movement and adjustment of the laminating mechanism 30 in the X-axis, Y-axis and Z-axis directions through the coordinated action of the guide rail 120 and the driving device, thereby ensuring the accuracy and consistency of the laminating position.

[0059] like Figure 5 As shown, the bonding mechanism 30 in this embodiment also includes an adsorption device 340, which is connected to the second connecting plate 330 and is used to suck up the wafer and bond it to the magnet. The adsorption device 340 is usually composed of a suction cup and a vacuum system. The suction cup can generate negative pressure through the vacuum system to adsorb the wafer on the suction cup. The stability and accuracy of the wafer during the bonding process can be ensured to prevent the wafer from moving or deviating from the bonding position. The adsorption device 340 can flexibly change the angle and position of adsorption. In this way, different bonding requirements can be met to ensure that the adsorption device 340 can accurately bond the wafer to the specified position of the magnet.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-channel wafer automatic bonding machine for bonding multiple wafers to a magnet, characterized in that: The multi-channel wafer automatic bonding machine comprises: A machine frame, on which a material table and a guide rail are arranged, and the material table is used to place the wafers and magnets to be bonded; A glue dispensing mechanism, the glue dispensing mechanism is arranged on the guide rail and is used to dispense glue to the magnet; A laminating mechanism, which is disposed on the guide rail and is used to laminarly attach the wafer to the magnet; Among them, a plurality of visual recognition cameras are respectively arranged on the material table, the dispensing mechanism and the bonding mechanism, and a needle alignment instrument is arranged on the material table, and the needle alignment instrument is used to detect the dispensing height of the dispensing mechanism.

2. The multi-channel wafer automatic bonding machine according to claim 1, characterized in that: The multi-channel wafer automatic bonding machine also includes a distance meter, which is arranged on the glue dispensing mechanism and is used to detect the distance from the glue dispensing mechanism to the magnet.

3. The multi-channel wafer automatic bonding machine according to claim 1, characterized in that: The visual recognition camera comprises: A first visual recognition camera, which is disposed on the dispensing mechanism and is used to detect the position of the magnet to be dispensed; A second visual recognition camera, which is disposed on the bonding mechanism and is used to detect the positions of the wafer and the magnet; A third visual recognition camera is arranged on the material table and is used to detect the bonding surface size of the chip.

4. The multi-channel wafer automatic bonding machine as claimed in claim 2, characterized in that: The needle alignment instrument comprises: A fixing seat, the fixing seat is arranged on the material table, and a through hole is arranged on the fixing seat; A connecting column, the connecting column is inserted into the through hole and fixedly connected to the fixing seat; The sensor is sleeved on the connecting column and is used to receive the contact signal of the dispensing machine.

5. The multi-channel wafer automatic bonding machine according to claim 1, characterized in that: The guide rail is arranged on the machine frame along the X-axis direction, and the glue dispensing mechanism and the bonding mechanism are movably arranged on the guide rail.

6. The multi-channel wafer automatic bonding machine according to claim 1, characterized in that: The dispensing mechanism comprises: A first Y-axis moving component, wherein the first Y-axis moving component is arranged on the guide rail along the Y direction; a first Z-axis moving component, wherein the first Z-axis moving component is arranged on the first Y-axis moving component along the Y direction and moves along the Y direction by being driven by the first Y-axis moving component; A first connecting plate, wherein the first connecting plate is disposed on the first Z-axis moving assembly and moves along the Z direction through the driving of the first Z-axis moving assembly.

7. The multi-channel wafer automatic bonding machine according to claim 6, characterized in that: The glue dispensing mechanism also includes a glue dispensing device, which is connected to the first connecting plate and is used to dispense glue on the magnet.

8. The multi-channel wafer automatic bonding machine according to claim 7, characterized in that: The dispensing device comprises: A motor, wherein the motor is fixedly mounted on the first connecting plate; A transmission belt connected to the motor; A transmission shaft, the transmission shaft being movably connected to the transmission belt; The glue dispensing head is fixedly connected to the transmission shaft and rotates through the rotation of the transmission shaft.

9. The multi-channel wafer automatic bonding machine according to claim 1, characterized in that: The laminating mechanism comprises: a second Y-axis moving assembly, the second Y-axis moving assembly being arranged on the guide rail along the Y direction; a second Z-axis moving assembly, wherein the second Z-axis moving assembly is arranged on the second Y-axis moving assembly along the Y direction and moves along the Y direction by being driven by the second Y-axis moving assembly; The second connecting plate is arranged on the second Z-axis moving assembly and moves along the Z direction through the driving of the second Z-axis moving assembly.

10. The multi-channel wafer automatic bonding machine according to claim 9, characterized in that: The bonding mechanism also includes an adsorption device, which is connected to the second connecting plate and is used to absorb the wafer and bond it to the magnet.

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