Side view light emitting diode package

Abstract

A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Description

CLAIM OF PRIORITY [0001] This application claims the benefit of Korean Patent Application No. 2005-113834 filed on Nov. 25, 2005, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a high power Light Emitting Diode (LED) package, particularly, in which the height of a sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall. [0004] 2. Description of the Related Art [0005] A Liquid Crystal Display (LCD) does not have a light source of its own, and thus requires an external illumination, which is generally referred to as a backlight unit. The backlight unit illuminates the LCD from the back and uses a Cold Cathode Fluorescent Lamp (CCFL) or an LED as a light source. [0006]FIGS. 1 and 2 show a general backlight unit 1 in use for the LCD. Refer...

AI Technical Summary

Benefits of technology

[0014] The present invention has been made to solve the foregoing problems of the prior art and therefore an aspect of the present invention is to provide a side view LED package in which the height of a sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

[0018] In this case, the height of the wire from the top of the LED chip to the top of the wire can be reduced preferably to 100 μm or less, and more preferably to the order of 70 μm. Thus, the afore-described bonding is advantageous to set the cavity depth in a small value.

Problems solved by technology

This, however, brings in following problems.

Third, the higher sidewall 17 may cause more easily a molding defect such as a void in an upper or lower portion of the sidewall 17.

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