Laser radar TOF module convenient for heat dissipation
By setting a thermally conductive insulating part and a thermally conductive metal layer on the back of the circuit board of the lidar TOF module, the problem of temperature rise inside the module is solved, and the heat dissipation performance and stability are improved.
Patent Information
- Application Number
- CN202323587714.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2033-12-27
AI Technical Summary
Due to the increase in electronic components and high power consumption of existing lidar TOF modules, the internal temperature of the module has increased sharply, affecting the stability of the equipment.
A lidar TOF module including a circuit board is designed. The back of the circuit board is provided with a thermally conductive insulating part, which is coated on the electronic components, and a thermally conductive metal layer is provided in the electronic component-free area to improve the heat distribution and accelerate heat export.
By improving the component arrangement structure and setting the thermally conductive insulation part and metal layer, the heat generation source inside the module is reduced and the heat is exported is accelerated, which significantly improves the heat dissipation performance and overall stability of the lidar TOF module.
Smart Images
Figure CN222599838U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of laser radar TOF ranging, and in particular to a laser radar TOF module which is easy to dissipate heat. Background Art
[0002] ToF (Time of flight) ranging method belongs to two-way ranging technology, which mainly uses the flight time of the signal between two asynchronous transceivers (or reflected surfaces) to measure the distance between nodes. Traditional ranging technology is divided into two-way ranging technology and one-way ranging technology. In the case of good modulation of signal level or in non-line-of-sight environment, the estimation result based on RSSI (Received Signal Strength Indication) ranging method is ideal; in line-of-sight environment, ToF distance estimation method can make up for the shortcomings of RSSI distance estimation method.
[0003] In ToF laser radar, the higher the integration, the lower the cost. With the rapid development of consumer products, the integration of functions inside the module will become higher and higher. At the same time, the requirements for product size are getting smaller and smaller, resulting in more and more electronic devices being arranged per unit area on the internal circuit board of the product. This will lead to an increase in the number of electronic components inside the module. The power consumption of the electronic components causes the temperature inside the module to rise sharply. In particular, the introduction of high-power electronic components is the main factor causing the temperature inside the module to rise. Therefore, the existing technology needs to be improved. Utility Model Content
[0004] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a laser radar TOF module that is easy to dissipate heat.
[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0006] The utility model provides a laser radar TOF module that is easy to dissipate heat, including a circuit board, a TOF module is arranged on the front side of the circuit board, a control module is arranged on the back side of the circuit board, the control module is electrically connected to the TOF module, and a heat-conducting insulating part is also arranged on the back side of the circuit board, and the heat-conducting insulating part is coated on the electronic components on the back side of the circuit board.
[0007] Furthermore, the laser radar TOF module that is easy to dissipate heat is provided with a heat-conducting metal layer in the area without electronic components on the back side of the circuit board.
[0008] Furthermore, for the laser radar TOF module that is easy to dissipate heat, the back side of the circuit board is also provided with supporting feet for protecting the electronic components on the back side.
[0009] Furthermore, in the laser radar TOF module that is easy to dissipate heat, the support legs are arranged around the outside of the electronic components on the back of the circuit board, and the thermally conductive insulating part is filled inside the support legs.
[0010] In a preferred embodiment, the laser radar TOF module that is easy to dissipate heat, the TOF module includes a bracket mounted on a circuit board, a transmitting lens and a receiving lens are arranged on the bracket, there is a cavity between the transmitting lens and the circuit board and between the receiving lens and the circuit board, and the circuit board in the cavity is correspondingly provided with a light-emitting element and a SPAD chip.
[0011] Furthermore, in the laser radar TOF module that is easy to dissipate heat, the thermally conductive metal layer is arranged on the circuit board on the back side of the light-emitting element and / or SPAD chip.
[0012] Furthermore, in the laser radar TOF module that is easy to dissipate heat, the thermally conductive metal layer is attached to the back side of the circuit board.
[0013] Furthermore, in the laser radar TOF module that is easy to dissipate heat, the thermally conductive metal layer is sandwiched between the thermally conductive insulating part and the circuit board.
[0014] Specifically, in the laser radar TOF module that is easy to dissipate heat, the control module includes an MCU, or the control module includes an MCU and a driver chip, and the TOF module and the driver chip are electrically connected to the MCU.
[0015] Furthermore, in the laser radar TOF module that is easy to dissipate heat, the thermally conductive insulating part is a thermally conductive potting glue or a thermally conductive silicone sheet.
[0016] Compared with the prior art, the utility model provides a laser radar TOF module that is easy to dissipate heat, including a circuit board, a TOF module is arranged on the front of the circuit board, a control module is arranged on the back of the circuit board, the control module is electrically connected to the TOF module, and a heat-conducting insulating part is also arranged on the back of the circuit board, and the heat-conducting insulating part is coated on the electronic components on the back of the circuit board. The utility model improves the arrangement structure of the components inside the laser radar TOF module, and arranges a heat-conducting insulating part on the back of the circuit board to improve the heat distribution of the module, which not only reduces the heat source inside the module, but also accelerates the heat extraction. The utility model improves the heat dissipation performance of the laser radar TOF module, which is beneficial to the overall stability of the laser radar TOF module. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the structure of the laser radar TOF module that is easy to dissipate heat provided by the utility model.
[0018] Figure 2 A schematic diagram of the front internal device layout of the laser radar TOF module that is easy to dissipate heat provided by the utility model.
[0019] Figure 3 A schematic diagram of the internal device layout on the back of the laser radar TOF module that facilitates heat dissipation provided by the utility model. DETAILED DESCRIPTION
[0020] It should be noted that when a component is referred to as being "mounted on", "fixed on" or "disposed on" another component, it may be directly on the other component or there may be a central component at the same time. When a component is referred to as being "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time.
[0021] It should also be noted that the directional terms such as left, right, up, and down in the embodiments of the present invention are merely relative concepts or are based on the normal use status of the product and should not be considered as restrictive.
[0022] like Figure 1 , Figure 2 and Figure 3 As shown, the utility model provides a laser radar TOF module that is easy to dissipate heat, including a circuit board 10, a TOF module 20 is arranged on the front of the circuit board 10, a control module 30 is arranged on the back of the circuit board 10, and the control module 30 is electrically connected to the TOF module 20. A heat-conducting insulating part 40 is also arranged on the back of the circuit board 10, and the heat-conducting insulating part is coated on the electronic components on the back of the circuit board 10. The utility model improves the arrangement structure of the components inside the laser radar TOF module, and arranges the heat-conducting insulating part 40 on the back of the circuit board 10 to improve the heat distribution of the module, which not only reduces the heat source inside the module, but also accelerates the heat extraction. The utility model improves the heat dissipation performance of the laser radar TOF module, which is beneficial to the overall stability of the laser radar TOF module.
[0023] Preferably, the TOF module of the laser radar provided by the utility model is easy to dissipate heat, and the TOF module 20 includes a bracket 25 mounted on the circuit board 10, and the bracket 25 is provided with a transmitting lens 21 and a receiving lens 22. There is a cavity between the transmitting lens 21 and the circuit board 10 and between the receiving lens 22 and the circuit board 10, and the circuit board 10 in the cavity is provided with a light-emitting element 23 and a SPAD chip 24. It is not easy to dissipate heat inside the cavity, and it is necessary to rely on the back of the circuit board 10 for heat dissipation. The utility model directly moves the main heat-generating device to the back, and applies a heat-conducting insulating part 40 to further reduce the temperature, and can add a force-bearing device to protect the device on the back.
[0024] Specifically, the utility model provides a laser radar TOF module that is easy to dissipate heat, wherein the control module 30 includes an MCU, or the control module 30 includes an MCU and a driver chip, and the TOF module 20 and the driver chip are electrically connected to the MCU. In the utility model, except for the necessary electronic components encapsulated inside the module, other auxiliary electronic components are placed on the back of the module, especially the driver chip (Driver IC), MCU (micro control unit) and other electronic components that generate severe heat.
[0025] Furthermore, the laser radar TOF module provided by the utility model is easy to dissipate heat, and a heat-conducting metal layer 60 is provided in the area without electronic components on the back of the circuit board 10. In order to quickly extract the internal heat. Furthermore, the laser radar TOF module provided by the utility model is easy to dissipate heat, and the back of the circuit board 10 is also provided with a support foot 50 for protecting the electronic components on the back. The support foot 50 is attached to the back of the module and is used for the subsequent assembly of the module and the protection of the electronic components on the back of the module.
[0026] Furthermore, the utility model provides a laser radar TOF module that is easy to dissipate heat, wherein the support foot 50 is arranged around the outside of the electronic components on the back of the circuit board 10, and the thermally conductive insulating part 40 is filled inside the support foot 50. Furthermore, the utility model provides a laser radar TOF module that is easy to dissipate heat, wherein the thermally conductive insulating part 40 is a thermally conductive potting glue or a thermally conductive silicone sheet. The thermally conductive insulating part 40 is filled inside the support foot 50 and on the back of the circuit board 10, so that it evenly covers all electronic components at the bottom of the module and is flush with the supporting end of the support foot 50, which not only increases the stability of the module structure, but also improves the heat dissipation performance of the module. The material process for filling the thermally conductive insulating part 40 on the back of the module can be achieved by dispensing or plastic sealing.
[0027] Furthermore, the utility model provides a laser radar TOF module that is easy to dissipate heat, and the thermally conductive metal layer 60 is arranged on the circuit board 10 on the back side of the light-emitting element 23 and / or the SPAD chip 24. The thermally conductive metal layer 60 can be directly attached to the back of the front SPAD chip 24 area, because the SPAD chip 24 area is very sensitive to heat, and when the temperature rises, the performance of many devices will be affected, and the temperature needs to be reduced as much as possible. Further, the utility model provides a laser radar TOF module that is easy to dissipate heat, and the thermally conductive metal layer is attached to the back of the circuit board 10. Further, the utility model provides a laser radar TOF module that is easy to dissipate heat, and the thermally conductive metal layer 60 where the thermally conductive insulating portion 40 is located is sandwiched between the thermally conductive insulating portion 40 and the circuit board 10. The heat of the module can be mainly dissipated at the back. The utility model accelerates the extraction of heat sources inside the module, which is beneficial to the stability of the performance of the module, helps to reduce the temperature rise inside the module, helps to ensure the normal service life of the module components, and reduces interference with light-emitting components, such as VCSEL and other light-emitting devices that are particularly sensitive to temperature, thereby greatly ensuring the reliability of the product.
[0028] In summary, the utility model improves the arrangement structure of the components inside the laser radar TOF module, and sets a heat-conducting insulating part on the back of the circuit board to improve the heat distribution of the module, which not only reduces the heat source inside the module, but also accelerates the heat extraction. The utility model improves the heat dissipation performance of the laser radar TOF module, which is beneficial to the overall stability of the laser radar TOF module. The utility model directly moves the main heat-generating device to the back, and applies a heat-conducting insulating part to further cool down, and can add a load-bearing device to protect the device on the back. Among them, the heat-conducting insulating part is filled on the inner side of the supporting foot and the back of the circuit board, so that it evenly covers all the electronic devices at the bottom of the module and is level with the supporting end of the supporting foot, which not only increases the stability of the module structure, but also can improve the heat dissipation performance of the module. The heat of the module can be mainly concentrated on the back for heat dissipation. The utility model accelerates the extraction of the internal heat source of the module, which is beneficial to the stability of the performance of the module, and is beneficial to reducing the temperature rise inside the module, which is beneficial to ensuring the normal service life of the module components, and reducing the interference with the light-emitting components, such as VCSEL and other light-emitting devices that are particularly sensitive to temperature, greatly ensuring the reliability of the product.
[0029] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and utility model concept of the utility model, and all these changes or substitutions should fall within the protection scope of the claims attached to the utility model.
Claims
1. A laser radar TOF module that is easy to dissipate heat, including a circuit board, characterized in that: A TOF module is arranged on the front side of the circuit board, a control module is arranged on the back side of the circuit board, the control module is electrically connected to the TOF module, a thermally conductive insulating portion is also arranged on the back side of the circuit board, and the thermally conductive insulating portion is coated on the electronic components on the back side of the circuit board.
2. The laser radar TOF module for heat dissipation according to claim 1, characterized in that: A heat-conducting metal layer is arranged in an area without electronic components on the back side of the circuit board.
3. The laser radar TOF module for heat dissipation according to claim 2, characterized in that: The back of the circuit board is also provided with supporting feet for protecting the electronic components on the back.
4. The laser radar TOF module for heat dissipation according to claim 3 is characterized in that: The supporting feet are arranged around the outer sides of the electronic components on the back of the circuit board, and the heat-conducting insulating part is filled inside the supporting feet.
5. The laser radar TOF module for heat dissipation according to claim 2, characterized in that: The TOF module includes a bracket mounted on a circuit board, on which a transmitting lens and a receiving lens are arranged, and there is a cavity between the transmitting lens and the circuit board and between the receiving lens and the circuit board, and the circuit board in the cavity is correspondingly provided with a light-emitting element and a SPAD chip.
6. The laser radar TOF module for heat dissipation according to claim 5, characterized in that: The heat-conducting metal layer is arranged on a circuit board on the back side of the light-emitting element and / or the SPAD chip.
7. The laser radar TOF module for heat dissipation according to claim 6, characterized in that: The heat-conducting metal layer is attached to the back side of the circuit board.
8. The laser radar TOF module for heat dissipation according to claim 7, characterized in that: The heat-conducting metal layer is sandwiched between the heat-conducting insulating portion and the circuit board.
9. The laser radar TOF module for facilitating heat dissipation according to any one of claims 1 to 8, characterized in that: The control module includes an MCU, or the control module includes an MCU and a driver chip, and the TOF module and the driver chip are electrically connected to the MCU.
10. The laser radar TOF module for heat dissipation according to claim 9, characterized in that: The heat-conducting insulating part is a heat-conducting potting glue or a heat-conducting silicone sheet.