Leadframe with lead protruding from the package
a lead frame and package technology, applied in the direction of printed circuits, basic electric elements, electric devices, etc., can solve the problems of lead frame deformation and performance degradation
Inactive Publication Date: 2018-07-05
STMICROELECTRONICS SRL
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- Description
- Claims
- Application Information
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Benefits of technology
The patent text describes a design for a semiconductor device with a protrusion on the die pad. The design includes an anchor on the first end of the die pad that prevents the end of the pad from slipping out of the encapsulant under stress. This design ensures better stability and reliability of the semiconductor device.
Problems solved by technology
The leads in these leadframes may suffer from degraded performance due to poor connections between the embedded leads and external contacts, such as those on a printed circuit board (PCB).
The leads of the leadframe can be formed from copper, which may have insufficient wettability for establishing a low resistance electrical connection between the lead and the PCB.
Method used
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[0016]In the following description, certain specific details are set forth in order to provide a thorough understanding of various embodiments of the disclosure. However, one skilled in the art will understand that the disclosure may be practiced without these specific details. In other instances, well-known structures associated with electronic components and fabrication techniques have not been described in detail to avoid unnecessarily obscuring the descriptions of the embodiments of the present disclosure.
[0017]Unless the context requires otherwise, throughout the specification and claims that follow, the word “comprise” and variations thereof, such as “comprises” and “comprising,” are to be construed in an open, inclusive sense, that is, as “including, but not limited to.”
[0018]Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure or characteristic described in connection with the embodiment is included in at l...
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The present disclosure is directed to a leadframe package having leads with protrusions on an underside of the leadframe. The protrusions come in various shapes and sizes. The protrusions extend from a body of encapsulant around the leadframe to couple to surface contacts on a substrate. The protrusions have a recess that is filled with encapsulant. Additionally, the protrusions may be part of the lead or may be a conductive layer on the lead. In some embodiments a die pad of the leadframe supporting a semiconductor die also has a protrusion on the underside of the leadframe. The protrusion on the die pad has a recess that houses an adhesive and at least part of the semiconductor die. The die pad with a protrusion may include anchor locks at the ends of the die pad to couple to the encapsulant.
Description
BACKGROUNDTechnical Field[0001]The present disclosure is directed to a to a non-planar leadframe design and, in particular, to a leadframe that includes leads with protrusions that extend outside of the package for coupling the leads to a substrate.Description of the Related Art[0002]Semiconductor and leadframe packages often include a semiconductor die and a leadframe that provides an interface between external contacts and the semiconductor die. The semiconductor can include an encapsulant to secure the elements of the package into a single discrete unit. The semiconductor die is typically placed on the leadframe, and the combination is covered with encapsulant in an application chamber. The encapsulant is typically applied at high pressure or temperature, and is then allowed to cool and solidify around the package elements.[0003]No-lead leadframes, such as quad-flat no-lead multiple-row (QFN-MR) leadframes, have integrated leads that are embedded in an encapsulant, with a side of...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/495H01L23/00H01L23/31H01L21/56H01L21/48H05K1/11
CPCH01L23/49555H01L23/4952H01L24/49H01L23/3121H01L2224/48091H01L21/4853H01L23/49503H05K1/111H01L21/563H01L21/561H01L23/488H01L23/49517H01L23/49541H01L21/4842H01L21/565H01L24/29H01L24/32H01L24/48H01L24/73H01L24/83H01L24/85H01L2224/2919H01L2224/32245H01L2224/48247H01L2224/73265H01L2224/83005H01L2224/85005H01L2924/1815H01L2924/351H01L2924/00014H01L2924/00012
InventorRODRIGUEZ, RENNIERNARVADEZ, RAYMOND ALBERTANTILANO, JR., ERNESTO
OwnerSTMICROELECTRONICS SRL