Multistage Magnetic Field Arc Ion Plating Method with Adjustable Transmission Direction

Abstract

The invention relates to a multilevel magnetic field arc ion plating method with adjustable transmission directions and belongs to the technical field of the material surface treatment. According to the multilevel magnetic field arc ion plating method with the adjustable transmission directions, the large particle problem occurring in the arc ion plating process of pure metal with low-melting-point or multi-component alloy materials and non-metallic materials (such as graphite) is solved; the using limitation of target materials with the low-melting-point is broken; the usable range of arc ion plating target materials and the field of thin film preparation are expanded. The multilevel magnetic field arc ion plating method comprises the steps that 1 a workpiece to be coated with a film is placed on a sample stage in a vacuum chamber and related power sources are connected; and 2 thin film deposition is conducted, when the vacuum degree in the vacuum chamber is less than 10-2 Pa, working gases are pumped in and the air pressure is adjusted, a film plating power source, namely, a grid bias power source is started, a multilevel magnetic field straight pipe magnetic filtration device removes the defect of large particles and guarantees the transmission efficiency of arc plasma, and then the magnetic field device with the adjustable transmission directions is used for guaranteeing the arc plasma to reach substrate surfaces of optional positions in the vacuum chamber and sets up needed technological parameters to make the thin film to deposit.

Description

technical field

[0001] The invention relates to a multi-stage magnetic field arc ion plating method with adjustable transmission direction, and belongs to the technical field of material surface treatment. Background technique

[0002] Arc ion plating technology can obtain almost all metal ions including carbon ions. At the same time, it has the advantages of high ionization rate, good diffraction, good film-substrate bonding force, good coating quality, high deposition efficiency and easy operation of equipment. Attention is paid to it, and it is one of the physical vapor deposition preparation technologies widely used in industry at present. It can not only be used to prepare metal protective coatings, but also realize the preparation of high-temperature ceramic coatings such as nitrides and carbides through the adjustment of process methods, and it is also used in the field of functional thin films. Arc ion plating can achieve rapid deposition of films even for parts wit...

Examples

specific Embodiment approach 1

[0014] Specific implementation mode one: the following combination figure 1 and figure 2 Describe this embodiment, the device used in the multistage magnetic field arc ion plating method with adjustable transmission direction in this embodiment includes a bias power supply 1, an arc power supply 2, an arc ion plating target source 3, a multistage magnetic field device 4, and a multistage magnetic field power supply 5. Magnetic field device with adjustable transmission direction 6. Magnetic field power supply with adjustable transmission direction 7. Vacuum chamber 8 and sample stage 9;

[0015] The method includes the following steps:

[0016] Step 1. Place the substrate workpiece to be processed on the sample stage 9 in the vacuum chamber 8, connect the workpiece to the pulse output end of the bias power supply 1, and connect the arc ion plating target source 3 installed on the vacuum chamber 8 to the arc power supply 2 , the multistage magnetic field device 4 is connected...

specific Embodiment approach 2

[0025] Specific embodiment two: the difference between this embodiment and embodiment one is that the method also includes:

[0026] Step 3. Traditional arc ion plating, pulsed cathode arc, multi-stage magnetic field filter device and transmission direction adjustable magnetic field device can be used alone for film deposition in combination with DC bias, pulse bias or DC pulse composite bias to prepare pure metal films , compound ceramic films with different element ratios, functional films and high-quality films with nano-multilayer or gradient structures.

specific Embodiment approach 3

[0027] Embodiment 3: The difference between this embodiment and Embodiment 1 is that Steps 1 to 3 are repeated to prepare multi-layered thin films with different stress states, microstructures and element ratios. Others are the same as Embodiment 1.

technical field

[0001] The invention relates to a multi-stage magnetic field arc ion plating method with adjustable transmission direction, and belongs to the technical field of material surface treatment. Background technique

[0002] Arc ion plating technology can obtain almost all metal ions including carbon ions. At the same time, it has the advantages of high ionization rate, good diffraction, good film-substrate bonding force, good coating quality, high deposition efficiency and easy operation of equipment. Attention is paid to it, and it is one of the physical vapor deposition preparation technologies widely used in industry at present. It can not only be used to prepare metal protective coatings, but also realize the preparation of high-temperature ceramic coatings such as nitrides and carbides through the adjustment of process methods, and it is also used in the field of functional thin films. Arc ion plating can achieve rapid deposition of films even for parts wit...

Examples

specific Embodiment approach 1

[0014] Specific implementation mode one: the following combination figure 1 and figure 2 Describe this embodiment, the device used in the multistage magnetic field arc ion plating method with adjustable transmission direction in this embodiment includes a bias power supply 1, an arc power supply 2, an arc ion plating target source 3, a multistage magnetic field device 4, and a multistage magnetic field power supply 5. Magnetic field device with adjustable transmission direction 6. Magnetic field power supply with adjustable transmission direction 7. Vacuum chamber 8 and sample stage 9;

[0015] The method includes the following steps:

[0016] Step 1. Place the substrate workpiece to be processed on the sample stage 9 in the vacuum chamber 8, connect the workpiece to the pulse output end of the bias power supply 1, and connect the arc ion plating target source 3 installed on the vacuum chamber 8 to the arc power supply 2 , the multistage magnetic field device 4 is connected...

specific Embodiment approach 2

[0025] Specific embodiment two: the difference between this embodiment and embodiment one is that the method also includes:

[0026] Step 3. Traditional arc ion plating, pulsed cathode arc, multi-stage magnetic field filter device and transmission direction adjustable magnetic field device can be used alone for film deposition in combination with DC bias, pulse bias or DC pulse composite bias to prepare pure metal films , compound ceramic films with different element ratios, functional films and high-quality films with nano-multilayer or gradient structures.

specific Embodiment approach 3

[0027] Embodiment 3: The difference between this embodiment and Embodiment 1 is that Steps 1 to 3 are repeated to prepare multi-layered thin films with different stress states, microstructures and element ratios. Others are the same as Embodiment 1.

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