A thermopile sensor with multiple sensing elements

Abstract

The present invention relates to a multi-sensing element thermopile sensor, comprising a base, a sensing unit arranged on the base, and a pipe cap arranged on the base and covering the periphery of the sensing unit; the sensing unit comprises a plurality of sensing chips spaced apart and connected to each other, each sensing chip is provided with a sensing surface in its sensing direction, and the sensing surfaces of the plurality of sensing chips form a sensing area of ​​the sensing unit; the pipe cap is provided with a sensing window corresponding to the sensing direction of the sensing unit. The present invention increases the sensing area of ​​the sensor by arranging a plurality of sensing chips and connecting each sensing chip, thereby effectively enhancing the sensing signal, improving the detection accuracy, and increasing the detection range.

Description

Technical Field

[0001] The present invention relates to the field of thermopile sensors, and more particularly to a multi-sensor thermopile sensor. Background Art

[0002] Traditional thermopile sensors generally only have one sensing chip, which detects changes in ambient temperature through the single sensing chip to achieve the purpose of detection.

[0003] However, since the traditional thermopile sensor only has one sensing chip, its detection accuracy is very low and it can only detect temperature within a very short distance. For long-distance human body detection, the detection signal obtained is very weak. If only a single sensing chip is set, the sensing area of ​​the single sensing chip is very small, which leads to a very small sensing angle of the thermopile sensor. Summary of the invention

[0004] The technical problem to be solved by the present invention is that, in view of the above-mentioned defects of the prior art, a multi-sensing element thermopile sensor is provided, comprising a base, a sensing unit arranged on the base, and a cap arranged on the base and covering the periphery of the sensing unit;

[0005] The sensing unit comprises a plurality of sensing chips which are spaced apart from each other and connected to each other, each of the sensing chips being provided with a sensing surface in its sensing direction, and the sensing surfaces of the plurality of sensing chips forming a sensing area of ​​the sensing unit; the tube cap being provided with a sensing window corresponding to the sensing direction of the sensing unit.

[0006] Preferably, the device further comprises: a focusing unit arranged in the sensing direction of the thermopile sensor and focusing the generated sensing signal in the sensing direction.

[0007] Preferably, the focusing unit comprises a plurality of lenses arranged in an array, each of the lenses is provided with a focusing surface in its focusing direction, and the focusing surfaces of the plurality of lenses in the array form a focusing area of ​​the focusing unit.

[0008] Preferably, the lens is a Fresnel lens.

[0009] Preferably, each sensing chip comprises a hot junction area arranged on the top surface thereof, and a cold junction area arranged on the top surface or the side surface of the sensing chip;

[0010] A surface of the hot junction area facing the sensing direction of the sensing chip forms a sensing surface of the sensing chip.

[0011] Preferably, the sensing unit comprises a substrate, the plurality of sensing chips are arranged on the substrate, and a surface of each sensing chip facing the tube cap is a sensing surface thereof.

[0012] Preferably, the base includes a conductive unit connected to the sensing unit, receiving a power supply signal and outputting an electrical signal generated by the sensing unit.

[0013] Preferably, the sensing unit comprises a first sensing chip, a second sensing chip, a third sensing chip and a fourth sensing chip;

[0014] The conductive unit includes a first pin, a second pin, a third pin and a fourth pin which are separately arranged, the first pin is connected to the first sensing chip to receive a power signal to provide electrical energy to the sensing unit; the second pin is suspended, the third pin is connected to a ground signal, and the fourth pin is connected to the fourth sensing chip to output the electrical signal generated by the sensing unit.

[0015] Preferably, it further comprises: an analog-to-digital converter which is arranged on the substrate and connected to the fourth sensing chip and performs analog-to-digital conversion processing on the electrical signal generated by the sensing unit.

[0016] Preferably, the sensing window is provided with an opening and a filter sealed at the opening;

[0017] The opening corresponds to the sensing area of ​​the sensing unit, and the outer circumference of the filter is larger than the inner circumference of the opening.

[0018] The multi-sensing element thermopile sensor of the present invention has the following beneficial effects: the present invention increases the sensing area of ​​the sensor by arranging multiple sensing chips in one thermopile sensor, thereby effectively enhancing the sensing signal, improving the detection accuracy, and increasing the detection range. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0020] Figure 1 is a schematic plan view of a thermopile sensor with multiple sensing elements provided by an embodiment of the present invention;

[0021] Figure 2 is a schematic diagram of the structure of a thermopile sensor with multiple sensing elements provided by an embodiment of the present invention;

[0022] Figure 3 It is a schematic diagram of the detection range of the multi-sensing element thermopile sensor provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] Figures 1 to 3 , showing a schematic diagram of a preferred embodiment of a multi-sensing element thermopile sensor provided by the present invention.

[0025] like Figure 1 and Figure 2 As shown, the multi-sensing element thermopile sensor includes a base 11, a sensing unit 12 arranged on the base 11, and a cap 13 arranged on the base 11 and covering the periphery of the sensing unit 12; wherein, the sensing unit 12 of the embodiment of the present invention includes a plurality of sensing chips arranged at intervals from each other, and the plurality of sensing chips are electrically connected, each sensing chip is provided with a sensing surface in its sensing direction, and the sensing surfaces of the plurality of sensing chips form the sensing area of ​​the sensing unit 12; the cap 13 is provided with a sensing window 131 corresponding to the sensing direction of the sensing unit 12. It can be understood that the sensing surface of each sensing chip is the sensing range of a single sensing chip, and the sum of the sensing surfaces of the plurality of sensing chips forms the sensing area of ​​the sensing unit 12. For example, assuming that two sensing chips are provided, the sensing area of ​​the thermopile sensor of the embodiment of the present invention is twice the sensing area of ​​the original thermopile sensor; and assuming that three sensing chips are provided, the sensing area of ​​the thermopile sensor of the embodiment of the present invention is three times the sensing area of ​​the original thermopile sensor. Similarly, the more sensing chips are provided in the thermopile sensor, the larger the sensing area of ​​the sensing unit 12 is, thereby effectively increasing the sensing area of ​​the thermopile sensor, increasing the sensitivity and detection accuracy, and increasing the sensing signal, thereby realizing the detection of a human body at a long distance, so as to sense the presence of a human body at a longer distance.

[0026] like Figure 2 As shown, each sensing chip includes a hot junction area arranged on its top surface, and a cold junction area arranged on the top surface or side surface of the sensing chip; wherein, the side of the hot junction area facing the sensing direction of the sensing chip forms the sensing surface of the sensing chip. The hot junction area is used to detect the ambient temperature of the thermopile sensor. When the ambient temperature of the thermopile sensor changes, it absorbs the temperature of the object to be measured (such as the human body), so that there is a temperature difference between the hot junction area and the cold junction area. The temperature difference further causes the two ends of the thermocouple to generate a temperature difference electromotive force, and then outputs a corresponding electrical signal, which is the sensing signal of each sensing chip.

[0027] like Figure 1As shown, the sensing unit 12 of the embodiment of the present invention includes a substrate 121 (the substrate is not shown in the figure), and a plurality of sensing chips are arranged on the substrate 121, and the side of each sensing chip facing the cap 13 is its sensing surface. It can be understood that the substrate 121 can be a whole board, or can be composed of a plurality of separate sub-substrates, wherein when the substrate 121 is a whole board, the plurality of sensing chips are all arranged on the substrate of the whole board; when the substrate 121 is composed of a plurality of separate sub-substrates, each sensing chip is respectively arranged on a corresponding sub-substrate.

[0028] like Figure 2 As shown, the base 11 includes a conductive unit connected to the sensing unit 12, receiving a power supply signal and outputting an electrical signal generated by the sensing unit 12. Figure 1 As shown, as a preferred embodiment, the sensing unit 12 of the embodiment of the present invention can be provided with four sensing chips, namely, a first sensing chip 1211, a second sensing chip 1212, a third sensing chip 1213 and a fourth sensing chip 1214. The conductive unit includes a first pin 111, a second pin 112, a third pin 113 and a fourth pin 114 which are separately provided. The first pin 111 is connected to the first sensing chip 1211 to receive a power signal to provide power to the sensing unit 12; the second pin 112 is suspended, the third pin 113 is connected to a ground signal, and the fourth pin 114 is connected to the fourth sensing chip 1214 to output the electrical signal generated by the sensing unit 12. Specifically, as shown in FIG. Figure 1 As shown, each sensing chip has two conductive positions (respectively recorded as the first conductive position A1 and the second conductive position B1 of the first sensing chip 1211, the first conductive position A2 and the second conductive position B2 of the second sensing chip 1212, the first conductive position A3 and the second conductive position B3 of the third sensing chip 1213, and the first conductive position A4 and the second conductive position B4 of the fourth sensing chip 1214). The first pin 111 is connected to the first conductive position A1 of the first sensing chip 1211 through a wire, the second conductive position B1 of the first sensing chip 1211 is connected to the first conductive position A2 of the second sensing chip 1212 through a wire, the second conductive position B2 of the second sensing chip 1212 is connected to the first conductive position A3 of the third sensing chip 1213 through a wire, the second conductive position B3 of the third sensing chip 1213 is connected to the first conductive position A4 of the fourth sensing chip 1214 through a wire, and the second conductive position B4 of the fourth sensing chip 1214 is connected to the fourth pin 114 through a wire.

[0029] Furthermore, since the electrical signal generated by the sensing unit 12 is an analog signal, when the electrical signal generated by the sensing unit 12 is output to an external circuit or device, the analog signal needs to be converted first. Therefore, the thermopile sensor further includes: an analog-to-digital converter 1215 disposed on the substrate 121 and connected to the fourth sensing chip 1214 to perform analog-to-digital conversion on the electrical signal generated by the sensing unit 12. Specifically, Figure 1 As shown, the second conductive bit B4 of the fourth sensor chip 1214 is connected to the input end of the analog-to-digital converter 1215 through a wire, and the output end of the analog-to-digital converter 1215 is connected to the fourth pin 114 through a wire.

[0030] Optionally, the base 11 of the embodiment of the present invention may be a metal sealing base 11. Further, in the embodiment of the present invention, the base 11 may adopt a TO base, such as TO46, TO5, TO39, etc. The TO base is adopted, and the pins connected to the sensing unit 12, such as the first pin 111, the second pin 112, the third pin 113, and the fourth pin 114 are directly packaged on the TO base, and are an integrated structure with the TO base, thereby increasing the stability and reliability of the thermopile sensor.

[0031] In the embodiment of the present invention, Figure 2 As shown, the sensing window 131 is arranged at the top of the tube cap 13, and the sensing window 131 is provided with an opening 1311 and a filter 1312 sealed at the opening 1311, and the filter 1312 can be arranged on the inner side of the tube cap 13. The outer circumference of the filter 1312 is larger than the inner circumference of the opening 1311. The size of the opening 1311 is based on not less than the sensing area of ​​the sensing unit 12, that is, the inner circumference of the opening 1311 is not less than the outer area of ​​the sensing unit 12.

[0032] Furthermore, the filter 1312 can be fixed on the tube cap 13 by conductive glue, or fixed on the tube cap 13 by interference fit. Of course, it is understandable that the filter 1312 can also be replaced by glass without filtering effect. When the lower glass without filtering effect is adjusted at the opening 1311, glue can generally be applied on the sensing surface of the sensing unit 12 (i.e., the sensing surface of each sensing chip), and the glue is mixed with filtering particles, and the set light is blocked by the filtering particles to achieve the filtering effect. Alternatively, no shielding material may be set at the opening 1311. At this time, glue can be poured into the tube cap 13 to form a sealing layer to cover the sensing unit 12. At the same time, the sealing layer is mixed with filtering particles, and the set light is blocked by the filtering particles to achieve the filtering effect.

[0033] In the embodiment of the present invention, the tube cap 13 can be set to a hollow cylindrical shape, a cube shape, or a rectangular parallelepiped shape. Of course, the tube cap 13 can also be set to a hollow truncated cone shape, in which case the opening 1311 is adjusted to the top surface of the truncated cone. When the tube cap 13 is set to a hollow truncated cone state, the sensing unit 12 can sense more light. Of course, the tube cap 13 can also be designed as other irregular switches, as long as the switch is set outside the sensing unit 12.

[0034] Furthermore, the tube cap 13 can be an opaque metal tube cap 13, which can form a closed packaging structure with the base 11 to encapsulate the sensing unit 12 in the closed space formed by the metal tube cap 13 and the base 11, thereby preventing the sensing unit 12 from being disturbed by light, and preventing the sensing unit 12 from being damaged by foreign objects, and at the same time, the sensitivity of the sensing unit 12 can be improved.

[0035] In the embodiment of the present invention, the pipe cap 13 can be set to a structure or an inclined window structure, which can be determined according to actual product requirements and is not specifically limited in the present invention.

[0036] like Figure 3 As shown, the multi-sensing element thermopile sensor may further include: a focusing unit 14 disposed in the sensing direction of the thermopile sensor and focusing the generated sensing signal in the sensing direction.

[0037] In an embodiment of the present invention, the focusing unit 14 may include a plurality of lenses arranged in an array, each lens having a focusing surface in its focusing direction, and the focusing surfaces of the plurality of array lenses form a focusing area of ​​the focusing unit 14. Optionally, the lens may be a Fresnel lens. In the thermopile sensor with multiple sensing elements of the present invention, since the sensing unit 12 is composed of a plurality of sensing chips, its sensing area is greatly increased, so that an array of lenses can be arranged in the sensing direction of the thermopile sensor (the sensing direction of the thermopile sensor is the sensing direction of the sensing unit 12), effectively increasing the detection range of the thermopile sensor, such as effectively increasing the sensing angle of the thermopile sensor.

[0038] The present invention uses a plurality of sensing chips to form the sensing unit 12 of the thermopile sensor, thereby improving the detection accuracy of the thermopile sensor and increasing the detection distance of the thermopile sensor, so that the thermopile sensor can detect a human body at a long distance (such as 3-5 meters) and detect a stationary human body. Furthermore, the present invention effectively increases the sensing angle of the thermopile sensor by arranging an array lens in the sensing direction of the thermopile sensor.

[0039] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot limit the scope of protection of the present invention. All equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

[0040] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. A multi-sensor thermopile sensor, characterized in that: It includes a base, a sensing unit arranged on the base, and a pipe cap arranged on the base and covering the periphery of the sensing unit; The sensing unit comprises a plurality of sensing chips which are spaced apart from each other and electrically connected, each of the sensing chips is provided with a sensing surface in its sensing direction, and the sensing surfaces of the plurality of sensing chips form a sensing area of ​​the sensing unit; the tube cap is provided with a sensing window corresponding to the sensing direction of the sensing unit; The base includes a conductive unit connected to the sensing unit, receiving a power supply signal and outputting an electrical signal generated by the sensing unit; the conductive unit includes a first pin, a second pin, a third pin and a fourth pin which are separately arranged; Each of the sensing chips has two conductive positions, and a plurality of the sensing chips are sequentially connected in series between the conductive units through the conductive positions, so that the sensing units receive electrical energy and output electrical signals; Specifically, the first pin is connected to the first sensing chip in series to receive a power signal to provide electrical energy to the sensing unit; the second pin is left floating; the third pin is connected to a ground signal; and the fourth pin is connected to the last sensing chip in series to output the electrical signal generated by the sensing unit.

2. The multi-sensor thermopile sensor according to claim 1, characterized in that: Also includes: A focusing unit is arranged in the sensing direction of the thermopile sensor and focuses the generated sensing signal in the sensing direction.

3. The multi-sensor thermopile sensor according to claim 2, characterized in that: The focusing unit includes a plurality of lenses arranged in an array, each of the lenses is provided with a focusing surface in its focusing direction, and the focusing surfaces of the plurality of lenses arranged in an array form a focusing area of ​​the focusing unit.

4. The multi-sensor thermopile sensor according to claim 3, characterized in that: The lens is a Fresnel lens.

5. The multi-sensor thermopile sensor according to claim 1, characterized in that: Each sensing chip includes a hot junction area arranged on the top surface thereof, and a cold junction area arranged on the top surface or the side surface of the sensing chip; A surface of the hot junction area facing the sensing direction of the sensing chip forms a sensing surface of the sensing chip.

6. The multi-sensor thermopile sensor according to claim 1, characterized in that: The sensing unit comprises a substrate, the plurality of sensing chips are arranged on the substrate, and a surface of each sensing chip facing the tube cap is a sensing surface thereof.

7. The multi-sensor thermopile sensor according to claim 1, characterized in that: The sensing unit includes a first sensing chip, a second sensing chip, a third sensing chip and a fourth sensing chip; The first pin is connected to the first sensing chip to receive a power signal to provide electrical energy to the sensing unit; the second pin is suspended, the third pin is connected to a ground signal, and the fourth pin is connected to the fourth sensing chip to output the electrical signal generated by the sensing unit.

8. The multi-sensor thermopile sensor according to claim 1, characterized in that: The sensing window is provided with an opening and a filter sealed at the opening; The opening corresponds to the sensing area of ​​the sensing unit, and the outer circumference of the filter is larger than the inner circumference of the opening.

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