Radiating unit and radiating device thereof

Abstract

The present invention provides a heat dissipation unit and a heat dissipation device thereof, comprising a base and a heat dissipation unit, the base having a first side and a second side, the heat dissipation unit having at least one heat dissipation fin correspondingly arranged on the first side, the heat dissipation fin being composed of a first plate body and a second plate body correspondingly covered together, and the first plate body and the second plate body jointly defining a plurality of independent flow channels, the plurality of independent flow channels being interconnected, and the plurality of independent flow channels being filled with a working fluid.

Description

Technical Field

[0001] The present invention relates to a heat dissipation unit and a heat dissipation device thereof, and in particular to a heat dissipation unit and a heat dissipation device thereof which can greatly increase heat dissipation efficiency. Background Art

[0002] As computing performance increases in current mobile devices, personal computers, servers, communication chassis, and other systems or devices, the heat generated by their internal computing units also increases. Therefore, a corresponding increase in the need for cooling units to assist in dissipating heat is required. Most businesses use cooling components such as radiators, heat pipes, and vapor chambers in conjunction with fans for auxiliary heat dissipation. When large areas need to be cooled, cooling devices (radiators) and cooling fans are used for forced cooling.

[0003] Generally, common heat sinks in the industry consist of a base plate and a plurality of heat sink fins disposed on one side of the base plate. As the computing performance of the aforementioned devices increases, the amount of heat generated within each device also gradually increases. Therefore, the size and height of the heat sink fins on the base plate must also be increased to provide a larger heat dissipation area to dissipate heat within each device. However, the heat dissipation efficiency of the heat sink fins gradually decreases as their height increases, resulting in a decrease in the overall heat dissipation efficiency of the heat sink.

[0004] As described above, the existing method has the following disadvantages:

[0005] 1. The heat dissipation efficiency is extremely poor;

[0006] 2. The heat sink is too large.

[0007] Therefore, how to solve the above-mentioned existing problems and deficiencies is the direction that the inventors of this case and related manufacturers engaged in this industry are eager to study and improve. Summary of the Invention

[0008] Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation unit that greatly improves the heat dissipation efficiency.

[0009] A secondary object of the present invention is to provide a heat dissipation unit that can significantly reduce the volume of the heat dissipation device.

[0010] A secondary purpose of the present invention is to provide a heat dissipation device that greatly increases heat dissipation efficiency.

[0011] A secondary object of the present invention is to provide a heat dissipation device that can significantly reduce the volume of the heat dissipation device.

[0012] To achieve the above object, the present invention provides:

[0013] A heat dissipation unit has at least one heat dissipation fin, characterized in that the heat dissipation fin is composed of a first plate and a second plate that are covered with each other, and the first plate and the second plate jointly define a plurality of independent flow channels, the plurality of independent flow channels are interconnected, and the plurality of independent flow channels are filled with a working fluid.

[0014] The heat dissipation unit, wherein: the heat dissipation fins also have at least one groove, which is formed on either the first plate or the second plate, and the first plate and the second plate are correspondingly covered so that the groove constitutes the independent flow channel.

[0015] The heat dissipation unit, wherein: the heat dissipation fins also have a plurality of grooves, and the grooves also have at least one first groove portion and at least one second groove portion, the first groove portion is formed on the first plate body, and the second groove portion is formed on the second plate body, and the first plate body and the second plate body cover each other so that the first groove portion and the second groove portion constitute the independent flow channel.

[0016] The heat dissipation unit, wherein: the groove is formed by mechanical processing, and the mechanical processing is stamping.

[0017] The heat dissipation unit, wherein: the grooves are formed on the first plate and the second plate in a staggered arrangement of length, or the grooves are formed on the first plate and the second plate in a straight or oblique manner side by side.

[0018] The heat dissipation unit, wherein: the inner wall of the independent flow channel is further provided with at least one capillary structure, and the capillary structure is any one of a grid body, a fiber body, a porous structure, or a groove.

[0019] The heat dissipation unit further comprises a coating, which is correspondingly arranged on either the inner wall of the independent flow channel or the capillary structure, or the inner wall of the independent flow channel and the capillary structure are arranged simultaneously.

[0020] The heat dissipation unit, wherein: the heat dissipation fins also form a plurality of ribs, the plurality of ribs are arranged in a transverse or longitudinal direction or in a staggered manner, and the plurality of ribs are used to increase the structural strength of the heat dissipation fins.

[0021] A heat dissipation device, comprising:

[0022] a base having a first side and a second side; and

[0023] A heat dissipation unit having at least one heat dissipation fin correspondingly arranged on the first side, wherein the heat dissipation fin is composed of a first plate body and a second plate body correspondingly covering each other, and the first plate body and the second plate body jointly define a plurality of independent flow channels, wherein the plurality of independent flow channels are interconnected and filled with a working fluid.

[0024] The heat dissipation device, wherein: the heat dissipation fin further has at least one groove, which is formed on either the first plate or the second plate, and the first plate and the second plate are correspondingly covered so that the groove constitutes the independent flow channel.

[0025] The heat dissipation device, wherein: the heat dissipation fins also have a plurality of grooves, and the grooves also have a first groove portion and a second groove portion, the first groove portion is formed on the first plate body, and the second groove portion is formed on the second plate body, and the first plate body and the second plate body cover each other so that the first groove portion and the second groove portion constitute the independent flow channel.

[0026] The heat dissipation device, wherein: the groove is formed by mechanical processing, and the mechanical processing is stamping.

[0027] The heat dissipation device, wherein: the grooves are formed on the first plate and the second plate in a staggered arrangement of length, or the grooves are formed on the first plate and the second plate in a straight or oblique manner side by side.

[0028] The heat dissipation device, wherein: the inner wall of the independent flow channel is further provided with at least one capillary structure, and the capillary structure is any one of a grid body, a fiber body, a porous structure, or a groove.

[0029] The heat dissipation device further comprises a coating, which is correspondingly arranged on the inner wall of the independent flow channel or the capillary structure, or the inner wall of the independent flow channel and the capillary structure are arranged at the same time.

[0030] The heat dissipation device, wherein: the heat dissipation fins also form a plurality of ribs, the plurality of ribs are arranged in a transverse or longitudinal direction or in a staggered manner, and the plurality of ribs are used to increase the structural strength of the heat dissipation fins.

[0031] The heat dissipation device, wherein: the first side of the base forms at least one embedding groove, and the heat dissipation fins are fixed in the embedding groove accordingly.

[0032] The heat dissipation device, wherein: the heat dissipation unit is fixed in the embedding groove by any of embedding, riveting, welding, gluing or snapping.

[0033] Through the design of this structure of the present invention, with the structural design of independent flow channels connected to each other arranged in the heat dissipation fins, when the second side of the base contacts a heat source, the heat generated by the heat source will be transferred from the second side of the base to the first side and then to the heat dissipation fins, and then the heat will be transferred to the independent flow channels, so that the working fluid in the independent flow channels connected to each other forms a gas, and the gaseous working fluid will quickly bring the heat to the other end away from the heat source, and after the gaseous working fluid gathers and condenses into a liquid working fluid, the liquid working fluid is returned to the heat dissipation fins close to one end of the heat source by means of at least one capillary structure arranged on the inner wall of the independent flow channel, so that a heat dissipation fin with continuous circulation of gas and liquid phases is formed, thereby achieving the effect of rapid heat dissipation and greatly improving the heat dissipation efficiency of the heat dissipation device.

[0034] In addition, the independent flow channel structure design that is interconnected within the heat sink fins can improve the problem of extremely poor heat dissipation efficiency caused by the excessively large heat sink fins of existing heat sinks. The present invention utilizes a structural design of independent flow channels with gas-liquid two-phase circulation, so that the heat sink is small in size without affecting its heat dissipation efficiency and is even better than existing heat sinks. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a perspective exploded view of a first embodiment of a heat dissipation unit of the present invention;

[0036] Figure 2 is a cross-sectional view of a first embodiment of a heat dissipation unit of the present invention;

[0037] Figure 3 is a perspective exploded view of a second embodiment of a heat dissipation unit of the present invention;

[0038] Figure 4 is a three-dimensional assembly diagram of a second embodiment of a heat dissipation unit of the present invention;

[0039] Figure 5 is a cross-sectional view of a second embodiment of a heat dissipation unit of the present invention;

[0040] Figure 6 is a perspective view of a third embodiment of a heat dissipation unit of the present invention;

[0041] Figure 7 is a three-dimensional combined diagram of the first and second embodiments of the heat dissipation device of the present invention;

[0042] Figure 8 FIG. 4 is a cross-sectional view of a second embodiment of a heat dissipation device according to the present invention.

[0043] Explanation of the reference numerals: heat dissipation unit 2; heat dissipation fins 20; first plate 201; second plate 202; independent flow channel 21; groove 210; first groove portion 211; second groove portion 212; working fluid 22; capillary structure 23; filling port 24; rib 25; base 3; first side 30; embedding groove 300; second side 31; heat dissipation device 4; heat source 5. DETAILED DESCRIPTION

[0044] The above-mentioned objectives and structural and functional characteristics of the present invention will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0045] See also Figure 1 、 Figure 2 , is a perspective exploded view and a cross-sectional view of the first embodiment of the heat dissipation unit of the present invention. As shown in the figure, a heat dissipation unit 2 has at least one heat dissipation fin 20. The heat dissipation fin 20 is composed of a first plate 201 and a second plate 202 correspondingly covered. In this embodiment, at least one groove 210 is formed on the first plate 201 (of course, the groove 210 can also be formed on the second plate 202. In this embodiment, the first plate 201 is used for illustration). In more detail, the first plate 20 of the heat dissipation fin 20 in this embodiment 01 has a groove 210 structure, and the second plate 202 is a flat plate (without the groove 210 structure); the first plate 201 and the second plate 202 are covered with each other so that the groove 210 of the first plate 201 and the second plate 202 form a plurality of independent flow channels 21, and the plurality of independent flow channels 21 are interconnected, and a working fluid 22 is filled in the plurality of independent flow channels 21 for gas-liquid circulation. In addition, the inner wall of each independent flow channel 21 can also be provided with at least one capillary structure 23 (see Figure 1 、 Figure 2 ) or coating, the capillary structure 23 can be selected as a grid body or a fiber body or a porous structure or groove, the purpose of which is to increase the efficiency of the gas-liquid circulation of the working fluid 22 in the independent flow channel 21.

[0046] The coating film may be disposed on the inner wall of the independent flow channel 21 or the capillary structure 23 , or both.

[0047] See also Figure 3 、 Figure 4 、 Figure 5, are three-dimensional and cross-sectional views of a second embodiment of the heat dissipation unit of the present invention. The difference between the second embodiment and the first embodiment is that at least one first groove portion 211 is formed on the first plate 201 of the heat dissipation fin 20, and at least one second groove portion 212 is formed on the second plate 202. That is, the first plate 201 and the second plate 202 are both formed with grooves. The first plate 201 and the second plate 202 are overlapped with each other so that the first groove portion 211 and the second groove portion 212 constitute the independent flow channel 21, and the independent flow channel 21 is also filled with the working fluid 22.

[0048] The manufacturing process of the aforementioned heat sink 20 is roughly as follows: First, one of the first plate body, the second plate body 201, and the second plate body 202 is mechanically processed to form the aforementioned groove 210, or the first plate body, the second plate body 201, and the second plate body 202 are mechanically processed to form the aforementioned first groove portion, the second groove portion 211, and the second groove portion 212, and the mechanical processing uses a stamping process to form the aforementioned groove 210 or the first groove portion, the second groove portion 211, and the second groove portion 212. Then, the first plate body and the second plate body 201 and the second plate body 202 are welded or other combined methods to cover and fix them accordingly, so that the groove 210 formed on the first plate body 201 or the second plate body 202 (or the first groove portion 211 formed on the first plate body 201 and the second groove portion 212 formed on the second plate body 202) constitute the aforementioned independent flow channel 21 structure, and then the independent flow channel 21 is vacuumed and simultaneously a filling port 24 of the heat sink 20 (such as Figure 4 As shown in the figure, the working fluid 22 (which can be any one of ammonia, refrigerant, water, hydrocarbon or other compounds) is filled in and the periphery of the plurality of grooves 210 and the filling port 24 are sealed to form the heat dissipation fin 20 structure of the present invention.

[0049] In addition, it should be noted that the shape, size, arrangement and arrangement direction of the aforementioned grooves 210 (or the first groove portion, the second groove portion 211, 212) are not particularly limited. For example, the grooves 210 can be formed on the first plate body and the second plate body 201, 202 in a staggered arrangement of different lengths, or the arrangement direction of the grooves 210 can be straight side by side or oblique side by side (such as Figure 4As shown in the figure, the groove 210 (or the first groove portion, the second groove portion 211, 212) is formed on the first plate body and the second plate body 201, 202, which can be adjusted according to the needs of the user; as long as the groove 210 (or the first groove portion, the second groove portion 211, 212) is formed by the mutual covering of the first plate body and the second plate body 201, 202 to form the aforementioned independent flow channel 21 structure, it is included in the scope of the present invention and will be described first; in addition, the inner wall of the independent flow channel 21 and the capillary structure or between the two can be further provided with the aforementioned coating (not shown) to increase the efficiency of the gas-liquid circulation of the working fluid 22 in the independent flow channel 21.

[0050] See also Figure 6 , is a three-dimensional diagram of a third embodiment of the heat dissipation unit of the present invention. The difference from the first embodiment is that the heat dissipation fins 20 further form a plurality of ribs 25. The plurality of ribs 25 are not limited in number and arrangement direction (they can be arranged in a horizontal or vertical direction or staggered), and can be adjusted according to user needs. The function of the rib 25 structure is to increase the structural strength of the heat dissipation fins 20, so that the heat dissipation fins 20 are not easily deformed.

[0051] Please also refer to Figure 7 , is a three-dimensional combination diagram of the first and second embodiments of the heat dissipation device of the present invention. The heat dissipation device 4 is composed of the above-mentioned heat dissipation unit 2 and a base 3. The base 3 has a first side 30 and a second side 31, and the first side 30 forms at least one embedding groove 300. The heat dissipation fins 20 are fixed in the embedding groove 300 accordingly. The heat dissipation fins 20 can be fixed in the embedding groove 300 by any of embedding, riveting, welding, gluing or clamping.

[0052] Please also refer to Figure 8 , through the design of this structure of the present invention, with the structural design of the independent flow channels 21 interconnected with each other provided in the heat dissipation fins 20, when the second side 31 of the base 3 contacts a heat source 5, the heat generated by the heat source 5 will be transferred from the second side 31 of the base 3 to the first side 30 and then to the heat dissipation fins 20, and then the heat will be transferred to the independent flow channel 21, so that the working fluid 22 in the independent flow channel 21 will become gaseous, and the gaseous working fluid 22 will quickly bring the heat to the other end away from the heat source 5, and after the gaseous working fluid 22 gathers and condenses into liquid working fluid 22, the capillary structure 23 provided on the inner wall of the independent flow channel 21 is used to return the liquid working fluid 22 to the heat dissipation fins 20 near one end of the heat source 5, so that a heat dissipation fin 20 with continuous circulation of gas-liquid two-phases is formed, thereby achieving the effect of rapid heat dissipation, and greatly improving the heat dissipation efficiency of the heat dissipation device 4.

[0053] In addition, the structural design of the independent flow channel 21 within the heat dissipation fin 20 of the present invention can also improve the problem of extremely poor heat dissipation efficiency caused by the excessive size of the heat dissipation fin 20 of the existing heat dissipation device 4. The present invention utilizes the structural design of the independent flow channel 21 with gas-liquid two-phases, so that the heat dissipation efficiency of the heat dissipation device 4 is small without affecting it, and it is even better than the existing heat dissipation device.

[0054] As described above, the present invention has the following advantages compared to the existing ones:

[0055] 1. Greatly improve heat dissipation efficiency;

[0056] 2. Significantly reduce the size of the heat dissipation device.

[0057] The above description is only illustrative of the present invention and not restrictive. Those skilled in the art will understand that many modifications, changes or equivalents may be made without departing from the spirit and scope defined by the claims, and all of them will fall within the scope of protection of the present invention.

Claims

1. A heat dissipation unit having at least one heat dissipation fin, characterized in that: The heat sink fin is composed of a first plate body and a second plate body which are covered with each other, and the first plate body and the second plate body jointly define a plurality of independent flow channels which are arranged in a staggered manner in length, and each independent flow channel has an end close to a heat source and an end far from the heat source, the plurality of independent flow channels are interconnected, and a working fluid is filled in the plurality of independent flow channels and is located at the end close to the heat source, and the ends close to the heat source and far from the heat source of adjacent independent flow channels are arranged at different heights.

2. The heat dissipation unit according to claim 1, characterized in that: The heat dissipation fin further has at least one groove, which is formed on either the first plate or the second plate. The first plate and the second plate are correspondingly covered so that the groove constitutes the independent flow channel.

3. The heat dissipation unit according to claim 1, characterized in that: The heat sink fin also has a plurality of grooves, and the grooves also have at least one first groove portion and at least one second groove portion. The first groove portion is formed on the first plate body, and the second groove portion is formed on the second plate body. The first plate body and the second plate body are overlapped so that the first groove portion and the second groove portion constitute the independent flow channel.

4. The heat dissipation unit according to claim 2 or 3, characterized in that: The groove is formed by mechanical processing, and the mechanical processing is a stamping process.

5. The heat dissipation unit according to claim 2 or 3, characterized in that: The grooves are formed on the first plate body and the second plate body in a straight or oblique manner.

6. The heat dissipation unit according to claim 1, characterized in that: The inner wall of the independent flow channel is also provided with at least one capillary structure, and the capillary structure is any one of a grid body, a fiber body, a porous structure, or a groove.

7. The heat dissipation unit according to claim 6, characterized in that: The invention also has a coating film, which is correspondingly arranged on the inner wall of the independent flow channel or the capillary structure, or the inner wall of the independent flow channel and the capillary structure are arranged at the same time.

8. The heat dissipation unit according to claim 1, characterized in that: The heat dissipation fins also form a plurality of ribs, which are arranged in a transverse or longitudinal direction or in a staggered manner, and are used to increase the structural strength of the heat dissipation fins.

9. A heat dissipation device, characterized in that: include: a base having a first side and a second side; and A heat dissipation unit having at least one heat dissipation fin correspondingly arranged on the first side, the heat dissipation fin being composed of a first plate body and a second plate body correspondingly covered, and the first plate body and the second plate body jointly define a plurality of independent flow channels arranged in a staggered arrangement of lengths, and each independent flow channel has an end close to a heat source and an end far from the heat source, the plurality of independent flow channels are interconnected, a working fluid is filled in the plurality of independent flow channels and is located at the end close to the heat source, and the ends close to the heat source and far from the heat source of adjacent independent flow channels are arranged at different heights.

10. The heat dissipation device according to claim 9, characterized in that: The heat dissipation fin further has at least one groove, which is formed on either the first plate or the second plate. The first plate and the second plate are correspondingly covered so that the groove constitutes the independent flow channel.

11. The heat dissipation device according to claim 9, characterized in that: The heat sink fin also has a plurality of grooves, and the grooves also have a first groove portion and a second groove portion. The first groove portion is formed on the first plate body, and the second groove portion is formed on the second plate body. The first plate body and the second plate body are overlapped so that the first groove portion and the second groove portion constitute the independent flow channel.

12. The heat dissipation device according to claim 10 or 11, characterized in that: The groove is formed by mechanical processing, and the mechanical processing is a stamping process.

13. The heat dissipation device according to claim 10 or 11, characterized in that: The grooves are formed on the first plate body and the second plate body in a straight or oblique manner.

14. The heat dissipation device according to claim 9, characterized in that: The inner wall of the independent flow channel is also provided with at least one capillary structure, and the capillary structure is any one of a grid body, a fiber body, a porous structure, or a groove.

15. The heat dissipation device according to claim 14, characterized in that: The invention also has a coating film, which is correspondingly arranged on the inner wall of the independent flow channel or the capillary structure, or the inner wall of the independent flow channel and the capillary structure are arranged at the same time.

16. The heat dissipation device according to claim 9, characterized in that: The heat dissipation fins also form a plurality of ribs, which are arranged in a transverse or longitudinal direction or in a staggered manner, and are used to increase the structural strength of the heat dissipation fins.

17. The heat dissipation device according to claim 9, characterized in that: At least one embedding groove is formed on the first side of the base, and the heat dissipation fin is fixedly disposed in the embedding groove accordingly.

18. The heat dissipation device according to claim 17, characterized in that: The heat dissipation unit is fixed in the embedding groove by any of embedding, riveting, welding, gluing or snapping.

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