Covered plate-type heat pipe
a plate-type heat pipe and cover technology, applied in indirect heat exchangers, semiconductor/solid-state device details, lighting and heating apparatus, etc., can solve the problems of plate body bending and breaking more easily, and achieve the effect of compact volume, large strength and large strength
Inactive Publication Date: 2010-01-14
CELSIA TECH TAIWAN INC
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
[0007]The present invention is to provide a covered plate-type heat pipe, in which a plate-type sleeve is covered outside the plate-type heat pipe with a vaporized end of the plate-type heat pipe being exposed to the outside, thereby generating a compact plate-type heat pipe having a large strength.
[0008]The present invention is to provide a compact plate-type heat pipe having a large strength, which includes a plate-type heat pipe having a vaporized end and a condensed end and a metallic plate-type sleeve. The plate-type sleeve is tightly covered on the plate-type heat pipe with the vaporized end of the plate-type heat pipe being exposed to the outside, thereby providing a covered plate-type heat pipe that is compact in volume and light in weight with a large heat-dissipating area. In use, the surface of the vaporized end of the plate-type heat pipe is adhered to the surface of a heat-generating electronic element, so that the heat generated by the electronic element can be dissipated quickly via the plate-type heat pipe.
Problems solved by technology
However, when the plate-type heat pipe intends to be made further compact, the plate body of the plate-type heat pipe will be bent and broken more easily especially during the transportation and package.
Therefore, it is an important issue for the Inventor to provide a plate-type heat pipe that still has a large strength even though it is compact in volume and light in weight.
Method used
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[0015]The detailed description and technical contents of the present invention will be explained with reference to the accompanying drawings. However, the drawings are illustrative only, but not used to limit the present invention.
[0016]Please refer to FIGS. 1 to 4. FIG. 1 is an exploded perspective view of the present invention, and FIG. 2 is an assembled view of the present invention. FIG. 3 is a side cross-sectional view of the present invention, and FIG. 4 is a side cross-sectional view of the present invention taken along another viewing angle. The present invention provides a covered plate-type heat pipe 10, which includes a plate-type heat pipe 20 and a plate-like sleeve 30. The plate-type heat pipe 20 has a vaporized end 21 and a condensed end 22. A plate body 201 of the plate-type heat pipe 20 has an injection port through which the working fluid 202 can be injected and a degassing or vacuum process can be perform. The plate body 201 is made of materials with good heat cond...
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Abstract
A compact plate-type heat pipe having a large strength includes a plate-type heat pipe having a vaporized end and a condensed end and a metallic plate-like sleeve. The plate-like sleeve is covered outside the plate-type heat pipe tightly with the vaporized end of the plate-type heat pipe being exposed to the outside. The surface of the vaporized end of the plate-type heat pipe is adhered to the surface of a heat-generating electronic element, so that the heat generated by the heat-generating electronic element can be dissipated quickly.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat pipe, and in particular to a compact plate-type heat pipe.[0003]2. Description of Prior Art[0004]Since the plate-type heat pipe has many advantageous features, such as a large capacity and a high rate of heat conductivity, light in weight, simple in structure and multiple functions, it can be used to transfer a large amount of heat without consuming any electricity. Therefore, the plate-type heat pipe is widely used in the heat conduction of electronic elements. Via the plate-type heat pipe, the heat generated by electronic elements can be dissipated quickly, thereby solving the heat accumulation of electronic elements at present stage.[0005]The working principle of the plate-type heat pipe is described as follows. Via an internal vacuum environment, after being heated, the working fluid filled in the heat pipe generates a phase change thereby to transfer heat. Then, after being c...
Claims
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Patent Timeline
Login to View More IPC IPC(8): F28D15/00
CPCF28D15/0233H01L23/427F28F2225/04Y10T29/49353H01L2924/0002H01L2924/00
Inventor MEYER, IV, GEORGE ANTHONYSUN, CHIEN-HUNGLU, YUNG-TAI
Owner CELSIA TECH TAIWAN INC