An insulating and highly efficient heat-conducting and heat-dissipating device

Abstract

The present invention relates to an insulated high-efficiency heat-conducting heat-dissipating device, comprising a heat-dissipating base, a fixed pressing plate, a heat-conducting pipe and a heat-dissipating profile, and is characterized in that: the heat-dissipating base and the fixed pressing plate are made of insulating aluminum nitride ceramic material, the heat-dissipating base is flexibly connected to the chip of the mainboard, the fixed pressing plate is installed on the heat-dissipating base, the heat-conducting pipe comprises two L-shaped sintered core heat-conducting pipes, the flat ends of the heat-conducting pipes are fixed in the through grooves of the fixed pressing plate, the other ends of the heat-conducting pipes are installed in the fixed grooves of the heat-dissipating profile, and the heat-dissipating profile is processed to form a number of parallel heat-dissipating plates. The present invention adopts a passive heat-dissipating design, and uses a heat-dissipating base and a fixed pressing plate made of aluminum nitride ceramic material to replace the existing metal heat-conducting sheet, which can eliminate the electrostatic interference of the heat-dissipating device on the chip, improve the heat transfer effect, and realize the high-efficiency heat-dissipating heat dissipation of the device through the cooperation of the sintered core heat-conducting pipe and the aluminum heat-dissipating profile, so as to meet the use of equipment with high electrostatic protection requirements and high-power heat-dissipating requirements.

Description

Technical Field

[0001] The invention belongs to the technical field of heat dissipation devices, and in particular relates to an insulating and highly efficient heat-conducting heat dissipation device. Background Art

[0002] The motherboard is usually the most basic and important component of an electrical appliance. The chips on the motherboard will generate heat during high-speed computing. If this heat is not dissipated in time, the motherboard temperature will gradually rise, eventually causing the chip to overheat and reduce frequency protection, reduce efficiency, and even cause chip damage. At present, active heat dissipation is usually used for motherboard heat dissipation, mainly using a radiator with a fan for heat dissipation. However, this method has problems such as high noise and spatial location restrictions. After long-term use, it is easy to cause dust accumulation on the motherboard and fan, resulting in increasingly poor heat dissipation effects. Rotating devices such as fans are also prone to failures after running for a long time.

[0003] The prior art also adopts passive heat dissipation for data communication equipment, high-computing processing equipment and other equipment with high-power heat dissipation requirements, and usually uses a heat dissipation device made of high-thermal-conductivity metal materials to achieve rapid heat conduction. For example, a Chinese patent with an authorization announcement date of December 30, 2015 and an authorization announcement number of CN204929521U discloses a heat dissipation device for a lottery machine motherboard, including a heat sink and a plurality of heat-conducting copper pipes. The heat sink is placed outside the motherboard box shell, and each heat-conducting copper pipe is set close to the heat source of the motherboard. The heat of each heat source is transferred to the heat sink by the heat-conducting copper pipe. Although this heat dissipation device reduces the noise during operation and avoids the accumulation of dust on the motherboard, the metal heat-conducting pipe or heat-conducting sheet of the heat dissipation device is usually in close contact with core components such as chips in order to ensure the heat dissipation effect, which will affect the capacitive coupling between the chip and the metal chassis shell. Since existing chips usually have a metal shell brazed on the upper surface of the chip, the metal shell of the chip is not grounded, which makes it easy for charge to accumulate on the surface of the shell. The presence of the metal heat-conducting components of the heat dissipation device will accelerate the charge accumulation speed on the surface of the shell. When the charge accumulates to a critical value, it will trigger a discharge effect. The discharge process may cause damage to the chip, causing chip data loss or even shutdown or freeze. Summary of the invention

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art and to provide an insulating and efficient heat-conducting heat-dissipating device with a simple structure, low noise, high heat-dissipating efficiency and no electrostatic interference or damage to the chip.

[0005] The technical solution adopted by the present invention to solve the above-mentioned problem is: the insulated and efficient heat-conducting heat dissipation device comprises a heat dissipation base, a fixed pressure plate, a heat-conducting pipe and a heat dissipation profile, characterized in that: flanges are provided at the four corners of the heat dissipation base, and circular through holes are opened on the flanges, and a mounting hole is provided on each side of the heat dissipation base, and a buffer seal is fixed inside the mounting hole, and a metal nut column is inlaid inside the buffer seal, the size of the fixed pressure plate is the same as the size of the heat dissipation base, U-shaped recesses are provided on both sides of the top surface of the fixed pressure plate, and connecting holes are provided on the bottom surface of the recess, and a through groove is provided on the bottom surface of the fixed pressure plate, the heat-conducting pipe is L-shaped, the flat end of the heat-conducting pipe is fixed in the through groove, and the other end of the heat-conducting pipe is installed in the fixed groove of the heat dissipation profile, and the bent inner side surface of the heat-conducting pipe is flush with the left side surface of the heat dissipation profile, and a number of parallel heat dissipation plates are processed on the upper side surface and the right side surface of the heat dissipation profile. The heat sink base and the fixed pressure plate are usually made of high thermal conductivity materials and are installed tightly with the chip to quickly absorb the heat generated by the chip. The four corner flanges of the heat sink base are used to install the heat sink base on the motherboard, and the mounting holes are used to achieve the connection between the heat sink base and the fixed pressure plate. The buffer seal realizes the flexible fixation of the two. The flat end of the heat pipe is fixed in the bottom groove of the fixed pressure plate and fully contacts with the heat sink base, so that the heat pipe can quickly transfer heat to the heat sink profile, and then quickly exchange heat with the outside air through the surface of the heat sink profile to complete the heat dissipation. The heat sink profile is processed to form a number of parallel heat sinks, which can significantly increase its heat dissipation area and improve the heat dissipation efficiency. The heat sink profile is usually installed on the outside of the chassis. The size of the heat sink profile is flexibly adjusted according to the size of the chassis. External installation helps to improve the convection effect with the air and further improve the heat dissipation efficiency.

[0006] As a preferred embodiment, the heat dissipation base and the fixed pressure plate of the present invention are both made of aluminum nitride ceramics, and are both made by compression molding, high pressure (or normal pressure) and high temperature sintering. The thermal conductivity of aluminum nitride ceramics is 170-185W / m·k, which is the same as or better than the thermal conductivity of commonly used metal aluminum profiles, and the thermal expansion coefficient is only (4.0-6.0)X10 -6 / ℃, with strong dimensional stability. In addition, aluminum nitride ceramics have high dielectric constant and resistivity, which will not cause electrostatic interference to the chip, but can improve the electrostatic protection level of the device and protect the chip. Integrated high-pressure sintering molding has the advantages of high dimensional accuracy and stable installation.

[0007] Preferably, the heat sink of the present invention is mounted on the chip by means of spring screws and fixing studs, and the bottom surface of the heat sink is in full contact with the chip. The spring screws are used to achieve a flexible connection between the heat sink and the motherboard, which can reduce the physical damage to the motherboard chip caused by fixing the heat sink.

[0008] Preferably, the position of the mounting hole of the present invention corresponds to the position of the connecting hole, and screws are installed in the mounting hole and the connecting hole. The screws are threadedly matched with the metal bolts embedded in the mounting hole, and the fixed pressure plate is flexibly pressed on the heat dissipation base under the action of the buffer seal, so that the flat end of the heat conduction pipe is fully in contact with the heat dissipation base, and the heat of the heat dissipation base is quickly conducted out through the heat conduction pipe.

[0009] Preferably, the heat pipe of the present invention is a sintered core heat pipe. The sintered core heat pipe realizes rapid heat conduction by utilizing the phase change process of the medium evaporating at the hot end and condensing at the cold end. The interior of the sintered core heat pipe is in a negative pressure state and filled with a low-boiling-point liquid. The inner wall of the pipe is a porous sintered material. When the flat end of the heat pipe absorbs the heat from the heat dissipation base, the liquid in the pipe is rapidly vaporized by heat. The steam flows to the end connected to the heat dissipation profile under the power of heat diffusion, and condenses and releases heat at this end. The liquid flows back to the flat end along the porous sintered material, and the cycle continues until the temperatures at both ends of the heat pipe are equal. This cycle speed is extremely fast, making the thermal conductivity of the sintered core heat pipe higher than that of any known metal.

[0010] Preferably, the heat pipe of the present invention is connected to the heat dissipation profile by crimping or reflow welding. The crimping or reflow welding connection method makes the heat pipe and the heat dissipation profile have better integrity, and the heat transfer efficiency at the connection between the two is higher.

[0011] Preferably, the heat dissipation profile of the present invention is formed by extruding an aluminum profile, which is low in price, light in weight, and has good heat dissipation performance, and can achieve efficient heat dissipation when combined with a heat pipe.

[0012] Compared with the prior art, the present invention has the following advantages and effects: (1) The present invention adopts a passive heat dissipation design, which can not only reduce the noise during heat dissipation and avoid dust accumulation on the mainboard, but also reduce the failure repair rate of the device. (2) The present invention uses a heat dissipation base and a fixed pressure plate made of aluminum nitride ceramic to replace the metal heat conductive sheet of the prior art, so that the heat dissipation base is in direct contact with the chip shell, which can not only improve the heat transfer effect, but also will not cause electrostatic interference to the chip. On the contrary, it can improve the electrostatic protection level of the device, protect the chip, and meet the heat dissipation requirements of equipment with high electrostatic protection level requirements.

[0013] (3) The present invention realizes efficient heat dissipation by combining a sintered core heat pipe with an aluminum heat dissipation profile. The shape and size of the heat dissipation profile can be flexibly adjusted according to the requirements of the chassis to achieve the best use effect. It is suitable for use in equipment with high-power heat dissipation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the specific implementation methods of the present invention or the solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 It is a schematic structural diagram of an embodiment of the present invention.

[0016] Figure 2 It is a schematic diagram of the explosion decomposition structure of an embodiment of the present invention.

[0017] Figure 3 It is a schematic diagram of the installation of the heat dissipation base and the fixed pressure plate according to an embodiment of the present invention.

[0018] Figure 4 It is an enlarged schematic diagram of point A of an embodiment of the present invention.

[0019] Figure 5 Schematic diagram of the use status of an embodiment of the present invention.

[0020] Explanation of the reference numerals in the accompanying drawings: 1. heat dissipation base; 2. fixed pressure plate; 3. heat conduction pipe; 4. heat dissipation profile; 5. flange; 6. through hole; 7. mounting hole; 8. buffer seal; 9. metal bolt; 10. recess; 11. connecting hole; 12. through groove; 13. flat end; 14. fixing groove; 15. parallel heat dissipation plate; 16. spring screw; 17. fixing stud; 18. chip; 19. screw. DETAILED DESCRIPTION

[0021] The present invention will be further described in detail below with reference to the accompanying drawings and by way of examples. The following examples are intended to explain the present invention but the present invention is not limited to the following examples.

[0022] Example

[0023] See also Figures 1 to 5 The insulated high-efficiency heat-conducting heat dissipation device of this embodiment includes a heat dissipation base 1, a fixed pressure plate 2, a heat-conducting pipe 3 and a heat dissipation profile 4.

[0024] The insulated high-efficiency heat-conducting heat dissipation device of this embodiment adopts a passive heat dissipation design. Compared with the traditional fan heat dissipation method, it can not only reduce the noise during heat dissipation and avoid dust accumulation on the mainboard, but also reduce the failure maintenance rate of the device.

[0025] The heat dissipation base 1 and the fixed pressure plate 2 of this embodiment are both made of aluminum nitride ceramics and are manufactured by compression molding, high pressure (or normal pressure) and high temperature sintering. Aluminum nitride ceramics have high thermal conductivity, small expansion coefficient, high dimensional stability, and high electrical strength. They will not cause electrostatic interference to the chip, but can improve the electrostatic protection level of the device. The heat dissipation base 1 and the fixed pressure plate 2 manufactured by compression molding, high pressure (or normal pressure) and high temperature sintering have the advantages of high dimensional accuracy and stable installation.

[0026] The heat dissipation base 1 and the fixed pressure plate 2 of this embodiment are both square, and flanges 5 are provided at the four corners of the heat dissipation base 1. A circular through hole 6 is provided on the flange 5. The flange 5 and the circular through hole 6 are used to fix the heat dissipation base 1 on the mainboard, so that the heat dissipation base 1 is in direct contact with the shell of the chip 18, thereby accelerating the heat dissipation of the chip 18. When in use, the fixing stud 17 is placed under the flange 5, and the spring screw 16 is passed through the circular through hole 6 to achieve flexible contact between the heat dissipation base 1 and the mainboard, which can reduce the physical damage to the chip 18 caused by fixing the heat dissipation base 1. A mounting hole 7 is provided on each side of the heat dissipation base 1, and a polyurethane buffer seal 8 is fixed inside the mounting hole 7, and a metal nut column 9 is also embedded inside the buffer seal 8. U-shaped concave platforms 10 are provided at corresponding positions on both sides of the fixed pressure plate 2, and a connecting hole 11 is provided on the bottom surface of the concave platform 10, and the screw 19 is threadedly matched with the metal nut column 9, and the fixed pressure plate 2 is flexibly pressed on the heat dissipation base 1 under the action of the buffer seal 8. The bottom surface of the fixed pressure plate 2 is also provided with a through groove 12, and the flat end 13 of the heat pipe 3 is fixed in the through groove 12. Compared with the existing metal heat sink, the heat sink base 1 made of aluminum nitride ceramic increases the distance between the metal parts of the heat sink and the chip 18, reduces the metal area of ​​the device, and increases the impedance of the discharge path between the heat pipe 3 and the chip 18 shell by changing the material, forcing the current to change the path, avoiding interference and damage to the chip 18.

[0027] The number of heat pipes 3 in this embodiment is two and both are L-shaped, and the flat ends 13 of the two heat pipes 3 are fixed in the through groove 12 and fully contact with the heat dissipation base 1, and the other ends are installed in the fixing groove 14 of the heat dissipation profile 4. The heat pipe 3 is a sintered core heat pipe, the interior of which is in a negative pressure state and filled with a low-boiling point liquid. The inner wall of the pipe is a porous sintered material, and the phase change process of the low-boiling point liquid evaporating at the hot end to absorb heat and condensing at the cold end to release heat is used to achieve rapid heat conduction. When the chip 18 is working and generating heat, the heat is transferred to the flat end 13 of the heat pipe 3 through the heat dissipation base 1, and the liquid in the pipe at the flat end 13 is quickly vaporized by heat. The steam flows to the end connected to the heat dissipation profile 4 under the power of heat diffusion, and condenses and releases heat at this end. The liquid then flows back to the flat end 13 along the porous sintered material, and the cycle is repeated until the temperature at both ends of the heat pipe 3 is equal. This cycle speed is extremely fast, so that the thermal conductivity of the heat pipe 3 is higher than that of any known metal, and can meet the needs of high-power heat dissipation.

[0028] The heat dissipation profile 4 of this embodiment is formed by extruding an aluminum profile. The aluminum alloy heat dissipation profile 4 has the advantages of low price, light weight, good heat dissipation, etc. The upper side and right side of the heat dissipation profile 4 are die-cast to form a number of parallel heat dissipation plates 15. The parallel heat dissipation plates 15 can increase the contact area between the heat dissipation profile 4 and the outside air, accelerate the heat exchange between the heat dissipation profile 4 and the outside air, and improve the heat dissipation efficiency. A horizontal fixing groove 14 is provided on the left side of the heat dissipation profile 4. The heat pipe 3 is connected to the fixing groove 14 by crimping or reflow welding, and the bent inner side of the heat pipe 3 is flush with the left side of the heat dissipation profile 4. The above connection method enables the heat pipe 3 and the heat dissipation profile 4 to form a good integrity, which helps to improve the heat transfer efficiency at the connection. The heat dissipation profile 4 is usually designed as an external component of the chassis. The size and shape of the heat dissipation profile 4 can be flexibly adjusted according to the needs of the chassis to achieve the best use effect.

[0029] In addition, it should be noted that the shapes and names of the parts and components of the specific embodiments described in this specification may be different, and the above content described in this specification is only an example of the structure of the present invention. All equivalent changes or simple changes made based on the structure, features and principles described in the patent concept of the present invention are included in the protection scope of the patent of the present invention. Technicians in the technical field of the present invention can make various modifications or supplements to the specific embodiments described or replace them in a similar manner, as long as they do not deviate from the structure of the present invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

Claims

1. An insulated, highly efficient heat-conducting and heat-dissipating device, comprising a heat-dissipating base (1), a fixed pressure plate (2), a heat-conducting pipe (3) and a heat-dissipating profile (4), characterized in that: The heat dissipation base (1) is provided with flanges (5) at four corners, and circular through holes (6) are formed on the flanges (5). A mounting hole (7) is provided on each side of the heat dissipation base (1). A buffer seal (8) is fixed inside the mounting hole (7), and a metal nut column (9) is embedded inside the buffer seal (8). The size of the fixed pressure plate (2) is the same as that of the heat dissipation base (1). U-shaped concave platforms (10) are provided on both sides of the top surface of the fixed pressure plate (2). A connection hole (11) is provided on the bottom surface, a through groove (12) is provided on the bottom surface of the fixed pressure plate (2), the heat conducting pipe (3) is L-shaped, the flat end (13) of the heat conducting pipe (3) is fixed in the through groove (12), the other end of the heat conducting pipe (3) is installed in the fixing groove (14) of the heat dissipation profile (4), and the bent inner side surface of the heat conducting pipe (3) is flush with the left side surface of the heat dissipation profile (4), and the upper side surface and the right side surface of the heat dissipation profile (4) are processed with a plurality of parallel heat dissipation plates (15); The heat dissipation base (1) and the fixed pressure plate (2) are both made of aluminum nitride ceramics and are both made by compression molding and high-pressure or normal-pressure high-temperature sintering; the heat dissipation base (1) is mounted on the chip (18) by means of spring screws (16) and fixing studs (17), and the bottom surface of the heat dissipation base (1) is in full contact with the chip (18); the position of the mounting hole (7) corresponds to the position of the connecting hole (11), and screws (19) are installed in the mounting hole (7) and the connecting hole (11); the heat conduction pipe (3) is a sintered core heat conduction pipe; and the heat dissipation profile (4) is formed in one piece by extrusion of an aluminum profile.

2. The insulated high-efficiency heat-conducting and heat-dissipating device according to claim 1, characterized in that: The heat conducting pipe (3) and the heat dissipating profile (4) are connected by means of crimping or reflow welding.

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