Dust-proof structure, microphone packaging structure, and electronic device

Abstract

The present invention discloses a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure includes a carrier and a mesh portion; the carrier is a hollow structure; the mesh portion includes a filter and a fixing portion arranged around the filter; the filter includes a central hole, and a multi-row mesh structure extending outwardly from the central hole and concentrically arranged along the circumference of the central hole; the mesh portion is arranged at one end of the carrier and covers the hollow structure, the filter is opposite to the hollow structure, and the fixing portion is connected to the carrier. One technical effect of the present invention is that the filter on the mesh portion can maintain a flat state, and the mesh portion can effectively block external particles and foreign matter from entering the interior of the microphone packaging structure.

Description

Technical Field

[0001] The present invention relates to the technical field of electro-acoustic conversion, and more specifically, to a dustproof structure, a microphone packaging structure and an electronic device. Background Art

[0002] With the rapid development of electroacoustic technology, various electroacoustic products emerge in an endless stream. Microphone, as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products. Nowadays, microphones have been widely used in many different types of electronic products such as mobile phones, tablets, laptops, VR devices, AR devices, smart watches, and smart wearables. In recent years, for microphone packaging structures, the design of their structures has become the focus and hotspot of research for technicians in this field.

[0003] The existing microphone packaging structure usually includes: a housing with a housing cavity, in which chip components (such as MEMS chips and ASIC chips) are fixed; and a sound pickup hole is also provided on the housing. However, in long-term applications, it is found that dust, impurities and other particles and foreign objects are easily introduced into the microphone's housing cavity through the sound pickup hole, and these particles and foreign objects will cause certain damage to the chip components and other components in the housing cavity, and ultimately affect the acoustic performance and service life of the microphone.

[0004] In response to the above-mentioned problems, the currently adopted solution is usually to set an isolation component on the sound pickup hole of the microphone packaging structure to block the entry of external particles, foreign objects, etc. The existing isolation component includes a carrier and an isolation net. When the isolation component is used, it is installed on the sound pickup hole. However, since the carrier of the existing isolation component is usually an organic non-metallic material and the isolation net is made of metal, when the two are combined together by hot pressing, after cooling, due to the different thermal expansion coefficients of the two materials, especially the metal carrier is prone to shrinkage, which will cause wrinkles on the isolation net fixed thereon. This will not only cause a decrease in the production yield of the product, but may also affect the airflow at the isolation net. Summary of the invention

[0005] An object of the present invention is to provide a new technical solution for a dustproof structure, a microphone packaging structure and an electronic device.

[0006] According to a first aspect of the present invention, there is provided a dustproof structure, comprising a carrier and a mesh portion;

[0007] The carrier is a hollow structure;

[0008] The mesh portion includes a filter screen and a fixing portion arranged around the filter screen; wherein the filter screen includes a central hole and a plurality of rows of mesh structures extending outward from the central hole and arranged concentrically along the circumference of the central hole;

[0009] The mesh portion is arranged at one end of the carrier and covers the hollow structure, the filter mesh is opposite to the hollow structure, and the fixing portion is connected to the carrier.

[0010] Optionally, on the filter net, the interval S between any two adjacent rows of the mesh structures is the same, and the interval S is 0.5-2 μm.

[0011] Optionally, on the filter net, each column of the mesh structure includes a plurality of meshes, and a size T of each mesh along the radial direction is 1-10 μm.

[0012] Optionally, on the filter net, the ratio of the area occupied by the meshes and the central holes on the multi-row mesh structure to the total area of ​​the filter net is defined as the opening rate of the filter net;

[0013] Wherein, the opening rate of the filter screen is 50%-90%.

[0014] Optionally, on the grid portion, the side of the filter mesh adjacent to the center hole is defined as the inner side of the filter mesh, and the side away from the center hole is defined as the outer side of the filter mesh, and the mesh length on the multi-row mesh structure gradually increases from the inner side to the outer side of the filter mesh.

[0015] Optionally, on the filter net, the portion between the multiple columns of grid structures forms a first spacer, and the first spacer is radially arranged at a predetermined radiation angle θ relative to the central hole;

[0016] Wherein, the predetermined radiation angle θ is 1°-20°.

[0017] Optionally, on the filter net, the mesh lengths of the multiple rows of mesh structures are the same.

[0018] Optionally, on the filter net, the portion between any two adjacent columns of the grid structures forms a second spacing portion, and any two adjacent second spacing portions are staggered with each other.

[0019] Optionally, the mesh is arc-shaped, and the size T of the mesh along the radial direction is T, and T is 1-10 μm;

[0020] The arc length of the mesh is L an ;

[0021] Then L an The relationship between L and T is: an / T=1-4.

[0022] Optionally, the filter mesh is circular, and the diameter of the filter mesh is 500-1100 μm.

[0023] Optionally, the filter has a thickness of 2-1500 nm.

[0024] According to a second aspect of the present invention, there is provided a microphone packaging structure, wherein the microphone packaging structure comprises a housing having a receiving cavity, wherein a sound pickup hole is provided on the housing, and wherein the sound pickup hole is used to connect the inside and the outside of the housing;

[0025] Also included is a microphone device, which is fixedly disposed in the accommodating cavity;

[0026] It also includes a dustproof structure as described in any one of the above items, and the dustproof structure is arranged on the sound pickup hole.

[0027] Optionally, the dustproof structure is located outside the housing.

[0028] Optionally, the housing comprises a substrate and a packaging cover, and the substrate and the packaging cover enclose the accommodating cavity;

[0029] The dustproof structure is accommodated in the accommodating cavity;

[0030] The microphone device includes a MEMS chip and a signal amplifier.

[0031] Optionally, the sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the packaging cover.

[0032] Optionally, the sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate to cover the MEMS chip.

[0033] Optionally, the sound pickup hole is located on the substrate, and the dustproof structure is fixedly arranged at a position corresponding to the sound pickup hole on the substrate.

[0034] Optionally, the sound pickup hole is located on the substrate, the dustproof structure is fixedly arranged at a position on the substrate corresponding to the sound pickup hole, and the MEMS chip is arranged on the dustproof structure.

[0035] According to a third aspect of the present invention, an electronic device is provided, wherein the electronic device comprises a microphone packaging structure as described in any one of the above.

[0036] The dustproof structure provided in the embodiment of the present invention improves the structure of the filter screen on the mesh part, and designs a special mesh structure on the filter screen. The opening design on the mesh structure can absorb radial stress, and when the mesh part is fixed on the carrier, the filter screen can remain flat.

[0037] The dustproof structure provided by the present invention can protect the pickup hole of the microphone packaging structure, and the mesh part can block external particles and foreign objects from entering the interior of the microphone packaging structure, thereby protecting the components inside the microphone to avoid affecting the acoustic performance and service life of the microphone. The technical tasks to be achieved or the technical problems to be solved by the present invention are never thought of or anticipated by those skilled in the art, so the present invention is a new technical solution.

[0038] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0040] Figure 1 is a side view of a dustproof structure provided according to an embodiment of the present invention.

[0041] Figure 2 It is a schematic diagram of the structure of a filter screen provided according to an embodiment of the present invention.

[0042] Figure 3 It is a schematic diagram of the structure of a filter screen provided according to another embodiment of the present invention.

[0043] Figure 4 is a structural schematic diagram of a microphone packaging structure provided according to a first embodiment of the present invention.

[0044] Figure 5 is a schematic structural diagram of a microphone packaging structure provided according to a second embodiment of the present invention.

[0045] Figure 6 is a structural schematic diagram of a microphone packaging structure provided according to a third embodiment of the present invention.

[0046] Figure 7 4 is a schematic diagram of the structure of a microphone packaging structure provided according to the fourth embodiment of the present invention.

[0047] Figure 8 is a schematic structural diagram of a microphone packaging structure provided according to a fifth embodiment of the present invention.

[0048] Description of reference numerals:

[0049] 1-carrier, 11-hollow structure, 2-grid part, 21-filter net, 211-center hole, 212-mesh, 213-first spacer, 214-second spacer, 22-fixing part, 3-housing, 31-packaging cover, 32-substrate, 4-pickup hole, 5-MEMS chip, 6-signal amplifier. DETAILED DESCRIPTION

[0050] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0051] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0052] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0053] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0054] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0055] According to an embodiment of the present invention, a dustproof structure is provided. The dustproof structure can be applied to, for example, a microphone packaging structure. The dustproof structure can prevent external particles, foreign matter, etc. from entering the interior of the microphone packaging structure through the sound pickup hole on the microphone packaging structure, thereby protecting the components inside the microphone to avoid affecting the acoustic performance and service life of the microphone.

[0056] The specific structure of the dustproof structure provided by the embodiment of the present invention is further described below. The dustproof structure provided by the embodiment of the present invention is as follows: Figure 1 As shown, it includes a carrier 1 and a mesh portion 2. The carrier 1 is a hollow structure. The mesh portion 2 includes a filter 21 and a fixing portion 22 arranged around the filter 21. Figure 2 and Figure 3As shown, the filter screen 21 includes a central hole 211, and a plurality of mesh structures extending outward from the central hole 211 and arranged concentrically along the circumference of the central hole 211. The mesh portion 2 is arranged at one end of the carrier 1 and covers the hollow structure 11, the filter screen 21 is opposite to the hollow structure 11, and the fixing portion 22 is connected to the carrier 1.

[0057] The dustproof structure provided in the embodiment of the present invention improves the structure of the filter screen 21 on the mesh part 2. Specifically, a special mesh structure is specially designed on the filter screen 21, and the opening design on the mesh structure can well absorb the stress from the radial direction. When the mesh part 2 is fixed on the carrier 1, it is very helpful to keep the filter screen 21 in a flat state, overcoming the defects in the prior art.

[0058] The dustproof structure provided by the embodiment of the present invention can effectively protect the microphone packaging structure. The mesh portion 2 is provided with a filter 21, which allows airflow to pass through, and the filter 21 can also effectively block external particles and foreign matter (for example, dust and impurities) from entering the interior of the microphone packaging structure, thereby better protecting the various components inside the microphone packaging structure to avoid affecting the acoustic performance and service life of the microphone. In addition, since the filter 21 on the mesh portion 2 is in a flat state for a long time, it is also conducive to the smooth flow of airflow here, and will not have an adverse effect on the movement of the airflow.

[0059] In the present invention, the carrier 1 can be made of metal materials, alloy materials or organic non-metallic materials known to those skilled in the art. Those skilled in the art can flexibly select the material for making the carrier 1 according to specific needs, and there is no limitation on this.

[0060] In the present invention, if Figure 2 and Figure 3 As shown, the mesh portion 2 includes a filter screen 21 and a fixing portion 22 arranged around the filter screen 21. The fixing portion 22 is used to connect the mesh portion 2 to the carrier 1 so that the mesh portion 2 can stably cover the carrier 1. It should be noted that when the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the fixing portion 22 is actually connected to the edge portion of the carrier 1. The fixing portion 22 of the mesh portion 2 and the edge portion of the carrier 1 can be connected together by adhesive bonding, for example. Of course, the two can also be connected together by fasteners, welding or hot pressing. Those skilled in the art can flexibly choose according to specific needs, and the present invention does not limit this.

[0061] The filter 21, for example, is a metal screen with a mesh size of no more than 10 μm, so that the airflow can pass smoothly, while also blocking the entry of dust, impurities and other particles from the outside. The metal filter has the characteristics of good durability, does not need to be frequently replaced, and has a long service life. Of course, the filter 21 can also be made of mesh with other aperture sizes and other materials. In addition, the shape of the mesh holes on the filter 21 can be, for example, circular, square, triangular, etc. Those skilled in the art can flexibly adjust according to specific needs, without limitation.

[0062] In addition, it should be noted that, on the mesh portion 2, the shape of the filter 21 itself can be, for example, a regular shape such as a circle, a square, an ellipse, etc. Of course, the filter 21 can also be other irregular shapes. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.

[0063] For example, the filter screen 21 is circular, and the diameter of the filter screen 21 is 500 μm-1100 μm. Within this range, it is beneficial to achieve a larger filtering area. The thickness of the filter screen 21 is 2-1500 nm. Within this range, the filter screen will not be too thick, and the filter screen 21 can have sufficient mechanical strength and is not easily damaged.

[0064] The dustproof structure provided by the present invention is as follows: Figure 2 and Figure 3 As shown, on the filter screen 21, the interval S between any two adjacent mesh structures is the same, and the size range of the interval S is 0.5μm-2μm. Within this range, the filter screen 21 can maintain a certain rigidity, so that the filter screen 21 can resist bending deformation. In addition, by reasonably setting the size of the gap S, it is possible to avoid the situation in which the filter screen 21 is insufficiently strong and breaks during production, which will affect the yield rate of the product.

[0065] The dustproof structure provided by the present invention is as follows: Figure 2 and Figure 3 As shown, on the filter screen 21, each column of mesh structure includes a plurality of meshes 212 arranged in sequence, and the size T of each mesh 212 along the radial direction is 1 μm-10 μm. Within this range, it is possible to prevent dust, impurities and other particles from entering from the meshes 212, and the mechanical strength of the entire filter screen 21 will not be affected by the openings.

[0066] The filter screen 21 may include a grid structure of 5-10 columns, for example. It should be noted that the specific number of columns of the grid structure can be flexibly adjusted according to the size of the grid portion 2 itself and the required opening ratio, and there is no limitation on this.

[0067] On the filter 21, the ratio of the area occupied by the meshes 212 and the central hole 211 on the multi-row mesh structure to the total area of ​​the filter 21 is defined as the opening rate of the filter 21. In the present invention, the opening rate of the filter is 50%-90%. A higher opening rate is designed on the filter 21, and when it is used in a microphone device, signal loss or noise can be minimized, that is, it is beneficial to improve the acoustic performance of the microphone.

[0068] The dustproof structure provided by the present invention has a filter 21 disposed on the mesh portion 2, and the mesh structure on the filter 21 is actually different from the prior art. In the present invention, the mesh structure on the filter 21 is changed to change the opening design on the filter 21. The specially designed opening can absorb radial stress and prevent the plane of the filter 21 from being deformed.

[0069] In an optional example of the present invention, on the mesh portion 2, as Figure 2 As shown, the side of the filter 21 adjacent to the center hole 211 is defined as the inner side of the filter 21, and the side away from the center hole 211 is defined as the outer side of the filter 21. From the inner side to the outer side of the filter 21, the length of the mesh 212 on the multi-row mesh structure gradually increases. This design in the present invention can prevent stress concentration and help to gradually disperse stress, so that the filter 21 can maintain a flat state.

[0070] like Figure 2 As shown, on the filter screen 21, the portion between the multiple columns of grid structures forms a first spacer 213, and the first spacer 213 is radially arranged at a predetermined radiation angle θ relative to the central hole 211. The predetermined radiation angle θ is 1°-20°. This design can improve the rigidity of the entire filter screen 21 and prevent the filter screen 21 from bending and deforming in the horizontal direction. Moreover, the filter screen 21 can be made stronger to prevent it from being torn or damaged during the manufacturing process.

[0071] In an optional example of the present invention, Figure 3 As shown, on the filter net 21 of the mesh part 2, the meshes 212 on different rows of mesh structures have the same length. That is, on the filter net 21 of the mesh part 2, except for the central hole 211, the lengths of all the meshes 212 are the same.

[0072] like Figure 3 As shown, in this example, the portion between any two adjacent rows of grid structures forms a second spacer 214, and any two adjacent second spacers 214 are staggered, that is, not on the same radial line. Optionally, the mesh 212 is arc-shaped, the size T of the mesh 212 along the radial direction is 1-10 μm, and the arc length of the mesh 212 is L an , then L anThe relationship between L and T is: an / T=1-4. The inventors of the present invention have found that providing the mesh 212 of the above size range on the filter 21 can not only block the entry of external particles, but also improve the rigidity of the filter 21 and prevent it from being deformed.

[0073] In addition, the mesh 212 on the filter screen 21 can have a variety of different shapes. For example, the mesh 212 is an elliptical hole. For another example, the boundary portion of the mesh 212 along the radial direction is wavy. For another example, the mesh 212 is a racetrack-shaped hole, in which case both ends of the mesh 212 are semicircular structures. The meshes 212 of the above three structures can effectively absorb radial stress without affecting the overall mechanical strength of the mesh portion 2.

[0074] When the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the two may be connected by bonding, welding, hot pressing or fasteners, for example. Those skilled in the art may flexibly adjust according to specific needs, and this is not limited.

[0075] In addition, in the present invention, the thickness of the mesh portion 2 can be, for example, about 0.5 μm. The height of the carrier 1 can be, for example, about 40 μm. This size is suitable for most microphone packaging structures. Of course, those skilled in the art can also appropriately adjust its size according to specific assembly needs, and there is no limitation on this.

[0076] According to another embodiment of the present invention, a microphone packaging structure is also provided. The microphone packaging structure can be applied to various types of electronic products such as mobile phones, laptops, iPads, VR devices, and smart wearable devices, and its application is relatively wide. The microphone packaging structure provided in the embodiment of the present invention can effectively prevent the internal chip components and other components from being damaged by external dust, impurities and other particles and foreign matter, which can extend the service life of the microphone and enable the microphone to maintain excellent acoustic performance.

[0077] The specific structure of the microphone packaging structure provided in the embodiment of the present invention is further described below.

[0078] like Figure 4-Figure 8 As shown, the microphone packaging structure provided by the embodiment of the present invention includes a shell 3 having a receiving cavity, and a sound pickup hole 4 is arranged on the shell 3. The sound pickup hole 4 is used to connect the inside and outside of the shell 3. A microphone device is accommodated and fixed in the receiving cavity of the shell 3. The microphone packaging structure provided by the present invention also includes the dustproof structure as described above, and the dustproof structure is fixedly mounted on the sound pickup hole 4.

[0079] In the present invention, the shape of the sound pickup hole 4 can be, for example, circular, square, triangular, elliptical, etc. The sound pickup hole 4 can be set to one or more as needed. The specific setting position of the sound pickup hole 4 can also be flexibly adjusted according to the specific situation of the microphone packaging structure, and the present invention does not limit this.

[0080] In an optional example of the present invention, Figure 4 As shown, the dustproof structure can be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dustproof structure is installed outside the microphone packaging structure to cover the sound pickup hole 4, and does not occupy the space inside the microphone packaging structure. When installing the dustproof structure, the position of the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned with the sound pickup hole 4, thereby preventing external particles and foreign matter from being introduced into the microphone packaging structure through the sound pickup hole 4.

[0081] Of course, the present invention is not limited to setting the dustproof structure outside the housing 3, and the dustproof structure may also be set in the accommodating cavity of the housing 3. Those skilled in the art may flexibly adjust the setting position of the dustproof structure according to specific needs.

[0082] The microphone packaging structure of the present invention has a shell 3 structured as follows: comprising a substrate 32 and a packaging cover 31, and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dustproof structure is accommodated in the accommodating cavity of the shell 3. The microphone device comprises a MEMS chip 5 and a signal amplifier 6.

[0083] In an optional example of the present invention, Figure 5 As shown, the sound pickup hole 4 is located on the packaging cover 31, and the dustproof structure is fixedly connected to the packaging cover 32. The position of the dustproof structure corresponds to the sound pickup hole 4, which can prevent external particles and foreign objects from being introduced into the microphone packaging structure through the sound pickup hole 4.

[0084] In an optional example of the present invention, Figure 6 As shown, the sound pickup hole 4 is located on the packaging cover 31, and the dustproof structure is fixedly connected to the position of the substrate 32 corresponding to the sound pickup hole 4. At the same time, the dustproof structure also covers the MEMS chip 5, which can effectively protect the chip in the microphone packaging structure.

[0085] In the present invention, the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, but can also be opened on the substrate 32. Figure 7 As shown, the sound pickup hole 4 is located on the substrate 32, and the dustproof structure is fixedly arranged on the substrate 32 at a position corresponding to the sound pickup hole 4. Figure 8As shown, the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly arranged at a position corresponding to the sound pickup hole 4 on the substrate 32, and the MEMS chip 5 is arranged on the dustproof structure. It should be noted that when the sound pickup hole 4 is opened on the substrate 32, those skilled in the art can adjust the installation position of the dustproof structure according to specific circumstances, as long as it can prevent external particles and foreign objects from entering or can protect the internal chip, and there is no limitation on this.

[0086] The packaging cover 31 is a dish-shaped structure with an open end. The material of the packaging cover 31 can be, for example, a metal material, a plastic material, or a PCB board. The shape of the packaging cover 31 can be, for example, a cylindrical shape, a rectangular parallelepiped shape, etc. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.

[0087] The substrate 32 may be a circuit board known in the art, such as a PCB, etc., without limitation. The packaging cover 31 and the substrate 32 may be fixed together, for example, by bonding with an adhesive or soldering with solder paste, and those skilled in the art may flexibly select the desired one, without limitation.

[0088] The microphone packaging structure provided by the present invention has a microphone device fixedly accommodated in the accommodating cavity of the housing 3. Specifically, Figure 4-Figure 8 As shown, the microphone device may include a MEMS chip 5 and a signal amplifier 6 , for example.

[0089] Wherein, the MEMS chip 5 includes a substrate and a sensing film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitor element, a piezoresistive element, etc. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the receiving cavity, the MEMS chip 5 can be mounted on the substrate 32. Of course, the MEMS chip 5 can also be mounted on the packaging cover 31, for example, a special adhesive can be used to bond the MEMS chip 5 to the packaging cover 31. The MEMS chip 5 can also be turned on by the circuit layout in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art and will not be described in detail in the present invention.

[0090] The signal amplifier 6 can be mounted on the package cover 31, and can also be mounted on the substrate 32. The signal amplifier 6 can be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, and processed and output by the ASIC chip. The MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.

[0091] In addition, the MEMS chip 5 and / or the signal amplifier 6 may also be buried in the substrate 32, or half buried in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductor is, for example, a metallized through hole provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through the conductor. The design of burying the MEMS chip 5 and the signal amplifier 6 in the substrate 32 helps to achieve miniaturization of the microphone.

[0092] It should be noted that when the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer is required to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat the surface of the signal amplifier 6 with protective glue, which can simplify the process and improve the product's resistance to optical noise.

[0093] In another aspect, the present invention further provides an electronic device, wherein the electronic device comprises the microphone packaging structure as described above.

[0094] The electronic device may be a mobile phone, a laptop computer, a tablet computer, a VR device, a smart wearable device, etc., and the present invention is not limited thereto.

[0095] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dustproof structure for a sound pickup hole of a microphone packaging structure, characterized in that: including a carrier and a mesh portion; The carrier is a hollow structure; The mesh portion includes a filter screen and a fixing portion arranged around the filter screen; wherein the filter screen includes a central hole and a plurality of rows of mesh structures extending outward from the central hole and arranged concentrically along the circumference of the central hole; The mesh part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected to the carrier; On the filter screen, the interval between any two adjacent rows of the mesh structures is S Same, the interval S 0.5-2μm; On the filter screen, each row of the mesh structure includes a plurality of meshes, and the size of each mesh along the radial direction is T 1-10μm; On the filter net, the ratio of the area occupied by the meshes and the central holes on the multi-row mesh structure to the total area of ​​the filter net is defined as the opening rate of the filter net; wherein the opening rate of the filter net is 50%-90%; On the mesh portion, the side of the filter mesh adjacent to the center hole is defined as the inner side of the filter mesh, and the side away from the center hole is defined as the outer side of the filter mesh. From the inner side to the outer side of the filter mesh, the mesh length on the multi-row mesh structure gradually increases.

2. The dustproof structure according to claim 1, characterized in that: On the filter net, the portion between the multiple rows of mesh structures forms a first spacer, and the first spacer is arranged at a predetermined radiation angle relative to the central hole. θ Arranged in a radial pattern; Wherein, the predetermined radiation angle θ 1°-20°.

3. The dustproof structure according to claim 1, characterized in that: On the filter net, the mesh lengths of the multiple rows of mesh structures are the same.

4. The dustproof structure according to claim 3, characterized in that: On the filter screen, the portion between any two adjacent rows of the mesh structures forms a second spacing portion, and any two adjacent second spacing portions are staggered with each other.

5. The dustproof structure according to claim 3, characterized in that: The mesh is arc-shaped, and the size of the mesh along the radial direction T for T ,and T 1-10μm; The arc length of the mesh is L an ; but L an and T The relationship between them is: L an / T =1-4.

6. The dustproof structure according to claim 1, characterized in that: The filter screen is circular, and the diameter of the filter screen is 500-1100 μm.

7. The dustproof structure according to claim 1, characterized in that: The thickness of the filter is 2-1500nm.

8. A microphone packaging structure, characterized in that: A housing having a receiving cavity is provided on the housing, and a sound pickup hole is provided on the housing, and the sound pickup hole is used to connect the inside and the outside of the housing; Also included is a microphone device, which is fixedly disposed in the accommodating cavity; It also includes a dustproof structure as described in any one of claims 1 to 7, wherein the dustproof structure is arranged on the sound pickup hole.

9. The microphone packaging structure according to claim 8, characterized in that: The dustproof structure is located outside the housing.

10. The microphone packaging structure according to claim 8, characterized in that: The housing comprises a substrate and a packaging cover, wherein the substrate and the packaging cover enclose the accommodating cavity; The dustproof structure is accommodated in the accommodating cavity; The microphone device includes a MEMS chip and a signal amplifier.

11. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the packaging cover.

12. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate to cover the MEMS chip.

13. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the substrate, and the dustproof structure is fixedly arranged at a position on the substrate corresponding to the sound pickup hole.

14. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole, and the MEMS chip is arranged on the dustproof structure.

15. An electronic device, characterized in that: Comprising a microphone packaging structure as described in any one of claims 8-14.

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